The present invention provides methods, compositions and kits for the characterization of cellular pathways in cells containing genetic alterations.

The present invention relates to in vitro methods of assessing the susceptibility or responsiveness of a subject to the treatment with an epidermal growth factor receptor (EGFR) inhibitor/antagonist, wherein the subject has been diagnosed or suspected of suffering from inflammation-associated. These methods comprise determining the level of expression of EGFR in myeloid cells in a sample from the subject, wherein an expression of EGFR in the myeloid cells is indicative of the subject being susceptible to the treatment with an EGFR inhibitor/antagonist. The invention also relates to EGFR inhibitors/antagonists for use in the treatment or amelioration of inflammation-associated cancer. The invention furthermore provides in vitro methods of prognosing the survival time, progression-free survival time or disease course of a subject that has been diagnosed or suspected of suffering from from inflammation-associated cancer. In addition thereto, the invention relates to in vitro diagnostic methods of assessing the proneness of a subject to develop inflammation-associated cancer in which the expression of EGFR is determined in myeloid cells from the subject.

The present invention relates to an in vitro method of diagnosing chronic myelomonocytic leukemia (CMML) in a subject, said method comprising the steps of: a) Detecting a monocyte population in a biological sample from said subject; b) Quantifying the CD14+/CD16− monocytes in said biological sample; c) Comparing the value of step b) to a reference value; and d) Diagnosing CMML based on said comparison. Preferably, said detecting step a) is performed by an exclusion gating strategy by flow cytometry.

The diagnosis of male infertility is based predominantly on the results of standard semen analysis for concentration, total motility, progressive motility, volume, pH, viscosity and/or morphology. When sperm enter the female reproductive tract, they must undergo a series of physiological changes, known as capacitation, in order to fertilize an egg. This process involves plasma membrane changes that occur in response to stimuli within the female tract. These changes include removal of sterols and redistribution of the ganglioside GM1. Semen analysis identifies only half the cases of male infertility due to standard semen analysis providing little information on sperm functional competence. Previous data demonstrated that localization of the ganglioside, GM1, identifies sub-populations of sperm capable of undergoing the functional maturation process known as capacitation and tracks strongly with fertility.

Methods for multiplexed delivery of agents to a solid tissue in vivo followed by assessment of efficacy with mass spectrometry are described.

Provided are a detection agent for detecting hydroxy vitamin D, preparation method thereof, and use thereof in 25-hydroxy vitamin D immunological detection. The detection agent comprises a conjugate formed by a 25-hydroxy vitamin D antigen derivative and protein carrier, and magnetic spheres coated by the conjugate. Also provided is a 25-hydroxy vitamin D detection kit comprising the detection agent.

A population of bright and stable nanocrystals is provided. The nanocrystals include a semiconductor core and a thick semiconductor shell and can exhibit high extinction coefficients, high quantum yields, and limited or no detectable blinking.

Oakland-based Nybll, a health-focused food service whose clients include high-profile companies and world-championship sports teams, has just introduced a new option beyond plant-based meal delivery and catering.

Last week, just in time to meet new needs spurred by shelter-in-place restrictions, chef/owner Kristen Thibeault launched Nybll Grocery.…

East Bay resident Miles Woodruff, CEO of the pioneering vegan-seafood brand Sophie's Kitchen, has just donated 3,000 cases of plant-based Toona to the Food Bank of Contra Costa and Solano County as well as several other Bay Area food shelters.

Amidst the Covid-19 outbreak, the company's brand-new Lemon Grass Toona flavor has not yet arrived in grocery stores — but 100 percent of it is now being provided to people in need.…

Just in time to celebrate its ten-year anniversary, popular Filipino-fusion food truck Señor Sisig has established a long-term location in Oakland.

The brand-new spot is at 3331 Fruitvale Ave. in the Dimond District.…

This month alone, Oakland-based, family-owned Mr. Espresso has already donated over 2,500 pounds of coffee to COVID-19 relief efforts all over the Bay Area.

During the first two weeks of April, the 42-year-old company — founded in Alameda by enterprising Italian-born Carlo Di Ruocco and now renowned as the first and currently only outfit in the nation that uses oak wood to roast its beans — has given coffee to the Alameda County Community Food Bank and San Francisco-Marin Food Bank, Frontline Foods, East Bay FeedER, Clinica de La Raza, St. Anthony’s Dining Room, Loaves and Fishes Family Kitchen, and other food-, health-, homeless-, youth-, and family-assistance programs.…

Now through May 5, healthcare workers and first responders can collect free "Thank You Meals" at any McDonald's location nationwide.

The promotion began on April 22.…

Celebrated chef-restaurateur Kyle Itani, who helms both Itani Ramen and Hopscotch Restaurant & Bar in Uptown Oakland, has just launched a brand-new project: a takeout sushi spot.

Operating out of Itani Ramen and serving its fare via pickup and delivery, Nikkei Sushi will be open Wednesday through Sunday, 2 p.m. - 8 p.m. during its soft opening with hours extending in the future.…

Uptown Oakland's alaMar Kitchen & Bar will celebrate its sixth anniversary this Friday, May 1, with a contactless, social-distancing, Covid-19-crisis parade.

"In celebration of this milestone, we are asking all of our fans and supporters to parade in the safety of their cars," management announced in a press release today.…

Celebrated chef-restaurateur Kyle Itani, who helms Itani Ramen and Hopscotch Restaurant & Bar in Uptown Oakland, has just launched a brand-new project: a takeout sushi spot.

The 2012 Progressive Opportunities Conference showcased the best work of nonprofits, companies, unions, activists, and government leaders, looking to shed light on some of our most pressing economic issues. The Conference sought to create an opportunity to network and exchange ideas, arming attendees with new tools to make positive economic change.…

Stories you shouldn’t miss:

1. Alameda County Public Health Director Muntu Davis contends that gentrification should be examined in terms of health impacts because of the displacement and stress it causes for low-income residents, the Bay Area News Group$ reports.…

If you happen to run into any medical residents anytime soon, they may look a little fatigued and broke, especially if they happen to be residents or pediatricians of UCSF Benioff Children’s Hospital of Oakland. Today, the CIR/SEIU Healthcare union that represents resident physicians and pediatricians said it plans to rally in front of the hospital on Friday at 12:15 p.m. along with nurses and community leaders to demand better wagers and working conditions.…

A ceramic electronic component includes an interior part and an exterior part. The interior part includes an interior part dielectric layer and an internal electrode layer. The exterior part includes an exterior part dielectric layer. The exterior part is positioned outside the interior part along a laminating direction thereof. The interior part dielectric layer and the exterior part dielectric layer respectively contain barium titanate as a main component. β−α≧0.20 and α/β≦0.88 are satisfied, where α mol part and β mol part are respectively an amount of a rare earth element contained in the interior and exterior part dielectric layers, provided that an amount of barium titanate contained in the interior and exterior part dielectric layers is respectively 100 mol parts in terms of BaTiO3.

A ceramic electronic component includes a dielectric layer and an electrode layer. The dielectric layer contains a plurality of ceramic particles and grain boundary phases present therebetween. A main component of the ceramic particles is barium titanate. An average thickness of the grain boundary phases is 1.0 nm or more. A thickness variation σ of the grain boundary phases is 0.1 nm or less.

A multilayer ceramic electronic component includes a laminated body including dielectric layers and internal electrode layers, and first and second external electrodes. The laminated body further includes a first conductor layer, a first insulating coating layer, a second conductor layer, and a second insulating coating layer. The surface of the first conductor layer closer to a first end surface is partially connected to the first external electrode. The surface of the second conductor layer closer to a second end surface is partially connected to the second external electrode.

The present invention relates to a process for producing an electrolytic capacitor, the process comprising process steps i) ii): i) providing a capacitor body (1) that comprises an electrode body (2) of an electrode material,a dielectric (3) which at least partially covers the surface of this electrode material, anda solid electrolyte (4) at least comprising an electrically conductive material which at least partially covers the dielectric surface; ii) applying a primer solution e) to the capacitor body (1), followed by an application of a solution or dispersion a) comprising a conjugated polymer b) and a solvent or dispersant d), followed by an at least partial removal of the solvent or dispersant d) for the formation of the polymeric outer layer (5) that is formed onto the capacitor body (1); wherein the primer solution e) comprises at least one monofunctional amine and at least one carboxylic acid.

A conductive composite is provided, which includes a conductive conjugated polymer and a mixture. The mixture includes (a) boron oxide, and (b) sulfur-containing compound, nitrogen-containing compound, or a combination thereof. A capacitor is also provided, which includes an anode electrode, a dielectric layer on the anode electrode, a cathode electrode, and an electrolyte between the dielectric layer and the cathode electrode, wherein the electrolyte includes the described conductive composite.

The invention relates to a device for thermally disconnecting or tripping an overvoltage protection device, comprising: a locking element (A1), on which a first force (F1) acts, and which is fixed in such a way that same is released when a limit temperature is exceeded; and a slider (S1) which is blocked in a first state (Z1) by the fixed locking element (A1), and on which a second force (F2) acts in order to transfer same into a second state (Z2) when the locking element (A1) is released.

A method and system for cooling a device (preferably a micro-device), comprising cooling the device by using a lower critical solution temperature (LCST) mixture. Enhancement of heat transfer rates is achieved during phase separation of a two-component system (two-component mixture) with a LCST. Convective heat transfer rates in small diameter pipes and over a vertical (hot) plate are demonstrated.

Embodiments are generally directed to cooling of electronics using folded foil microchannels. An embodiment of an apparatus includes a semiconductor die; a substrate, the semiconductor die being coupled with the substrate; and a cooling apparatus for the semiconductor die, wherein the cooling apparatus includes a folded foil preform, the folded foil forming a plurality of microchannels, and a fluid coolant system to direct a fluid coolant through the microchannels of the folded foil.

A wiring device includes a housing that encloses a line voltage port and a low-voltage port for providing power to at least one removable load. The removable load can couple to a connector PCB. The connector PCB may include a tongue portion with retention surface features and a body portion with supporting circuitry. The tongue portion may be disposed within a low-voltage port of the wiring device. A plurality of conductive traces may extend from the body to the tongue of the connector PCB. The low voltage port may include sidewalls disposed around the tongue portion to guide the plug of a removable load into engagement with the conductive traces of the tongue portion so that one or more of the plurality of conductive traces electrically contact the removable load to deliver power to the removable load.

A household distribution box comprises a distribution box case; two service lines introduced from a transformer into the distribution box case of a consumer; three main lines installed in the distribution box case and provided with two lines and a second service line; two sub-lines installed in the distribution box case and formed by branching the second service line among the main lines into two lines; a first circuit breaker installed in the distribution box case; a second circuit breaker installed in the distribution box case; and a controller connected to the first circuit breaker.

The present disclosure provides a method and a system for protecting an electrical device. The method includes: acquiring coordinate data of the electronic device; determining whether the coordinate data exceeds a data range corresponding to a preset state of the electronic device; and disabling the electronic device when the coordinate data exceeds the data range corresponding to the preset state.

A junction box is configured to be arranged between a DC power source and a load. The junction box includes a first mechanical relay configured to be connected to a positive terminal of the DC power source, a second mechanical relay configured to be connected to a negative terminal of the DC power source, a semiconductor relay connected in series to at least one of the first mechanical relay and the second mechanical relay, and a controller that controls driving of the first mechanical relay, the second mechanical relay and the semiconductor relay respectively. When an abnormal state occurs, the controller controls the first and second mechanical relays to turn the first and second mechanical relays off after controlling the semiconductor relay to turn the semiconductor relay off.

A surge suppression device includes a micro electromechanical system (MEMS) switch electrically connected to a current path. Additionally, the surge suppression device includes a transient voltage suppression (TVS) device electrically connected in series to the MEMS switch. The surge suppression device is configured to protect electronic components from voltage surges or current surges.

An overvoltage protection device includes a resistor that is connected in series between an internal signal line connected to a communication terminal of a processor and a communication line, a diode of which a cathode is connected to the internal signal line and an anode is connected to a ground, and a PNP transistor of which a base is connected to a power supply terminal, an emitter is connected to the internal signal line, and a collector is connected to the ground. When a base-emitter voltage (a junction saturation voltage) of the transistor in operation is defined as VBE and a power source is turned on (a voltage V1) by the operation of the transistor, a voltage of the internal signal line is limited to the source voltage V1+VBE. When the power source is turned off (a voltage 0 V), the voltage of the internal signal line is limited to the source voltage 0 V+VBE.

The present invention provides a chip and an electronic device. The chip comprises at least one pin, and the chip comprises at least one ESD (Electrostatic Discharge) protection circuit inside, and the ESD protection circuit is employed to reduce or eliminate a damage of electrostatic to other elements or circuit inside the chip, and the ESD protection circuit is located corresponding to a pin, and the ESD protection circuit is electrically coupled to the pin. The electronic device comprises the aforesaid chip.

An electrical energy receiving end capable of overvoltage protection and a wireless electrical energy transmission device are provided. An electrical energy receiving coil is divided into a first receiving coil and a second receiving coil, so that under normal operation the first receiving coil and the second receiving coil jointly resonate with an impedance matching network to receive energy. When the electrical energy receiving end has an overvoltage, the first receiving coil and the impedance matching network (or the second receiving coil and the impedance matching network) form a loop, and due to the impedance mismatch, the energy received by the electrical energy receiving end is greatly reduced to solve the problem of overvoltage at the electrical energy receiving end.

Electronic device heat transfer technology is disclosed. In an example, an electronic device package can include a substrate. The electronic device package can also include a heat transfer component. The electronic device package can further include a heat-generating electronic component coupled to the substrate between the substrate and the heat transfer component. The electronic device package can also include a viscous thermal interface material (TIM) providing a heat transfer pathway between the electronic component and the heat transfer component. In addition, the electronic device package can include a barrier about at least a portion of a periphery of the viscous TIM to maintain the viscous TIM within a confined location in proximity to the electronic component. The TIM is uninterrupted by the barrier within the periphery.

A package includes a conductive pad, with a plurality of openings penetrating through the conductive pad. A dielectric layer encircles the conductive pad. The dielectric layer has portions filling the plurality of openings. An Under-Bump Metallurgy (UBM) includes a via portion extending into the dielectric layer to contact the conductive pad. A solder region is overlying and contacting the UBM. An integrated passive device is bonded to the UBM through the solder region.

A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad.

A flexible printed circuit board including an annular main board and a plurality of branches connected with the annular main board is provided. Each of the branches includes an extension portion connected with the annular main board and a bonding portion, and an electronic component is adapted to be disposed on the bonding portion. A supporting holder including an annular base, two wing structures, and a plurality of mounting portions is also disclosed, wherein the wing structures extend outward from the annular base and the mounting portions are located on the annular base and the wing structures. Further, a controller including the flexible printed circuit board and the supporting holder aforementioned is disclosed, wherein the annular main board is disposed on the annular base and the branches are disposed on the annular base and the wing structures, such that the bonding portions are located on the mounting portions correspondingly.

A stretchable electronic assembly comprising a stretchable body, a plurality of electronic components encapsulated in the stretchable body, at least one meandering conductor connected to at least one electronic component of the plurality of electronic components, at least one hollow pocket formed in the stretchable body, the at least one meandering conductor encapsulated in the stretchable body and the at least one meandering conductor located within the at least one hollow pocket formed in the stretchable body.

An automation field device having a housing and a modular field device electronics unit located inside the housing. The electronics unit has a first circuit board having at least one first and one second plug-in connector element, wherein the first plug-in connector element is used to electrically connect a peripheral unit, wherein both the first and the second plug-in connector elements can be contacted essentially from the same preferred plug-in direction, and a second circuit board having at least one third plug-in connector element, wherein the circuit boards are arranged such that the second plug-in connector element is connected to the third plug-in connector element in a detachable manner to electrically connect the peripheral unit to the second circuit board, and the second circuit board has at least one opening, via which the first plug-in connector element of the first circuit board is accessible for connecting the peripheral unit.

An apparatus to support a flexible screen of an electronic device includes a plurality of shafts, a plurality of rows of first connecting members, and a plurality of rows of second connecting members. Each first and second connecting member has a top side, a bottom side, a left aperture and a right aperture extending from the top side to the bottom side, with each aperture coupled to a shaft. The width of the apertures for each second connecting member is greater than the width of the apertures for each first connecting member. The plurality of shafts are connected to each other by alternate rows of first connecting members and second connecting members along the length of the shafts. Each connecting member in a row of connecting members overlaps with two connecting members in an adjacent row of connecting members.

An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.

The present invention is to provide a chassis switch, which comprises a chassis for accommodating a designated number of line cards therein; a backplane installed on the back side of the chassis and having a plurality of connectors disposed thereon; at least one line card plugged into one of the connectors corresponding thereto via a front side of the chassis and each having an access switch chip adapted to switch local network signals and an interconnect switch chip adapted to switch the signals between ports of the at least one line card; and a loop adapted to connect the corresponding ports of the access switch chip and the interconnect switch chip respectively through the connectors, so as to enable each line card plugged into the chassis switch to perform a local network switching function and a switching function between the at least one line card.

Examples of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat sink includes a base portion, a first protrusion structure and a second protrusion structure. The base portion has a first side and a second side opposite the first side. The first protrusion structure protrudes from the first side of the base portion, and includes multiple fins. The second protrusion structure protrudes from the second side of the base portion, and includes multiple ribs. The heat sink may be made of silicon.

An enhanced airflow chassis system includes a component chassis that defines a chassis enclosure including a chassis entrance and component slots. First component carriers are mounted to first components and positioned in each of the component slots. Each first component carrier defines first component carrier airflow apertures that direct airflow entering the chassis entrance to the first component mounted to that first component carrier. A backplane located in the chassis enclosure opposite the component slots from the chassis entrance defines backplane airflow apertures and includes a component connector located adjacent each of the component slots that is connected to the first component mounted to the component carrier positioned in that component slot. A chassis venting member positioned between at least two of the component slots defines chassis venting member airflow apertures that direct airflow entering the chassis entrance through the chassis enclosure to a subset of the backplane airflow apertures.

An electronic apparatus includes a housing including a sealable housing section, heat generating components accommodated in the housing section, an internal-side heat exchanger contacting one inner surface of one wall of the housing, an external-side heat exchanger contacting one outer surface of the wall and opposed to the internal-side heat exchanger, an external-side heat exchanger for heat generating components for heat exchange between the heat generating components and air outside the housing section, and an internal fan. A high-heat generating component generating the most heat contacts the inner surface and opposed to the external-side heat exchanger for heat generating components. Heat exchange between the high-heat generating component and air outside the housing section is effected via the external-side heat exchanger for heat generating components. Heat exchange between air inside the housing section and air outside the housing section is effected via the internal-side heat exchanger and the external-side heat exchanger.

I was wondering why the iconic Civic Centre clock in Southampton is not lit up blue on Thursday at 8pm to clap for the NHS.

ONLY a delusional Lib Dem like Martin Kyrle could come up with an excuse like this about his beloved party doing well in the last election when in fact they lost over half their seats, then blaming it on our undemocratic electoral system, it’s the system we have, and our MP’s are elected on that system.

More rose-tinted views of the EU: the EU not falling apart?

I say to all communities pat yourselves on the back for the great job you are doing taking care of each other and supporting each other.