The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus for manufacturing metal plate chip resistors including cutting mold for cutting intermediate product strip transversely to obtain worked product chip, ohm meter for measuring the resistance of the worked product chip, control device having a calculating part for performing a calculation using the resistance measured by the ohm meter to work out a width in which the strip is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjustor for making an adjustment so that the strip is to be cut transversely in the width obtained from the calculating part.

A spectrometer system for providing information about a target with terahertz radiation. The system may receive incident radiation from the target through fore optics, a slit aperture, secondary optics and a dispersive element which images a slit on an array of terahertz sensitive detectors. The detectors may include uncooled sensors. Each sensor may be connected to its own micro antenna. The array of detectors may be situated proximate to the dispersive element so that radiation from the element may be dispersed according to wavelength to the respective detectors optimally sensitive to the various respective wavelengths. Detector signals indicating the impingement of terahertz radiation may provide information for identifying a material of the target.

An apparatus and method for improved current shunt sensing in an electrical system, such as a renewable energy electrical system, is disclosed. A current shunt according to aspects of the present disclosure includes a conductive portion that is placed in series with an electrical system The current shunt includes a sensing element that is used to measure the voltage across the conductive portion of the current shunt. The sensing element has an increased width relative to the width of the conductive portion of the shunt. The increased width of the sensing element provides for improved current shunt sensing that results in more accurate voltage (and thus current) measurements across a wide range of frequencies.

Provided is a resistive element which has excellent inrush current resistance, and can suppress heat generation in a steady state. The resistive element has an element main body of a semiconductor ceramic in which the main constituent has a structure of R11-xR2xBaMn2O6 in which 0.05≦x≦1.0 when R1 is Nd and R2 is at least one of Sm, Eu and Gd; 0.05≦x≦0.8 when R1 is Nd and R2 is at least one of Tb, Dy, Ho, Er, and Y; 0≦x≦0.4 when R1 is at least one of Sm, Eu, and Gd and R2 is at least one of Tb, Dy, Ho, and Y; and 0≦x≦1.0 when R1 is at least one of Sm, Eu, and Gd and R2 is at least one of Sm, Eu, and Gd, but the Sm, Eu, and/or Gd in R1 is different from that in R2.

There is provided an array type chip resistor including: a chip body, four pairs of lower electrodes disposed on both sides of a lower surface of the chip body and formed so as to be extended to edges of the chip body, side electrodes formed so that the lower electrodes are extended to sides of the chip body, and a resistor interposed between the lower electrodes on the lower surface of the chip body and electrically connected to the lower electrode through a contact portion, wherein when a width of the side electrode is defined as d1, a distance between adjacent side electrodes is defined as d2, and a height of the side electrode is defined as h, in the case in which d1/d2 is 0.5 to 1.5, a value of h is 4,300/d1 μm or above and is 0.24d2+87.26 μm or less.

A heater assembly includes one or more first heating elements, the one or more first heating elements being characterized by a positive temperature coefficient; and one or more second heating elements, the one or more second heating elements comprising resistance wire elements. The one or more second heating elements are positioned in proximity to the one or more first heating elements such that at least one of the one or more second heating elements is configured to, upon being powered on, pre-heat at least one of the one or more first heating elements before the at least one first heating element is powered on.

There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni).

A surface-mountable over-current protection device comprises a PTC material layer, first and second conductive layers, first and second electrodes, first and second electrically conductive connecting members. The PTC material layer has a resistivity less than 0.18 Ω-cm. The conductive layers are in contact with opposite surfaces of the PTC material layer. The first electrode comprises pair of first metal foils and is insulated from the second conductive layer. The second electrode comprises a pair of second metal foils and is insulated from the first conductive layer. The first electrically conductive connecting member connects to the first metal foils and conductive layer. The second electrically conductive connecting member connects to the second metal foils and conductive layer. The first electrically conductive connecting member comprises 40%-100% by area of the first lateral surface, and the second electrically conductive connecting member comprises 40%-100% by area of the second lateral surface.

An electronic power apparatus is provided, including a circuit board having a conductive pads and a sense pad coupled to an output signal, and an actuator having a wiper portion accommodating a conductive wiper. The wiper includes a first end arranged to engage the sense pad and a second end arranged to slidably engage at least one of the conductive pads on the circuit board. The conductive pads are arranged in a first row of conductive pads and a second row of conductive pads in parallel with and at a distance to the first row of conductive pads. An alignment of the second row of conductive pads is offset with respect to the first row of conductive pads.

A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.

Provided is a non-linear resistive element which improves the degree of freedom of design of its mounting space. A ceramic sheet 10 which constitutes the non-linear resistive element is configured by a plurality of ceramic pieces 11 being consolidated in a plate like form by an insulating resin 12. One or a plurality of ceramic pieces 11 configure each of a plurality of conductive paths which penetrate the ceramic sheet 10 in a thickness direction thereof, and the ceramic pieces 11 which configure both ends of the conductive paths partially projects from the insulating resin 12.

A touch panel includes a touch sensor layer including a first transparent electrode and a second transparent electrode, wherein an arrangement direction of the first transparent electrode can be perpendicular to that of the second transparent electrode, and both of the first and second transparent electrodes include two transparent metallic patterns which are stacked and electrically connected to each other.

A resistive device includes a resistive layer, a flexible substrate arranged on the resistive layer, and an electrode layer. The electrode layer includes two electrode sections arranged below the resistive layer and separate to each other. Moreover, a method for manufacturing the resistive device with flexible substrate is also disclosed.

An elastomeric particle (1, 1, 1″) comprises a non-conducting elastomeric body (2) having an electrically conducting surface (4a, 4b, 6). Pressure sensor elements (20, 20', 20″; 30, 30', 30″, 30'″) comprising such elastomeric particles are disclosed, as well as sensor clusters (50″, 50'″, 50IV, 50V, 50VI, 50VII, 70) comprising such sensor elements. There is also disclosed a pressure sensor element (40, 40', 40″, 40'″, 40IV, 40V, 40VI, 40VII), comprising a resistive element (44, 44', 44″) providing a conduction path, a first electrode (42a, 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6), connected to the resistive element, a second electrode (42b, 42b'), which in a quiescent state is spaced from said first electrode, wherein the second electrode, when the pressure sensor element is subjected to a pressure, is arranged to contact said first electrode or said resistive element. Systems comprising such sensor elements and sensor clusters are disclosed, as well as methods of their fabrication.

Provided is a resistive element which is excellent in inrush current resistance even in the case of having a surface-mountable small chip shape. The resistive element has an element main body composed of a semiconductor ceramic in which a main constituent thereof is composed of a Mn compound represented by the general formula (Nd1-xMx)yBazMn2O6 (M is at least one rare-earth element selected from Sm, Gd, Eu, Tb, Dy, Ho, Er, and Y), and x, y, and z respectively meet the conditions of: 0.05≦x≦0.4; 0.80≦y≦1.2; and 0.80≦z≦1.2 in the chemical formula.

The invention provides a movable contact movable on a fixed contact or a resistor. The movable contact includes first and second sliders. The first and second sliders are arranged in such a manner as to slide along different sliding tracks from each other on the fixed contact or the resistor in accordance with movement of the movable contact.

A surface mountable over-current protection device comprises one PTC material layer, first and second conductive layers, first and second electrodes, and an insulating layer. The PTC material layer comprises crystalline polymer and conductive filler dispersed therein. The first and second conductive layers are disposed on first and second planar surfaces of the PTC material layer, respectively. The first and second electrodes are electrically connected to the first and second conductive layers. The insulating layer is disposed between the first and the second electrodes for insulation. At the melting point of the crystalline polymer, the CTE of the crystalline polymer is greater than 100 times the CTE of the first or second conductive layer, and the first and/or second conductive layers has a thickness which is large enough to obtain a resistance jump value R3/Ri less than 1.4.

A five axis vise includes two separated vise body portions that are supported on a machine tool table or other support that fixes the vise body portions in position. The vise body portions have jaws spaced up from the machine tool table sufficiently to permit machining five surfaces of a work piece held in the jaws. A vise screw is rotatably mounted in one of the vise body portions, and extends to the other vise body portion to actuate a movable jaw on the other vise body portion. The vise screw is threaded into a jaw nut that has a drive surface that engages and drives a driven surface on the movable jaw, with the drive and driven surfaces being inclined relative to the axis of force application to provide a downward force component on the movable jaw as it is tightened. The vise screw is an assembly of a threaded shank or shaft and a hub that is rotatably mounted in one of the body portions, with the threaded shank or shaft being locked in position in the hub.

An articulated work holder for a fractional dimensioned, performance vehicle including a base member and first, second and third, support arms having multiple degrees of rotational movement and a vise member carrying vehicle engagement pads for supporting a fractional dimensioned, performance vehicle between the vise engagement pads.

A clamping mechanism includes a positioning member, a support plate, a frame, a fastening assembly, and an operating assembly. The support plate defines a through hole. The fastening assembly is fixed to the frame. The fastening assembly includes a fastening member and an elastic member. The positioning member extends through the through hole of the support plate, and is fastened by the fastening member under an elastic force of the elastic member. The operating assembly resists the fastening member, thereby driving the fastening member away from the positioning member.

A work orienting plate or angled vise parallel for use with a machine vise and which angled plate has first, second and third reference edges with the second and third reference edges being spaced apart side edges that are perpendicular to the first edge. Angled work piece support edges join the second and third reference edges, respectively. The angled work piece support edges are at different angles from one another so that a work piece can be supported on any one of the edges relative to a reference surface of a vise on which the work orienting plate is mounted to position the work piece at selected angles for machining angled surfaces.

A welding workbench assembly comprises a base. The welding workbench assembly further comprises a first wraparound barrier comprising at least three panels, including a first panel, a second panel, and a third panel. The second panel is adjacent to the first panel at a first end of the first panel and the third panel is adjacent to the first panel at a second end of the first panel. The welding workbench assembly further comprises a second wraparound barrier comprising at least three panels, including a fourth panel, a fifth panel, and a sixth panel. The fifth panel is adjacent to the fourth panel at a first end of the fourth panel and the sixth panel is adjacent to the fourth panel at a second end of the fourth panel.

A ski tip hold down assembly for holding the tip end of the ski. The ski tip hold down assembly having a base attached to a work bench and an upright stand affixed to the base. The upright stand having a ski rest on a top surface thereof and a ski tip hold down bar secured to the upright stand in spaced apart relation to the ski rest defining an opening adapted to receive a ski tip, with the ski oriented in a base-up configuration, with the ski tip extending underneath the ski tip hold down bar. The apparatus further including a tail rest assembly having a base adapted to be used on the work bench in spaced apart relation to the ski tip hold down assembly and further including an upright stand affixed to the base with a ski rest provided on a top surface thereof.

A system and method of painting parts of large dimensions that present a certain amount of flexibility that makes their shape geometrically unstable in the event of being moved. The surface of a part is moved in front of a paint spray device by an arm of a robot, while the spray device remains stationary relative to the robot and while the part is being deformed. Other elements include a gripper for gripping parts of large dimensions, the gripper being adapted to implement the method; an installation; and a booth for performing surface treatment of parts.

Disclosed herein is a rotary jig for battery cells to successively manufacture battery cells having different sizes including a main body configured to have a hexahedral structure having a rotary rod mounted at a lower end thereof, the main body being provided at sides thereof with mounting frames having sizes corresponding to sizes of battery cells so that the battery cells can be uprightly mounted in the mounting frames in a state in which electrode terminals of the battery cells are exposed upward, a die disposed at a lower end of the main body, the die connected to the rotary rod so that the die can be rotated manually or by a rotary motor, and support members formed at the die to support the mounting frames of the main body and the battery cells mounted in the mounting frames, wherein the rotary rod is rotated so that resistance welding is performed with respect to a portion of one of battery cells to be welded using a welding rod located above the battery cell in a state in which the battery cells are mounted to the corresponding sides of the main body.

A part fixturing system for securing a workpiece includes an expanding clamping device and a work holding device. The expanding clamping device includes a clamp base portion, first and second traversing wedge blocks, an actuation screw, and a clamp plate portion. The clamp base portion comprises a longitudinal recess, and the traversing wedge blocks are located inside the longitudinal recess, each block including an inclined contact surface and a threaded aperture. The actuation screw passes through the longitudinal recess of the clamp base portion and the threaded apertures of the traversing wedge blocks. The clamp plate portion comprises first and second declined contact surfaces. The work holding device comprises first and second support columns that define a longitudinal loading envelope. The expanding clamping device is positioned inside the longitudinal loading envelope of the work holding device and couples the workpiece to the first and second support columns.

An aspect of the present invention is drawn to a device for use with an electrostatic chuck having a top surface and a bottom surface, the top surface being separated from the bottom surface by a width, the electrostatic chuck additionally having a hole therein, the hole having a first width at the top surface and having a second width at the bottom surface, the first width being less than the second width, the top surface being capable of having wafer disposed thereon. The device includes a pin, a shaft, a neck portion and an outer housing portion. The pin has a pin width less than the first width. The shaft has a pin-holding portion, an end portion and a central portion disposed between the pin-holding portion and the end portion. The central portion has a first bearing portion. The outer housing portion has a first end and a second end and includes a second bearing portion. The shaft is disposed within the outer housing portion and is moveable relative to the outer housing portion. The neck portion is disposed at the first end. The second bearing portion is stationary relative to the neck portion. The first bearing portion is movable relative to the second bearing portion.

A support disk fixing apparatus which includes an upper surface to which a wafer is bonded, a lower surface, a cylindrical side surface between the upper surface and the lower surface, and a chamfered portion between the upper surface and the side surface, includes a base upon which the support disk is placed; and a fixture that is provided on the base, and that has a first surface that abuts against the side surface of the support disk and covers the side surface of the support disk, and a second surface that abuts against the chamfered portion of the support disk and covers the chamfered portion of the support disk.

The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.

An apparatus for supporting a workpiece during processing of the workpiece is disclosed. The apparatus comprises: a chassis having a vacuum chamber that is connectable to a vacuum source; a supporting device rotatable relative to the chassis, the supporting device having a hollow compartment and a supporting surface for holding the workpiece; and at least one sealing device arranged between the chassis and the supporting device, to provide an air-tight seal between the chassis and the supporting device while allowing for rotation of the supporting device with respect to the chassis, so as to form a vacuum passage extending from the supporting surface of the supporting device through the hollow compartment of the supporting device and the vacuum chamber of the chassis to the vacuum source, to thereby hold the workpiece to the supporting surface of the supporting device during processing of the workpiece.

The present invention relates to an adjusting device of wafer machine, which includes a rotary adjustment assembly that is rotatable to cause the rotation of a rod so as to displace a support block thereby elevating or lowering a support post. A balance board is thus caused to move a wafer substrate so as to realize balancing of wafer through the support post, whereby efficient adjustment of the wafer machine to a balanced position can be achieved without extra expense of time in adjustment operation and thus accelerating the time of manufacturing process and providing extremely high precision and further effectively reducing the potential risk of damage caused by over-adjustment.

A loading container (10) for a washing machine (60) comprises a containing body (12) to support and position objects to be washed inside the washing machine (60) or washing devices (20, 22) containing the objects to be washed. The container (10) also comprises a base body (14), located below the containing body (12), and a rotation unit (45) to connect rotatably the base body (14) and the containing body (12) so as to allow a selective reciprocal angular positioning of the containing body (12) and the base body (14).

A dual-toggle-type mobile platform structure comprises a base, a motor, a ball screw, a linear slide, a first toggle link rod, a second toggle link rod, a guide rail and a work platform. The second toggle link rod has an end coupled to the first toggle link rod and the other end coupled to the work platform. A connecting position of the second toggle link rod and the first toggle link rod is designed with an optimal configuration to provide a smaller footprint than the conventional dual-toggle-type mobile platform structure, and the advantages of a larger stroke of the work platform and a smaller feed resolution difference, and the structure serves as a reference of an optimal manufacturing area.

A turbine component repair apparatus includes: a first die having male and female halves for clamping a first section of a turbine blade with a platform and a root portion of an airfoil, the first die having a recess shaped to receive the root portion and retain a faying surface thereof in predetermined alignment; and a second die having male and female halves for clamping a repair section which defines a tip portion of the airfoil, the second die having a second recess shaped to receive the tip portion and retain a faying surface of the tip portion in predetermined alignment. The first and second dies have mating front faces configured to align their bottom surfaces in a common plane. A alignment device is removably attached to the second die to temporarily align the repair section in the absence of the male half of the second die.

Kit of improved accessories suitable for automated storage structures (20) comprising an automatic clamping system adapted to lock in position workpieces stored during transport on a truck, plant conveyor or any other vehicle and supporting elements (11) for the workpieces stored each formed by bending of iron wire according to the workpiece profile.

A c-shaped clamp tool system preferably includes slider arms, one or more slider arm supports, pads, one or more threaded rods, and turning knobs. The clamping system preferably includes multiple slider arms and slider arm supports of different lengths. In a preferred embodiment, the slider arms are made of unidirectional pultruded carbon fiber and the slider arm support is made of woven carbon fiber.

A reconfigurable clamping system is disclosed. An example clamping system for securing a workpiece comprises a retention assembly and an inflatable bladder. The retention assembly comprises a plurality of links, each pair of adjacent links having a pivotal connection to enable the retention assembly to be configured to the general shape of a workpiece, and each pair of adjacent links having a locking mechanism to selectively lock an angular relationship between the pair. The inflatable bladder is coupled between the retention assembly and the workpiece and is to apply a clamping force to the workpiece.

A spring clamp includes a first body which comprises a gripping portion and a clamping portion, a second body which comprises a gripping portion and a clamping portion, a first pivot element which pivotally connects the first body and the second body, and a locking mechanism which comprises at least a pair of friction pair components. The first friction pair component is arranged on the first body, and includes a first friction pair element; and the second friction pair component is arranged on the second body, and includes a second friction pair element. The first and second friction pair elements rub against each other to effect the locking function. The rubbing of the friction pair elements occurs mainly in the plane perpendicular to the first pivot element axis.

A retractable assembly for introducing an insertable device into a container through a container opening, comprising: a linear guide, which is releasably mountable on the container via a holder; and, guided along the linear guide, a slider, on which an articulated head is so seated, that it has at least two degrees of freedom perpendicular to the linear guide, wherein the insertable device is at least axially guided in the articulated head in the mounted state.

A multi-functional vice base including a main body and a plate is provided. The main body includes a bottom surface, side surfaces and fixing portions. At least two side surfaces form a groove therebetween. Each fixing portion is disposed between the groove and the bottom surface. A first fixing member goes through a through hole of one of the fixing portions and is fixed on a working machine bench. The plate is detachably disposed at one of the side surfaces. Whereby the vice base can be mounted on various sized horizontal machining centers. Besides, plates with different size are allowed to be mounted on the main body for clamping work pieces whose sizes are different.

A clamp device includes a clamp main body, an engagement assembly, a clamp rod, a drive mechanism, and a support mechanism. The engagement assembly can be changed over between a diameter-expanded state in which it engages with an inner circumferential surface of an aperture in a workpiece, and a diameter-reduced state in which it does not so engage. The clamp rod is engaged with an interior of the engagement assembly. The drive mechanism drives the clamp rod to and from the clamp main body. The support mechanism supports the engagement assembly with a pneumatic force of pressurized air. At least a part of the pneumatic force is released after the engagement assembly has been expanded in diameter.

An interlocking and removable tool for floral arranging, consisting of two interlocking pieces which form a sturdy grid when assembled. This grid is placed on top of a vase, jar, bowl, or other vessel used for housing arranged flowers. This grid keeps flowers in place while being arranged, without falling over, and allows the user to construct floral arrangements with ease. When the desired arrangement is complete, the interlocking components slide apart and are removed without disrupting the floral arrangement.

An adjustment mechanism includes a first adjustment assembly and a second adjustment assembly. The first adjustment assembly includes a first regulating member and a second regulating member. The first regulating member includes a bearing plate and a first supporting portion protruding from the bearing plate. The first supporting portion includes an arcuate first supporting surface. The second regulating member includes a base body and a second supporting portion protruding from the base body away from the first supporting portion. The second supporting portion includes an arcuate second supporting surface. The second adjustment assembly includes a mounting member latched with the base body. First supporting surface resists the base body, to enable the bearing plate to rock along a curvature relative to the base body. Second supporting surface resists the mounting member, to enable the bearing plate and the base body to rock relative to the mounting member.

The present invention is directed to apparatus and methods for clamping along a work piece. In one embodiment, a clamping system includes one or more force applying units each including a plunger or force applying member adapted to apply clamping force to the work piece, and one or more coupling units linked with the force applying units forming a chain of force applying units and coupling units. The coupling units may include a lockable pivot adapted to pivot to conform the chain to the surface of the work piece when unlocked, and adapted to be locked when at least one of the plurality of force applying units applies clamping force to the work piece. In another embodiment, a clamping system may include multi-axis pivot units. In a further embodiment, a clamping system may include length adjusting units.

A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.

An image forming apparatus includes an image forming part including a recording head to form an image on a recording medium, a conveyance mechanism disposed opposite the image forming part to convey the recording medium, and a cover closably openable relative to a body of the image forming apparatus and disposed opposite the conveyance mechanism with the image forming part interposed therebetween. The recording head is detachably attachable to the cover and is configured to move away from the conveyance mechanism when the cover is opened.

An image forming apparatus is provided. The image forming apparatus includes a conveyer configured to convey a recording medium along a conveying path in a conveying direction, an image forming unit configured to form an image on the recording medium being conveyed, a supporting member arranged in a position to face the image forming unit and configured to support the recording medium, and an aspirator configured to aspirate dust through an aspiration inlet, which is formed in a downstream position along the conveying direction with respect to the image forming unit and in proximity to a downstream end of the supporting member.

The present invention aims to provide a technique that prints characters and patterns clearly onto a tire surface without complicated operations. A tire printing device of the present invention includes a printer head that ejects and applies a coating material onto a tire surface, a widthwise moving unit that moves the printer head along the width direction of the tire, a radial moving unit that moves the printer head along the radical direction of the tire, and a swinging unit that swings the printer head around the axis along the circumferential direction of the tire.

The present invention addresses the problem of improving the quality of recorded images in ink jet recording technologies in which a plurality of nozzle lines that discharge ink of the same color are used. As a solution, nozzle lines (10) of n columns (where n is a natural number of three or more) each record a recording pixel column (2) on a recording medium by discharging ink of the same color while scanning over the recording medium (1); and when the nozzle lines (10) of n columns each extract a recording pixel column (2), which is recorded in a single scan, for each n columns in the scanning direction, ink is discharged in such a manner that there are at least two permutation patterns for the nozzle columns (10) that record each column of the extracted recording pixel columns (3).

A fluidic structure has a first chamber having a connection to a fluid reservoir and a connection to an array of apertures, the chamber forming a flow path between the fluid reservoir and the array of apertures, a second chamber having a connection to at least one vent connected to an atmosphere external to the fluidic structure, and at least one path between the first chamber and the second chamber.