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[ Q.5022 (04/20) ] - Signalling procedure of energy efficient device-to-device communication for IMT-2020 network

Signalling procedure of energy efficient device-to-device communication for IMT-2020 network




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[ Q.3963 (04/20) ] - The compatibility testing of SDN-based equipment using OpenFlow protocol

The compatibility testing of SDN-based equipment using OpenFlow protocol




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[ C 819 ] Revision 3 - English - MS Word Document 2007 - Proposal of second draft of K.soft_ba "Overview of particle radiation effects on telecommunications systems"

Proposal of second draft of K.soft_ba "Overview of particle radiation effects on telecommunications systems"
Source: Fujitsu Limited, Xilinx Incorporation




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[ G.9979 (11/18) ] - Implementation of the generic mechanism in the IEEE 1905.1a-2014 standard to include applicable ITU-T Recommendations

Implementation of the generic mechanism in the IEEE 1905.1a-2014 standard to include applicable ITU-T Recommendations




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[ G.9992 (03/19) ] - Indoor optical camera communication transceivers - System architecture, physical layer and data link layer specification

Indoor optical camera communication transceivers - System architecture, physical layer and data link layer specification




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[ G.9991 (03/19) ] - High-speed indoor visible light communication transceiver - System architecture, physical layer and data link layer specification

High-speed indoor visible light communication transceiver - System architecture, physical layer and data link layer specification




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[ G.Sup67 (07/19) ] - Application of optical transport network Recommendations to 5G transport

Application of optical transport network Recommendations to 5G transport




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[ G.671 (08/19) ] - Transmission characteristics of optical components and subsystems

Transmission characteristics of optical components and subsystems




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[ G.7710/Y.1701 (08/19) ] - Common equipment management function requirements

Common equipment management function requirements




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[ G.7712/Y.1703 (08/19) ] - Architecture and specification of data communication network

Architecture and specification of data communication network




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[ V.8bis (08/96) ] - Procedures for the identification and selection of common modes of operation between data circuit-terminating equipments (DCEs) and between data terminal equipments (DTEs) over the general switched telephone network and on leased poin

Procedures for the identification and selection of common modes of operation between data circuit-terminating equipments (DCEs) and between data terminal equipments (DTEs) over the general switched telephone network and on leased point-to-point telephone-type circuits




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[ V.140 (01/05) ] - Procedures for establishing communication between two multiprotocol audiovisual terminals using digital channels at a multiple of 64 or 56 kbit/s

Procedures for establishing communication between two multiprotocol audiovisual terminals using digital channels at a multiple of 64 or 56 kbit/s




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[ V.10/X.26 (11/88) ] - Electrical characteristics for unbalanced double-current interchange circuits for general use with integrated circuit equipment in the field of data communications

Electrical characteristics for unbalanced double-current interchange circuits for general use with integrated circuit equipment in the field of data communications




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[ V.11/X.27 (11/88) ] - Electrical characteristics for balanced double-current interchange circuits for general use with integrated circuit equipment in the field of data communications

Electrical characteristics for balanced double-current interchange circuits for general use with integrated circuit equipment in the field of data communications




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[ V.254 (09/10) ] - Asynchronous serial command interface for assistive and multi-functional communication devices

Asynchronous serial command interface for assistive and multi-functional communication devices




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[ V.Imp152 (03/11) ] - Implementers' Guide for Recommendation ITU-T V.152 (Procedures for supporting voice-band data over IP networks)

Implementers' Guide for Recommendation ITU-T V.152 (Procedures for supporting voice-band data over IP networks)




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[ V.250 Supplement 1 (06/01) ] - Various extensions to V.250 basic command set

Various extensions to V.250 basic command set




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10 Reasons To Become A UX Designer in 2022

UX design is a dynamic, interdisciplinary industry that’s constantly evolving. With global demand, countless job opportunities, low barriers to entry, accessible online resources, affordable UX certifications, higher-than-average salaries, there’s never been a better time to venture into this industry. Here we look at ten important reasons why you should become a UX designer and where […]

The post 10 Reasons To Become A UX Designer in 2022 appeared first on Usability Geek




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What’s happening with 23andMe? Mass layoffs and restructuring are the latest blow for the embattled DNA-testing company

DNA-testing company 23andMe (Nasdaq: ME), once an industry leader that attracted millions of customers, including rapper Snoop Dogg and investor Warren Buffett, has announced significant cuts to its operations, with plans to lay off 200 employees or roughly 40% of its workforce. The company also said it will discontinue development of its therapeutic programs. Here’s what to know about the latest development and what led up to it.

Board exodus

The latest move comes as the company looks to stabilize after facing significant challenges, including the resignation of all seven independent board members in October.

Data breach

Last year, 23andMe suffered a massive data breach when hackers accessed the personal information of 6.9 million users. The incident led to a class-action lawsuit, which, in September, 23andMe agreed to settle for $30 million.

The problem with SPACs

In 2021, 23andMe went public through a merger with a special purpose acquisition company, or SPAC. It later expanded into drug-discovery and weight-loss sectors. However, as DNA test kit sales declined, so did its financial health. By fiscal 2023, it reported a $312 million net loss, with its stock down 98% since going public, currently at about $4 after a reverse stock split in October 2024.

Separate reports have found that things have often not ended well for companies that took advantage of the pandemic-era SPAC boom, which led to billions in losses for investors and a number of bankruptcies for companies.

What’s next for 23andMe and its employees?

The layoffs are expected to result in $12 million in severance, termination, and transition-related costs and are part of a broader plan to streamline the business and achieve annual cost savings of $35 million.

The company says it is exploring various strategic options for its therapeutic programs, including potential licensing agreements and the sale of assets in its development pipeline.

“We are taking these difficult but necessary actions as we restructure 23andMe and focus on the long-term success of our core consumer business and research partnerships,” said Anne Wojcicki, cofounder, CEO, and chair of the board, in a statement.

Shares of 23andMe were up almost 6% to $4.87 on the news, which was announced late yesterday. The stock is down more than 73% year to date.




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Leveraging GPO to Distribute User- and Computer Certificate

The use of Group Policy Objects (GPO) can be really powerful in a Windows environment. In this post we’re going to leverage GPO to distribute certificates to the user and computer as well as enabling the 802.1X supplicant. First, let’s















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QuantumPay (QTP) represents an ambitious technological initiative that blends blockchain technology and artificial intelligence (AI) to create a secure, efficient, and transparent digital transaction - StreetInsider.com

QuantumPay (QTP) represents an ambitious technological initiative that blends blockchain technology and artificial intelligence (AI) to create a secure, efficient, and transparent digital transaction  StreetInsider.com





















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TSMC Halts Advanced Chip Shipments To Chinese AI Companies

Starting November 11, TSMC plans to stop supplying 7 nm and smaller chips to Chinese companies working on AI processors and GPUs. "The move is reportedly to ensure it remains compliant with US export restrictions," reports The Register. From the report: This will not affect Chinese customers wanting 7 nm chips from TSMC for other applications such as mobile and communications, according to Nikkei, which said the overall impact on the chipmaker's revenue is likely to be minimal. TrendForce further cites another China-based source who claims the move was at the behest of the US Department of Commerce, which informed TSMC that any such shipments should not proceed unless approved and licensed by its BIS (Bureau of Industry and Security). We asked the agency for confirmation. Any moves by the silicon supremo is likely to be out of caution to pre-empt accusations from Washington that it isn't doing enough to prevent advanced technology from getting into the hands of Chinese entities that have been sanctioned. As TrendForce notes, it "highlights the foundry giant's delicate position in the global semiconductor supply chain amid the heating chip war between the world's two superpowers."

Read more of this story at Slashdot.