se

Brunei Dollar(BND)/Japanese Yen(JPY)

1 Brunei Dollar = 75.4822 Japanese Yen




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Brunei Dollar(BND)/Chinese Yuan Renminbi(CNY)

1 Brunei Dollar = 5.0056 Chinese Yuan Renminbi




se

[Men's Basketball] Men's Basketball Advances to Conference Tournament as No.6 Seed




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[Men's Basketball] A.I.I. Men's Basketball Conference Banquet News Release




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[Men's Basketball] Loss to No.3 Seed Lincoln College Ends Men's Basketballs Post Season Play




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SemiEngineering Article: Why IP Quality Is So Difficult to Determine

Differentiating good IP from mediocre or bad IP is getting more difficult, in part because it depends upon how and where it is used and in part, because even the best IP may work better in one system than another—even in chips developed by the same vendor.  

So, how do you measure IP quality and why it is so complicated?

The answer depends on who is asking. Most of the time, the definition of IP quality depends on your vantage point.  If you are an R&D manager, IP quality means something. If you are a global supply manager, IP quality means something else. If you are an SoC start-up, your measure of quality is quite different from that of an established fabless company. If you are designing IP in-house, then your considerations are very different than being a commercial IP vendor. If you are designing an automotive SoC, then we are in a totally different category. How about as an IP vendor? How do you articulate IP quality metrics to your customers?

This varies greatly by the type of IP, as well. When it comes to interface (hard) IP and controllers, if you are an R&D manager, your goal is to design IP that meets the IP specifications and PPA (power, performance, and area) targets. You need to validate your design via silicon test chips. This applies to all hard PHYs, which must be mapped to a particular foundry process. For controllers that are in RTL form—we called these soft IP—you have to synthesize them into a particular target library in a particular foundry process in order to realize them in a physical form suitable for SoC integration. Of course, your design will need to go through a series of design validation steps via simulation, design verification and passing the necessary DRC checks, etc. In addition, you want to see the test silicon in various process corners to ensure the IP is robust and will perform well under normal process variations in the production wafers.

For someone in IP procurement, the measure of quality will be based on the maturity of the IP. This involves the number of designs that have been taped out using this IP and the history of bug reports and subsequent fixes. You will be looking for quality of the documentation and the technical deliverables. You will also benchmark the supplier’s standard operating procedures for bug reporting and technical support, as well as meeting delivery performance in prior programs. This is in addition to the technical teams doing their technical diligence.

An in-house team that is likely to design IP for a particular SoC project will be using an established design flow and will have legacy knowledge of last generation’s IP. They may be required to design the IP with some reusability in mind for future programs. However, such reusability requirements will not need to be as stringent and as broad as those of commercial IP vendors because there are likely to be established metrics and procedures in place to follow as part of the design team’s standard operating procedures. Many times, new development based on a prior design that has been proven in use will be started, given this stable starting point. All of these criteria help the team achieve a quality outcome more easily.

Then, if designing for an automotive SoC, additional heavy lifting is required.  Aside from ensuring that the IP meets the specifications of the protocol standards and passes the compliance testing, you also must pay attention to meeting functional safety requirements. This means adherence to ISO 26262 requirements and subsequently achieving ASIL certification. Oftentimes, even for IP, you must perform some AEC-Q100-related tests that are relevant to IP, such as ESD, LU, and HTOL.

To read more, please visit: https://semiengineering.com/why-ip-quality-is-so-difficult-to-determine/




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How to Verify Performance of Complex Interconnect-Based Designs?

With more and more SoCs employing sophisticated interconnect IP to link multiple processor cores, caches, memories, and dozens of other IP functions, the designs are enabling a new generation of low-power servers and high-performance mobile devices. The complexity of the interconnects and their advanced configurability contributes to already formidable design and verification challenges which lead to the following questions:

While your interconnect subsystem might have a correct functionality, are you starving your IP functions of the bandwidth they need? Are requests from latency-critical initiators processed on time? How can you ensure that all applications will receive the desired bandwidth in steady-state and corner use-cases?

To answer these questions, Cadence recommends the Performance Verification Methodology to ensure that the system performance meets requirements at the different levels:

  1. Performance characterization: The first level of verification aims to verify the path-to-path traffic measuring the performance envelope. It targets integration bugs like clock frequency, buffer sizes, and bridge configuration. It requires to analyze the latency and bandwidth of design’s critical paths.
  2. Steady state workloads: The second level of verification aims to verify the master-by-master defined loads using traffic profiles. It identifies the impact on bandwidth when running multi-master traffic with various Quality-of-Service (QoS) settings. It analyzes the DDR sub-system’s efficiency, measures bandwidth and checks whether masters’ QoS requirements are met.
  3. Application specific use cases: The last level of verification simulates the use-cases and reaches the application performance corner cases. It analyzes the master-requested bandwidth as well as the DDR sub-system’s efficiency and bandwidth.

Cadence has developed a set of tools to assist customers in performance validation of their SoCs. Cadence Interconnect Workbench simplifies the setup and measurement of performance and verification testbenches and makes debugging of complex system behaviors a snap. The solution works with Cadence Verification IPs and executes on the Cadence Xcelium® Enterprise Simulator or Cadence Palladium® Accellerator/Emulator, with coverage results collected and analyzed in the Cadence vManager  Metric-Driven Signoff Platform.

To verify the performance of the Steady State Workloads, Arm has just released a new AMBA Adaptive Traffic Profile (ATP) specification which describes AMBA abstract traffic attributes and defines the behavior of the different traffic profiles in the system.

With the availability of Cadence Interconnect Workbench and AMBA VIP support of ATP, early adopters of the AMBA ATP specification can begin working immediately, ensuring compliance with the standard, and achieving the fastest path to SoC performance verification closure.

For more information on the AMBA Adaptive Traffic Profile, you can visit Dimitry's blog on AMBA Adaptive Traffic Profiles: Addressing The Challenge

More information on Cadence Interconnect Workbench solution is available at Cadence Interconnect Solution webpage.

Thierry




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Did You “Stress Test” Yet? Essential Step to Ensure a Quality PCIe 4.0 Product

The PCI-SIG finalized the PCIe 4.0 specification with doubling the data to 16GT/s from 8GT/s in PCIe 3.0 in 2017. Products implementing this technology have begun to hit the market in 2019. Earlier this year, AMD announced it X570 chipset would support the PCIe 4.0 interface and Phison also introduced the world’s first PCIe 4.0 SSD.  With the increasing companies are working on PCIe 4.0 related product development, Cadence, as the key and leading PCIe IP solution vendor in the market, has strived for continuous enhancement of its PCIe 4.0 to be the best in the class IP solution. From our initial PCIe 4.0 solution in 4 years ago (revealed in 2015), we have made many advancements and improvements adding features such as Multi-link with any lane assignment, U.2/U.3 connector, and Automotive support. The variety of applications that PCIe4 finds a home in require extensive robustness and reliability testing over and above the compliance tests mandated by the standard body, i.e., PCI-SIG.

PCIe 4.0 TX Eye-Diagram, Loop-back Test (Long-reach) and RX JTOL Margin Test

Cadence IP team has also implemented additional "stress tests" in conjunction to its already comprehensive IP characterization plan, covering electrical, functional, ESD, Latch-up, HTOL, and yield sorting. Take the Receiver Jitter Tolerance Test (JTOL) for instance. JTOL is a key index to test the quality of the receiver of a system. This test use data generator/analyzer to send data to a SerDes receiver which is then looped back through the transmitter back to the instrument. The data received is compared to the data generated and the errors are counted. The data generator introduce jitter into the transmit data pattern to see how well the receiver functions under non-ideal conditions. While PCI-SIG compliance can be obtained on a single lane implementation, real world scenarios require wider implementations under atypical operating conditions. Cadence’s PCIe 4.0 IP was tested against to additional stressed conditions, such as different combination of multi-lanes operations, “temperature drift” conditions, e.g., bring up the chip at room temperature and check the JTOL at high temperature. 

PCIe 4.0 Sub-system Stress Test Setup

Besides complying with electrical parameters and protocol requirements, real world systems have idiosyncrasies of their own. Cadence IP team also built a versatile “System test” setup in house to perform a system level stress test of its PCIe 4.0 sub-system. The Cadence PCIe 4.0 sub-system is connected to a large number of server and desktop motherboards. This set up is tested with 1000s of cycles of repeated stress under varying operating conditions. Stress tests include speed change from 2.5G all the way to 16G and down, link enable/disable, cold boot, warm boot, entering and exiting low power states, and BER test sweeping presets across different channels. Performing this level of stress test verifies that our IP will operate to spec robustly and reliably when presented with the occasional corner cases in the real world.

More Information

For the demonstration of Cadence PCIe4 PHY Receiver Test and Sub-system Stress Test, see the video:

For more information on Cadence's PCIe IP offerings, see our PCI Express page.

For more information on PCIe in general, and on the various PCI standards, see the PCI-SIG website.

Related Posts




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This Video Hurts the Sentiments of Hindu’s [sic] Across the World

I loved Nina Paley’s brilliant animated film Sita Sings the Blues. If you’re reading this, stop right now—and watch the film here.

Paley has set the story of the Ramayana to the 1920s jazz vocals of Annette Hanshaw. The epic tale is interwoven with Paley’s account of her husband’s move to India from where he dumps her by e-mail. The Ramayana is presented with the tagline: “The Greatest Break-Up Story Ever Told.”

All of this should make us curious. But there are other reasons for admiring this film:

The film returns us to the message that is made clear by every village-performance of the Ramlila: the epics are for everyone. Also, there is no authoritative narration of an epic. This film is aided by three shadow puppets who, drawing upon memory and unabashedly incomplete knowledge, boldly go where only pundits and philosophers have gone before. The result is a rendition of the epic that is gloriously a part of the everyday.

This idea is taken even further. Paley says that the work came from a shared culture, and it is to a shared culture that it must return: she has put the film on Creative Commons—viewers are invited to distribute, copy, remix the film.

Of course, such art drives the purists and fundamentalists crazy. On the Channel 13 website, “Durgadevi” and “Shridhar” rant about the evil done to Hinduism. It is as if Paley had lit her tail (tale!) and set our houses on fire!

Rave Out © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic




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Trump and Modi are playing a Lose-Lose game

This is the 22nd installment of The Rationalist, my column for the Times of India.

Trade wars are on the rise, and it’s enough to get any nationalist all het up and excited. Earlier this week, Narendra Modi’s government announced that it would start imposing tariffs on 28 US products starting today. This is a response to similar treatment towards us from the US.

There is one thing I would invite you to consider: Trump and Modi are not engaged in a war with each other. Instead, they are waging war on their own people.

Let’s unpack that a bit. Part of the reason Trump came to power is that he provided simple and wrong answers for people’s problems. He responded to the growing jobs crisis in middle America with two explanations: one, foreigners are coming and taking your jobs; two, your jobs are being shipped overseas.

Both explanations are wrong but intuitive, and they worked for Trump. (He is stupid enough that he probably did not create these narratives for votes but actually believes them.) The first of those leads to the demonising of immigrants. The second leads to a demonising of trade. Trump has acted on his rhetoric after becoming president, and a modern US version of our old ‘Indira is India’ slogan might well be, “Trump is Tariff. Tariff is Trump.”

Contrary to the fulminations of the economically illiterate, all tariffs are bad, without exception. Let me illustrate this with an example. Say there is a fictional product called Brump. A local Brump costs Rs 100. Foreign manufacturers appear and offer better Brumps at a cheaper price, say Rs 90. Consumers shift to foreign Brumps.

Manufacturers of local Brumps get angry, and form an interest group. They lobby the government – or bribe it with campaign contributions – to impose a tariff on import of Brumps. The government puts a 20-rupee tariff. The foreign Brumps now cost Rs 110, and people start buying local Brumps again. This is a good thing, right? Local businesses have been helped, and local jobs have been saved.

But this is only the seen effect. The unseen effect of this tariff is that millions of Brump buyers would have saved Rs 10-per-Brump if there were no tariffs. This money would have gone out into the economy, been part of new demand, generated more jobs. Everyone would have been better off, and the overall standard of living would have been higher.

That brings to me to an essential truth about tariffs. Every tariff is a tax on your own people. And every intervention in markets amounts to a distribution of wealth from the people at large to specific interest groups. (In other words, from the poor to the rich.) The costs of this are dispersed and invisible – what is Rs 10 to any of us? – and the benefits are large and worth fighting for: Local manufacturers of Brumps can make crores extra. Much modern politics amounts to manufacturers of Brumps buying politicians to redistribute money from us to them.

There are second-order effects of protectionism as well. When the US imposes tariffs on other countries, those countries may respond by imposing tariffs back. Raw materials for many goods made locally are imported, and as these become expensive, so do those goods. That quintessential American product, the iPhone, uses parts from 43 countries. As local products rise in price because of expensive foreign parts, prices rise, demand goes down, jobs are lost, and everyone is worse off.

Trump keeps talking about how he wants to ‘win’ at trade, but trade is not a zero-sum game. The most misunderstood term in our times is probably ‘trade-deficit’. A country has a trade deficit when it imports more than what it exports, and Trump thinks of that as a bad thing. It is not. I run a trade deficit with my domestic help and my local grocery store. I buy more from them than they do from me. That is fine, because we all benefit. It is a win-win game.

Similarly, trade between countries is really trade between the people of both countries – and people trade with each other because they are both better off. To interfere in that process is to reduce the value created in their lives. It is immoral. To modify a slogan often identified with libertarians like me, ‘Tariffs are Theft.’

These trade wars, thus, carry a touch of the absurd. Any leader who imposes tariffs is imposing a tax on his own people. Just see the chain of events: Trump taxes the American people. In retaliation, Modi taxes the Indian people. Trump raises taxes. Modi raises taxes. Nationalists in both countries cheer. Interests groups in both countries laugh their way to the bank.

What kind of idiocy is this? How long will this lose-lose game continue?



© 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic




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DAC 2015: Lip-Bu Tan, Cadence CEO, Sees Profound Changes in Semiconductors and EDA

As a leading venture capitalist in the electronics technology, as well as CEO of Cadence, Lip-Bu Tan has unique insights into ongoing changes that will impact EDA providers and users. Tan shared some of those insights in a “fireside chat” with Ed Sperling, editor in chief of Semiconductor Engineering, at the Design Automation Conference (DAC 2015) on June 9.

Topics of this discussion included industry consolidation, the need for more talent and more startups, Internet of Things (IoT) opportunities and challenges, the shift from ICs to full product development, and the challenges of advanced nodes. Following are some excerpts from this conversation, held at the DAC Pavilion theater on the exhibit floor.

 

Ed Sperling (left) and Lip-Bu Tan (right) discuss trends in semiconductors and EDA

Q: As you look out over the semiconductor and EDA industries these days, what worries you most?

Tan: At the top of my list is all the consolidation that is going on. Secondly, chip design complexity is increasing substantially. Time-to-market pressure is growing and advanced nodes have challenges.

The other thing I worry about is that we need to have more startups. There’s a lot of innovation that needs to happen. And this industry needs more top talent. At Cadence, we have a program to recruit over 10% of new hires every year from college graduates. We need new blood and new ideas.

Q: EDA vendors were acquiring companies for many years, but now the startups are pretty much gone. Where does the next wave of innovation come from?

Tan: I’ve been an EDA CEO for the last seven years and I really enjoy it because so much innovation is needed. System providers have very big challenges and very different needs. You have to find the opportunities and go out and provide the solutions.

The opportunities are not just in basic tools. Massive parallelism is critical, and the power challenge is huge. Time to market is critical, and for the IoT companies, cost is going to be critical. If you want to take on some good engineering challenges, this is the most exciting time.

Q: You live two lives—you’re a CEO but you’re also an investor. Where are the investments going these days and where are we likely to see new startups?

Tan: Clearly everybody is chasing the IoT. There is a lot of opportunity in the cloud, in the data center. Also, I’m a big believer in video, so I back companies that are video related. A big area is automotive. ADAS [Advanced Driver Assistance Systems] is a tremendous opportunity.

These companies can help us understand how the industry is transforming, and then we can provide solutions, either in terms of IP, tools, or the PCB. Then we need to connect from the system level down to semiconductors. I think it’s a different way to design.

Q: What happens as we start moving from companies looking to design a semiconductor to system companies who are doing things from the perspective that we have this purpose for our software?

Tan: We are extending from EDA to what we call system design enablement, and we are becoming more application driven. The application at the system level will drive the silicon design. We need to help companies look at the whole system including the power envelope and signal integrity. You don’t want to be in a position where you design a chip all the way to fabrication and then find the power is too high.

We help the customers with hardware/software co-design and co-verification. We have a design suite and a verification suite that can provide customers with high-level abstractions, as well as verify IP blocks at the system level. Then we can break things down to the component level with system constraints in mind, and drive power-aware, system-aware design.

We are starting to move into vertical markets. For example, medical is a tremendous opportunity.

Q: How does this approach change what you provide to customers?

Tan: Every year I spend time meeting with customers. I think it is very important to understand what they are trying to design, and it is also important to know the customer’s customer requirements. We might say, “Wait a minute, for this design you may want to think about power or the library you’re using.” We help them understand what foundry they should use and what process they should use. They don’t view me as a vendorthey view me as a partner.

We also work very closely with our IP and foundry partners. We work as one teamthe ultimate goal is customer success.

Q: Is everybody going to say, FinFETs are beautiful, we’re going to go down to 10nm or 7nmor is it a smaller number of companies who will continue down that path?

Tan: Some of the analog/mixed-signal companies don’t need to go that far. We love those customerswe have close to 50% of that business. But we also have customers in the graphics or processor area who are really pushing the envelope, and need to be in 16nm, 14nm, or 10nm. We work very closely with those guys to make sure they can go into FinFETs.

We always want to work with the customer to make sure they have a first-time silicon success. If you have to do a re-spin, you miss the opportunity and it’s very costly.

Q: There’s a new market that is starting to explodeIoT. How real is that world to you? Everyone talks about large numbers, but is it showing up in terms of tools?

Tan: Everybody is talking about huge profits, but a lot of the time I think it is just connecting old devices that you have. Billions of units, absolutely yes, but if you look close enough the silicon percentage of that revenue is very tiny. A lot of the profit is on the service side. So you really need to look at the service killer app you are trying to provide.

What’s most important to us in the IoT market is the IP business. That’s why we bought Tensilicait’s programmable, so you can find the killer app more quickly. The other challenges are time to market, low power, and low cost.

Q: Where is system design enablement going? Does it expand outside the traditional market for EDA?

Tan: It’s not just about tools. IP is now 11% of our revenue. At the PCB level, we acquired a company called Sigrity, and through that we are able to drive system analysis for power, signal integrity, and thermal. And then we look at some of the verticals and provide modeling all the way from the system level to the component level. We make sure that we provide a solution to the end customer, rather than something piecemeal.

Q: What do you think DAC will look like in five years?

Tan: It’s getting smaller. We need to see more startups and innovative IP solutions. I saw a few here this year, and that’s good. We need to encourage small startups.

Q: Where do we get the people to pull this off? I don’t see too many people coming into EDA.

Tan: I talk to a lot of university students, and I tell them that this small industry is a gold mine. A lot of innovation is needed. We need them to come in [to EDA] rather than join Google or Facebook. Those are great companies, but there is a lot of fundamental physical innovation we need.

Richard Goering

Related Blog Posts

Gary Smith at DAC 2015: How EDA Can Expand Into New Directions

DAC 2015: Google Smart Contact Lens Project Stretches Limits of IC Design

Q&A with Nimish Modi: Going Beyond Traditional EDA




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About using Liberate to create .lib for a cell with two separate outputs.

Hello, my name is Hsukang. I want to use Liberate to create a .lib file for the following circuit. This is a scan FF with two separate outputs.   The question is that no matter how I described its function, the synthesis tool said its a manformed scan FF.  Has anyone ever encountered anything like this?How should I describe the function correctly?I found that almost standard flip-flop cells are with only one output Q or have Qn at the same time. Does Liberate support scan flip-flop cells with two separate outputs ?

Thanks.





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License Issue

This are the Errors i am getting can you please provide the solution.

Checking out license: Genus_Synthesis (12 seconds elapsed).
License 'Genus_Synthesis' (main version: 17.2, alternate version: 17.2) checkout failed.
Checking out license: Virtuoso_Digital_Implem (12 seconds elapsed).
License 'Virtuoso_Digital_Implem' (main version: 17.1, alternate version: 17.1) checkout failed.
Checking out license: Virtuoso_Digital_Implem_XL (12 seconds elapsed).
License 'Virtuoso_Digital_Implem_XL' (main version: 17.1, alternate version: 17.1) checkout failed.
Cannot obtain 'Genus_Synthesis' license.
Abnormal exit.




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How do I setup a student License?

I recently received a student version or OrCad, which I was able to download and install without trouble. However, I do not know how to setup my license.

I received the license file in an email. The instructions within the file were to include my hostname and the absolute path. I do not know what the path should point to so I left it empty. 

I was able to setup the licence server using the license file without any issues. However, setting up the licence configuration utility gives the following messages:

A user environment variable name CDC_LIC_FILE is found. The CDC_LIC_FILE settings you make will be overwritten by this user level variable. Furthermore, I get the error:

ERROR: Unable to update the CDS_LIC_FILE license path environment variable. 

This is preventing me from using any of the software.

What are the steps to installing the license and how could I resolve this error?

Thank you




se

Which algorithm is used in Modus ATPG?

According to the book Electronic Design Automation For Integrated Circuits Handbook there are mutiple algorithms available. Quote from book: "One of the first complete ATPG algorithms is the D-algorithm [9]. Subsequently, other algorithms were proposed, including PODEM [14], FAN [15], and SOCRATES [10]."

I was wondering which algorithms are used in Cadence Modus.




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Interaction between Innovus and Virtuoso through OA database

Hello,

I created a floorplan view in Virtuoso ( it contains pins and blockages). I am trying to run PnR in Innovus for floorplan created in Virtuoso. I used  set vars(oa_fp)    "Library_name cell_name view_name"   to read view from virtuoso. I am able to see pins in Innovus but not the blockages. Can i know how do i get the blockages created in virtuoso to Innovus.

Regards,
Amuu 




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stretching LOW pulse signal for extra 100ns

Hello, i have a logic output from a D-flipflop which generates a reset signal with variable pulse width. I want to stretch this LOW pulse width with an extra 100ns added to the original pulse width digitally, is there any way to do that?




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Reuse of Schematics across different Projects

Hi All,

I have 1 huge project(day X) which has different reference power supply designs.

Now I start a new project and I require 1 specific reference power supply from X.

What is the easist way to do this, other than a copy paste.

Is there a way to create say symbols or something similar, so that multiple different people could use it if they need, in their projects

Thanks for your help and suggestions.




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Mouse wheel and [i][o] button doesn't zoom

Hi,

I recently encountered a probelm where scrolling with the mouse wheel and [i][o] button does not zoom in or out both in "Allegro orcad capture CIS 17.2.2016 " .

When I scroll the mouse wheel or [i][o] button, nothing is done.

 

The thing is that it worked fine until yesterday.

 

Anyone has an idea?

 

Thanks,

Dung.




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Post-synthesis Simulation Failing when lp_insert_clock_gating true

When I enable clock gating in my synthesis flow (using Genus 18.15), my simulation (using Xcelium) on the post-synthesis netlist fails. The simulation succeeds pre-synthesis and also if I remove clock-gating in the design. I use set_db  lp_insert_clock_gating true to enable clock gating during synthesis. I printed out some of the signals from the netlist and can see where it fails (it incorrectly writes a register). However, I am not sure how to solve this issue or what I should be looking for. Any help would be appreciated. Thanks.




se

SystemVerilog package used inside VHDL-2008 design?

Hi,

Is it possible to use a SystemVerilog package which is compiled into a library and then use it in a VHDL-2008 design file? Is such mixed-language flow supported?

I'm considering the latest versions of Incisive / Xcelium available today (Oct 2019).

Thank you,

Michal




se

Allegro System Architect 17.2 Project Settings not Opening

I have been working on a an ASA 17.2 project for the last 6 months.

When I go to Project --> Settings, the settings window does not open. 

The tool indicates that a window is open, as I cannot click on anything else in the project. But it does not show the Settings window.

This has been happening only for the last 2 months. Before that it was working fine.

If I send the project to my colleague, the settings window shows up for him.




se

SpectreRF Tutorials and Appnotes... Shhhh... We Have a NEW Best Kept Secret!

It's been a while since you've heard from me...it has been a busy year for sure. One of the reasons I've been so quiet is that I was part of a team working diligently on our latest best kept secret: The MMSIM 12.1.1/MMSIM 13.1 Documentation has...(read more)




se

See Cadence RF Technologies at IEEE International Microwave Symposium 2014

RF Enthusiasts, Come connect with Cadence RF experts and discover the latest advances in Cadence RF technologies, including Spectre RF at the IEEE International Microwave Symposium (IMS) 2014. This year, IMS will be held in Tampa, Florida. Cadence...(read more)




se

How to Specify Phase Noise as an Instance Parameter in Spectre Sources (e.g. vsource, isource, Port)

Last year, I wrote a blog post entitled Modeling Oscillators with Arbitrary Phase Noise Profiles . We now have an easier way to do this. Starting in MMSIM 13.1 , you can specify the phase noise as an instance parameter in Spectre sources, including...(read more)




se

Cadence Presenting Four Spectre RF MicroApp Papers at IMS2016, May 22-27

Hello Spectre RF Users, Next week is my all time favorite technical conference - the International Microwave Symposium IMS2016 , May 22-27 in San Francisco, CA at the Moscone Center. If you're at the conference, please stop by the Cadence booth and...(read more)




se

Noise Simulation in Spectre RF Using Improved Pnoise/Hbnoise and Direct Plot Form Options

Did you check out the new Pnoise and Hbnoise Choosing Analyses forms in the MMSIM 15.1 and IC6.1.7 /ICADV12.2 releases? These forms have been significantly improved and simplified. The Direct Plot Form has also been enhanced and is much easy to use....(read more)




se

7 Habits of Highly Successful S-Parameters: How to Simulate Those Pesky S-Parameters in a Time Domain Simulator

Hello Spectre Users, Simulating S-parameters in a time domain (transient, periodic steady state) simulator has been and continues to be a challenge for many analog and RF designers. I'm often asked: What is required in order to achieve accurate...(read more)




se

Link to: 7 Habits of Highly Successful S-Parameters: How to Simulate Those Pesky S-Parameters in a Time Domain Simulator

Hi All, If you were unable to attend IMS 2017 in June 2017, the IMS MicroApp “7 Habits of Highly Successful S-Parameters” is on our Cadence website. On Cadence Online Support , the in-depth AppNote is here: 20466646 . Best regards, Tawna...(read more)




se

How to Set Up and Plot Large-Signal S Parameters?

Large-signal S-parameters (LSSPs) are an extension of small-signal S-parameters and are defined as the ratio of reflected (or transmitted) waves to incident waves. (read more)




se

Measurement of Phase Noise in Oscillators

The other day, I happened to sneak out some time for myself after having sent the kids to play in the neighborhood park. I made myself a hot cup of coffee and settled on the couch hoping to enjoy the silence in the house. But was it really ...(read more)




se

Not able to close a form

Hi,

I am trying to write a skill code where it takes form inputs by default and just displays tree directly.

i have written below code,

procedure( create_tree()
let(()

leHiTree()
leTreeForm->treeOption->value="Current to user level"
leTreeForm->userLevel->value= 31
ipcSleep(1)
hiFormDone(leTreeForm)

))

the form takes in values but it is not closing.

tried with regtimer in place of ipc sleep, didn't work.

how to close form(should be same as pressing OK)? 

Thanks in advance,

vishwas 




se

How to get test name from test session object?

Hi,

I have a test session object that I am getting like this:

maeTstSession=maeGetTestSession(test ?session session)

Is it possible to get the test name from this object? I am asking because this object passed to several levels of functions and I don't want to pass an additional argument with the test name




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Select all members of a constraint with SKILL

I want to select a constraint, and then run a SKILL command that returns a list with the members of that constraint. Is this possible?

Thx,




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Celebrating Five Years of Performance-Optimized Arm-Based SoCs: Now including AMBA5

It’s been quite a long 5-year journey building and deploying Performance Analysis, Verification, and Debug capabilities for Arm-based SoCs. We worked with some of the smartest engineers on the planet. First with the engineers at Arm, with whom we...(read more)




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Perspec System Verifier is #1 in Portable Stimulus in 2017 User Survey

It’s now official: Perspec System Verifier is rated the #1 product in the #1 category of Portable Stimulus, according to the 2017 EDA User Survey published on Deepchip.com. There were 33 user responses in favor of Perspec as the #1 tool, and dr...(read more)




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Portable Stimulus User Gives Perspec PSS Technology Nearly Perfect Review

It’s always good to hear what real users think of products. Here is a very detailed review (~4000 words) by an Anonymous user, nick named Ant-Man (from the movie). Overall it’s a very strong endorsement of Perspec, and summarize...(read more)




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Integration and Verification of PCIe Gen4 Root Complex IP into an Arm-Based Server SoC Application

Learn about the challenges and solutions for integrating and verification PCIe(r) Gen4 into an Arm-Based Server SoC. Listen to this relatively short webinar by Arm and Cadence, as they describe the collaboration and results, including methodology and...(read more)




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Willamette HDL and Cadence Develop the Industry's First PSS Training Course for Perspec System Verifier

Cadence continues to be a leader in SoC verification and has expanded our industry investment in Accellera portable stimulus language standardization. Some customers have expressed reservations that portable stimulus requires the effort of learn...(read more)




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DAC 2019 Preview – Multi-MHz Prototyping for Billion Gate Designs, AI, ML, 5G, Safety, Security and More

Vegas, here we come. All of us fun EDA engineers at once. Be prepared, next week’s Design Automation Conference will be busy! The trends I had outlined after last DAC in 2018—system design, cloud, and machine learning—have...(read more)




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Cashing the PSS Promises

A little bit of everything in the blog today: PSS is All Over As someone that was involved with UVM and PSS, both becoming Accellera standards, it is exciting to see both growing independently and together. With PSS we had a massive amount of papers ...(read more)




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1G Mobile: AMPS, TOPS, C-450, Radiocom 2000, and All Those Japanese Ones

You can't read anything about technology these days without reading about 5G. But before there was 5G, there was 4G. And before that 3G, 2G, and 1G. A 0G even. For the next few Thursdays,...

[[ Click on the title to access the full blog on the Cadence Community site. ]]




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2019 HF1 Release for Clarity, Celsius, and Sigrity Tools Now Available

The 2019 HF1 production release for Clarity, Celsius, and Sigrity Tools is now available for download at Cadence Downloads . SIGRITY2019 HF1 For information about supported platforms, compatibility...

[[ Click on the title to access the full blog on the Cadence Community site. ]]




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Wally Rhines: Predicting Semiconductor Business Trends After Moore's Law

I recently attended a webinar presented by Wally Rhines about his new book, Predicting Semiconductor Business Trends After Moore's Law . Wally was the CEO of Mentor, as you probably know. Now he...

[[ Click on the title to access the full blog on the Cadence Community site. ]]




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BoardSurfers: Training Insights: Placing Parts Manually Using Design for Assembly (DFA) Rules

If I talk about my life, it was much simpler when I used to live with my parents. They took good care of whatever I wanted - in fact, they still do. But now, I am living alone, and sometimes I buy...

[[ Click on the title to access the full blog on the Cadence Community site. ]]




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Tales from DAC: Semiconductor Design in MY Cloud? It's More Likely Than You Think

Everyone keeps talking about “the cloud” this and “the cloud” that these days—but you’re a semiconductor designer. Everyone keeps saying “the cloud” is revolutionizing all aspects of electronics design—but what does it mean for you? Cadence's own Tom Hackett discussed this in a presentation at the Cadence Theater during DAC 2019.

What people refer to as “the cloud” is commonly divided into three categories: Infrastructure as a Service (IaaS), Platform as a Service (PaaS), and software as a Service (SaaS). With IaaS, you bring your own software—i.e. loading your owned or appropriately licensed tools onto cloud hardware that you rent by the minute. This service is available from providers like Google Cloud Platform, Amazon Web Service, and Microsoft Azure. In PaaS (also available from the major cloud providers), you create your own offering using capabilities and a software design environment provided by the cloud vendor that makes subsequent scaling and distribution really easy because the service was “born in the cloud”.  Lastly, there’s SaaS, where the cloud is used to access and manage functionality and data without requiring users to set up or manage any of the underlying infrastructure used to provide it.  SaaS companies like Workday and Salesforce deliver their value in this manner.  The Cadence Cloud portfolio makes use of both IaaS and SaaS, depending on the customers’ interest.  Cadence doesn’t have PaaS offerings because our customers don’t create their own EDA software from building blocks that Cadence provides.

All of these designations are great, but you’re a semiconductor designer. Presumably you use Workday or some similar software, or have in the past when you were an intern, but what about all of your tools? Those aren’t on the cloud.

Wait—actually, they are.

Using EDA tools in the cloud allows you to address complexity and data explosion issues you would have to simply struggle through before. Since you don’t have to worry about having the compute-power on-site, you can use way more power than you could before. You may be wary about this new generation of cloud-based tools, but don’t worry: the old rules of cloud computing no longer apply. Cloud capacity is far larger than it used to be, and it’s more secure. Updates to scheduling software means that resource competition isn’t as big of a deal anymore. Clouds today have nearly unlimited capacity—they’re so large that you don’t ever need to worry about running out of space.

The vast increase in raw compute available to designers through the cloud makes something like automotive functional safety verification, previously an extremely long verification task, doable in a reasonable time frame. With the cloud, it’s easy to scale the amount of compute you’re using to fit your task—whether it’s an automotive functional safety-related design or a small one.

Nowadays, the Cadence Cloud Portfolio brings you the best and brightest in cloud technology. No matter what your use case is, the Cadence Cloud Portfolio has a solution that works for you. You can even access the Palladium Cloud, allowing you to try out the benefits of an accelerator without having to buy one.

Cloud computing is the future of EDA. See the future here.




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Automotive Security in the World of Tomorrow - Part 1 of 2

Autonomous vehicles are coming. In a statistic from the U.S. Department of Transportation, about 37,000 people died in car accidents in the United States in 2018. Having safe, fully automatic vehicles could drastically reduce that number—but the trick is figuring out how to make an autonomous vehicle safe. Internet-enabled systems in cars are more common than ever, and it’s unlikely that the use of them will slow or stop—and while they provide many conveniences to a driver, they also represent another attack surface that a potential criminal could use to disable a vehicle while driving.

So—what’s being done to combat this? Green Hills Software is on the case, and they explained the landscape of security in automotive systems in a presentation given by Max Hinson in the Cadence Theater at DAC 2019. They have software embedded [FS1] in most parts of a car, and all the major OEMs use their tech. The challenge they’ve taken on is far from a simple one—between the sheer complexity of modern automotive computer systems, safety requirements like the ISO 26262 standard, and the cost to develop and deploy software, they’ve got their work cut out for them. It’s the complexity of the systems that represents the biggest challenge, though. The autonomous cars of the future have dynamic behaviors, cognitive networks, require security certification to at least ASIL-D, require cyber security like you’d have on an important regular computer system to cover for the internet-enabled systems—and all of this comes with a caveat: under current verification abilities, it’s not possible to test every test case for the autonomous system. You’d be looking at trillions of test cases to reach full coverage—not even the strongest emulation units can cover that today.

With regular cars, you could do testing with crash-test dummies, and ramming the car into walls at high speeds in a lab and studying the results. Today, though, that won’t cut it. Testing like that doesn’t see if a car has side-channel vulnerabilities in its infotainment system, or if it can tell the difference between a stop sign and a yield sign. While driving might seem simple enough to those of us that have been doing it for a long time, to a computer, the sheer number of variables is astounding. A regular person can easily filter what’s important and what’s not, but a machine learning system would have to learn all of that from scratch. Green Hills Software posits that it would take nine billion miles of driving for a machine learning system of today’s caliber to reach an average driver’s level—and for an autonomous car, “average” isn’t good enough. It has to be perfect.

A certifier for autonomous vehicles has a herculean task, then. And if that doesn’t sound hard enough, consider this: in modern machine-vision systems, something called the “single pixel hack” can be exploited to mess them up. Let’s say you have a stop sign, and a system designed to recognize that object as a stop sign. Randomly, you change one pixel of the image to a different color, and then check to see if the system still recognizes the stop sign. To a human, who knows that a stop sign is octagonal, red, and has “STOP” written in white block letters, a stop sign that’s half blue and maybe bent a bit out of shape is still, obviously, a stop sign—plus, we can use context clues to ascertain that sign at an intersection where there’s a white line on the pavement in front of our vehicle probably means we should stop. We can do this because we can process the factors that identify a stop sign “softly”—it’s okay if it’s not quite right; we know what it’s supposed to be. Having a computer do the same is much more difficult. What if the stop sign has graffiti on it? Will the system still recognize it as a stop sign? How big of an aberration needs to be present before the system no longer acknowledges the mostly-red, mostly-octagonal object that might at one point have had “stop” written on it as a stop sign? To us, a stop sign is a stop sign, even with one pixel changed—but change it in the right spot, and the computer might disagree.

The National Institute of Security and Technology tracks vulnerabilities along those lines in all sorts of systems; by their database, a major vulnerability is found in Linux every three days. And despite all our efforts to promote security, this isn’t a battle we’re winning right now—the number of vulnerabilities is increasing all the time.

Check back next time to see the other side: what does Green Hills Software propose we do about these problems? Read part 2 now.




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Automotive Security in the World of Tomorrow - Part 2 of 2

If you missed the first part of this series, you can find it here.

So: what does Green Hills Software propose we do?

The issue of “solving security” is, at its core, impossible—security can never be 100% assured. What we can do is make it as difficult as possible for security holes to develop. This can be done in a couple ways; one is to make small code in small packs executed by a “safing plan”—having each individual component be easier to verify goes a long way toward ensuring the security of the system. Don’t have sensors connect directly to objects—instead have them output to the safing plan first, which can establish control and ensure that nothing can be used incorrectly or in unintended ways. Make sure individual software components are sufficiently isolated to minimize the chances of a side-channel attack being viable.

What all of these practices mean, however, is that a system needs to be architected with security in mind from the very beginning. Managers need to emphasize and reward secure development right from the planning stages, or the comprehensive approach required to ensure that a system is as secure as it can be won’t come together. When something in someone else’s software breaks, pay attention—mistakes are costly, but only one person has to make it before others can learn from it and ensure it doesn’t happen again. Experts are experts for a reason—when an independent expert tells you something in your design is not secure, don’t brush them off because the fix is expensive. This is what Green Hills Software does, and it’s how they ensure that their software is secure.

Now, where does Cadence fit into all of this? Cadence has a number of certified secure offerings a user can take advantage of when planning their new designs. The Tensilica portfolio of IP is a great way to ensure basic components of your design are foolproof. As always, the Cadence Verification Suite is great for security verification in both simulation and emulation, and JasperGold platform’s formal apps are a part of that suite as well.

We are entering a new age of autonomous technology, and with that new age we have to update our security measures to match. It’s not good enough to “patch up” security at the end—security needs to beat the forefront of a verification engineer or hardware designer’s mind at all stages of development. For a lot of applications, quite literally, lives are at stake. It’s uncharted territory out there, but with Green Hills Software and Cadence’s tools and secure IP, we can ensure the safety of tomorrow.




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BoardSurfers: Allegro In-Design IR Drop Analysis: Essential for Optimal Power Delivery Design

All PCB designers know the importance of proper power delivery for successful board design. Integrated circuits need the power to turn on, and ICs with marginal power delivery will not operate reliably. Since power planes can...(read more)




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BoardSurfers: Training Insights: Placing Parts Manually Using Design for Assembly (DFA) Rules

So, what if you can figure out all that can go wrong when your product is being assembled early on? Not guess but know and correct at an early stage – not wait for the fabricator or manufacturer to send you a long report of what needs to change. That’s why Design for Assembly (DFA) rules(read more)



  • Allegro PCB Editor