A programmable routing scheme provides improved connectivity both between Universal Digital Blocks (UDBs) and between the UDBs and other micro-controller elements, peripherals and external Inputs and Outputs (I/Os) in the same Integrated Circuit (IC). The routing scheme increases the number of functions, flexibility, and the overall routing efficiency for programmable architectures. The UDBs can be grouped in pairs and share associated horizontal routing channels. Bidirectional horizontal and vertical segmentation elements extend routing both horizontally and vertically between different UDB pairs and to the other peripherals and I/O.

An apparatus relates generally to a clock generator is disclosed. The clock generator is coupled to receive an input clock signal and further coupled to provide an output clock signal. An address and control register is coupled to receive an address signal and the output clock signal. An access generator is coupled to receive the output clock signal. The clock generator includes: an input node coupled to receive the input clock signal; at least one pulse generator coupled to the input node to receive the input clock signal and further coupled to provide a clock control signal; and a control gate coupled to the input node to receive the input signal and further coupled to the at least one pulse generator to receive the clock control signal. The clock control signal is provided in a non-toggling state for a high-frequency mode and in a toggling state for a low-frequency mode.

A latch circuit includes a latch unit and a clock propagation suppressing unit. The latch circuit holds and outputs input data of 0 or 1. The clock propagation suppressing unit compares the input data input to the latch unit with output data output from the latch unit. When it is detected that the input data matches the output data at 0, or that the input data matches the output data at 1, an externally input clock signal is prevented from propagating to the latch unit.

An active termination circuit for a differential receiver includes a first receiver element configured to receive a first component of a differential signal, a second receiver element configured to receive a second component of a differential signal, a common mode measurement element configured to receive the differential signal and generate a transmit common mode signal (Vcm) representing an average value of the differential signal, and a receiver (RX) common mode signal node. The termination circuit also comprises an active element configured to receive the transmit common mode signal (Vcm) and provide an output to the receiver common mode signal node, the output configured to drive the value of the signal at the receiver common mode signal node to the value of the transmit common mode signal (Vcm), and a capacitive element coupled to the receiver common mode signal node in parallel with the active element.

Apparatus for glitch-free switching between two clock sources on an integrated circuit. Clock gaters provide a clock from a single source that can be turned on and off without causing partial pulses to be created. Control circuitry going to the individual clock gaters provides the ability to shut all clocks off for a period of time equal to the longest clock period. By combining the clocks with an OR gate and gating all clocks off before switching from one clock to another, a glitch-free train of clock pulses can be created from individual clock inputs. Since clock glitches can cause erratic behavior in integrated circuits, this invention allows one to switch between different (unrelated) clocks without causing erratic behavior.

Apparatus and methods are provided for an extraction circuit. In one configuration, an apparatus includes: an edge extraction circuit for receiving a first clock signal and outputting a second clock signal, wherein a duty cycle of the second clock is substantially smaller than a duty cycle of the first clock; a transistor for receiving the second clock signal and outputting a current signal; a transmission line for receiving the current signal on a first end and transmitting the current signal to a second end; a termination circuit for receiving the current signal at the second end and converting the current signal into a voltage signal; and an edge detection circuit for outputting a third clock by detecting an edge of the voltage signal. In one embodiment, the edge detection circuit comprises an inverter. In another embodiment, the edge detection circuit comprises a comparator.

A system and methods that generates a physical unclonable function (“PUF”) security key for an integrated circuit (“IC”) through use of equivalent resistance variations in the power distribution system (“PDS”) to mitigate the vulnerability of security keys to threats including cloning, misappropriation and unauthorized use.

A level shifter, or method, producing a final output from a driver supplied by a high-side source driver providing VDD or common, and a low-side source driver providing common or VSS. A delay is introduced to prevent a source driver output at common from beginning to transition toward a supply rail until a delaying source driver at a rail begins transitioning toward common. The level shifter may be single-ended or differential, and the delaying source driver may be coupled to the same final output driver as is the delayed source driver, or may be coupled to a different final output driver. The level shifter may have a second level shifter front end stage, which may have high-side and low-side intermediate source driver outputs coupled by a capacitor, and/or may couple one of the supplies to all intermediate source drivers via a common impedance or current limit Zs.

A transceiver includes a transmitter and receiver that form a series current path between two power-supply nodes. Powering both the transmitter and receiver with the same supply current saves power. The transmitter functions as a resistive load for the receiver, and thus performs useful work with power that would otherwise be dissipated as waste heat.

A method and apparatus that controls the clock of a digital circuit, and therefore power consumption, without substantially comprising performance is provided. The apparatus may include monitoring the utilization of a First in First Out (FIFO) buffer. For example in a systems and methods according to the invention, clock speed may be reduced when the FIFO is relatively empty and increased when the FIFO is relatively full. The clock speed may be controlled by a phase locked loop, a clock divider, a clock masking device or a combination of more than one of these methods. Power reduction may also be obtained by controlling the clocking of different stages of a pipelined device. One or more aspects of the inventions may be implemented in combination with other aspects of the invention to further reduce power use.

A phase locked loop includes a voltage controlled oscillator and a frequency divider or frequency multiplier. The voltage controlled oscillator and the frequency divider/multiplier are coupled together in a stacked configuration. A drive current is supplied to the voltage controlled oscillator. The drive current passes from the voltage controlled oscillator to the frequency divider/multiplier, thereby driving the frequency divider/multiplier with the same drive current that was supplied to the voltage controlled oscillator.

A self-feedback random generator comprises a digital-to-analog converter, a digital oscillator, a frequency-modulating unit and a first D-type flip-flop. The digital-to-analog converter receives a digital random-code signal and the digital random-code signal is converted to corresponding analog random signal. The frequency-modulating unit modulates frequency of first digital oscillating signal so as to increase random of frequency of first digital oscillating signal according to voltage value of the analog random signal, and accordingly outputs a second digital oscillating signal. The first D-type flip-flop receives the second digital oscillating signal and a clock signal, and reads the second digital oscillating signal through utilizing the clock signal so as to outputs the digital random-code signal, wherein frequency of the clock signal is smaller than frequency of the first digital oscillating signal, and random of frequency of the second digital oscillating signal corresponds to random of the digital random-code signal.

The present invention proposes a digital system and method of measuring (estimating) non-energy parameters of the signal (phase, frequency and frequency rate) received in additive mixture with Gaussian noise. The first embodiment of the measuring system consists of a PLL system tracking variable signal frequency, a block of NCO full phase computation (OFPC), a block of signal phase primary estimation (SPPE) and a first type adaptive filter filtering the signal from the output of SPPE. The second embodiment of the invention has no block SPPE, and NCO full phase is fed to the input of a second type adaptive filter. The present invention can be used in receivers of various navigation systems, such as GPS, GLONASS and GALILEO, which provide precise measurements of signal phase at different rates of frequency change, as well as systems using digital PLLs for speed measurements.

A crystal-less clock generator (CLCG) and an operation method thereof are provided. The CLCG includes a first oscillation circuit, a second oscillation circuit, and a control circuit. The first oscillation circuit is controlled by a control signal for generating an output clock signal of the CLCG. The second oscillation circuit generates a reference clock signal. The control circuit is coupled to the first oscillation circuit for receiving the output clock signal and coupled to the second oscillation circuit for receiving the reference clock signal. The control circuit is used to generate the control signal for the first oscillation circuit according to the relationship between the output clock signal and the reference clock signal.

An injection locking oscillator (ILO) comprising a tank circuit having a digitally controlled capacitor bank, a cross-coupled differential transistor pair coupled to the tank circuit, at least one signal injection node, and at least one output node configured to provide an injection locked output signal; a digitally controlled injection-ratio circuit having an injection output coupled to the at least one signal injection node, configured to accept an input signal and to generate an adjustable injection signal applied to the at least one injection node; and, an ILO controller connected to the capacitor bank and the injection-ratio circuit configured to apply a control signal to the capacitor bank to adjust a resonant frequency of the tank circuit and to apply a control signal to the injection-ratio circuit to adjust a signal injection ratio.

Disclosed are a phase locked loop (PLL) of a digital scheme and a method thereof. More specifically, disclosed are a digital phase locked loop having a time-to-digital converter (TDC), a digital loop filter (DLF), and a digitally controlled oscillator (DCO), and that is designed to have a constant jitter characteristic at all times even though an operating condition of a circuit varies according to a process, voltage, temperature (PVT) change, and a method thereof.

Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.

An assembly structure of an electronic control unit and a coil assembly of a solenoid valve for an electronic brake system connected to the electronic control unit having a printed circuit board and applying power to the solenoid valve. The coil assembly is penetrated to allow an upper portion of the solenoid valve to be fitted thereinto, and includes a cylindrical bobbin provided with a coil and a coil case. The electronic control unit is provided with a housing having an insertion groove and joined to the hydraulic control unit, the printed circuit board being disposed spaced apart from the coil assembly, and the housing is provided with an elastic member having one end contacting the printed circuit board and the other end contacting the coil case. The elastic member is configured with a coil spring to produce different elastic forces.

A solenoid valve, the magnet armature of which is designed to be movable relative to a first valve-closing element, for which purpose the first valve-closing element is accommodated telescopically in a coupling element attached to the magnet armature, wherein the coupling element is guided along the inner wall of a guide sleeve inserted in the valve housing in order to align the magnet armature precisely with the first valve-closing element in the direction of a second valve-closing element which is likewise accommodated in the guide sleeve.

A method and device for the production of books, including: moving book blocks successively along a conveying section of a book production line; supplying a stack of book cases to the book production line; identifying a marking on each of the book blocks and the book cases; transmitting an identified marking on at least one book case to a machine control of the book production line; assigning a dataset stored in the machine control for a sequence of book cases to the supplied stack; determining a sequence in the machine control for book blocks positioned on the conveying section; comparing the dataset for the sequence of the book cases to the sequence of the book blocks; and removing and/or supplying at least one book block from or to the conveying section if the sequence of the book blocks deviates from the sequence of the book cases using the machine control.

An apparatus and method are provided, for alternatively producing either small or bulk packs of napkins from a stack of folded napkins produced by one folding machine, through use of a pack dispatching arrangement having an inlet, a small pack transfer station and a bulk pack transfer station, and configured for operation in a small pack mode for dispatching a stream of spaced apart small packs of folded sheets separated from the stack of folded sheets, and received at an inlet of the pack dispatching arrangement, to the small pack transfer station, and alternatively operable in a bulk pack mode for dispatching a stream of spaced apart bulk packs of folded sheets separated from the stack of folded sheets, and received at an inlet of the pack dispatching arrangement, to the bulk pack transfer station.

A sheet handling apparatus includes a sheet folding unit configured to perform folding on a sheet; and a sheet stacking unit configured to stack the folded sheet on a sheet stacking surface having an inclined surface and a horizontal surface in order from upstream to downstream in a sheet conveying direction. A downstream end of the inclined surface is higher than an upstream end of the inclined surface with respect to a horizontal plane. The sheet handling apparatus also includes a discharging unit configured to discharge the folded sheet to the sheet stacking unit; a sheet conveying unit configured to convey the discharged sheet from the inclined surface to the horizontal surface; and a conveying force applying unit configured to apply a conveying force to the sheet in contact with an upper surface of the sheet from above the inclined surface.

A web product folding and stacking machine includes two folding line making rolls, two folding fingers, a first carrier unit, a stoppage unit and a holder. The folding line making rolls and the folding fingers are operated to fold up web products on the first carrier unit to form a stack of interfolded web products. Further, there is at least one suction device arranged on the top surface of the first carrier unit to suck the web products nearing the top surface of the first carrier unit and facilitate accurate stacking of the interfolded web products.

When information about weight of a sheet indicates weight less than a predetermined weight, a sheet stacking apparatus configured to align sheets to be stacked on a stacking tray discharges the sheet onto the stacking tray while overlapping the sheet with another sheet by an overlapping unit, and, when the information about the weight of the sheet indicates weight not less than the predetermined weight, the sheet stacking apparatus discharges the sheet onto the stacking tray without overlapping the sheet with another sheet by the overlapping unit.

A puncher cylinder includes a puncher knife, the cylinder being arranged for cooperation with a paper web such that the cylinder when in use can be rolled longitudinally along and in contact with the paper web, punching holes in the paper web by way of the puncher knife. The holes are punched a longitudinal distance from each other essentially corresponding to the circumference of the cylinder. A system is further disclosed including the punching cylinder, as is a method utilizing the punching cylinder, and a newspaper partly produced by way of the punching cylinder.

The stack package includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first substrate having a first modulus and at least one semiconductor chip mounted on the first substrate. The second semiconductor package stacked on the first semiconductor package and includes a second substrate having a second modulus and at least one semiconductor chip mounted on the second substrate. The second modulus is less than the first modulus. Even in the event that the first semiconductor package is under severe warpage due to a temperature change, the flexible second substrate, which includes e.g., polyimide or poly ethylene terephthalate, of the second semiconductor package may be less sensitive to the temperature change, thereby improving reliability of the stack package.

A land grid array (LGA) package including a substrate having a plurality of lands formed on a first surface of the substrate, a semiconductor chip mounted on a second surface of the substrate, a connection portion connecting the semiconductor chip and the substrate, and a support layer formed on part of a surface of a first land.

Maskless hybrid laser scribing and plasma etching wafer dicing processes are described. In an example, a method of dicing a semiconductor wafer having a front surface with a plurality of integrated circuits thereon and having a passivation layer disposed between and covering metal pillar/solder bump pairs of the integrated circuits involves laser scribing, without the use of a mask layer, the passivation layer to provide scribe lines exposing the semiconductor wafer. The method also involves plasma etching the semiconductor wafer through the scribe lines to singulate the integrated circuits, wherein the passivation layer protects the integrated circuits during at least a portion of the plasma etching. The method also involves thinning the passivation layer to partially expose the metal pillar/solder bump pairs of the integrated circuits.

An apparatus including a die including a dielectric material on a device side, an insulating layer surrounding a die area and embedding a thickness dimension of the die; and a carrier including a plurality of layers of conductive material disposed on the device side of the die, a first one of the layers of conductive materials being formed on the insulating layer and patterned into traces at least a portion of which are connected to respective contact points on the die. A method including disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; disposing a mold on the sacrificial substrate around; introducing an insulating material into a chase of the mold; removing the mold; forming a carrier on the insulating material adjacent a device side of a die; and separating the die and the carrier from the sacrificial substrate.

Disclosed herein is a single mask package apparatus on a device comprising a first substrate having a land disposed on a first surface, a stud disposed on the land and a protective layer disposed over the first surface of the first substrate and around the stud. The protective layer may optionally have a thickness of at least 3 μm. A PPI may be disposed over the protective layer and in electrical contact with the stud, with a first portion of the PPI extending laterally from the stud. An interconnect may be disposed on and in electrical contact with the first portion of the PPI, and a second substrate mounted on the interconnect. A molding compound may be disposed over the PPI and around the interconnect. The stud may be a substantially solid material having a cylindrical cross section and may optionally be wirebonded to the land.

A multi-chip package is provided. The multi-chip package includes a plurality of chips including at least one bad chip and at least one good chip that are stacked and a plurality of through electrodes each penetrating the chips. A logic circuit included in the at least one bad chip is isolated from each of the plurality of through electrodes.

Systems, manufactures, methods and/or techniques for a merged fiducial for chip packages are described. According to some embodiments, an integrated circuit package may include a package substrate having a first side and a second side, a plurality of conductive traces coupled to the first side and a plurality of balls disposed on the second side. The balls may be adapted to electrically connect the laminate package to a circuit board. The integrated circuit package may include a plurality of ball pads disposed on the second side, the ball pads being adapted to electrically connect the plurality of balls to the plurality of conductive traces. One or more of the ball pads may be uniquely shaped when compared to the rest of the plurality of ball pads, optionally, to serve as a fiducial to designate an A1 pin or ball of the laminate package.

Described herein are methods and systems for providing corrective maintenance using global knowledge sharing. A method to provide corrective maintenance with a CM system includes performing a query to generate a ranking of fixable causes based on factors (e.g., symptoms, configuration, test). The ranking may be determined based on a fixable cause percent match with the factors. The ranking of fixable causes may be associated with one or more solutions for each fixable cause. The ranking can be updated based on performing tests or solutions.

A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

Embodiments of a method for fabricating stacked microelectronic packages are provided, as are embodiments of a stacked microelectronic package. In one embodiment, the method includes arranging microelectronic device panels in a panel stack. Each microelectronic device panel includes a plurality of microelectronic devices and a plurality of package edge conductors extending therefrom. Trenches are formed in the panel stack exposing the plurality of package edge conductors. An electrically-conductive material is deposited into the trenches and contacts the plurality of package edge conductors exposed therethrough. The panel stack is then separated into partially-completed stacked microelectronic packages. For at least one of the partially-completed stacked microelectronic packages, selected portions of the electrically-conductive material are removed to define a plurality of patterned sidewall conductors interconnecting the microelectronic devices included within the stacked microelectronic package.

Provided is a back plate component having reflective sheet reinforcing structure. The back plate component includes: a frame, a reflective sheet and a plurality of supporting film sheets. The frame includes a plurality of lateral beams and vertical beams, and at least one hollow part is included between the lateral beams and the vertical beams. The reflective sheet is attached to the frame, and includes a reflective surface and a back surface corresponding to the reflective surface. A portion of the back surface covers the whole hollow part. The plurality of supporting film sheets is attached to the back surface at a region corresponding to the hollow part, and includes a material the same as that of the reflective sheet. A liquid crystal display device is further disclosed herein.

A liquid crystal display (LCD) device and a backlight module. The backlight module includes a lightbar, a lightbar heat sink, and a light guide panel (LGP). A light coupling distance is set between the lightbar and the LGP. The backlight module further includes a control structure controlling the light coupling distance. The lightbar is configured with a through hole, the control structure penetrating through the through hole is arranged on the lightbar heat sink, and the lightbar heat sink provides a fixing force that controls a position the LGP.

The present invention provides a backlight module and a liquid crystal display device using the backlight module. The backlight module includes: a backplane (2), a light guide plate (4) arranged in the backplane (2), a backlight source (6) arranged in the backplane (2), an optic film assembly (8) arranged above the light guide plate (4), and a reflection plate (9) arranged between the backplane (2) and the light guide plate (4). The backlight source (6) includes a PCB (62) and a plurality of LED lights (64) mounted on and electrically connected to the PCB (62). The backplane (2) includes a bottom plate (22) and a plurality of side plates (24) perpendicularly connected to the bottom plate (22). The bottom plate (22) of the backplane (2) includes a snap-engagement structure (220) formed thereon. The PCB (62) is snap-fit into and retained by the snap-engagement structure (220). The reflection plate (9) is directly positioned on and supported by the PCB (62).

According to one embodiment, a first gene encodes a reporter protein. The first gene is disposed at the downstream of the gene promoter. A second gene is disposed at the downstream of the gene promoter and encodes a replication origin-binding protein. An internal ribosome entry site is disposed between the first gene and the second gene. The transcription termination signal sequence encodes a signal for terminating the transcription of the first gene and the second gene. A replication origin sequence is recognized by the replication origin-binding protein.

The invention provides an improved design for the construction of extensible nucleic acid-based, ligand-controlled regulatory systems, and the nucleic acid regulatory systems resulting therefrom. The invention contemplates improving the design of the switches (ligand-controlled regulatory systems) through the design of an information transmission domain (ITD). The improved ITD eliminates free-floating ends of the switching and the competing strands, and localizes competitive hybridization events to a contiguous strand of competing and switching strands in a strand-displacement mechanism-based switch, thereby improving the kinetics of strand-displacement. The improved regulatory systems have many uses in various biological systems, including gene expression control or ligand-concentration sensing.

The present invention relates to a composition comprising at least three primary antibodies or fragments thereof, wherein the at least three antibodies or fragments thereof binds specifically to at least three different proteins, and wherein the at least three different proteins are AMCAR, CK 5/6, and HMWC. Methods for using the composition in diagnosis, prognosis, and assessing efficacy of treatment is further included as well as kits comprising said composition, and optionally, instructions of its use.

Monoclonal antibodies (mAbs) having thyroid stimulating activity (TSAb), especially full or considerably agonistic activity, or thyroid blocking activity (TBAb), which are obtainable by genetic immunization of mice, or fragments (F(ab')2, Fab or Fv) or humanized forms of such monoclonal antibodies or single chain forms (SCA; scFv) of such fragments, which antibodies, or their fragments, compete with bovine TSH for epitopes of the human TSHr, compete with autoantibodies from sera from Graves' patients as well as with autoantibodies from sera from patients harboring blocking autoantibodies for epitopes of the human TSHr, bind to conformational epitopes of the human TSHr located in the first 281 amino acids of the human TSHr, and usually also bind to TSFR receptors (TSHr) from different animals. Various uses of such antibodies, or of peptides corresponding to variable regions of such antibodies, are also described and claimed.

Described herein are techniques for assembling a polynucleotide encoding a transcription activator-like effector nucleases (TALEN). The techniques ligate and digest necessary modules for a TALEN assembly in one reactor or system. Methods and Kits for generating a TALEN are also described.

This invention provides recombinant DNA constructs and methods for manipulating expression of a target gene that is regulated by a small RNA, by interfering with the binding of the small RNA to its target gene. More specifically, this invention discloses recombinant DNA constructs encoding cleavage blockers, 5-modified cleavage blockers, and translational inhibitors useful for modulating expression of a target gene and methods for their use. Further disclosed are miRNA targets useful for designing recombinant DNA constructs including miRNA-unresponsive transgenes, miRNA decoys, cleavage blockers, 5-modified cleavage blockers, and translational inhibitors, as well as methods for their use, and transgenic eukaryotic cells and organisms containing such constructs.

A chair including a dynamically-flexible back and seat having a shape that adjusts to the movements of a user seated in the chair to enhance user comfort. Each of the back and seat has an air gap formed therewithin and a resilient frame or liner with a spring memory. The resilient liner is adapted to flex in response to compressive forces that are generated as the user slides his body back or from side-to-side in the chair. Accordingly, some of the chair back and some of the chair seat move into respective air gaps so that the shapes of the back and seat change to conform to the movements of the user. The air gaps also establish air flow ventilation channels which run laterally through the back and seat of the chair.

A chair for facilitating efficient stacking includes a seat element having a seat frame, a plurality of front legs attached to a front portion of the seat element, a plurality of rear legs attached to a back portion of the seat element, and one or more telescopic leg mechanisms disposed on at least one of the front or rear legs, wherein the telescopic leg mechanisms provide for lateral movement of the at least one of the front or rear legs with respect to the seat element.

An ergonomic back support device utilizing one or multiple vertical components that include layers (28,36), pressure distributing layers (34,38,50), and a single notched layer (48). These layers provide primary back support located behind and conforming to the Erector spinae muscles (124). The vertical components form an open channel (24) that is parallel to the prime neurological pathway of the spinal column (100). The vertical conforming support components and open channel facilitate physiological functions that promote health. The device accomplishes support without using any transverse, hard or continuous components across or against the back. Other embodiments include the following additional vertical components: a lateral pressure-adjusting device (14), heating layers (40,46), circulation stimulating layers (42,44), and massage layers (52,54). Embodiments include portable and permanently installed versions that can be utilized in the following applications, including, but not limited to, furniture, vehicles, trains, aircraft, boats, ships, and backpacks.

A seating unit that includes a linkage mechanism adapted to move the seating unit between seat-lift, closed, extended, reclined, and seat-lift positions is provided. The linkage mechanism includes a seat-mounting plate mounted to a footrest assembly, a base plate fixedly mounted to a lift assembly, a back-mounting link rotatably coupled to the seat-mounting plate, a seat-adjustment assembly with a bellcrank, and a linear actuator for automating adjustment of the linkage mechanism. In operation, a stroke in a first phase of the linear actuator generates a force on the bellcrank that translates the seat-mounting plate rearward in a consistent angle of inclination and rotates the back-mounting link from a reclined to an upright orientation. A stroke in a second phase acts to collapse the footrest assembly. A stroke in a third phase causes the lift assembly to raise and tilt the seating unit, thereby accommodating egress and ingress of an occupant.

A chair capable of allowing positions of armrests and a back plate to be simultaneously adjusted having an integrated back plate cell including a backrest portion and armrest portions extending forward from the backrest portion, a lower frame including a seat plat support portion and an armrest support portion which extends upward from the seat plat support portion and is coupled to each of the armrest portions, and a fixing lever which fixes the armrest portion to the armrest support portion, wherein the integrated back plate cell is obliquely movable relative to the lower frame.

A latch plate for a lock device is proposed which comprises a latch plate proper and a film that covers the latch plate proper. The latch plate proper includes upper and lower finger portions between which a striker catching recess is defined. An upper surface of the lower finger portion includes a depressed main portion located near the bottom of the striker catching recess, a raised leading end portion and a stepped portion provided between the depressed main portion and the raised leading end portion. The film covers the latch plate proper except the raised leading end portion. The film covers the depressed main portion of the upper surface in such a manner that an outer surface of the film is flush with the stepped portion. When the film is depressed by the striker, the stepped portion enhances a function is to stop a movement of the striker toward a mouth of the striker catching recess.