A surface-mountable over-current protection device comprises one PTC material layer, first and second connecting conductors, first and second electrodes and an insulating layer. The PTC material layer has a resistivity less than 0.2 Ω-cm, and comprises crystalline polymer and conductive filler dispersed therein. The first and second connecting conductors are capable of effectively dissipating heat generated from the PTC material layer. The first and second electrodes are electrically connected to first and second surfaces of the PTC material layer through the first and second connecting conductors, respectively. The dissipation factor depending on the ratio of the total area of the electrodes and the conductors to the area of the PTC material layer is greater than 0.6. At 25° C., the value of the hold current of the device divided by the product of the area of the PTC material layer and the number of the PTC material layer is greater than 1A/mm2.

A thermal, flow measuring device for determining and/or monitoring the flow of a measured medium through a measuring tube. The thermal, flow measuring device includes: a first pin-shaped shell and at least a second pin-shaped shell; a first resistance thermometer and at least a second resistance thermometer. At least the first resistance thermometer is embodied so as to be heatable, wherein the resistance thermometers, in each case, have a first surface, and at least a second surface, which lies opposite the first surface. The first pin-shaped shell surrounds the first resistance thermometer, and the second pin-shaped shell surrounds the second resistance thermometer. The pin-shaped shells are fillable with a fill material. In each case, at least one spacer is placeable between the pin-shaped shell and the first surface of the resistance thermometer, and the second surface of the resistance thermometer is at least partially covered with fill material.

A surface mountable over-current protection device having upper and lower surfaces comprises a PTC device, first and second electrodes, and first and second circuits. The PTC device comprises a PTC material layer and first and second conductive layers. The PTC material layer is disposed between the conductive layers and comprises crystalline polymer and conductive filler dispersed therein. The first electrode comprises a pair of first metal foils, whereas the second electrode comprises a pair of second metal foils. The first circuit connects the first electrode and conductive layer, and has a first planar line extending horizontally. The second circuit connects the second electrode and conductive layer, and has a second planar line extending horizontally. At least one of the planar lines has a thermal resistance sufficient to mitigate heat dissipation by which the over-current protection device undergoes a test at 25° C. and 8 amperes can trip within 60 seconds.

One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

An electromagnetic field measuring apparatus capable of measuring an electromagnetic field for a minuscule area in which electronic devices are densely packed with a high sensitivity is provided. In an electromagnetic field measuring apparatus according to the present invention, the amplitude level of signal light (pf) is adjusted by the analyzer (34) by adjusting its angle with respect to the plane of polarization of the signal light (pf) based on an amplitude level control signal (eb) supplied from the calculation control unit (40). An amplitude level control signal (eb) is supplied from the calculation control unit (40) to the analyzer (34) based on the spectrum (ea) of an electric signal (ed) measured by an RF spectrum analyzer (39). The amplitude level ration between the carrier and the sideband contained in the signal light (ph) incident on the optical receiver (38) is controlled to a fixed value.

An over-current protection device has a PTC device, first and second electrodes and an insulation layer. The PTC device comprises first and second electrically conductive members and a PTC layer laminated between the first and second electrically conductive members. The first and second electrodes are electrically connected to the first and second electrically conductive members, respectively. The insulation layer is disposed on a surface of the first electrically conductive member. The device is a stack structure extending along a first direction, and comprises at least one hole extending along a second direction substantially perpendicular to the first direction. The value of the covered area of the hole divided by the area of the form factor of the over-current protection device is not less than 2%, and the value of the thickness of the device divided by the number of the PTC devices is less than 0.7 mm.

A resistance component includes a stack of ceramic layers and inner electrodes. Inner electrodes of a first type are electrically conductively connected to a first external contact and inner electrodes of a second type are electrically conductively connected to a second external contact. The inner electrodes of the first type are arranged such that there is no overlap with the inner electrodes of the second type. An inner electrode of a third type, which is electrically conductively connected neither to the first external contact nor to the second external contact, at least partially overlaps the inner electrodes of the first type and the inner electrodes of the second type.

In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.

A chip resistor includes an insulating substrate, top terminal electrodes formed on top surface of the substrate using silver-based cermet, bottom electrodes, resistive element that is situated between the top terminal electrodes and overlaps them partially, an optional internal protective coating that covers resistive element completely or partially, an external protective coating that covers completely the internal protection coating and partially covers top terminal electrodes, a plated layer of nickel that covers face sides of the substrate, top and bottom electrodes, and overlaps partially external protective coating, finishing plated layer that covers nickel layer. The overlap of nickel layer and external protective layer possesses a sealing property because of metallization of the edges of external protective layer prior to the nickel plating process.

The present disclosure provides a high-temperature thermal pellet composition that maintains structural rigidity up to a transition temperature of about 240° C. The composition comprises at least one organic compound (e.g., triptycene or 1-aminoanthroquinone). The pellet can be disposed in a housing of a thermally-actuated, current cutoff device, such as a high-temperature thermal cutoff device (HTTCO). Also provided are material systems, which include the pellet composition and a high-temperature seal that provides substantial sealing up to at least the transition temperature. Methods of making such high-temperature pellet compositions and incorporating them into a thermally-actuated, current cutoff device are also provided.

The invention relates to a main housing element for a multi-part housing of an electrical device. The main housing element consists of a frame element and at least one connector element integrated in the frame element and produced in one piece with the frame element. The connecting region between the at least one connector element and the frame element is configured as a predetermined breaking point. In the course of assembly of the main housing element a mechanical separation of the connector element from the frame element takes place, whereby the connector element and the frame element are uncoupled.

It is an object to provide a configuration with an enhanced sensing accuracy, in which a shunt resistance main body and a terminal member are formed as separate pieces. A shunt resistor includes a resistance main body and a terminal member (21) that is electrically connected to the resistance main body. The terminal member (21) includes a resistance connection portion (23) to be in contact with the resistance main body, and a circuit connection portion (24) provided so as to extend from the resistance connection portion (23). The circuit connection portion (24) is divided into two parts by a slit (27) being formed therein. The slit (27) is formed up to a part of the resistance connection portion (23).

A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.

The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus for manufacturing metal plate chip resistors including cutting mold for cutting intermediate product strip transversely to obtain worked product chip, ohm meter for measuring the resistance of the worked product chip, control device having a calculating part for performing a calculation using the resistance measured by the ohm meter to work out a width in which the strip is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjustor for making an adjustment so that the strip is to be cut transversely in the width obtained from the calculating part.

An apparatus and method for improved current shunt sensing in an electrical system, such as a renewable energy electrical system, is disclosed. A current shunt according to aspects of the present disclosure includes a conductive portion that is placed in series with an electrical system The current shunt includes a sensing element that is used to measure the voltage across the conductive portion of the current shunt. The sensing element has an increased width relative to the width of the conductive portion of the shunt. The increased width of the sensing element provides for improved current shunt sensing that results in more accurate voltage (and thus current) measurements across a wide range of frequencies.

There is provided an array type chip resistor including: a chip body, four pairs of lower electrodes disposed on both sides of a lower surface of the chip body and formed so as to be extended to edges of the chip body, side electrodes formed so that the lower electrodes are extended to sides of the chip body, and a resistor interposed between the lower electrodes on the lower surface of the chip body and electrically connected to the lower electrode through a contact portion, wherein when a width of the side electrode is defined as d1, a distance between adjacent side electrodes is defined as d2, and a height of the side electrode is defined as h, in the case in which d1/d2 is 0.5 to 1.5, a value of h is 4,300/d1 μm or above and is 0.24d2+87.26 μm or less.

A piezoresistive sensor device and a method for making a piezoresistive device are disclosed. The sensor device comprises a silicon wafer having piezoresistive elements and contacts in electrical communication with the elements. The sensor device further comprises a contact glass coupled to the silicon wafer and having apertures aligned with the contacts. The sensor device also comprises a non-conductive frit for mounting the contact glass to a header glass, and a conductive non-lead glass frit disposed in the apertures and in electrical communication with the contacts. The method for making a piezoresistive sensor device, comprises bonding a contact glass to a silicon wafer such that apertures in the glass line up with contacts on the wafer, and filling the apertures with a non-lead glass frit such that the frit is in electrical communication with the contacts. The use of a lead free glass frit prevents catastrophic failure of the piezoresistive sensor and associated transducer in ultra high temperature applications.

There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni).

A surface-mountable over-current protection device comprises a PTC material layer, first and second conductive layers, first and second electrodes, first and second electrically conductive connecting members. The PTC material layer has a resistivity less than 0.18 Ω-cm. The conductive layers are in contact with opposite surfaces of the PTC material layer. The first electrode comprises pair of first metal foils and is insulated from the second conductive layer. The second electrode comprises a pair of second metal foils and is insulated from the first conductive layer. The first electrically conductive connecting member connects to the first metal foils and conductive layer. The second electrically conductive connecting member connects to the second metal foils and conductive layer. The first electrically conductive connecting member comprises 40%-100% by area of the first lateral surface, and the second electrically conductive connecting member comprises 40%-100% by area of the second lateral surface.

An electronic power apparatus is provided, including a circuit board having a conductive pads and a sense pad coupled to an output signal, and an actuator having a wiper portion accommodating a conductive wiper. The wiper includes a first end arranged to engage the sense pad and a second end arranged to slidably engage at least one of the conductive pads on the circuit board. The conductive pads are arranged in a first row of conductive pads and a second row of conductive pads in parallel with and at a distance to the first row of conductive pads. An alignment of the second row of conductive pads is offset with respect to the first row of conductive pads.

A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.

A touch panel includes a touch sensor layer including a first transparent electrode and a second transparent electrode, wherein an arrangement direction of the first transparent electrode can be perpendicular to that of the second transparent electrode, and both of the first and second transparent electrodes include two transparent metallic patterns which are stacked and electrically connected to each other.

A resistive device includes a resistive layer, a flexible substrate arranged on the resistive layer, and an electrode layer. The electrode layer includes two electrode sections arranged below the resistive layer and separate to each other. Moreover, a method for manufacturing the resistive device with flexible substrate is also disclosed.

An elastomeric particle (1, 1, 1″) comprises a non-conducting elastomeric body (2) having an electrically conducting surface (4a, 4b, 6). Pressure sensor elements (20, 20', 20″; 30, 30', 30″, 30'″) comprising such elastomeric particles are disclosed, as well as sensor clusters (50″, 50'″, 50IV, 50V, 50VI, 50VII, 70) comprising such sensor elements. There is also disclosed a pressure sensor element (40, 40', 40″, 40'″, 40IV, 40V, 40VI, 40VII), comprising a resistive element (44, 44', 44″) providing a conduction path, a first electrode (42a, 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6), connected to the resistive element, a second electrode (42b, 42b'), which in a quiescent state is spaced from said first electrode, wherein the second electrode, when the pressure sensor element is subjected to a pressure, is arranged to contact said first electrode or said resistive element. Systems comprising such sensor elements and sensor clusters are disclosed, as well as methods of their fabrication.

A surface mountable over-current protection device comprises one PTC material layer, first and second conductive layers, first and second electrodes, and an insulating layer. The PTC material layer comprises crystalline polymer and conductive filler dispersed therein. The first and second conductive layers are disposed on first and second planar surfaces of the PTC material layer, respectively. The first and second electrodes are electrically connected to the first and second conductive layers. The insulating layer is disposed between the first and the second electrodes for insulation. At the melting point of the crystalline polymer, the CTE of the crystalline polymer is greater than 100 times the CTE of the first or second conductive layer, and the first and/or second conductive layers has a thickness which is large enough to obtain a resistance jump value R3/Ri less than 1.4.

A five axis vise includes two separated vise body portions that are supported on a machine tool table or other support that fixes the vise body portions in position. The vise body portions have jaws spaced up from the machine tool table sufficiently to permit machining five surfaces of a work piece held in the jaws. A vise screw is rotatably mounted in one of the vise body portions, and extends to the other vise body portion to actuate a movable jaw on the other vise body portion. The vise screw is threaded into a jaw nut that has a drive surface that engages and drives a driven surface on the movable jaw, with the drive and driven surfaces being inclined relative to the axis of force application to provide a downward force component on the movable jaw as it is tightened. The vise screw is an assembly of a threaded shank or shaft and a hub that is rotatably mounted in one of the body portions, with the threaded shank or shaft being locked in position in the hub.

An articulated work holder for a fractional dimensioned, performance vehicle including a base member and first, second and third, support arms having multiple degrees of rotational movement and a vise member carrying vehicle engagement pads for supporting a fractional dimensioned, performance vehicle between the vise engagement pads.

A fixing device for fixing a workpiece includes a base, a first pressing block pressing the workpiece to the base, a second pressing block, a first support member, a second support member, and a side pressing block. The workpiece includes a preprocessing portion to be machined, which has an inner surface and an outer surface, the inner and outer surfaces of the preprocessing portion are sandwiched between non-rigid materials during a machining process to avoid the generating of swarfs.

A ski tip hold down assembly for holding the tip end of the ski. The ski tip hold down assembly having a base attached to a work bench and an upright stand affixed to the base. The upright stand having a ski rest on a top surface thereof and a ski tip hold down bar secured to the upright stand in spaced apart relation to the ski rest defining an opening adapted to receive a ski tip, with the ski oriented in a base-up configuration, with the ski tip extending underneath the ski tip hold down bar. The apparatus further including a tail rest assembly having a base adapted to be used on the work bench in spaced apart relation to the ski tip hold down assembly and further including an upright stand affixed to the base with a ski rest provided on a top surface thereof.

A system and method of painting parts of large dimensions that present a certain amount of flexibility that makes their shape geometrically unstable in the event of being moved. The surface of a part is moved in front of a paint spray device by an arm of a robot, while the spray device remains stationary relative to the robot and while the part is being deformed. Other elements include a gripper for gripping parts of large dimensions, the gripper being adapted to implement the method; an installation; and a booth for performing surface treatment of parts.

Disclosed herein is a rotary jig for battery cells to successively manufacture battery cells having different sizes including a main body configured to have a hexahedral structure having a rotary rod mounted at a lower end thereof, the main body being provided at sides thereof with mounting frames having sizes corresponding to sizes of battery cells so that the battery cells can be uprightly mounted in the mounting frames in a state in which electrode terminals of the battery cells are exposed upward, a die disposed at a lower end of the main body, the die connected to the rotary rod so that the die can be rotated manually or by a rotary motor, and support members formed at the die to support the mounting frames of the main body and the battery cells mounted in the mounting frames, wherein the rotary rod is rotated so that resistance welding is performed with respect to a portion of one of battery cells to be welded using a welding rod located above the battery cell in a state in which the battery cells are mounted to the corresponding sides of the main body.

A part fixturing system for securing a workpiece includes an expanding clamping device and a work holding device. The expanding clamping device includes a clamp base portion, first and second traversing wedge blocks, an actuation screw, and a clamp plate portion. The clamp base portion comprises a longitudinal recess, and the traversing wedge blocks are located inside the longitudinal recess, each block including an inclined contact surface and a threaded aperture. The actuation screw passes through the longitudinal recess of the clamp base portion and the threaded apertures of the traversing wedge blocks. The clamp plate portion comprises first and second declined contact surfaces. The work holding device comprises first and second support columns that define a longitudinal loading envelope. The expanding clamping device is positioned inside the longitudinal loading envelope of the work holding device and couples the workpiece to the first and second support columns.

An aspect of the present invention is drawn to a device for use with an electrostatic chuck having a top surface and a bottom surface, the top surface being separated from the bottom surface by a width, the electrostatic chuck additionally having a hole therein, the hole having a first width at the top surface and having a second width at the bottom surface, the first width being less than the second width, the top surface being capable of having wafer disposed thereon. The device includes a pin, a shaft, a neck portion and an outer housing portion. The pin has a pin width less than the first width. The shaft has a pin-holding portion, an end portion and a central portion disposed between the pin-holding portion and the end portion. The central portion has a first bearing portion. The outer housing portion has a first end and a second end and includes a second bearing portion. The shaft is disposed within the outer housing portion and is moveable relative to the outer housing portion. The neck portion is disposed at the first end. The second bearing portion is stationary relative to the neck portion. The first bearing portion is movable relative to the second bearing portion.

A support disk fixing apparatus which includes an upper surface to which a wafer is bonded, a lower surface, a cylindrical side surface between the upper surface and the lower surface, and a chamfered portion between the upper surface and the side surface, includes a base upon which the support disk is placed; and a fixture that is provided on the base, and that has a first surface that abuts against the side surface of the support disk and covers the side surface of the support disk, and a second surface that abuts against the chamfered portion of the support disk and covers the chamfered portion of the support disk.

An apparatus for supporting a workpiece during processing of the workpiece is disclosed. The apparatus comprises: a chassis having a vacuum chamber that is connectable to a vacuum source; a supporting device rotatable relative to the chassis, the supporting device having a hollow compartment and a supporting surface for holding the workpiece; and at least one sealing device arranged between the chassis and the supporting device, to provide an air-tight seal between the chassis and the supporting device while allowing for rotation of the supporting device with respect to the chassis, so as to form a vacuum passage extending from the supporting surface of the supporting device through the hollow compartment of the supporting device and the vacuum chamber of the chassis to the vacuum source, to thereby hold the workpiece to the supporting surface of the supporting device during processing of the workpiece.

The present invention relates to an adjusting device of wafer machine, which includes a rotary adjustment assembly that is rotatable to cause the rotation of a rod so as to displace a support block thereby elevating or lowering a support post. A balance board is thus caused to move a wafer substrate so as to realize balancing of wafer through the support post, whereby efficient adjustment of the wafer machine to a balanced position can be achieved without extra expense of time in adjustment operation and thus accelerating the time of manufacturing process and providing extremely high precision and further effectively reducing the potential risk of damage caused by over-adjustment.

A loading container (10) for a washing machine (60) comprises a containing body (12) to support and position objects to be washed inside the washing machine (60) or washing devices (20, 22) containing the objects to be washed. The container (10) also comprises a base body (14), located below the containing body (12), and a rotation unit (45) to connect rotatably the base body (14) and the containing body (12) so as to allow a selective reciprocal angular positioning of the containing body (12) and the base body (14).

A dual-toggle-type mobile platform structure comprises a base, a motor, a ball screw, a linear slide, a first toggle link rod, a second toggle link rod, a guide rail and a work platform. The second toggle link rod has an end coupled to the first toggle link rod and the other end coupled to the work platform. A connecting position of the second toggle link rod and the first toggle link rod is designed with an optimal configuration to provide a smaller footprint than the conventional dual-toggle-type mobile platform structure, and the advantages of a larger stroke of the work platform and a smaller feed resolution difference, and the structure serves as a reference of an optimal manufacturing area.

A turbine component repair apparatus includes: a first die having male and female halves for clamping a first section of a turbine blade with a platform and a root portion of an airfoil, the first die having a recess shaped to receive the root portion and retain a faying surface thereof in predetermined alignment; and a second die having male and female halves for clamping a repair section which defines a tip portion of the airfoil, the second die having a second recess shaped to receive the tip portion and retain a faying surface of the tip portion in predetermined alignment. The first and second dies have mating front faces configured to align their bottom surfaces in a common plane. A alignment device is removably attached to the second die to temporarily align the repair section in the absence of the male half of the second die.

A panel jig apparatus is provided which has first moving units that are respectively installed at the left and right sides of a base frame, and selectively reciprocate a first sliding plate provided on top of the base frame leftward and rightward on the base frame. Likewise, the second moving units are respectively installed at the front and rear sides of the base frame, and selectively reciprocate a second sliding plate provided on top of the base frame forward and rearward on the base frame. The first support units are movable leftward and rightward on the base frame by the respective first sliding plates, and movable upward and downward by an ascending and descending means so as to support a panel. The second support units are movable forward and rearward on the base frame by the second sliding plates, and provided to support the panel.

A rocking jaw gripper for restraining tubulars including an arm with a rocking jaw gripper rocker jaw, a rocking jaw gripper frame connected with the arm, a locking pin connecting the rocking jaw gripper frame to the chain cylinder, a hinge pin connecting the rocking jaw gripper frame to the arm and a plate jaw fastener retaining the rocker jaw body between the top plate and the bottom plate by engaging the tail hole of the rocker jaw body. When the rocking jaw gripper is engaged, it acts to restrain the movement of a tubular during make-up and break-out.

A reconfigurable clamping system is disclosed. An example clamping system for securing a workpiece comprises a retention assembly and an inflatable bladder. The retention assembly comprises a plurality of links, each pair of adjacent links having a pivotal connection to enable the retention assembly to be configured to the general shape of a workpiece, and each pair of adjacent links having a locking mechanism to selectively lock an angular relationship between the pair. The inflatable bladder is coupled between the retention assembly and the workpiece and is to apply a clamping force to the workpiece.

An optical fiber fusion splicer includes: a windshield cover having a rotating shaft and rotating around the rotating shaft so as to be openable and closable; a cable member wrapping unit coupled and fixed to the windshield cover on the same axis as the rotating shaft of the windshield cover or formed as a portion of the windshield cover, the cable member wrapping unit being rotatable in a normal direction or in a reverse direction around the rotating shaft; a first cable member winding unit that is a rotary pulley, a non-rotary pulley, or a rotary gear; and a closed-loop member including a deformable cable member wound around the cable member wrapping unit and the first cable member winding unit, the closed-loop member constituting a closed loop.

A multi-functional vice base including a main body and a plate is provided. The main body includes a bottom surface, side surfaces and fixing portions. At least two side surfaces form a groove therebetween. Each fixing portion is disposed between the groove and the bottom surface. A first fixing member goes through a through hole of one of the fixing portions and is fixed on a working machine bench. The plate is detachably disposed at one of the side surfaces. Whereby the vice base can be mounted on various sized horizontal machining centers. Besides, plates with different size are allowed to be mounted on the main body for clamping work pieces whose sizes are different.

A hand tool for inserting a large variety of connector components into narrow plastic irrigation piping is disclosed. This tool is an improved and progressive development of my previous Israeli patent no: 152089 in that it is designed to work with a large variety of connector components and is designed to accommodate both sizes of narrow spaghetti piping, whereas the previous patent could accommodate only a single size of narrow piping. The tool as shown in FIG. 2 has a body onto which all the elements are connected and the body is configured to sit comfortably in the palm of the hand. When pressing down on the handle, the grips secure the narrow piping and cause a connector component, deployed in appropriate recess provided in the tool to be easily inserted into the narrow piping.

An optical fiber fusion splicer that heats and fusion-splices optical fibers to each other, the optical fiber fusion splicer includes: a coating clamp installation base; a coating clamp that is attached to the coating clamp installation base and has a coating clamp lid that is openable and closable; and a first power source for advancing the coating clamp installation base and opening the coating clamp lid. An operation of opening the coating clamp lid is performed using the first power source after the fusion splicing is completed.

An interlocking and removable tool for floral arranging, consisting of two interlocking pieces which form a sturdy grid when assembled. This grid is placed on top of a vase, jar, bowl, or other vessel used for housing arranged flowers. This grid keeps flowers in place while being arranged, without falling over, and allows the user to construct floral arrangements with ease. When the desired arrangement is complete, the interlocking components slide apart and are removed without disrupting the floral arrangement.

The present invention is directed to apparatus and methods for clamping along a work piece. In one embodiment, a clamping system includes one or more force applying units each including a plunger or force applying member adapted to apply clamping force to the work piece, and one or more coupling units linked with the force applying units forming a chain of force applying units and coupling units. The coupling units may include a lockable pivot adapted to pivot to conform the chain to the surface of the work piece when unlocked, and adapted to be locked when at least one of the plurality of force applying units applies clamping force to the work piece. In another embodiment, a clamping system may include multi-axis pivot units. In a further embodiment, a clamping system may include length adjusting units.

A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.

A device for cleaning trays comprises a tub that has a bottom and a wall. The tub is dimensioned such that a baking tray can be placed therein. The device further comprises a dish drain that can be placed in the tub. Said device for cleaning a baking tray uses only a small amount of space in a kitchen and is easy to handle. In fact, in a typical kitchen that already has a dish drain, the device requires no additional space.