A device for joining a plastic part to a second part with an insert adapted to thread into the plastic part. The insert includes a longitudinal body with outer threads, a hole in the longitudinal body with female threads, and an annular flange. Protrusions and recesses on the bottom of the annular flange alternate in a radial pattern. The insert is threaded into an opening in the plastic part. The protrusions and recesses of the insert interact with the plastic part to resist over rotation of the insert. The opening in the plastic part may include a hole and a counter bore portion. The counter bore includes protrusions and recesses. The protrusions and recesses alternate in a radial pattern. When the insert is threaded into the opening, the protrusions and recesses of the insert interact with the protrusions and recesses of the plastic part and resist over rotation.

A nut assembly and a holddown assembly using the nut assembly are described, including methods of manufacture and assembly. The nut assembly may include a body portion having first and second openings with an internal wall extending between them. A rotation-inhibiting wall may be included between the first and second openings. A nut portion configured to move axially within the internal wall of the body portion includes structures for co-acting with a rotation-inhibiting wall to limit or prevent rotation of the body portion and the nut portion relative to each other. A nut portion and a body portion extending around the nut portion have limited axial movement relative to each other due to axial engagement between adjacent surfaces on the nut portion and the body portion.

A system and method for positioning a tool. The system includes a base member configured to contact a first decking member and a second decking member; at least one base guide including a first end and an opposing second end, the first end coupled to the base member, the at least one base guide configured to position the base member relative to the first decking member and the second decking member; and an adjustable section coupled to the base member, the adjustable section configured to allow adjustment of at least one of a position and an angle of the tool relative to the base member. The system further includes a fastener configured to secure the first and/or second decking members to a joist.

Panel fasteners, panel assemblies, methods of assembly and installation of panel assemblies and panel fasteners, anchor systems, anchor systems with captive fasteners and assemblies are disclosed.

A connecting arrangement is provided between a plastic component with at least two mutually adjacent and at least approximately parallel walls and another structural element, having at least one force-transmission element which is adhesively bonded to the plastic component via an adhesive bond on the plastic component in frusto-conical or spherical-segment-shaped depressions in the mutually adjacent walls of the plastic component. The force-transmission element has a carrying structure for the other structural element. With the exception of a possibly provided coating, the force-transmission element is composed only of metallic material and has a plate which is adapted to the depression in the outer wall of the plastic component, which outer wall is adjacent to the other structural element. The edge of the plate rests with interposition on the outer wall in the surrounding region of the depression, wherein the plate is connected via a web to an end section of the force-transmission element, which end section is adapted to the depression in the other inner wall of the plastic component. The depression is configured in the outer wall without a bottom to such an extent that the end section of the force-transmission element can be inserted through the outer wall into the recess of the inner wall.

In a driving circuit, one output circuit has a scanning signal line, a first transistor which controls electrical connection between the scanning signal line and a clock signal line which has a gate connected to a first node, the first node which is at an active potential in a first time period including a time period during which the active potential is output to the scanning signal line, a second transistor which electrically connects the first node and an inactive signal line which has a potential to open the transistor in a second time period other than the first time period, and the second transistor has a gate connected to a second node, wherein the second node has two kinds of timings to be charged for retaining the active potential.

To suppress malfunctions in a shift register circuit. A shift register having a plurality of flip-flop circuits is provided. The flip-flop circuit includes a transistor 11, a transistor 12, a transistor 13, a transistor 14, and a transistor 15. When the transistor 13 or the transistor 14 is turned on in a non-selection period, the potential of a node A is set, so that the node A is prevented from entering into a floating state.

A method and system for synchronizing the output signal phase of a plurality of frequency divider circuits in a local-oscillator (LO) or clock signal path is disclosed. The LO path includes a plurality of frequency divider circuits and a LO buffer for receiving a LO signal coupled to the plurality of frequency divider circuits. The method and system comprise adding offset voltage and setting predetermined state to each of the frequency divider circuits; and enabling the frequency divider circuits. The method and system includes enabling the LO buffer to provide the LO signal to the frequency divider circuits after they have been enabled. When the LO signal drives each of the frequency divider circuits, each of the frequency divider circuits starts an operation. Finally the method and system comprise removing the offset voltage from each of the frequency divider circuits to allow them to effectively drive other circuits.

An open loop clock divider circuit includes (a) a first divider configured to receive an incoming clock signal and output a first divided clock signal, (b) a flying-adder synthesizer configured to fractionally divide the first divided clock signal and output a fractionally divided clock signal, and (c) a second divider configured to receive the fractionally divided clock signal and output a second divided clock signal. The open loop clock divider circuit advantageously provides a fractional divider in which there is no feedback loop between the source frequency (fs) and the destination frequency (fd). Methods of generating a divided clock signal involving the open loop clock divider circuit are also disclosed.

A low profile hold down assembly is mounted to the exterior surface of a sidewall of a trailer. The hold down assembly includes a cover member formed from the same material from which the sidewall of the trailer is formed and therefore is aesthetically desirable.

A vehicle restraint system includes a strap assembly configured to be positioned on a portion of a tire of a vehicle to secure the vehicle to a deck of a transport. The strap assembly is also configured to be coupled to the deck of the transport on a first side of the tire of the vehicle. The system also includes a mandrel assembly operable to be coupled to the strap assembly on a second side of the tire of the vehicle, opposite the first side. The system further includes a winch assembly configured to be coupled to the deck of the transport and the mandrel assembly on the second side of the tire of the vehicle, the winch assembly configured to rotate the mandrel assembly to produce a tightening force to tighten the strap assembly around the portion of the tire. The system still further includes a release mechanism disposed between the winch assembly and the mandrel assembly and configured to create a coupling between the winch assembly and the mandrel assembly in a manner that transmits the tightening force from the winch assembly to the mandrel assembly. The release mechanism is configured to release the coupling between the winch assembly and the mandrel assembly when a force greater than or equal to a predetermined force is produced against the release mechanism.

An improved captive beam decking system is disclosed for use in a cargo trailer. The system includes a beam assembly and a foot assembly that is selectively engagable to a vertical sliding track system. The sliding track system is attached to the sidewall of a trailer vertically. The beam can be easily moved at different heights that are selected based upon the configuration of the cargo trailer.

A fastening system includes an energy absorbing or impact indicator and at least one or more of the following: (1) a fastening base for mounting in an emergency vehicle, (2) a patient support engageable with a base, (3) a patient securement mechanism for securing a patient on a patient support, (4) a patient securement mechanism for securing a patient to a vehicle, (5) a patient support securement mechanism operable to secure a patient support in an emergency vehicle, or (6) a patient support securement mechanism operable to secure a patient support to a base, wherein the energy absorbing or impact indicator is located (1) at the patient securement mechanism, or (2) at the patient support securement mechanism, or wherein the energy absorbing or impact indicator is between (1) the base and the vehicle, (2) the patient support and the base, (3) the patient securement mechanism and the patient support, (4) the patient support and the emergency vehicle, (5) the patient and the emergency vehicle, or (6) the patient securement mechanism and the emergency vehicle, wherein the energy absorbing device or impact indicator has at least an energy absorbing state and a rigid state or indicates a level of impact at or between any of the respective component or components.

An anti-disassembling device for an electronic product includes a case, a linear movement device, a circular movement device and an optical encoder. At least one retractable transmission member is connected to the case. The circular movement device is located in the case and has an encoding disk, which has multiple slots defined therethrough and teeth are defined in the periphery thereof. The at least one retractable transmission member is engaged with the teeth to rotate the encoding disk. The optical encoder has a lighting module which emits light beams through the slots of the encoding disk and a photosensitive module receives the light beams and sends a signal to the storage unit of the electronic product. The retractable device rotates when the electronic product is disassembled.

A method for quickly calibrating a memory interface circuit from time to time in conjunction with operation of a functional circuit is described. The method uses controlling the memory interface circuit with respect to read data capture for byte lanes, including controlling CAS latency compensation for the byte lanes. In the method control settings for controlling CAS latency compensation are determined and set according to a dynamic calibration procedure performed from time to time in conjunction with functional operation of a circuit system containing one or more memory devices connected to the memory interface circuit. In the method, determining and setting the control settings for controlling CAS latency compensation is performed independently and parallely in each of the byte lanes.

Multi-threshold flash Null Convention Logic (NCL) includes one or more high threshold voltage transistors within a flash NCL gate to reduce power consumption due to current leakage by transistors of the NCL gate. High-threshold voltage transistors may be added and/or may be used in place of one or more lower voltage threshold transistors of the NCL gate. A high-Vt device is included in the pull-up path to reduce power when the flash NCL logic gate is in the null state.

A floorplan for a Structured ASIC chip is shown having a core region containing memory and VCLB logic cells surrounded by a plurality of IO connection fabrics that include a first IO connection fabric comprising IO sub-banks connecting the core of the chip to pins for external signals to the core, a first high-speed routing fabric disposed along the east-west vertical top of the core and connects the core to high-speed IO such as SerDes; a network-aware connection fabric connects the core to a microcontroller primarily for testing and repair of the memory in the core; and a second-high speed routing fabric is disposed on the north-south vertical sides of the core and communicates with the IO sub-banks. The VCLB Structured ASIC chip is manufactured on a 28 nm CMOS process lithographic node or smaller, having several metal layers and preferably is programmed on a single via layer.

A device for passive equalization and slew-rate control of a signal includes a first branch and a second branch. The first branch includes a first driver coupled in series with an equalization capacitor. The second branch includes a second driver coupled in series with a resistor. The second branch may be coupled in parallel to the first branch. The first branch may be configurable to enable either passive equalization or slew-rate control of the signal based on a mode control signal.

An embodiment of this invention uses a massive parallel interconnect fabric (MPIF) at the flipped interface of a core die substrate (having the core logic blocks) and a context die (used for in circuit programming/context/customization of the core die substrate), to produce ASIC-like density and FPGA-like flexibility/programmability, while reducing the time and cost for development and going from prototyping to production, reducing cost per die, reducing or eliminating NRE, and increasing performance. Other embodiments of this invention enable debugging complex SoC through large contact points provided through the MPIF, provide for multi-platform functionality, and enable incorporating FGPA core in ASIC platform through the MPIF. Various examples are also given for different implementations.

The present disclosure relates to nanoresonator oscillators or NEMS (nanoelectromechanical system) oscillators. A circuit for measuring the oscillation frequency of a resonator is provided, comprising a first phase-locked feedback loop locking the frequency of a controlled oscillator at the resonant frequency of the resonator, this first loop comprising a first phase comparator. Furthermore, a second feedback loop is provided which searches for and stores the loop phase shift introduced by the resonator and its amplification circuit when they are locked at resonance by the first loop. The first and the second loops operate during a calibration phase. A third self-oscillation loop is set up during an operation phase. It directly links the output of the controllable phase shifter to the input of the resonator. The phase shifter receives the phase-shift control stored by the second loop.

Embodiments provide a multi-phase voltage controlled oscillator (VCO) that produces a plurality of output signals having a common frequency and different phases. In one embodiment, the VCO may include a passive conductive structure having a first ring and a plurality of taps spaced around the first ring. The VCO may further include a capacitive load coupled to the passive conductive structure, one or more feedback structures coupled between a pair of opposing taps of the plurality of taps, and one or more current injection devices coupled between a pair of adjacent taps of the plurality of taps.

The present invention proposes a digital system and method of measuring (estimating) non-energy parameters of the signal (phase, frequency and frequency rate) received in additive mixture with Gaussian noise. The first embodiment of the measuring system consists of a PLL system tracking variable signal frequency, a block of NCO full phase computation (OFPC), a block of signal phase primary estimation (SPPE) and a first type adaptive filter filtering the signal from the output of SPPE. The second embodiment of the invention has no block SPPE, and NCO full phase is fed to the input of a second type adaptive filter. The present invention can be used in receivers of various navigation systems, such as GPS, GLONASS and GALILEO, which provide precise measurements of signal phase at different rates of frequency change, as well as systems using digital PLLs for speed measurements.

A method, an apparatus, and a computer program product are provided. The apparatus tunes a frequency provided by a VCO. The apparatus determines a relative capacitance change associated with a first frequency and a desired frequency from a look-up table. The apparatus adjusts a capacitor circuit in the VCO based on the determined relative capacitance change determined from the look-up table in order to tune from the first frequency to the desired frequency. The apparatus determines that the frequency provided by the VCO is a second frequency different than the desired frequency after adjusting the capacitor circuit. The apparatus performs an iterative search to further adjust the capacitor circuit when a difference between the second frequency and the desired frequency is greater than a threshold.

Disclosed are a phase locked loop (PLL) of a digital scheme and a method thereof. More specifically, disclosed are a digital phase locked loop having a time-to-digital converter (TDC), a digital loop filter (DLF), and a digitally controlled oscillator (DCO), and that is designed to have a constant jitter characteristic at all times even though an operating condition of a circuit varies according to a process, voltage, temperature (PVT) change, and a method thereof.

An assembly structure of an electronic control unit and a coil assembly of a solenoid valve for an electronic brake system connected to the electronic control unit having a printed circuit board and applying power to the solenoid valve. The coil assembly is penetrated to allow an upper portion of the solenoid valve to be fitted thereinto, and includes a cylindrical bobbin provided with a coil and a coil case. The electronic control unit is provided with a housing having an insertion groove and joined to the hydraulic control unit, the printed circuit board being disposed spaced apart from the coil assembly, and the housing is provided with an elastic member having one end contacting the printed circuit board and the other end contacting the coil case. The elastic member is configured with a coil spring to produce different elastic forces.

A flush adaptor for use with a valve fitment assembly for dispensing liquids from a container; wherein the flush adaptor comprises an outer ring-collar; a flange with an edge molded to the bottom of the outer ring-collar; an interior ring-collar adjacent to the outer ring-collar; a ridge molded in the interior ring-collar; a seat molded onto the interior ring-collar and a pin molded into the interior ring-collar which keeps the valve in an open position; and a hollow tube molded into the adaptor to allow the flow of liquid through the adaptor and into the fitment assembly; whereby the flush adaptor allows for cleaning of the assembly and any tubes connected thereto.

A fuel system valve assembly may include a housing, a spring, and a body. The housing may have a fuel passage defined in part or more by a fuel passage wall. The fuel passage wall may have a seat and a cylindrical section. The cylindrical section may have a constant diameter and may be located downstream of the seat. In use, the body may reciprocate linearly in the housing between an open position and a closed position. The body may be biased to the closed position by the spring. The body may abut the seat when the body is in the closed position.

Power-efficient actuator apparatus and methods. In one exemplary embodiment, the actuator assembly utilizes a shape memory alloy (SMA) filament driven by an electronic power source to induce movement in the underlying assembly to actuate a load (e.g., water valve). In addition, a circuit board is included which allows the actuator assembly to be readily incorporated or retrofit into a wide range of systems such that the signal characteristics of the supply line can, among other applications, be conditioned in order to protect the SMA filament. Furthermore, the circuit board can also readily be adapted for use with “green” power sources such as photovoltaic systems and the like. Methods for manufacturing and utilizing the aforementioned actuator assembly are also disclosed.

A filler assembly is mounted in an axial hole of a cap of a valve. The filler assembly includes at least one first filler and at least one second filler stacked in a longitudinal direction. A valve rod received in the axial hole extends through the at least one first filler and the at least one second filler. At least one of two mutually abutting faces respectively of the at least one first filler and the at least one second filler is at a non-parallel angle to a radial direction perpendicular to the longitudinal direction. If one of the at least one first filler and the at least one second filler is subjected to a pressing force in the longitudinal direction, at least one of the at least one first filler and the at least one second filler is moved in the radial direction to press against the valve rod.

A seal member for an aseptic coupling device includes a cross-sectional area including a first end portion, a middle portion, and a second end portion opposite the first end portion, the middle portion being thinner in radial dimension than the first and second end portions.

An apparatus includes a light foil device configured to move based on radiation pressure associated with light received by the light foil device. The apparatus includes a mechanism configured to transition between operational states in response to the movement of the light foil device, or includes a valve configured to control a flow of material through a conduit based, at least in part, on the movement of the light foil device.

For a flap assembly, in particular an exhaust gas flap assembly, with the flap mounted on both sides via bearing devices in the housing, the disclosure describes a design in which a bearing body is supported radially against an annular collar of the bearing device and, by way of the annular collar, is held braced in a radially spring-loaded manner in a predefined radial position.

The present invention involves, in some embodiments, systems and methods involving fluid handling apparatus for pumping fluid to and from a patient, which may include a reusable component and a disposable pumping cartridge. The reusable component may comprise a control chamber and a pressure transducer configured to measure a gas pressure associated with the control chamber, as well as a processor. The processor may be configured to supply the control chamber with a gas at a predetermined pressure, monitor the gas pressure associated within the control chamber with the pressure transducer over a predetermined period of time, and determine if the change in gas pressure associated within the control chamber exceeds a maximum allowable predetermined limit.

A method and device for the production of books, including: moving book blocks successively along a conveying section of a book production line; supplying a stack of book cases to the book production line; identifying a marking on each of the book blocks and the book cases; transmitting an identified marking on at least one book case to a machine control of the book production line; assigning a dataset stored in the machine control for a sequence of book cases to the supplied stack; determining a sequence in the machine control for book blocks positioned on the conveying section; comparing the dataset for the sequence of the book cases to the sequence of the book blocks; and removing and/or supplying at least one book block from or to the conveying section if the sequence of the book blocks deviates from the sequence of the book cases using the machine control.

A sheet processing apparatus which is capable of completing a bound document containing appropriately Z-folded sheets when performing folding together with edge cutting and binding. The sheet processing apparatus controls a Z-folding process, a cutting process, and a binding process for a sheet. A first folding position from a free end of the sheet coincides with a position corresponding to half a width of the sheet excluding a cut width of the sheet a binding margin, when the Z-folding process, the cutting process, and the binding process are executed.

A supply device (10) for a machine for transversely cutting two strips (11 and 12) of a flexible material, in particular a strip of paper, moving continuously, to produce separate stacks of documents cut transversely according to predetermined formats. The device comprises lower and upper driving mechanisms (13, 14) associated with the two strips (11, 12) of flexible material respectively, which each include a mechanically rotated first roller (13a, 14a) and a freely rotatable second bearing roller (13b and 14b). The driving mechanism is mounted on a frame (15) supported by a movable platform (16) which is rigidly connected to a linear actuator (17) arranged to be moved transversely with respect to the direction of movement of the strips (11 and 12). Optical reading cells (11a, 11b, 12a, 12b) define the operating modes of the driving servomotors (13b and 14b) and of the linear actuator (17).

In a first step, in a printed material web (1) moved in a feed direction, a first material web part (5) which is formed by a material web section (1a)is folded against the rest of the material web (6) that is formed from two material web portions (1b, 1c)).In the region of a connecting line (2b) extending between neighbouring material web sections (1b, 1c) the two material web parts (5,6) are connected to one another by a means of a bonding adhesive. In a subsequent step the material web (1) is folded again along a line (2b) extending between two neighbouring material web sections. (1b, 1c)All material web sections (1a, 1b, 1c) lie above one another. Subsequently, multi-page sub-products (11), the pages (12a, 12b, 12c) of which are connected to one another in the region of the spine (13) of the sub-product, are separated from the twice-folded material web (1). Finally, the sub-products (11) are placed on top of one another to form a stack (16) and are connected to one another in the region of the spine (13) thereof by means of a bonding adhesive.

A creasing device forms a crease in a to-be-folded portion of a sheet. The creasing device includes a sheet-information reading unit that reads any one of sheet information and binding information; a determining unit that determines a surface, on which the crease is to be formed, of the sheet according to the one of the sheet information and the binding information read by the sheet-information reading unit; and a creasing unit that forms the crease on the surface determined by the determining unit.

A land grid array (LGA) package including a substrate having a plurality of lands formed on a first surface of the substrate, a semiconductor chip mounted on a second surface of the substrate, a connection portion connecting the semiconductor chip and the substrate, and a support layer formed on part of a surface of a first land.

Maskless hybrid laser scribing and plasma etching wafer dicing processes are described. In an example, a method of dicing a semiconductor wafer having a front surface with a plurality of integrated circuits thereon and having a passivation layer disposed between and covering metal pillar/solder bump pairs of the integrated circuits involves laser scribing, without the use of a mask layer, the passivation layer to provide scribe lines exposing the semiconductor wafer. The method also involves plasma etching the semiconductor wafer through the scribe lines to singulate the integrated circuits, wherein the passivation layer protects the integrated circuits during at least a portion of the plasma etching. The method also involves thinning the passivation layer to partially expose the metal pillar/solder bump pairs of the integrated circuits.

An apparatus including a die including a dielectric material on a device side, an insulating layer surrounding a die area and embedding a thickness dimension of the die; and a carrier including a plurality of layers of conductive material disposed on the device side of the die, a first one of the layers of conductive materials being formed on the insulating layer and patterned into traces at least a portion of which are connected to respective contact points on the die. A method including disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; disposing a mold on the sacrificial substrate around; introducing an insulating material into a chase of the mold; removing the mold; forming a carrier on the insulating material adjacent a device side of a die; and separating the die and the carrier from the sacrificial substrate.

In a disclosed embodiment, a method for tiling selected vias in a semiconductor device having a plurality of vias comprises generating a layout database for the semiconductor device; creating zones around the plurality of vias; measuring density of covering metal in each zone; selecting a low density zone as being a zone that has a metal density less than a threshold metal density; and adding at least one tiling feature on a metal layer above the plurality of vias in the low density zone so that metal density of the low density zone increases to at least the same as the threshold metal density.

Methods for the fabrication of a Microelectromechanical Systems (“MEMS”) devices are provided, as are MEMS devices. In one embodiment, the MEMS device fabrication method includes forming at least one via opening extending into a substrate wafer, depositing a body of electrically-conductive material over the substrate wafer and into the via opening to produce a via, bonding the substrate wafer to a transducer wafer having an electrically-conductive transducer layer, and forming an electrical connection between the via and the electrically-conductive transducer layer. The substrate wafer is thinned to reveal the via through a bottom surface of the substrate wafer, and a backside conductor is produced over a bottom surface of the substrate wafer electrically coupled to the via.

Disclosed herein is a single mask package apparatus on a device comprising a first substrate having a land disposed on a first surface, a stud disposed on the land and a protective layer disposed over the first surface of the first substrate and around the stud. The protective layer may optionally have a thickness of at least 3 μm. A PPI may be disposed over the protective layer and in electrical contact with the stud, with a first portion of the PPI extending laterally from the stud. An interconnect may be disposed on and in electrical contact with the first portion of the PPI, and a second substrate mounted on the interconnect. A molding compound may be disposed over the PPI and around the interconnect. The stud may be a substantially solid material having a cylindrical cross section and may optionally be wirebonded to the land.

A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

A microelectronic assembly and method of making, which includes a first microelectronic element (including a substrate with first and second opposing surfaces, a semiconductor device, and conductive pads at the first surface which are electrically coupled to the semiconductor device) and a second microelectronic element (including a handler with first and second opposing surfaces, a second semiconductor device, and conductive pads at the handler first surface which are electrically coupled to the second semiconductor device). The first and second microelectronic elements are integrated such that the second surfaces face each other. The first microelectronic element includes conductive elements each extending from one of its conductive pads, through the substrate to the second surface. The second microelectronic element includes conductive elements each extending between the handler first and second surfaces. The conductive elements of the first microelectronics element are electrically coupled to the conductive elements of the second microelectronics element.

The present invention provides an electroconductive sheet and a touch panel which do not impair visibility in a vicinity of an electrode terminal in a sensing region. In an electroconductive sheet which has an electrode pattern constructed of a metal thin wire and an electrode terminal that is electrically connected to an end of the electrode pattern, a transmittance of the electrode pattern is 83% or more, and when the transmittance of the electrode pattern is represented by a %, a transmittance of the electrode terminal is controlled to be (a-20)% or more and (a-3)% or less.

A display apparatus includes a lower substrate, an upper substrate, a spacer and an image display layer. The spacer includes a main spacer, a first sub-spacer and a second sub-spacer. The main spacer has a height greater than that of the first and second sub-spacers. The second sub-spacer has an area wider than that of the main spacer and the first sub-spacer.

A liquid crystal display panel, including: a pixel electrode formed on a first substrate; an alignment layer formed on the pixel electrode, wherein the alignment layer includes an alignment layer material and aligns first liquid crystal molecules in a direction substantially perpendicular to the pixel electrode; and a photo hardening layer formed on the alignment layer, wherein the photo hardening layer includes a photo hardening layer material and aligns second liquid crystal molecules to be tilted with respect to the pixel electrode, wherein the alignment layer material and the photo hardening layer material have different polarities from each other.

According to one embodiment, a first gene encodes a reporter protein. The first gene is disposed at the downstream of the gene promoter. A second gene is disposed at the downstream of the gene promoter and encodes a replication origin-binding protein. An internal ribosome entry site is disposed between the first gene and the second gene. The transcription termination signal sequence encodes a signal for terminating the transcription of the first gene and the second gene. A replication origin sequence is recognized by the replication origin-binding protein.