The present invention relates to methods of determining if a subject has an increased risk of suffering from memory impairment. The methods comprise analyzing at least one sample from the subject to determine a value of the subject's exosomal profile or combined biomarker profile (lipids plus exosomal cargo) and comparing the value of the subject's exosomal or combined biomarker profile with the value of a normal exosomal or biomarker profile, respectively. A change in the value of the subject's exosomal or combined biomarker profile, including a change in the subject's exosomal or combined biomarker profile, over normal values is indicative that the subject has an increased risk of suffering from memory impairment compared to a normal individual.

In sporadic Alzheimer's disease, neurofibrillary lesion formation is preceded by extensive post-translational modification of the microtubule associated protein tau. Immunoassays have been developed recently that detect tau in biological specimens, thus providing a means for pre-mortem diagnosis of Alzheimer's disease, which has remained elusive. These assays have been improved by the analysis of relevant post-translational modifications, such as phosphorylation, however opportunity for improvement remains. The present invention addresses this issue by disclosing synthetic methylated peptides derived from the tau protein of paired helical filaments and non-diseased control brain. Alzheimer's disease specificity is provided by the presence or absence of methyl moieties on lysine residues and differences between mono-, di-, and tri-methylation. The methylated peptide is useful as an antigen and a binding partner for identifying compounds that interact with the peptide and the methylated tau protein, including antibodies that can distinguish non-diseased brain from that affected by Alzheimer's disease. The resulting antibodies are useful diagnostically and therapeutically. The compounds that specifically bind to methylated tau proteins are useful for eliminating abnormally methylated tau.

Provided are a detection agent for detecting hydroxy vitamin D, preparation method thereof, and use thereof in 25-hydroxy vitamin D immunological detection. The detection agent comprises a conjugate formed by a 25-hydroxy vitamin D antigen derivative and protein carrier, and magnetic spheres coated by the conjugate. Also provided is a 25-hydroxy vitamin D detection kit comprising the detection agent.

The present disclosure provides robust, high-throughput, and clinically applicable methods for simultaneously separating and quantifying the biologically active forms of Vitamin B1 (TPP) and Vitamin B6 (PLP) from human whole blood.

Compositions and methods useful for point of care testing for hemophilia by measuring coagulation factor levels are provided.

A population of bright and stable nanocrystals is provided. The nanocrystals include a semiconductor core and a thick semiconductor shell and can exhibit high extinction coefficients, high quantum yields, and limited or no detectable blinking.

Oakland's alaMar Kitchen & Bar is about to start serving 1,500 free meals per week to restaurant workers who have been displaced and derailed by the coronavirus outbreak.

Located at 100 Grand Ave., chef Nelson German's popular seafood restaurant has just issued this announcement:

"We are here for you, Oakland! ...…

Noted restaurateur Reem Assil has decided to close her Fruitvale restaurant, Reem's California.

"From the bottom of our hearts, we'd like to thank everyone who has supported us in keeping our humble oakland restaurant operation a force in our community.…

Off the Grid will stage a two-part free-meal giveaway today, April 8, from 12 noon to 1 p.m. at Nob Hill Foods Alameda and from 2:30 p.m. to 3:30 p.m. at Pak 'N Save Emeryville.

It's part of the Grocery Employees Meal Fund, which OTG recently launched to help creators feed grocery-store employees and their family members throughout the Covd-19 crisis.…

The owners of Oakland's Homestead Restaurant have just debuted a new business concept that is meant to outlast the Covid-19 crisis.

Currently operating at the restaurant's 4029 Piedmont Ave. space Tuesdays through Saturdays from 10 a.m. to 6 p.m. via curbside pickup and Caviar or Doordash delivery, The Humble Sandwich comprises a selection of classic deli sandos made with the same high-quality ingredients for which the seven-year-old restaurant is revered.…

The owners of Oakland's Homestead Restaurant have debuted a new concept meant to outlast the COVID-19 crisis.

This month alone, Oakland-based, family-owned Mr. Espresso has already donated over 2,500 pounds of coffee to COVID-19 relief efforts all over the Bay Area.

During the first two weeks of April, the 42-year-old company — founded in Alameda by enterprising Italian-born Carlo Di Ruocco and now renowned as the first and currently only outfit in the nation that uses oak wood to roast its beans — has given coffee to the Alameda County Community Food Bank and San Francisco-Marin Food Bank, Frontline Foods, East Bay FeedER, Clinica de La Raza, St. Anthony’s Dining Room, Loaves and Fishes Family Kitchen, and other food-, health-, homeless-, youth-, and family-assistance programs.…

People for the Ethical Treatment of Animals sent UC Berkeley chancellor Carol Christ a letter today requesting permission to place a banner on the university's famous clocktower that reads "It's High Time We Went Vegan. PETA."…

This month alone, Oakland-based, family-owned Mr. Espresso has already donated more than 2,500 pounds of coffee to Bay Area COVID-19 relief efforts.

Benchmark Pizzeria in Old Oakland has closed permanently.

A notice now posted at the restaurant's website, addressed "to our Friends, Regulars, and Supporters," reads:

"We have made the very tough decision to close Benchmark Oakland permanently.…

Now through May 5, healthcare workers and first responders can collect free "Thank You Meals" at any McDonald's location nationwide.

The promotion began on April 22.…

Together with a team of volunteers — including the Street Royalty Motorcycle Club — popular pitmaster Matt Horn prepared and served 600 pork and chicken sandwiches to feed the entire staff at Valley Children's Hospital in Fresno.

Rather than lament the delayed opening of his eagerly awaited Horn Barbecue brick-and-mortar restaurant in the heart of Oakland, last month the pitmaster created a philanthropic project, the Horn Initiative, which has since mid-March facilitated the making and serving of over 4,000 meals to frontline workers and others in need.…

Uptown Oakland's alaMar Kitchen & Bar will celebrate its sixth anniversary this Friday, May 1, with a contactless, social-distancing, Covid-19-crisis parade.

"In celebration of this milestone, we are asking all of our fans and supporters to parade in the safety of their cars," management announced in a press release today.…

Stories you shouldn’t miss:

1. Alameda County Public Health Director Muntu Davis contends that gentrification should be examined in terms of health impacts because of the displacement and stress it causes for low-income residents, the Bay Area News Group$ reports.…

If you happen to run into any medical residents anytime soon, they may look a little fatigued and broke, especially if they happen to be residents or pediatricians of UCSF Benioff Children’s Hospital of Oakland. Today, the CIR/SEIU Healthcare union that represents resident physicians and pediatricians said it plans to rally in front of the hospital on Friday at 12:15 p.m. along with nurses and community leaders to demand better wagers and working conditions.…

The city's 911 system can leave callers waiting for more than 120 seconds before an operator ever answers. Seconds of delay in an emergency can lead to death. As a result, 911 calls are supposed to be answered quickly.…

A ceramic electronic component includes an interior part and an exterior part. The interior part includes an interior part dielectric layer and an internal electrode layer. The exterior part includes an exterior part dielectric layer. The exterior part is positioned outside the interior part along a laminating direction thereof. The interior part dielectric layer and the exterior part dielectric layer respectively contain barium titanate as a main component. β−α≧0.20 and α/β≦0.88 are satisfied, where α mol part and β mol part are respectively an amount of a rare earth element contained in the interior and exterior part dielectric layers, provided that an amount of barium titanate contained in the interior and exterior part dielectric layers is respectively 100 mol parts in terms of BaTiO3.

A ceramic electronic component includes a dielectric layer and an electrode layer. The dielectric layer contains a plurality of ceramic particles and grain boundary phases present therebetween. A main component of the ceramic particles is barium titanate. An average thickness of the grain boundary phases is 1.0 nm or more. A thickness variation σ of the grain boundary phases is 0.1 nm or less.

A multilayer ceramic electronic component includes a laminated body including dielectric layers and internal electrode layers, and first and second external electrodes. The laminated body further includes a first conductor layer, a first insulating coating layer, a second conductor layer, and a second insulating coating layer. The surface of the first conductor layer closer to a first end surface is partially connected to the first external electrode. The surface of the second conductor layer closer to a second end surface is partially connected to the second external electrode.

The present invention relates to a process for producing an electrolytic capacitor, the process comprising process steps i) ii): i) providing a capacitor body (1) that comprises an electrode body (2) of an electrode material,a dielectric (3) which at least partially covers the surface of this electrode material, anda solid electrolyte (4) at least comprising an electrically conductive material which at least partially covers the dielectric surface; ii) applying a primer solution e) to the capacitor body (1), followed by an application of a solution or dispersion a) comprising a conjugated polymer b) and a solvent or dispersant d), followed by an at least partial removal of the solvent or dispersant d) for the formation of the polymeric outer layer (5) that is formed onto the capacitor body (1); wherein the primer solution e) comprises at least one monofunctional amine and at least one carboxylic acid.

A conductive composite is provided, which includes a conductive conjugated polymer and a mixture. The mixture includes (a) boron oxide, and (b) sulfur-containing compound, nitrogen-containing compound, or a combination thereof. A capacitor is also provided, which includes an anode electrode, a dielectric layer on the anode electrode, a cathode electrode, and an electrolyte between the dielectric layer and the cathode electrode, wherein the electrolyte includes the described conductive composite.

The invention relates to a device for thermally disconnecting or tripping an overvoltage protection device, comprising: a locking element (A1), on which a first force (F1) acts, and which is fixed in such a way that same is released when a limit temperature is exceeded; and a slider (S1) which is blocked in a first state (Z1) by the fixed locking element (A1), and on which a second force (F2) acts in order to transfer same into a second state (Z2) when the locking element (A1) is released.

A mounting member includes a body having a surface including a mounting surface on which an object is mountable, a channel arranged in the body, and a first layer arranged on an inner surface of the channel. The first layer has a higher thermal conductivity than the body.

A method and system for cooling a device (preferably a micro-device), comprising cooling the device by using a lower critical solution temperature (LCST) mixture. Enhancement of heat transfer rates is achieved during phase separation of a two-component system (two-component mixture) with a LCST. Convective heat transfer rates in small diameter pipes and over a vertical (hot) plate are demonstrated.

Embodiments are generally directed to cooling of electronics using folded foil microchannels. An embodiment of an apparatus includes a semiconductor die; a substrate, the semiconductor die being coupled with the substrate; and a cooling apparatus for the semiconductor die, wherein the cooling apparatus includes a folded foil preform, the folded foil forming a plurality of microchannels, and a fluid coolant system to direct a fluid coolant through the microchannels of the folded foil.

An SSD with a package optimized for semiconductor wafers is configured by thinning a plurality of undiced wafers and stacking the wafers. The wafers are connected to each other by TSV. A subset of the wafers include memory circuits. One of the wafer not in the subset includes peripheral circuits. A casing houses the wafers.

A household distribution box comprises a distribution box case; two service lines introduced from a transformer into the distribution box case of a consumer; three main lines installed in the distribution box case and provided with two lines and a second service line; two sub-lines installed in the distribution box case and formed by branching the second service line among the main lines into two lines; a first circuit breaker installed in the distribution box case; a second circuit breaker installed in the distribution box case; and a controller connected to the first circuit breaker.

The present disclosure provides a method and a system for protecting an electrical device. The method includes: acquiring coordinate data of the electronic device; determining whether the coordinate data exceeds a data range corresponding to a preset state of the electronic device; and disabling the electronic device when the coordinate data exceeds the data range corresponding to the preset state.

A ground fault circuit interrupter (GFCI) breaker testing system can include an enclosure having at least one wall that forms a cavity. The system can also include at least one GFCI breaker disposed within the cavity. The system can further include a sensing circuit assembly having at least one switch, where the at least one switch is electrically coupled to the at least one GFCI breaker. The system can also include a user interface assembly disposed, at least in part, outside the cavity, where the user interface assembly is coupled to the sensing circuit assembly, where the user interface assembly instructs the at least one switch to test the at least one GFCI breaker.

An electrical energy receiving end capable of overvoltage protection and a wireless electrical energy transmission device are provided. An electrical energy receiving coil is divided into a first receiving coil and a second receiving coil, so that under normal operation the first receiving coil and the second receiving coil jointly resonate with an impedance matching network to receive energy. When the electrical energy receiving end has an overvoltage, the first receiving coil and the impedance matching network (or the second receiving coil and the impedance matching network) form a loop, and due to the impedance mismatch, the energy received by the electrical energy receiving end is greatly reduced to solve the problem of overvoltage at the electrical energy receiving end.

An object of the present invention is to provide a power module having high reliability. The power module according to the present invention, includes a circuit body and a case housing the circuit body. The case has a first case member including a first base plate and a second case member including a second base plate. The first case member has a first side wall portion formed in an arrangement direction of the first base plate and the second base plate. The second case member has a second side wall portion formed in the arrangement direction, the second side wall portion coupling to the first side wall portion. The first side wall portion and the second side wall portion are formed so as to have the sum of lengths of the first side wall portion and the second side wall portion in the arrangement direction smaller than the thickness of the circuit body. The first case member has a deforming portion smaller than the first base plate and the second base plate in rigidity.

Electronic device heat transfer technology is disclosed. In an example, an electronic device package can include a substrate. The electronic device package can also include a heat transfer component. The electronic device package can further include a heat-generating electronic component coupled to the substrate between the substrate and the heat transfer component. The electronic device package can also include a viscous thermal interface material (TIM) providing a heat transfer pathway between the electronic component and the heat transfer component. In addition, the electronic device package can include a barrier about at least a portion of a periphery of the viscous TIM to maintain the viscous TIM within a confined location in proximity to the electronic component. The TIM is uninterrupted by the barrier within the periphery.

A flexible circuit board includes a first circuit substrate, a second circuit substrate and a bonding layer. The first circuit substrate includes a first base layer, a first circuit layer, a second circuit layer and metal coating layer. The first circuit layer includes a signal line and at least two grounding lines. The metal coating layer encloses the signal line. The second circuit substrate includes a third circuit layer. The bonding layer is located between and bonding the first circuit substrate and the second circuit substrate. The second circuit layer, the third circuit layer are electrically coupled with the grounding lines by a plurality of electrically conductive holes. The first base layer, the bonding layer and the second circuit substrate cooperatively enclose a hermetic medium layer receiving the signal line. The hermitic medium layer is filled with air. A method for manufacturing the flexible circuit board is also provided.

In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.

A circuit board upon which to mount an integrated circuit chip may include a first interconnect zone on the surface of the circuit board having first contacts with a first pitch, and a second interconnect zone, surrounding the first zone, having second contacts or traces with a second pitch that is smaller than the first pitch. The first contacts may have a design rule (DR) for direct chip attachment (DCA) to an integrated circuit chip. The first contacts may be formed by bonding a sacrificial substrate having the first contacts to a surface of the board; or by laser scribing trenches where the conductor will be plated to create the first contacts. Such a board allows DCA of smaller footprint processor chips for devices, such as tablet computers, cell phones, smart phones, and value phone devices.

A flexible substrate and a flexible display device including the same are disclosed. In one aspect, the flexible substrate includes a first substrate that is flexible and a metal wiring layer over the first substrate and having a first surface facing the first substrate, a second surface opposite to the first surface, and a plurality of holes penetrating the first and second surfaces. The holes are arranged in a plurality of rows. The holes comprise a first hole in an n-th row and a first hole in a (n-1)th row. The first hole of the n-th row is spaced apart from the first hole in the (n-1)th row by a first distance, and an edge of each of the holes is curved.

A stretchable electronic assembly comprising a stretchable body, a plurality of electronic components encapsulated in the stretchable body, at least one meandering conductor connected to at least one electronic component of the plurality of electronic components, at least one hollow pocket formed in the stretchable body, the at least one meandering conductor encapsulated in the stretchable body and the at least one meandering conductor located within the at least one hollow pocket formed in the stretchable body.

Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.

An automation field device having a housing and a modular field device electronics unit located inside the housing. The electronics unit has a first circuit board having at least one first and one second plug-in connector element, wherein the first plug-in connector element is used to electrically connect a peripheral unit, wherein both the first and the second plug-in connector elements can be contacted essentially from the same preferred plug-in direction, and a second circuit board having at least one third plug-in connector element, wherein the circuit boards are arranged such that the second plug-in connector element is connected to the third plug-in connector element in a detachable manner to electrically connect the peripheral unit to the second circuit board, and the second circuit board has at least one opening, via which the first plug-in connector element of the first circuit board is accessible for connecting the peripheral unit.

An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.

Examples of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat sink includes a base portion, a first protrusion structure and a second protrusion structure. The base portion has a first side and a second side opposite the first side. The first protrusion structure protrudes from the first side of the base portion, and includes multiple fins. The second protrusion structure protrudes from the second side of the base portion, and includes multiple ribs. The heat sink may be made of silicon.

A fan assembly includes a first guide, a second guide disposed in a direction vertical to the first guide such that the height of the first guide is adjustable, a slider disposed to move in a horizontal direction along the second guide, and a plurality of fan modules fastened to the slider, wherein each of the plurality of fan modules is fastened to the slider such that the height of the fan module is adjustable. Accordingly, the heights of the plurality of fan modules can be simultaneously adjusted, and the heights of some of the plurality of fan modules can be adjusted different from those of the other fan modules, so that the plurality of fan modules can be optimally installed.

An enhanced airflow chassis system includes a component chassis that defines a chassis enclosure including a chassis entrance and component slots. First component carriers are mounted to first components and positioned in each of the component slots. Each first component carrier defines first component carrier airflow apertures that direct airflow entering the chassis entrance to the first component mounted to that first component carrier. A backplane located in the chassis enclosure opposite the component slots from the chassis entrance defines backplane airflow apertures and includes a component connector located adjacent each of the component slots that is connected to the first component mounted to the component carrier positioned in that component slot. A chassis venting member positioned between at least two of the component slots defines chassis venting member airflow apertures that direct airflow entering the chassis entrance through the chassis enclosure to a subset of the backplane airflow apertures.

News, arts, and dining coverage for Oakland, Berkeley, and the greater East Bay.

News, arts, and dining coverage for Oakland, Berkeley, and the greater East Bay.