A battery connector is provided which is used to electrically connect a button battery. The connector has an insulating housing and positive and negative terminals. The housing has a limiting space for receiving and fixing the battery. The positive terminal has a positive contact portion which extends into the space and a first tail portion which maintains an electrical connection with a circuit board. The negative terminal has a negative contact portion which extends into the space so as to contact a negative electrode on a bottom surface of the battery, a second tail portion which maintains an electrical connection with the board, and a connection portion which is brought to move by the negative contact portion so as to electrically connect with the board when the battery is received in the space. The battery connector can be provided as part of a circuit module having an indicating member.

A crimp terminal has a crimp barrel which is crimped onto a core wire of a cable. The crimp barrel has an inner surface in which a plurality of cavities which are independent from one another is formed. Each of the cavities has a predetermined shape in a plane orthogonal to a depth direction thereof before the crimp barrel is crimped onto a core wire. The predetermined shape has at least two straight portions and a concave curved portion connecting the straight portions. The concave curved portion is indented inward of the predetermined shape. A plurality of the concave curved portions which are close to each other and included respectively in the predetermined shapes distinct from each other is arranged on an identical imaginary circle or rounded rectangular.

A binding screw for a wire connection assembly comprises a driving section, a threaded section, and a contact section. The contact section has a tapered penetration portion establishing electrical contact with a stranded wire. A length of the penetration portion is at least three-quarters of a diameter of the binding screw in the threaded section.

A terminal attaching/detaching device includes a housing, an engaging member, and a movable member. The engaging member is configured to move in a first direction toward a terminal inserted in the housing to engage with the terminal, and is configured to move from the terminal inserted in the housing in a second direction to disengage from the terminal. The movable member is configured to move in concert with the engaging member in the moving process thereof in the first direction, and is configured to move the engaging member from the terminal inserted in the housing in the second direction, so that the engaging member is disengaged from the terminal.

The present invention relates to a connection element for connection of an electrical connector (17) with a cable (15) connected on the connection element (10), wherein the connection element (10) has a mechanism (21) which is configured to secure the connection element (10) in a predetermined position on the electrical connector (17), and wherein the connection element (10) has on a contact region between the connection element (10) the electrical connector (17) that is generated after the connection of the electrical connector (17) with the cable (15) at least one layer made of a sealing material, which is configured to seal a region of the connecting element (10) on the electrical connector (17) in a liquid tight manner.

An arrangement for an electronic device is disclosed. A plurality of electrically conductive pins is positioned in respective vias of the circuit carrier, the pins extend from a first face of the circuit carrier to a contact end in order to electrically contact one or more components. The arrangement is equipped with an electrically insulating layer on a circuit carrier face, which is the first or a second face, in the region of the pin, the insulating layer having a prefabricated element which is positioned on the face of the circuit carrier. A portion of each pin, the portion being arranged adjacently to the respective via on the face, is surrounded by the material of the insulating layer in a continuously lateral manner.

An example apparatus for connecting linear edge cards includes a housing to hold at least one set of conductive contacts facing perpendicularly towards a mating plane. The apparatus further includes an activator bar coupled to the housing, the activator bar to hold two parts of the housing apart via two opposing normal forces. The apparatus also includes a contact load spring coupled to the housing, the contact load spring to apply two forces parallel to the direction of the conductive contacts and against the two opposing normal forces of the activator bar. The apparatus further includes an ejector spring coupled to the contact load spring and the activator bar. The ejector spring is to apply a force perpendicular to the two opposing normal forces of the activator bar and in a direction of an opening of the housing.

A force biased spring probe pin assembly includes a barrel member having a barrel wall defining an elongate internal cavity with a lower end and an upper end. The assembly also includes a first plunger member reciprocally mounted in the internal cavity proximate the lower end of the internal cavity. A spring member is positioned in the internal cavity between the plunger member and the second end of the internal cavity. Three or more conductive bearings are positioned in the internal cavity in contact with the first plunger member and the spring member. A force biased spring probe pin assembly includes a barrel member having a barrel wall defining an elongate internal cavity with a lower end and an upper end. The assembly also includes a first plunger member reciprocally mounted in the internal cavity proximate the lower end of the internal cavity and a second plunger member reciprocally mounted in the internal cavity proximate the upper end of the internal cavity. A spring member is positioned in the internal cavity between the first plunger member and the second plunger member. Three or more conductive bearings are positioned in the internal cavity in contact with the first plunger member and the spring member.

A force-biased spring probe pin assembly includes a barrel member having a barrel wall defining an elongate internal cavity with a lower end and an upper end. The assembly also includes a first plunger member reciprocally mounted in the internal cavity proximate the lower end of the internal cavity. A spring member is positioned in the internal cavity between the plunger member and the second end of the internal cavity. At least one cavity formed in the plunger member with a conductive bearing in the cavity in electrical contact with the plunger and with the wall of the barrel member. A force-biased spring probe pin assembly includes a barrel member having a barrel wall defining an elongate internal cavity with a lower end and an upper end. The assembly also includes a first plunger member reciprocally mounted in the internal cavity proximate the lower end of the internal cavity and a second plunger member reciprocally mounted in the internal cavity proximate the upper end of the internal cavity. A spring member is positioned in the internal cavity between the first plunger member and the second plunger member. At least one cavity formed in the first plunger member with a first conductive bearing in the cavity in electrical contact with the first plunger and with the wall of the barrel member and at least one cavity formed in the second plunger member with a second conductive bearing in the cavity in electrical contact with the second plunger and with the wall of the barrel member.

A power outlet having safety cover, the power outlet comprises a shell body, a base fixed in the shell body, a sliding element disposed between the shell body and the base; the shell body has at least one first outlet hole and at least one second outlet hole; the base has a first post, a third outlet hole and a fourth outlet hole; one side of the sliding element has a first inclined block, the middle of the sliding element has a through hole, another side of the sliding element has a second inclined block and a second post; an elastic element is disposed between the first post and the second post; wherein the through hole can contain the first post, the second post and the elastic element; a distance between the first inclined block and an inner wall of the base is smaller than the length of the elastic element.

An electrical connector includes a housing having pockets formed in a receiving end of the housing. A terminal module is inserted into the pockets wherein the terminal modules are constructed from a stitch plate including a plurality of terminals retained therein, A cover having a plurality of spaced apart walls form thereon is arranged on the stitch plate and is moved into engagement with the stitch plate with the walls disposed in the intervening space between adjacent terminals. The connector assembly is pressed onto a circuit board in which a force is applied to the connector housing and is directly transferred to the terminal tails of the terminal modules causing electrical contact between conductive holes of the circuit board and the terminals.

An electrical receptacle connector includes a metallic shell, an insulated housing, first receptacle terminals, second receptacle terminals, first glue recess, and a first texture region. The metallic shell circularly encloses the insulated housing. The first and second receptacle terminals are held in the insulated housing. The first texture region is annularly formed on an inner wall of the metallic shell and corresponds to a periphery of the outer wall of the insulated housing. Therefore, the sealing member can attach onto the first texture region efficiently. Therefore, the sealing member does not overflow to the front portion of the receptacle cavity, and the inner gap can be sealed by the sealing member properly. Hence, the first texture region allows the sealing member to attach onto the inner wall of the shell body, and the sealing member can cover the inner gap completely to provide a reliable waterproof performance.

A high pressure and temperature, hermetically sealed bulkhead connector with pin and socket contacts for use in logging tools is described. The bulkhead connector comprises (a) one or more contact(s) placed within one or more channels wherein the channels provide a clearance path between contact(s) and bulkhead body and travel at least a partial longitudinal distance between proximal and distal ends. The contact(s) reside in the channel(s) and include at least; an optional movement limiter section, one central elongated section, and one fixed section where the contact(s) is attached to the bulkhead body at the distal end. The body correctly positions respective ends of the contact so that the body secures contact(s) to be parallel to each other and the contact(s) have terminal ends for connection. This arrangement provides at least one pivotable, pliable, free floating contact extending away from the fixed distal end of the bulkhead body.

The present invention provides a system and method for providing a seal for an electrical penetrator in a subsea environment. More specifically, the present invention provides for a system for creating a seal about an electrical penetrator without using o-rings or independent seals. The present invention provides for a set of supporting apparatuses to be placed in compression about a central ceramic penetrator element. The geometry of the central ceramic penetrator element and the interior of the supporting apparatuses forms a hermetic seal when under a constant radial and axial, or axial compressive force.

Subsea high voltage connection assembly (10) comprising a first section (100) having a first section body (104) to which a set of first connector(s) (111) is arranged and a second section (200) having second section body (204) to which a set of second connector(s) (211) is arranged. The assembly (10) further has a section body movement arrangement (103, 400, 9, 123) adapted to move one of the section bodies (104, 204) towards and away from the other section body, between a disengaged position and an engaged position. Further, the assembly (10) has a connector movement arrangement (105, 400). Also disclosed are a method and a subsea high voltage wet mate connector assembly.

Provided is an electronic device that is highly resistant to a water-soluble grinding oil and a method for manufacturing the same. An electronic device includes a main body and a cable including a lead wire, an insulating portion, and an outer coat, a first sealing portion that covers the insulating portion, and a second sealing portion that seals the first sealing portion, the insulating portion is made of a material that is more resistant to a water-soluble grinding oil than the outer coat is, and the first sealing portion is made of a material that has higher adherence to the insulating portion than that of the second sealing portion does.

An electrical cord covering system includes a first housing portion and a second housing portion. The housing portions each include compression portions around their respective rims. The compression portions each have two recessed areas. When the housing portions are in a closed position a hollow region is formed to cover mated electrical cord plugs. A rim seal is formed with the compression portions. Two apertures are formed in the rim seal from the recessed apertures. The cable apertures form seals against electrical cords running to the electrical cord plugs.

An apparatus comprises a cable connector including: a first connector body portion including a first plurality of electrical contacts arranged to contact electrical contacts of a first surface of an edge connector substrate; a second connector body portion separate from the first connector body portion and including a second plurality of electrical contacts arranged to oppose the first plurality of electrical contacts of the first connector body portion and to contact electrical contacts of a second surface of the edge connector substrate, wherein the first and second plurality of electrical contacts are electrically coupled to one or more cables; and a joining mechanism configured to join the first connector body portion and the second connector body portion together and to apply a bias force to the edge connector substrate when the edge connector substrate is arranged between the first connector body portion and the second connector body portion.

An independently powered USB connector is provided. The independently powered USB connector replaces the computer USB power supply for the direct transmission of digital signals from and between computers and audio components, eliminating micro-circuitry and computer generated noise from the digital signal chain so as to prevent sonic coloration from these sources. The independent power supply is coupled to the male connection of the USB connector, wherein the coupling is wrapped with shrink wrap designed for stability.

Previously available elastomeric EMI gaskets provided for multiport RF connector assemblies have performance limiting drawbacks. Consequently, EM isolation provided by a previously available elastomeric EMI gasket is often inadequate. Various implementations disclosed herein include multiport RF connection arrangements that use a metal gasket arranged within at least a portion of an isolation space provided by a multiport RF connector. In some implementations, a multiport connection arrangement includes a substrate, a multiport RF connector and a fitted metal gasket. The substrate includes a first surface and a first plurality of connection ports. The multiport connector has a body that includes a second surface, a second plurality of connection ports, and includes an electromagnetic isolation boundary that defines an isolation space between at least two of the second plurality of connection ports terminating at the second surface. Mechanical fasteners are optional and are included to merely provide engagement, without substantial compressive force.

The invention relates to a shielded connector for a motor vehicle. The connector comprises at least one casing shielding element. The shielding element includes a cable outlet portion provided with a plurality of resilient tabs that are integral with the shielding element. The tabs include a contact zone in electrical contact with a ferrule crimped to a shielding braid of a cable. The contact zone is maintained pressed against the shielding braid by means of a removable clamping ring.

Switchable grounded terminal loads are built into, or otherwise coupled to, connectors on motherboards and control devices. The terminal loads are coupled to the bus termination at the connector when the connector is “stuffed” (connected to a mating connector). The switchable grounded terminal loads replace dummy connectors in preventing empty “unstuffed” connectors from increasing error risks on active channels.

An electronic device system can include an electronic device. The electronic device can include a receptacle, and a device logic driving status unit configured to generate a status signal indicating activity of the electronic device, and a communications cable. The communications cable can include a first plug configured to connect to the receptacle and receive the status signal, wherein the first plug includes a status indicator configured to indicate activity of the electronic device based on the status signal.

A terminal block for an electronic device, which block can be attached to an electronics housing of the electronic device, includes at least one base strip comprising a plurality of connector sockets; and a plurality of connector modules that can be attached to the connector sockets of the at least one base strip in at least one insertion direction, are held on the connector sockets in an inserted position, and can be released from the connector sockets to be removed from the at least one base strip; and a locking device. The locking device includes: an actuating part that can be moved relative to the at least one base strip in an actuation direction; and a plurality of locking elements that are engaged in a locking manner in mating elements of the connector modules in a locked position.

The present invention describes a microfabricated or nanofabricated structured diamond abrasive with a high surface density array of geometrical protrusions of pyramidal, truncated pyramidal or other shape, of designed shapes, sizes and placements, which provides for improved conditioning of CMP polishing pads, or other abrasive roles. Three methods of fabricating the structured diamond abrasive are described: molding of diamond into an array of grooves of various shapes and sizes etched into Si or another substrate material, with subsequent transferal onto another substrate and removal of the Si; etching of an array of geometrical protrusions into a thick diamond layer, and depositing a thick diamond layer over a substrate pre-patterned (or pre-structured) with an array of geometrical protrusions of designed sizes, shapes and placements on the surface.

In an embodiment, a polycrystalline diamond compact includes a substrate and a preformed polycrystalline diamond table having an upper surface, an interfacial surface, and at least one side surface extending therebetween. The interfacial surface of the polycrystalline diamond table is bonded to the substrate. The polycrystalline diamond table includes bonded diamond grains defining interstitial regions. The polycrystalline diamond table includes a first region extending inwardly from at least a portion of the upper surface and at least a portion of the at least one side surface. The first region spaced from the interfacial surface. The polycrystalline diamond table includes at least a second region extending inwardly from the interfacial surface to the upper surface. The first region includes at least a first infiltrant disposed interstitially between the bonded diamond grains thereof. The second region includes at least a second infiltrant disposed interstitially between the bonded diamond grains thereof.

An abrasive product includes a plurality of abrasive particles and a resin binder cured from a resin composition that includes an aqueous dispersion of melamine methylol having a melamine-to-formaldehyde molar equivalent ratio of between about 1:1 and about 1:3.2, wherein the aqueous dispersion has a pH in a range of between about 8 and about 10. The composition also includes a formaldehyde-based resins, such as a urea-formaldehyde resin or phenol-formaldehyde resin. The melamine methylol comprises between about 1 wt % and about 50 wt % of the combined weight of the formaldehyde-based resin and the melamine methylol.

The present invention concerns a method for depositing mixed crystal layers with at least two different metals on a substrate by means of PVD methods. To provide a method of depositing mixed crystal layers with at least two different metals on a substrate by means of PVD methods, which gives mixed crystal layers which are as free as possible of macroparticles (droplets) and which have a proportion as high as possible of a desired crystalline phase and which are highly crystalline, it is proposed according to the invention that deposition of the mixed crystal layer is effected with simultaneous application of i) the cathode sputtering method of dual magnetron sputtering or high power impulse magnetron sputtering and ii) arc vapour deposition.

A polycrystalline diamond (PCD) with diamond grains includes a first zone of the diamond grains and a second zone of the diamond grains. The first zone forms a working surface and a first catalyzing material is disposed within voids of the diamond grains in the first zone. A second catalyzing material is bonded to the diamond grains disposed in the second zone. The first catalyzing material in the first zone is connected to the diamond grains disposed in the first zone less intimately than the second catalyzing material is bonded to the diamond grains in the second zone.

An abrasive article includes a polymer matrix and abrasive grains dispersed in the polymer matrix, wherein the abrasive article has a void volume of at least 50%. The polymer matrix is polymerized from a monomer including at least one double bond.

Embodiments of the invention relate to polycrystalline diamond (“PCD”) fabricated by sintering a mixture including diamond particles and a selected amount of graphite particles, polycrystalline diamond compacts (“PDCs”) having a PCD table comprising such PCD, and methods of fabricating such PCD and PDCs. In an embodiment, a method includes providing a mixture including graphite particles present in an amount of about 0.1 weight percent (“wt %”) to about 20 wt % and diamond particles. The method further includes subjecting the mixture to a high-pressure/high-temperature process sufficient to form PCD.

An abrasive article includes a body having abrasive particles contained within a bond material. The abrasive particles can include a majority content of silicon nitride and a minority content of sintering material including at least two rare-earth oxide materials. In an embodiment, the rare-earth oxide materials can include Nd2O3 and Y2O3. In a particular embodiment, the abrasive particles comprise a content (wt %) of Nd2O3 that is greater than a content of Y2O3 (wt %).

A method of forming an abrasive article includes providing a green body having abrasive particles including microcrystalline alumina, and heating the green body via microwave radiation to form a bonded abrasive body including the abrasive particles and a bond material comprising a vitreous phase.

Polycrystalline ultra-hard materials and compacts comprise an ultra-hard material body having a polycrystalline matrix of bonded together ultra-hard particles, e.g., diamond crystals, and a catalyst material disposed in interstitial regions within the polycrystalline matrix. The material microstructure is substantially free of localized concentrations, regions or volumes of the catalyst material or other substrate constituent. The body can include a region extending a depth from a body working surface and that is substantially free of the catalyst material. The compact is produced using a multi-stage HPHT process, e.g., comprising two HPHT process conditions, wherein during a first stage HPHT process the catalyst material is melted and only partially infiltrates the precursor ultra-hard material, and during a second stage further catalyst material infiltrates the precursor ultra-hard material to produce a fully sintered compact.

An abrasive article includes a fibrous substrate, a binder disposed on the fibrous substrate, and abrasive grains in contact with the binder. The binder includes an imide cross-linked urethane derived from a blocked isocyanate component and an anhydride component.

A plastic soft composition is formed of soft base material constantly provided with plasticity, porous fine particles for polishing contained in the base material, and the like, and a polishing process and a coating process are performed to a painted surface and the like using the plastic soft composition. The fine particles for polishing are impregnated with a coating agent (a surface protective agent) added with an activator which is emulsified by contact with water, and the coating agent is held in concave portions formed in the fine particles. Both polishing work and coating work are achieved by sliding the plastic soft composition on a painted surface by a palm pressure of a user.

An abrasive article including a bonded abrasive having a body formed of abrasive grains contained within a bond material, wherein the body grinds a superabrasive workpiece having an average Vickers hardness of at least about 5 GPa at an average specific grinding energy (SGE) of not greater than about 350 J/mm3, at a material removal rate of at least about 8 mm3/sec, and wherein grinding is a centerless grinding operation.

A cubic boron nitride sintered body tool has, at least at a cutting edge, a cubic boron nitride sintered body composed of a cubic boron nitride particle and a binder phase. The binder phase contains at least Al2O3 and a Zr compound. On any straight line in the sintered body, the mean value of a continuous distance occupied by Al2O3 is 0.1-1.0 μm, and the standard deviation of the continuous distance occupied by Al2O3 is not more than 0.8. On the straight line, X/Y is 0.1-1 where X represents the number of points of contact between Al2O3 and the Zr compound, and Y represents the sum of the number of points of contact between Al2O3 and cBN and the number of points of contact between Al2O3 and binder phase component(s) other than Al2O3 and the Zr compound.

A layer of matrix powder is deposited within a mold opening. A layer of super-abrasive particles is then deposited over the matrix powder layer. The super-abrasive particles have a non-random distribution, such as being positioned at locations set by a regular and repeating distribution pattern. A layer of matrix powder is then deposited over the super-abrasive particles. The particle and matrix powder layer deposition process steps are repeated to produce a cell having alternating layers of matrix powder and non-randomly distributed super-abrasive particles. The cell is then fused, for example using an infiltration, hot isostatic pressing or sintering process, to produce an impregnated structure. A working surface of the impregnated structure that is oriented non-parallel (and, in particular, perpendicular) to the super-abrasive particle layers is used as an abrading surface for a tool.

An abrasive element comprises a body of crystalline abrasive material. The body has an array of cutting elements formed of crystalline abrasive material which projects from a surface of the body. The shape, size and form of the projections is controlled in the production process. The body may be a natural or synthetic crystal. The body may be a film formed by deposition. The body may be diamond or cubic boron nitride. The body may be monocrystalline or polycrystalline. The projections may be aligned along a crystallographic plane or planes.

Embodiments of the invention relate to methods of fabricating a polycrystalline diamond compacts and applications for such polycrystalline diamond compacts. In an embodiment, a method of fabricating a polycrystalline diamond body includes mechanically milling non-diamond carbon and a sintering aid material for a time and aggressiveness sufficient to form a plurality of carbon-saturated sintering aid particles and sintering a plurality of diamond particles in the presence of the plurality of carbon-saturated sintering aid particles to form the polycrystalline diamond body.

An abrasive article having an abrasive body including abrasive grains contained within a bond material, wherein the abrasive grains comprise microcrystalline alumina, and wherein the bond material includes less than about 1.0 mol % phosphorous oxide (P2O5), and a ratio measured in mol % between a total content of sodium oxide (Na2O) and a total content of potassium oxide (K2O) defined by [K2O/Na2O] having a value greater than about 0.5.

A cBN sintered body tool has the following feature. In at least one cross sectional surface of the cBN sintered body tool taken along a plane perpendicular to a joining surface having the largest area in joining surfaces between the cBN sintered body and the joining layer, a point C and a point D are assumed to represent points away by ¼ of the length of a line segment connecting a point A and a point B shown in a figure. A value obtained when an area of a region surrounded by a line segment connecting the point C and the point D, the first cBN particle, the second cBN particle, and the binder phase is divided by the length of the line segment connecting the point A and point B to each other is 0.14-0.6 μm.

The present invention discloses a cleaning cloth, an abrasive cloth, a cleaning buff and an abrasive buff which are each formed by knitting/weaving bamboo fibers having excellent cleaning, abrasive capacity and excellent ignition resistance.

Disclosed herein are abrasive grains based on zirconia alumina melted in an electric arc furnace, comprising a content of 52 to 62 wt % Al203 and 35 to 45 wt % ZrO2, wherein the high-temperature phases of the zirconia are stabilized by a combination of reduced Ti compounds and yttrium oxide.

Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.

Methods of making a superabrasive tool precursor are disclosed, along with such precursors and associated tools. Particularly, methods are disclosed for orienting superabrasive particles in a viscous binding material in order to provide tools based thereupon and having desired performance characteristics.

A low defect chemical mechanical polishing composition for polishing silicon oxide containing substrates is provided comprising, as initial components: water, a colloidal silica abrasive; and, an additive according to formula I.

A CMP polishing pad comprising (a) a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured opaque thermoset polyurethane region and at least one aperture region; said at least one cured opaque thermoset region has a porosity from about 10% to about 55% by volume; said at least one aperture region having (1) a top opening positioned below the polishing surface, (2) a bottom opening that is co-planar with said back surface and (3) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region filled with a cured plug of thermoset polyurethane local area transparency material that has a light transmission of less than 80% at a wavelength from 700 to 710 nanometers and is chemically bonded directly to a thermoset polyurethane opaque area; (b) an aperture-free removable release sheet covering at least a portion of said back surface of the polishing layer; and(c) an adhesive layer interposed between said polishing layer and said release sheet; said adhesive layer capable of adhering the polishing layer to a platen of a CMP apparatus after said release sheet has been removed.

Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) comprising a polycrystalline diamond (“PCD”) table including a thermally-stable region having at least one low-carbon-solubility material disposed interstitially between bonded diamond grains thereof, and methods of fabricating such PDCs. In an embodiment, a PDC includes a substrate, and a PCD table bonded to the substrate. The PCD table includes a plurality of diamond grains exhibiting diamond-to-diamond bonding therebetween and defining a plurality of interstitial regions. The PCD table further includes at least one low-carbon-solubility material disposed in at least a portion of the plurality of interstitial regions. The at least one low-carbon-solubility material exhibits a melting temperature of about 1300° C. or less and a bulk modulus at 20° C. of less than about 150 GPa.