This blog describes how to efficiently use Virtuoso Visualization and Analysis XL.(read more)

In my last blog, Getting Your Existing SiP File Into Virtuoso RF, I talked about the new enhancements in ICADVM20.1 ISR25 for Virtuoso RF Solution. At the end of the blog, I told you about the Fully Assisted Roundtrip flow, which includes importing SiP files that are compatible with the Virtuoso RF Solution assisted import flow into the Virtuoso platform. Let's examine how the Fully Assisted Roundtrip flow works in this blog.(read more)

Concurrent Layout Editing enables more than one designer to work in a hierarchy at the same time. Check out this blog to know more. (read more)

This blog introduces the new Voltus-XFi Custom Power Integrity Solution, a transistor-level EM-IR tool that enables designers to complete comprehensive analysis and debugging easily and quickly.(read more)

Is there a way to set a thru via hole to thru via hole spacing constraint?

I need the hole to hole spacing, nit pad to pad spacing.

I can calculate the spacing using the via pad diameter, but this won't work for multiple via pad sizes.

I am trying to figure out the most efficient workflow for adding test points. My use case involves adding ~100 or so SMT pads at the bottom for bed-of-nails ICT test that are required to be on a test point grid. A lot of the nets are on the top or from inner layers and so have to be brought to the bottom using stubs. I'm used to Xpediiton workflow of being able to set a test point padstack, set a test point grid, and then select a net, add the test point to the bottom layer on the grid with that net attached and then route the stub with gridless routing.

In Orcad, it seems I need to route the stub, switch layer pairs to be both bottom once I bring the stub to the bottom and then change the grid to be the test point grid and then add the test point on the grid. It requires a lot of clicks, very mistake prone requiring lots of oops and very slow for 100+ test points to be brought out at the bottom. 

I'm sure there is a better way that is used by folks with a lot of Orcad experience. Any suggestions?

Hello,

I have a sensitive trace on layer 2 and I would like to prevent any routing along or across it on adjacent layers (L1 and L3).

My idea was to use a route keepout shape on L1 and L3, however that also removed the ground pour on those layers and I would like to keep the ground pour.

Can I get around this somehow or should I use something else than route keepout?

Regards,

Filip

I have a small shape for connecting three SMD pads, but it won't connect to one of the pads (0.2x0.6 mm). Thermal relief connects are set to Full contact for SMD pin in Shape parameters, but that doesn't help.

However, if I decrease the Minimum aperture for gap width in Void controls in Shape parameters to something below 0.2 mm the shape connects to the pad. But it is a little contracted at the pad entrance. Just 0.002 mm. What is going on here? 

Tried to attach some pictures, but I get: "An error occurred. Please try again or contact your administrator.". Will try later again.

/F

Hi

I have fixed a SPACING RULE (SP1) for a CLASS_DIFF_PAIR whereas for via associated to the net (DP_VIA), the DISTANCE > 60mils respect to ANY other vias (PTH, BB, TEST vias)

Now my problem is that this rules should NOT be applied for GND VIAS (STICHING VIA) which must be placed at a distance < 40mils respect to DP_VIA

How to create an exemption to the SPACING RULE (SP1)?

Dear Community,

I have created a PCB layout with multiple high-speed nets, I want to check the SI like how signals are reflected and taken to each other.

I have the OrCAD X Professional, how to check the reflection and crosstalk using the OrCAD X Professional software version 24.1.

I want to create a topology flow to the PCB layout and perform the reflection and crosstalk.

Regards,

Rohit Rohan

Hai Community,

I have a PCB board which has multiple high speed nets and I want to perform the EMI and EMC checking.

Which Cadence tool should I use for checking the EMI and EMC coupling?

Regards,

Rohit Rohan

Dear Community,

I have created a PCB board and let's say I have found some parts of the PCB board where there are impedance issues, then how to resolve that impedance issue using the OrCAD X Professional.

Regards,

Rohit Rohan

Socionext, a leader in SoC design, recently made significant strides in enhancing its design efficiency for a complex billion-gate project. Faced with the initial challenges of lengthy eight-day iterations and a protracted two-month timing signoff process, the objective was to reduce the iteration cycle to just three days. By integrating Cadence's cutting-edge solutions—Certus Closure Solution, Tempus Timing Solution, and Quantus Extraction Solution—Socionext achieved remarkable improvements.

Notably, the Tempus DSTA tool dramatically cut timing closure time by 73%, outperforming conventional single-machine STA methods. This achievement, combined with the synergistic use of Cadence's Certus Closure and Tempus Timing solutions, allowed Socionext to meet their ambitious three-day iteration target and double productivity. Additionally, integrating these solutions significantly decreased both human and machine resource needs, slashing memory and disk costs by up to 90% and halving engineering resources during the optimization and signoff phases.

For more on this collaboration, check out the "Designed with Cadence" success story video on Cadence's website and YouTube channel.

Also, don't miss the on-demand webinar "Fast, Accurate STA for Large-Scale Design Challenges," which provides a deeper dive into Socionext's breakthroughs and the innovative solutions that powered their success.

The blog discusses Voltus InsightAI RAK that is designed to give you an accelerated start on the execution of Voltus InsightAI flow.(read more)

The world of electronics design thrives on efficient tools that bridge the gap between concept and silicon. Virtuoso Digital Implementation is a powerful ally for mixed-signal designs, which integrate both analog and digital components. This blog post will examine Virtuoso Digital Implementation's capabilities and explore how it can streamline your mixed-signal design workflow.

Virtuoso Digital Implementation in a Nutshell

Virtuoso Digital Implementation is a license package within the Cadence Virtuoso Design Platform. It offers a streamlined RTL-to-GDSII flow to implement smaller digital blocks within a mixed-signal design environment. Here's what makes Virtuoso Digital Implementation stand out:

• Focus on Small Digital Blocks: Optimized for digital blocks with an instance count of up to 50,000 (expandable to 150,000 with specific configurations), Virtuoso Digital Implementation is ideal for integrating digital logic into your analog-centric design.
• Leveraging Industry Leaders: Virtuoso Digital Implementation utilizes cut-down versions of the renowned Cadence Genus Synthesis Solution and Innovus Implementation System under the hood. This ensures you get access to proven technologies for logic optimization and place-and-route.
• Seamless Integration with the Virtuoso Environment: Virtuoso Digital Implementation's key advantage is its tight integration with the Virtuoso Layout Suite. You can launch the synthesis and place-and-route tools directly from the Virtuoso environment, eliminating the need to switch between platforms.

Benefits of Using Virtuoso Digital Implementation

 By incorporating Virtuoso Digital Implementation into your mixed-signal design flow, you can get several benefits:

• Simplified Workflow: Virtuoso Digital Implementation offers a centralized environment for both digital block implementation and layout editing within the Virtuoso environment. This reduces context switching and streamlines the design process.
• Faster Time-to-Market: Virtuoso Digital Implementation's streamlined workflow can significantly reduce design turnaround times, allowing you to get your product to market quicker.
• Improved Design Quality: Leveraging industry-leading synthesis and place-and-route engines from Cadence ensures high-quality digital block implementation within your mixed-signal design.

Who Should Consider Virtuoso Digital Implementation?

 Virtuoso Digital Implementation is a valuable tool for anyone working on mixed-signal designs with smaller digital blocks. It's particularly well-suited for:

• Analog IC designers who need to integrate digital logic into their designs.
• Circuit design teams working on mixed-signal applications like data converters, power management ICs, and RF transceivers.

Virtuoso Digital Implementation provides a compelling solution for designers working on mixed-signal projects. Its streamlined workflow, tight integration with the Virtuoso design platform, and access to proven digital design tools can significantly improve design efficiency and time-to-market. Virtuoso Digital Implementation is worth considering if you're looking to optimize your mixed-signal design flow.

I am here to help and guide you on how to learn more about Virtuoso Digital Implementation flow.

Welcome to Virtuoso Digital Implementation, an online course recently released. This course teaches implementing digital blocks using Cadence tools based on the Virtuoso Digital Implementation flow. Also, you can download a lab database after the lecture and get hands-on experience in each stage.

Want to Enroll in this Course?

We organize this Virtuoso Digital Implementation training for you as a "Blended" or "Live" training. Please reach out to Cadence Training for further information.

Register for the Online Training with the following steps:

• Log on to cadence.com with your registered Cadence ID and password.
• Select Learning from the menu > Online Courses.
• Search for Virtuoso Digital Implementation using the search bar.
• Select the course and click Enroll.

And don't forget to obtain your Digital Badge after completing the training!

Related Resources

Online Courses

• Cadence RTL-to-GDSII Flow v6.0
• Virtuoso Digital Implementation Training

Training Byte Videos

• How Do You Run Placement Optimization in the Innovus Implementation System?
• How to Run the Synthesis Without DFT?
• How to Run the Synthesis Flow with DFT?
• Creating Power Rings, Power Stripes, and Power Rails in the Innovus Implementation System
• How to Run Power Analysis and Analyze the Results in Innovus?

Happy Learning!

Designing 3D-ICs with integrity involves a commitment to ethical practices, reliability, and sustainability throughout the design and manufacturing process. This includes using environmentally friendly materials, ensuring robust and efficient performance, and incorporating thorough testing and verification. By prioritizing transparency, responsibility, and long-term sustainability, designers can create advanced integrated circuits that meet high standards of quality and social responsibility.

Start Learning Now!

Start with our Designing with Integrity 3D-IC online course, which introduces Integrity 3D-IC, the industry's first comprehensive, high-capacity 3D-IC platform that integrates 3D design planning, implementation, and system analysis in a single, unified environment. You will be guided through the following activities involved in designing a silicon interposer with a digital ASIC and HBM2 interface in a 2.5D configuration.

• You will design the interposer from scratch in the new Integrity System Planner and the Integrity 3D-IC implementation environment.
• You will examine the ASIC and interposer designs using some of the new 3D-IC multi-die design features.
• You will route the interposer using some of the new advanced routing capabilities with NanoRoute

—and this in only two days!

WATCH VIDEO

Interested? Get an overview in less than two minutes.

Are you primarily interested in selected snippets instead? Then, take our Training Bytes, which—like the online training course—are available to Cadence customers for free 24/7 in the Cadence Learning and Support portal.

Cadence Training Services now offers free Digital Badges for all popular online training courses. These badges indicate proficiency in a certain technology or skill and give you a way to validate your expertise to managers and potential employers. You can add the digital badge to your email signature or any social media channels, such as Facebook or LinkedIn, to highlight your expertise.

To find out more, see the blog post. It’s the Digital Era; Why Not Showcase Your Brand Through a Digital Badge!

Related Resources

• 3D-IC Introduction (Video)
• 3D-IC Development Process With Challenges. (Video)
• Demo: How to Create the Interposer Contact Pads and Die Connectivity Using the Integrity 3D-IC? (Video)
• Demo: How To Pull The Interposer Design From System Planner Into Integrity 3D-IC Layout? (Video)
• Demo: Routing The Interposer Design Using The Integrity 3D-IC Layout_Part 1 (Video)
• Demo: Routing The Interposer Design Using The Integrity 3D-IC Layout_Part 2 (Video)
• Demo: How To Create C4 Bumps For NC Connections And Generating C4 Dummy Cover Bumps In Integrity 3D-IC? (Video)

Related Blogs

• How Cadence Is Expanding Innovation for 3D-IC Design
• Training Bytes: They May Be Shorter, But the Impact Is Stronger!
• Training Insights — 3D-IC: What Is Silicon Interposer?
• System Analysis Knowledge Bytes: What’s New in the Clarity 3D Solver Course
• System Analysis Knowledge Bytes - Early System-Level Thermal Analysis
• 3D-IC: The Future of Integrated Electronics Is the Future of Electronics Itself

Related Trainings

• OrbitIO System Planner
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A more appropriate title for this blog could be “All Vehicles with ADAS Need the Midas Functional Safety Platform”.

EVs tend to have advanced driving assistance systems (ADAS) because they’re newer, but not all vehicles with ADAS are EVs!

Certifying Advanced Driver Assistance Systems (ADAS) is a multifaceted process involving rigorous testing, validation, and regulatory compliance to ensure safety and reliability.
As ADAS technologies become increasingly sophisticated, the certification process is evolving to meet these challenges.

The ISO26262 standard provides the requirements to be met to attain safety certification for digital designs.

One of the key aspects of ADAS certification is functional safety. This includes:

• Ensuring the system operates as intended under all conditions, including failures.
• Adherence to standards like ISO26262.
• Rigorous testing to identify potential hazards and mitigate risks.

The Midas Safety Platform provides early-phase exploration of functional safety architectures and leverages native chip design data to perform accurate safety analysis efficiently.

The platform is a unified solution available across Cadence products, and with its modular architecture, it supports both embedded and standalone usage with the Cadence flow.

After extracting the design information, an output Midas database file contains the isolated DUT and provides the design components and their fault tolerances to various tools in the flow.

Conformal can easily verify design transformations that include necessary components like TMR for safety.

In these videos, we explore how to create reports for both Transient and Permanent faults.

Creating Detailed FMEDA in Midas (Video)

Creating Architectural FMEDA in Midas (Video) 

Also, read this blog post for additional motivation: What Is Zonal Architecture? And Why Is it Upending the Automotive Supply Chain?

What Next?

Join the Midas Safety Platform Introduction and the Functional Safety Implementation and Verification with Midas trainings and learn more about:

• Setting up and defining the USF file
• Using the Midas Safety Platform to create functional safety reports, and
• Midas integration with the Genus  Synthesis Solution, Innovus  Implementation System, and Conformal Equivalence Checker tools to implement functional safety

The online class is free for all Cadence customers with a Cadence Learning and Support Portal account. If you don’t have a Cadence Support account, go to Registration Help or Register Now and complete the requested information. For instructor-led training sessions "Live" or "Blended" please contact Cadence Training.

Please don't forget to obtain your Digital Badge after completing the training. Add your free digital badge to your email signature or any social media and networking platform to show your qualities and build trust, making you and your projects even more successful.

If you want to make sure you are always the first to know about anything new in training, then you can use the SUBSCRIBE button on the landing page to sign up for our regular training newsletters.

In this training webinar, we explore the concepts of RTL design, design verification, and coverage analysis while unveiling the exciting world of front-end design flow. We will guide you through the essential steps in creating integrated circuits, the building blocks of modern electronics.

We’ll break down the process into manageable stages, from defining the chip’s functionality to its physical realization. We’ll investigate the front-end part of the RTL-to-GDSII flow—from specification to functional verification and design coverage—and explore:

• Key concepts of specifying chip behavior and performance
• How to translate ideas into a digital blueprint and transform that into a design
• How to ensure your design is free of errors

This webinar provides practical knowledge, making it your gateway to understanding the magic behind RTL-to-GDSII front-end design flow.

When Is the Webinar?

Date and Time

Wednesday, September 18, 2024
07:00 PDT San Jose / 10:00 EDT New York / 15:00 BST London / 16:00 CEST Munich / 17:00 IDT Jerusalem / 19:30 IST Bangalore / 22:00 CST Beijing 

REGISTER

To register for this webinar, sign in with your Cadence Support account (email ID and password) to log in to the Learning and Support System.

Then select Enroll to register for the session. Once registered, you’ll receive a confirmation email containing all login details.

If you don’t have a Cadence Support account, go to Cadence User Registration and complete the requested information. Or visit Registration Help.

For inquiries or issues with registration, reach out to eur_training@cadence.com.

For inquiries or issues with registration, reach out to eur_training@cadence.com.

To view our complete training offerings, visit the Cadence Training website.

Want to share this and other great Cadence learning opportunities with someone else? Tell them to subscribe.

Want to Learn More?

This link gives you more information about the related training course and a link to enroll:

Cadence RTL-to-GDSII Flow Training

The course includes slides with audio and downloadable laboratory exercises designed to emphasize the topics covered in the lecture. There is also a Digital Badge available for the training.

The online class is free for all Cadence customers with a Cadence Learning and Support Portal account. For instructor-led training sessions "Live" or "Blended" please contact Cadence Training.

Also, take this opportunity to register for the free Online Trainings related to this webinar topic.

Cadence RTL-to-GDSII Flow

Xcelium Simulator

Verilog Language and Application

Xcelium Integrated Coverage

Related Training Bytes

How to Run the Synthesis Without DFT?

How to Run the Synthesis Flow with DFT? (Video)

Related Blogs

Did You Miss the RTL-to-GDSII Webinar? No Worries, the Recording Is Available!

Training Insights – Why Is RTL Translated into Gate-Level Netlist?

Training Bytes: They May Be Shorter, But the Impact Is Stronger!

Cadence Support - A Round-the-Clock Problem Solver, Webinar Recording Available!

The traditional methods of power analysis lag by various shortcomings and challenges:

• Getting an accurate measure of RTL power consumption during design exploration
• Getting consistent power through the design progress from RTL to P&R.
• System-level verification tools are disconnected from the implementation tools that translate RTL to gates and wires.

The Cadence Joules RTL Power Solution closes this gap by delivering time-based RTL power analysis with system-level runtimes, capacity, and high-quality estimates of gates and wires based on production implementation technology. The Cadence Joules RTL Power Solution is an RTL power analysis tool that provides a unified engine to compute gate netlist power and estimate RTL power. The Joules solution delivers 20X faster time-based RTL power analysis and can analyze multi-million instance designs overnight, with impressive accuracy within 15% of signoff power.

Moreover, it integrates seamlessly with numerous Cadence platforms, eliminating compatibility and correlation issues! In addition, the Joules RTL Power Solution GUI (Graphical User Interface) helps you analyze/debug the power estimation/results using several GUI capabilities.

Want to take a tour of this power estimation world? Gear up to attend the training class created just for you to dive deep into the entire flow and explore this exciting power estimation method/flow with hands-on labs in two days!

Training

In the Joules Power Calculator Training course, you will identify solutions and features for RTL power using Cadence Joules RTL Power Solution. You will set up and run the RTL power flow with Joules RTL Power Solution and identify Joules's Graphical User Interface (GUI) capabilities. The training also explores how you can estimate power using vectorless power, stimulus flow, RTL Stim to Gate flow, and replay flow, and also interfaces Joules with Cadence's Palladium Emulation Platform. You will estimate power at the chip level and understand how to navigate the design and data mining using Joules.

The training also covers power exploration features and how to analyze ideal power and ODC-driven sequential clock gating. You will identify low-activity registers at the clock gate. You will also identify techniques to analyze power, generate various reports, and analyze results through Joules GUI. The training covers multiple strategies to debug low stimulus annotation and how you can better correlate RTL power with signoff. You also identify Genus-Joules Integration. In addition, we ensure that your learning journey is smooth with hands-on labs covering various design scenarios.

Lab Videos

To start you on your exciting journey as an RTL power analysis expert, we have created a series of short channel lab videos on our Customer Support site: Lab Demo: Setting Up and Running Basic RTL Power Flow in Joules RTL Power Solution (Video). You can refer to each lab module's instructions in demo format. This will help accelerate your tool ramp-up and help you perform the lab steps more quickly if you are stuck. You might be a beginner in the RTL power analysis world, but we can help you sail through it smoothly.

What's Next?

Grab your badge after finishing the training and flaunt your expertise!

Related Training

• Genus Low-Power Synthesis Flow with IEEE 1801
• Low-Power Synthesis Flow with Genus Stylus Common UI

Related Blogs

• Do You Want to Flaunt Your Expertise? Grab the Digital Badge Today!
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• Let's Replay the Process of Power Estimation with the Power of 'x'
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• What's Inside Joules Graphical User Interface
• Joules – Power Exploration Capabilities

Power efficiency is a critical factor in the fast-evolving world of semiconductor design.

The IEEE 1801 standard, also known as UPF (Unified Power Format), was developed by the IEEE to address the intricate challenges associated with power management in contemporary semiconductor designs. This standard offers a uniform framework for defining power domains, power states, and power intent, ensuring consistency across diverse tools and phases of the design process. By utilizing UPF, you can precisely model and regulate power consumption, a critical aspect for battery-operated devices, high-performance computing, and energy-efficient designs.

The key concepts of IEEE 1801 are:

1. Power domains
2. Power states
3. Power gating and isolation
4. Power switches
5. Level shifters, isolation, and retention cells
6. Macro model

Based on these building blocks, you write the power intent of the design.

The power intent for the design includes identifying/implementing low-power strategies that provide a clear description of the power architecture of a design.

The power definitions can effectively manage power consumption and ensure the chip meets its power and performance requirements.

You can start by creating the Power Supply Network, which defines how power is supplied to the design's various power domains and logic cells.

What's the next step to build the file? How do you understand the various concepts related to IEEE 1801? How do you complete the rest of the power intent file?

Relax!

Gear up to attend the training class created just for you to dive deep into the entire format and explore this exciting power specification method/format with hands-on labs in one day!

Training

Fundamentals of IEEE 1801 Low-Power Specification Format Training

This course is a complete tutorial for understanding the fundamentals of IEEE 1801 low-power specification format concepts. You learn about IEEE 1801 power supply networks, ground ports and nets, creating and connecting supply ports/nets, power domain, power switch, power states, defining isolation and level shifter strategies, hierarchical IEEE 1801, and various versions of the IEEE 1801. You also explore how power intent information can be used for a design across various flow stages, such as functional verification, synthesis, logic equivalency checking, place-and-route, test, timing signoff, power integrity, and so forth, using Cadence^® tools.

Labs

We ensure that your learning journey is smooth with hands-on labs covering various design scenarios.

Lab Videos

Now, the exciting part is that to help you further, we have created engaging videos of the training labs. You can refer to the lab module's instructions in demo format at https://support.cadence.com.

Lab Demo: Checking Power Supply Network in IEEE 1801 format and Running IEEE 1801 Quality Checks using Conformal Low Power

Lab Demo: Checking Power Intent for The Macro Connections in IEEE 1801 Format And Running IEEE 1801 Quality Checks using Conformal Low Power 

Online Class

Here is the course link.

Get ready for the most thrilling experience with Accelerated Learning!

The more you know, the faster you go!

Grab the cycle  or hike it, based on your existing knowledge.

Take the quiz and increase your learning pace!!

What's Next?

Grab your Badge after finishing the training and flaunt the expertise you have built up. 😊

Ready to take a tour of this power specification world? Let's help you enroll in this course.

We organize this training for you as a "Blended" or "Live" training. Please reach out to Cadence Training for further information. If you want to ensure you are always the first to know about anything new in training, you can use the SUBSCRIBE button on the landing page to sign up for our regular training newsletters.

Related Short Training Bytes/Videos

Enhance the learning experience with short videos:

Genus Synthesis Solution: Video Library

 Joules RTL Power Solution: Video Library

Related Training

 Low-Power Synthesis Flow with Genus Synthesis Solution

Genus Low-Power Synthesis Flow with IEEE 1801

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Conformal ECO Designer enables you to implement RTL engineering change orders (ECOs) for pre- and post-mask layout and offers early ECO prototyping capabilities for driving critical project decisions.

Conformal ECO compares two designs and generates a functional patch that implements the changes between the two designs.

One major criterion for determining patch quality is whether the patch can meet timing closure. To determine this, you typically need to run the time-consuming process of incremental synthesis and place-and-route. Instead, Conformal can analyze path logic depth changes before and after ECO patch generation. This provides a faster way to evaluate timing impact in patch generation stages.

After the patch is created and applied, it is passed to Genus to optimize the patch.

During patch optimization, you can choose to do many things like:

• Keeping constants in the patch
• Allowing tie cell inversion
• Specifying tie cell types
• Preserve DFF cells and cell types in the patch
• Preserve all cells and nets in the patch
• Preserve clock buffer cell in the patch
• Turn on/off sequential constant and sequential merge in patch optimization
• Allowing phase mapping for DFFs
• Map to spare cells
• Force fix DRC before timing

What's Next?

Join the Conformal ECO course to:

• Explore the many options and capabilities of Conformal ECO
• Use Conformal Engineering Change Order (ECO) for flat and hierarchical designs
• Generate a functional ECO patch, apply it to a design, optimize it, and map it to a specified technology
• Run a hierarchical design through ECO and run a comparison to prove the ECO is equivalent
• Run a postmask ECO using Conformal ECO GXL

Make sure you have experience with Conformal Equivalence Checker or completed the Conformal Equivalence Checking course before taking this course.

The online class is free for all Cadence customers with a Cadence Learning and Support Portal account. If you don’t have a Cadence Support account, go to Registration Help or Register Now and complete the requested information. For instructor-led training sessions "Live" or "Blended" please contact Cadence Training.

Please don't forget to obtain your Digital Badge after completing the training. Add your free digital badge to your email signature or any social media and networking platform to show your qualities and build trust, making you and your projects even more successful.

The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, machine learning-driven, automated approach to chip design flow optimization. Block engineers specify the design goals, and Cadence Cerebrus will intelligently optimize the Cadence digital full flow to meet the power, performance, and area (PPA) goals in a completely automated way. Use Cerebrus Apps to optimize some aspects of the design as well.

Running a full RTL to GDSII flow, Cadence Cerebrus has a lot of possibilities and combinations of different tool settings to explore.

Using the knowledge from previous runs, combined with on-the-fly analysis within the flow, Cadence Cerebrus can assess many settings combinations and fine-tune the flow accordingly in a very efficient manner.

As technology advances, projects become bigger and way more complex than before. The ability of a single engineer to run simultaneously a large number of blocks in a traditional way is limited. Cadence Cerebrus allows a single engineer to work more efficiently and implement more blocks, while maintaining the same or even better PPA, using compute power.

Being such a revolutionary tool, integrating Cerebrus into your existing flow is surprisingly simple as it can wrap around any existing flow scripts.

Please join me in this course, to learn about the features and basics of Cadence Cerebrus Intelligent Chip Explorer.

We’ll walk through the tool setting stage, explain what is a primitive and how it effects our run, talk about the cost function and the run goals.

We’ll understand the concept of scenarios, learn how to analyze the results of the different runs, and compare them.

In addition, we’ll talk about basic debug rules and methods to analyze failures.

Sounds Interesting?

Please join our “live” one-day Cadence Cerebrus Intelligent Chip Explorer Training @Cadence Feldkirchen planned for October 9th, 2024!

For more details and registration, please contact Training Germany.

If you would like to have an instructor-led training session in another region please contact your local training department.

Become Cadence Certified

Cadence Training Services offers a digital badge for this training course. This badge indicates proficiency in a certain technology or skill and gives you a way to validate your expertise to managers and potential employers. You can highlight your expertise by adding this digital badge to your email signature or any social media platform, such as Facebook or LinkedIn.

Related Training

Innovus Block Implementation with Stylus Common UI

Related Training Bytes

Cerebrus Primitives (Video) 

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Cerebrus - Verifying Distribution Script (Video)

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Cerebrus Web Interface Monitor and Control (Video) 

How to Setup Cerebrus for a Successful Run (Video) 

Flow Wrapping: The Cadence Cerebrus Intelligent Chip Explorer Must Have (Webinar) (Video) 

Cerebrus Cost Functions (Video) 

Related Blogs

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This blog informs about the new badge certification available for Cadence Certus Closure Solution, that grants credit to your proficiency.(read more)

In this recent Training Webinar, we explore the concepts of RTL design, design verification, and coverage analysis while unveiling the exciting world of front-end design flow by guiding you through essential steps involved in creating integrated circuits—the building blocks of modern electronics.

We’ll break down the process into manageable stages, from defining the chip’s functionality to its physical realization. We’ll investigate the front-end part of the RTL-to-GDSII flow—from specification to functional verification and design coverage—and explore:

• Key concepts of specifying chip behavior and performance
• How to translate ideas into a digital blueprint and transform that into a design
• How to ensure your design is free of errors

Watch the Training Webinar recording from September 18, 2024: A Beginner’s Guide to RTL-to-GDSII Front-End Flow

Want to Learn More?

This link gives you more information about this RTL-to-GDSII Flow, the related training course, and a link to enroll:

Cadence RTL-to-GDSII Flow Training

The course includes slides with audio and downloadable laboratory exercises designed to emphasize the topics covered in the lecture. There is also a Digital Badge available for the training.

 Also, take this opportunity to register for the free Online Training related to this Webinar Topic.

Cadence RTL-to-GDSII Flow

Xcelium Simulator

Verilog Language and Application

Learning Maps

The online class is free for all Cadence customers with a Cadence Learning and Support Portal account. For instructor-led training sessions "Live" or "Blended" please contact Cadence Training.

Related Training Bytes

What is RTL Coding In VLSI Design?

What is Digital Verification?

What Is Synthesis in VLSI Design?

What Is Logic Equivalence Checking in VLSI Design?

What Is DFT in VLSI Design?

What is Digital Implementation?

What is Power Planning?

What are DRC and LVS in Physical Verification?

What are On-Chip Variations?

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