Polycrystalline ultra-hard materials and compacts comprise an ultra-hard material body having a polycrystalline matrix of bonded together ultra-hard particles, e.g., diamond crystals, and a catalyst material disposed in interstitial regions within the polycrystalline matrix. The material microstructure is substantially free of localized concentrations, regions or volumes of the catalyst material or other substrate constituent. The body can include a region extending a depth from a body working surface and that is substantially free of the catalyst material. The compact is produced using a multi-stage HPHT process, e.g., comprising two HPHT process conditions, wherein during a first stage HPHT process the catalyst material is melted and only partially infiltrates the precursor ultra-hard material, and during a second stage further catalyst material infiltrates the precursor ultra-hard material to produce a fully sintered compact.

A method for fabricating a semiconductor device includes (a) depositing an insulating film on a semiconductor substrate; (b) forming a recess in the insulating film; (c) depositing a conductive film on the insulating film while filling the recess with the conductive film; and (d) polishing the conductive film. Step (d) includes a first polishing substep of using a first polisher pad conditioned with a first dresser and a second polishing substep of using a second polisher pad conditioned with a second dresser different from the first dresser.

An abrasive article includes a fibrous substrate, a binder disposed on the fibrous substrate, and abrasive grains in contact with the binder. The binder includes an imide cross-linked urethane derived from a blocked isocyanate component and an anhydride component.

A plastic soft composition is formed of soft base material constantly provided with plasticity, porous fine particles for polishing contained in the base material, and the like, and a polishing process and a coating process are performed to a painted surface and the like using the plastic soft composition. The fine particles for polishing are impregnated with a coating agent (a surface protective agent) added with an activator which is emulsified by contact with water, and the coating agent is held in concave portions formed in the fine particles. Both polishing work and coating work are achieved by sliding the plastic soft composition on a painted surface by a palm pressure of a user.

An abrasive article including a bonded abrasive having a body formed of abrasive grains contained within a bond material, wherein the body grinds a superabrasive workpiece having an average Vickers hardness of at least about 5 GPa at an average specific grinding energy (SGE) of not greater than about 350 J/mm3, at a material removal rate of at least about 8 mm3/sec, and wherein grinding is a centerless grinding operation.

A cubic boron nitride sintered body tool has, at least at a cutting edge, a cubic boron nitride sintered body composed of a cubic boron nitride particle and a binder phase. The binder phase contains at least Al2O3 and a Zr compound. On any straight line in the sintered body, the mean value of a continuous distance occupied by Al2O3 is 0.1-1.0 μm, and the standard deviation of the continuous distance occupied by Al2O3 is not more than 0.8. On the straight line, X/Y is 0.1-1 where X represents the number of points of contact between Al2O3 and the Zr compound, and Y represents the sum of the number of points of contact between Al2O3 and cBN and the number of points of contact between Al2O3 and binder phase component(s) other than Al2O3 and the Zr compound.

A layer of matrix powder is deposited within a mold opening. A layer of super-abrasive particles is then deposited over the matrix powder layer. The super-abrasive particles have a non-random distribution, such as being positioned at locations set by a regular and repeating distribution pattern. A layer of matrix powder is then deposited over the super-abrasive particles. The particle and matrix powder layer deposition process steps are repeated to produce a cell having alternating layers of matrix powder and non-randomly distributed super-abrasive particles. The cell is then fused, for example using an infiltration, hot isostatic pressing or sintering process, to produce an impregnated structure. A working surface of the impregnated structure that is oriented non-parallel (and, in particular, perpendicular) to the super-abrasive particle layers is used as an abrading surface for a tool.

A composite sintered body according to the present invention contains at least cubic boron nitride and a binder. Cubic boron nitride has a continuous skeleton structure as a result of bonding of a plurality of first cubic boron nitride particles to each other. The binder has a continuous structure as a result of bonding of a plurality of binder particles to each other, that are present in a region except for a bonding interface where the first cubic boron nitride particles are bonded to each other. Second cubic boron nitride particles isolated from the first cubic boron nitride particles forming the skeleton structure are dispersed in the continuous structure of the binder particles.

An abrasive element comprises a body of crystalline abrasive material. The body has an array of cutting elements formed of crystalline abrasive material which projects from a surface of the body. The shape, size and form of the projections is controlled in the production process. The body may be a natural or synthetic crystal. The body may be a film formed by deposition. The body may be diamond or cubic boron nitride. The body may be monocrystalline or polycrystalline. The projections may be aligned along a crystallographic plane or planes.

Embodiments of the invention relate to methods of fabricating a polycrystalline diamond compacts and applications for such polycrystalline diamond compacts. In an embodiment, a method of fabricating a polycrystalline diamond body includes mechanically milling non-diamond carbon and a sintering aid material for a time and aggressiveness sufficient to form a plurality of carbon-saturated sintering aid particles and sintering a plurality of diamond particles in the presence of the plurality of carbon-saturated sintering aid particles to form the polycrystalline diamond body.

An abrasive article having an abrasive body including abrasive grains contained within a bond material, wherein the abrasive grains comprise microcrystalline alumina, and wherein the bond material includes less than about 1.0 mol % phosphorous oxide (P2O5), and a ratio measured in mol % between a total content of sodium oxide (Na2O) and a total content of potassium oxide (K2O) defined by [K2O/Na2O] having a value greater than about 0.5.

A cBN sintered body tool has the following feature. In at least one cross sectional surface of the cBN sintered body tool taken along a plane perpendicular to a joining surface having the largest area in joining surfaces between the cBN sintered body and the joining layer, a point C and a point D are assumed to represent points away by ¼ of the length of a line segment connecting a point A and a point B shown in a figure. A value obtained when an area of a region surrounded by a line segment connecting the point C and the point D, the first cBN particle, the second cBN particle, and the binder phase is divided by the length of the line segment connecting the point A and point B to each other is 0.14-0.6 μm.

A coated cBN sintered body has excellent wear resistance, fracture resistance, adhesiveness between a substrate and a coating, and a tool life of which is elongated as compared with conventional cBN sintered bodies. The coated cBN sintered body has a cBN sintered body substrate and a coating coated on the surface thereof. The cBN sintered body includes 76 to 90% by volume of cBN, and 10 to 24% by volume of a binder phase and inevitable impurities. An average grain size of cBN is 0.5 to 5.0 μm, an average value of the thickness of the binder phase is 0.05 to 0.8 μm, and the standard deviation of the thickness of the binder phase is 0.8 μm or less.

The present invention discloses a cleaning cloth, an abrasive cloth, a cleaning buff and an abrasive buff which are each formed by knitting/weaving bamboo fibers having excellent cleaning, abrasive capacity and excellent ignition resistance.

A fixed abrasive pad includes a substrate and a plurality of discrete abrasive blocks attached thereon, wherein the abrasive blocks comprise a plurality of abrasive sub-layers, wherein the abrasive density of the sub-layers increases layer-by-layer from the top sub-layer to the bottom sub-layer according to a predetermined ratio. The predetermined ratio ranges from about 1.099 to about 1.124.

Disclosed herein are abrasive grains based on zirconia alumina melted in an electric arc furnace, comprising a content of 52 to 62 wt % Al203 and 35 to 45 wt % ZrO2, wherein the high-temperature phases of the zirconia are stabilized by a combination of reduced Ti compounds and yttrium oxide.

Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.

Methods of making a superabrasive tool precursor are disclosed, along with such precursors and associated tools. Particularly, methods are disclosed for orienting superabrasive particles in a viscous binding material in order to provide tools based thereupon and having desired performance characteristics.

A low defect chemical mechanical polishing composition for polishing silicon oxide containing substrates is provided comprising, as initial components: water, a colloidal silica abrasive; and, an additive according to formula I.

A CMP polishing pad comprising (a) a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured opaque thermoset polyurethane region and at least one aperture region; said at least one cured opaque thermoset region has a porosity from about 10% to about 55% by volume; said at least one aperture region having (1) a top opening positioned below the polishing surface, (2) a bottom opening that is co-planar with said back surface and (3) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region filled with a cured plug of thermoset polyurethane local area transparency material that has a light transmission of less than 80% at a wavelength from 700 to 710 nanometers and is chemically bonded directly to a thermoset polyurethane opaque area; (b) an aperture-free removable release sheet covering at least a portion of said back surface of the polishing layer; and(c) an adhesive layer interposed between said polishing layer and said release sheet; said adhesive layer capable of adhering the polishing layer to a platen of a CMP apparatus after said release sheet has been removed.

Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) comprising a polycrystalline diamond (“PCD”) table including a thermally-stable region having at least one low-carbon-solubility material disposed interstitially between bonded diamond grains thereof, and methods of fabricating such PDCs. In an embodiment, a PDC includes a substrate, and a PCD table bonded to the substrate. The PCD table includes a plurality of diamond grains exhibiting diamond-to-diamond bonding therebetween and defining a plurality of interstitial regions. The PCD table further includes at least one low-carbon-solubility material disposed in at least a portion of the plurality of interstitial regions. The at least one low-carbon-solubility material exhibits a melting temperature of about 1300° C. or less and a bulk modulus at 20° C. of less than about 150 GPa.

An abrasive article includes a shaped abrasive particle including a body having a first height (h1) at a first end of the body defining a corner between an upper surface, a first side surface, and a second side surface, and a second height (h2) at a second end of the body opposite the first end defining an edge between the upper surface and a third side surface, wherein the average difference in height between the first height and the second height is at least about 50 microns. The body also includes a bottom surface defining a bottom area (Ab) and a cross-sectional midpoint area (Am) defining an area of a plane perpendicular to the bottom area and extending through a midpoint of the particle, the body has an area ratio of bottom area to midpoint area (Ab/Am) of not greater than about 6.

In one aspect, cutting tools are described having coatings adhered thereto. A coated cutting tool, in some embodiments, comprises a substrate and a coating adhered to the substrate, the coating comprising at least one composite layer deposited by chemical vapor deposition comprising an aluminum oxynitride phase and a metal oxide phase, the metal oxide phase including at least one oxide of a metallic element selected from Group IVB of the Periodic Table.

The present invention provides a shearing die having longer life and a method for manufacturing the same. The shearing die includes a pair of substrates, at least one of which has a hard film formed by an arc ion plating method and located at least on a region of a curved surface and on an adjacent region from the end part of the curved surface on the side facing to the surface of the sheet or plate material to 300 μm along the surface of the substrate. The hard film comprises Al and one or more of Ti and Cr, and has a thickness of 1 to 5 μm, such that a number of metal particles having a diameter of 20 μm or more, which are present on a line segment having a length of 10 mm on a surface of the hard film, is 2 or less.

An object of the present invention is to provide a polishing pad that is prevented from causing an end-point detection error due to a reduction in light transmittance from the early stage to the final stage of the process, and to provide a method of producing a semiconductor device with the polishing pad. The present invention is directed to a polishing pad, comprising a polishing layer comprising a polishing region and a light-transmitting region, wherein a polishing side surface of the light-transmitting region is subjected to a surface roughness treatment, and the light-transmitting region has a light transmittance of 40% to 60% at a wavelength of 600 nm before use.

Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) and methods of fabricating such PDCs. In an embodiment, a PDC includes a substrate and a preformed polycrystalline diamond table including an interfacial surface bonded to the substrate and an opposing working surface. The preformed polycrystalline diamond table includes a proximal region extending from the interfacial surface to an intermediate location within the preformed polycrystalline diamond table that includes a metallic infiltrant infiltrated from the substrate, and a distal region extending from the working surface to the intermediate location that is substantially free of the metallic infiltrant. A boundary exists between the proximal and distal regions that has a nonplanar irregular profile characteristic of the metallic infiltrant having been infiltrated into the preformed polycrystalline diamond table.

A cutting tool insert for machining by chip removal comprising a body of a hard alloy of cemented carbide, cermet, ceramics or cubic boron nitride based material onto which a hard and wear resistant coating is deposited by CVD, and the methods of making and using the same. The coating includes at least one α-Al2O3 layer with a thickness between 0.5 μm and 40 μm having a {01-15} and/or {10-15} texture exhibiting excellent wear and metal cutting performance.

Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

The inventive method comprises chemically-mechanically polishing a substrate with an inventive polishing composition comprising a liquid carrier and abrasive particles that have been treated with a compound.

The present disclosure relates to cubic boron nitride (cBN) cutting elements that have high cBN content and that are cuttable by electric discharge machining (EDM). A cutting element according to an embodiment includes a self-sintered polycrystalline cubic boron nitride (PCBN) compact, having a first phase of cubic boron nitride (cBN) particles and a ceramic binder phase with titanium compounds. The first phase occupies greater than 80% by volume of the self-sintered PCBN compact. The self-sintered PCBN compact has an electrical conductivity sufficient to be cuttable by electrical discharge machining.

A polishing composition contains colloidal silica particles having protrusions on the surfaces thereof. The average of values respectively obtained by dividing the height of a protrusion on the surface of each particle belonging to the part of the colloidal silica particles that has larger particle diameters than the volume average particle diameter of the colloidal silica particles by the width of a base portion of the same protrusion is no less than 0.245. Preferably, the part of the colloidal silica particles that has larger particle diameter than the volume average particle diameter of the colloidal silica particles has an average aspect ratio of no less than 1.15. Preferably, the protrusions on the surfaces of particles belonging to the part of the colloidal silica particles that has larger particle diameters than the volume average particle diameter of the colloidal silica particles have an average height of no less than 3.5 nm.

The present disclosure relates to cubic boron nitride (cBN) cutting elements that have high cBN content and that are cuttable by electric discharge machining (EDM). A cutting element according to an embodiment includes a self-sintered polycrystalline cubic boron nitride (PCBN) compact, having a first phase of cubic boron nitride (cBN) particles and a ceramic binder phase with titanium compounds. The first phase occupies greater than 80% by volume of the self-sintered PCBN compact. The self-sintered PCBN compact has an electrical conductivity sufficient to be cuttable by electrical discharge machining.

An abrasive article includes an elongated body, a bonding layer including a metal overlying a surface of the elongated body, and a coating layer including a polymer material overlying the boding layer. The abrasive article further includes abrasive grains contained within the bonding layer and coating layer, and wherein the bonding layer comprises an average thickness (tbl) at least about 40% of the average grit size of the abrasive grains.

CVD coated cutting tools are provided. A coated cutting tool described herein, in some embodiments, comprises a PcBN substrate and a polished coating adhered to the substrate including one or more layers of Al2O3 deposited by chemical vapor deposition, wherein the coating has a surface roughness (Ra) less than about 600 nm in an area of the cutting tool for contacting a workpiece.

The invention relates to a cutting tool comprising a main part and a multilayer coating applied thereon. A first layer A made of a hard material is applied on the main part, said hard material being selected from titanium aluminum nitride (TiAlN), titanium aluminum silicon nitride (TiAlSiN), chromium nitride (CrN), aluminum chromium nitride (AlCrN), aluminum chromium silicon nitride (AlCrSiN), and zirconium nitride (ZrN), and a second layer B made of silicon nitride (Si3N4) is applied directly over the first layer A.

Methods of forming a polycrystalline compact for use in an earth-boring tool include sintering a plurality of hard particles with catalyst material to form a polycrystalline material that includes a plurality of inter-bonded particles of hard material integrally formed with the catalyst material and introducing at least a portion of the polycrystalline material to a reactive material to remove at least a portion of the catalyst material contained within the polycrystalline material. The reactive material may include at least one of a molten glass, an ionic compound, a leaching liquor, and a chemical plasma. The reactive material may be introduced to the polycrystalline material at a temperature of greater than or equal to a melting point thereof.

A method of manufacturing grooved polishing layers for use in chemical mechanical polishing pads is provided, wherein the formation of defects in the polishing layers are minimized.

Methods for preparing a silicon bonded PCD material involving a one step, double sweep process and drilling cutters made by such processes are disclosed. The PCD material includes thermally stable phases in the interstitial spaces between the sintered diamond grains. The method sweeps a diamond powder with a binder to form sintered PCD, reacts said molten binder with a temporary barrier separating said binder and said diamond from a silicon (Si) source, and sweeps said sintered PCD with said Si source to form SiC bonded PCD.

In the production method for abrasive grains according to the invention, an aqueous solution of a salt of a tetravalent metal element is mixed with an alkali solution, under conditions such that a prescribed parameter is 5.00 or greater, to obtain abrasive grains including a hydroxide of the tetravalent metal element.

A method of making shaped abrasive particles including forming an abrasive flake comprising a plurality of precursor shaped abrasive particles and a frangible support joining the precursor shaped abrasive particles together; transporting the abrasive flake through a rotary kiln to sinter the abrasive flake; and breaking the sintered abrasive flake into individual shaped abrasive particles. The method is useful to make small shaped abrasive particles having insufficient mass to be efficiently individually sintered in a rotary kiln without joining two or more of the shaped abrasive particles together.

A method for making a super-hard construction comprising a first structure comprising a first material joined to a second structure comprising a second material, in which the coefficient of thermal expansion (CTE) and Young's moduli of the materials of each material are substantially different from each other. The method includes forming an assembly comprising the first material, the second material and a binder material arranged to be capable of bonding the first and second materials together, the binder material comprising metal; subjecting the assembly to a sufficiently high temperature for the binder material to be in the liquid state and to a first pressure at which the super-hard material is thermodynamically stable; reducing the pressure to a second pressure at which the super-hard material is thermodynamically stable, the temperature being maintained sufficiently high to maintain the binder material in the liquid state; reducing the temperature to solidify the binder material; and reducing the pressure and the temperature to an ambient condition to provide the super-hard construction.

Disclosed herein is a frequency modulated continuous wave (FMCW) radar. The FMCW radar includes: a transmission signal generator that generates a frequency-modulated transmission signal; a transmission signal sender that sends the transmission signal; a receiver that receives a reflected wave of the transmission signal; an adjuster that adjusts the amplitude and phase of a cancel signal, which cancels a leakage signal component in a received signal, in accordance with a variation in the frequency of the transmission signal; and a superimposer that superimposes the cancel signal over the received signal to cancel the leakage signal component.

An electronic device including a signal generating circuit and a movable sensing circuit is provided. The signal generating circuit generates a sensory signal through a signal source. The movable sensing circuit generates a feedback signal in response to a detection signal from the signal generating circuit, and transmits the feedback signal to the signal generating circuit. The signal generating circuit obtains a first distance value between the signal source and the movable sensing circuit based on the feedback signal, and adjusts the intensity of the sensory signal according to the first distance value.

A Continuous Transmission Frequency Modulated (CTFM) detection apparatus is provided. The apparatus includes a projector, a sensor, and a hardware processor. The projector is configured to transmit a frequency modulated transmission wave at a given transmission period. The sensor is configured to receive a reflected wave, the reflected wave comprising a reflection of the transmission wave on a target object. The hardware processor is programmed to at least generate a beat signal based at least in part on the transmission wave and the reflected wave, extract asynchronously from the transmission period a processing signal from the beat signal, and generate information related to the target object based on the processing signal.

The present invention relates to a system for determining a distance, a transponder, a position detection apparatus, and a method therefor. The method for determining a distance comprises providing a position detection apparatus (101), and a transponder (105). The method further comprises generating (201) a pseudo number sequence, transmitting (202) the pseudo number sequence, receiving (203) the pseudo number sequence; modulate (204) the received pseudo number sequence by means of delaying the recieved pseudo number sequence a predetermined number of clock cycles from a group of at least two predetermined number of clock cycles. The method further comprises transmitting (205) the modulated pseudo number sequence, recieving (206) the modulated pseudo number sequence, detecting (207) a path time of the pseudo number sequence, by means of delaying and correlating the generated pseudo number sequence with the received modulated pseudo number sequence, wherein the delay time corresponds to the path time, The method further comprises detecting (208) a clock correction factor for the transponder (105) using the received modulated pseudo number sequence, calculating (209) a flight time of the pseudo number sequence between the position detection apparatus and the transponder by means of the path time, the clock correction factor, and the predetermined number of clock cycles of the transponder, and calculating (210) the distance between said position detection apparatus and said transponder by means of the flight time.

Methods and systems for detection of an occupancy status of a space monitored by a system (100) are described herein. The method comprises detecting a magnetic field value at the space by a magnetic field sensor (210) of a sensing device (104). The detected magnetic field value with a reference magnetic field value, to determine a magnetic occupancy status (MOS) of the space. The MOS is indicative of the change in the occupancy status of the space. The change in the occupancy status is indicative of one of a change from empty to occupied occupancy status, and a change from occupied to empty occupancy status. Further, when the MOS indicates the change in the occupancy status of the space, a radar sensor (212) of the sensing device (104) is activated to determine a radar occupancy status (ROS) by generating at least one radar reading from the radar sensor (212). The ROS is indicative of the change in the occupancy status of the space. Thereafter, the change in the occupancy status of the space is established when the ROS indicating the change in the occupancy status of the space is in agreement with the MOS. Further, the established change of the occupancy status in the space is communicated to a central unit (102) of the system (100).

A system for use in a vehicle determining the type of terrain ahead of the vehicle, the system comprising; a processor configured to receive sensor output data from a plurality of vehicle-mounted sensors, including at least one radar sensor and at least one acoustic sensor, each for receiving a reflected signal from the terrain ahead of the vehicle; and a data memory configured to store pre-determined data relating sensor output data, for the or each acoustic sensor and the or each radar sensor, to a terrain type; wherein the processor is configured to compare the sensor output data with the pre-determined data to determine an indication of the terrain type corresponding to the sensor output data.

A method and system for estimating uncertainties in radar based precipitation estimates is provided. In an embodiment, gauge measurements at one or more gauge locations are received by an agricultural intelligence computer system. The agricultural intelligence computer system obtains precipitation estimates for the one or more gauge locations that correspond to the gauge measurements and computes the differences between the precipitation estimates and the gauge measurements. Using the precipitation estimates and the computed differences, the agricultural intelligence computer system then models a dependence of the uncertainty in the precipitation estimates on the value of the precipitation estimates. When the agricultural intelligence computer system receives precipitation estimates for a location where gauge measurements are unavailable, the agricultural intelligence computer identifies an uncertainty for the precipitation estimate based on the value of the precipitation estimate and the model of the dependence of the uncertainty on the precipitation estimate values.

Methods and devices are presented for synchronizing positioning signals in a kinematic location network. In particular, methods and devices are presented for synchronizing a unique positioning signal generated by a positioning-unit device to a reference positioning signal generated by a reference transmitter, where the positioning-unit device and the reference transmitter are moving relative to each other. In certain embodiments the reference transmitter or the positioning-unit device, or both, self-monitor trajectory data comprising one or more of location, velocity or acceleration, e.g. using inertial navigation systems, and broadcast that data in their positioning signals. The trajectory data enables estimation of Doppler shifts and propagation delays associated with the positioning signals, allowing measurement and correction of clock drift for synchronization of the positioning signals.

A dual mode electromagnetic detection system and a protective dome for the electromagnetic detection system are described. The protective dome includes a substrate having a portion transparent to both infrared radiation and radio frequency radiation. The portion of the substrate includes a macromolecular material including a polymer selected from a family of polyolefins and an antistatic additive.