A toy construction kit has a plurality of magnetic modules, each with a housing having a plurality of sides, each side having an internal hollow. A magnet is contained within each of the hollows at a given polar orientation relative to the housing and the hollow. The hollow has dimensions that permit the magnet to move within the hollow, but substantially constrains the magnet to the given polar orientation relative to the housing. When a side of a module is placed near a side of another module, they are bound by magnetic attraction by the respective aligned magnets, either because the polar orientations are opposite when they are initially juxtaposed or due to shifting of one or both magnets in their respective hollows to achieve relative polar opposition.

A modular building set having a plurality of interlocking members comprising a plurality of planks and a plurality of posts. The planks each comprise a central plank member having two pairs of opposing recesses and four pairs of opposing parallel bars with two pairs of bars located equidistant one another on either the recesses. The posts each comprise a central post member with a pair of opposing central recesses depending from the upper and lower edges. The posts each have two pairs of opposing bar members with one set of bar members between the opposing central recesses and a first end a post, and another set of bar members between the opposing central recesses and a second end opposite said first end. The plank and/or post members interlockably engage one another by joining a recess of a first member with the recess of the second member.

Implementations and examples of fiber lasers based on fiber laser cavity designs that produce self-similar pulses (“similaritons”) to achieve a pulse spectral bandwidth greater than a gain spectral bandwidth based on a spectral broadening fiber segment and a spectral filter to ensure the proper similariton conditions.

A multi-color harmonic synthesized laser system for laser processing and a laser processing method using multi-color harmonic synthesized laser are disclosed. The multi-color harmonic synthesized laser system includes a laser source for providing a single laser wave, a converter for converting the single laser wave into a plurality of harmonic waves with different frequencies, and a modulating unit for modulating amplitudes and relative phases of the harmonic waves to form a plurality of modulated harmonic waves, so as to synthesize the modulated harmonic waves as a single synthesized laser wave, wherein the single synthesized laser wave is focused on an object to perform a laser processing. The converter includes a plurality of non-linear crystals for converting the single laser wave into a fundamental harmonic wave and a plurality of multi-frequency harmonic waves. The harmonic waves are coherent and collinear, and the phases of the harmonic waves are related to one another.

A microlaser system includes an optical source, a microlaser, an actuator switch, and a photovoltaic power source. The microlaser, which includes a control element, is optically pumped by at least a portion of light emitted by the optical source. The actuator switch is configured to be activated by a triggering event. Furthermore, the photovoltaic power source is coupled in a series connection with the actuator switch and the control element, the series connection configured to connect the photovoltaic power source to the control element of the microlaser when the actuator switch is activated by the triggering event.

A heat dissipation device of a light engine for a projector has a housing, a fan module, a light engine and a heat sink. The light engine is positioned in the housing and connected to the heat sink. The heat sink is positioned out of the housing. The housing has a fan-enclosed flow channel attached on an outer surface of the housing. The fan module is guided by the fan-enclosed flow channel to the heat sink to enhance heat dissipation efficiency of the light engine for the projector.

An EUV light generation system includes a driver laser comprising a master oscillator such as a semiconductor laser, a spatial filter, gas slab amplification devices, relay optical systems, and high-speed axial-flow amplifiers. The slab amplification devices include beam adjusting optical units disposed, respectively, at input and output sides of the slab amplifiers SA to convert the beam profile and/or polarization direction and/or an elongated direction of the beam profile with the slab amplifiers is parallel to a free space axis AF of the slab waveguides, i.e. parallel to the discharge electrodes.

An apparatus comprising an optical medium, a power splitter coupled to the optical medium, a first delay line coupled to the power splitter such that the power splitter is positioned between the first delay line and the optical medium, a first comb reflector coupled to the first delay line such that the first delay line is positioned between the first comb reflector and the power splitter, and a second comb reflector coupled to the power splitter but not the first comb reflector and not the first delay line. A method comprising receiving an optical signal, splitting the optical signal into a first split optical signal and a second split optical signal, delaying the first split optical signal, tuning the delayed first split optical signal, tuning the second split optical signal, and delaying the tuned second split optical signal.

A communication module according to the present invention includes a substrate, a laser element and a light receiving element provided on a front surface of the substrate and separating from each other, a transparent resin package collectively sealing the laser element and the light receiving element, and a diffusion unit provided to be opposed to a light emitting surface of the laser element at a prescribed distance for diffusing a laser beam emitted by the laser element, while the distance T between the laser element and the light receiving element satisfies the following formula (1): T≧t1·tan θ+(t1+t2)·tan θ' . . . (1) (in the formula (1), t1 represents the distance between the light emitting surface of the laser element and the diffusion unit, θ represents the maximum angle of emission of the laser element, t2 represents the difference between the height from the front surface of the substrate up to the light emitting surface and the height up to alight receiving surface of the light receiving element, and θ' represents the maximum diffusion angle of the diffusion unit.)

Novel methods and systems for miniaturized lasers are described. A photonic crystal is bonded to a silicon-on-insulator wafer. The photonic crystal includes air-holes and can include a waveguide which couples the laser output to a silicon waveguide.

Improved brightness and feedback multi-emitter laser diode modules and methods are provided. A plurality of laser diode emitters emit broad-area light beams in a beam direction. In cross-section, each beam is broad in its slow axis and narrow in its fast axis. Groups of downstream optical components collimate, shape, stack and direct the beams along a light path towards a beam spot (which may be fiber-coupled). After collimating, stacking and directing, the beams are Fourier transformed in the fast-axis through a lens feature having a fast-axis focal length less than about 3 millimeters. In some embodiments, the fast-axis focal length is between about 0.1 and 2.0 millimeters. Astigmatism may be introduced between the fast axis and the slow axis in the beams upstream of the lens feature and in accordance with the fast axis focal length of the lens feature. The emitters may receive feedback including wavelength locking feedback.

A manufacturing method and device for supporting conductors. Using a non-metallic insulating material extending beyond one or both parallel legs of a staple the thumb and forefinger may grip this extension while the staple is being driven into a supporting structure. This finger grip allows for a small, insulated staple to be held with increased safety to thumb and forefinger during penetration of staple into support.

A method for applying compression to a joint includes providing an intramedullary fixation assembly having a proximal screw member positioned at a proximal end of the intramedullary fixation assembly and a lag screw member positioned at a distal end of the intramedullary fixation assembly. Medullary canals are drilled in a first and second bone and the medullary canals are reamed. The proximal screw member is inserted into the first bone and a drill is used create a dorsal hole in the first bone. The lag screw member is slideably coupled to the dorsal hole and to the proximal screw member and into the second medullary canal. A torque is applied to the lag screw member to apply compression to the joint.

A method and apparatus for an insulating cover for fasteners. In one advantageous embodiment, an apparatus comprises a washer and a cover. The washer is capable of receiving a fastener. The cover is capable of being secured to the insulating washer, wherein an insulating volume is created with the cover secured to the washer.

In a driving circuit, one output circuit has a scanning signal line, a first transistor which controls electrical connection between the scanning signal line and a clock signal line which has a gate connected to a first node, the first node which is at an active potential in a first time period including a time period during which the active potential is output to the scanning signal line, a second transistor which electrically connects the first node and an inactive signal line which has a potential to open the transistor in a second time period other than the first time period, and the second transistor has a gate connected to a second node, wherein the second node has two kinds of timings to be charged for retaining the active potential.

Various structures and methods are disclosed related to configurable scrambling circuitry. Embodiments can be configured to support one of a plurality of protocols. Some embodiments relate to a configurable multilane scrambler that can be adapted either to combine scrambling circuits across a plurality of lanes or to provide independent lane-based scramblers. Some embodiments are configurable to select a scrambler type. Some embodiments are configurable to adapt to one of a plurality of protocol-specific scrambling polynomials. Some embodiments relate to selecting between least significant bit (“LSB”) and most significant bit (“MSB”) ordering of data. In some embodiments, scrambler circuits in each lane are adapted to handle data that is more than one bit wide.

A counter includes a buffer unit and a ripple counter. The buffer unit generates at least one least significant signal of a count by buffering at least one clock signal until a termination time point. The ripple counter generates at least one most significant signal of the count by sequentially toggling in response to at least one of the least significant signal. The counter performs multiple data rate counting with enhance operation speed and reduced power consumption.

To provide a pulse signal output circuit and a shift register which have lower power consumption, are not easily changed over time, and have a longer lifetime. A pulse signal output circuit includes a first input signal generation circuit; a second input signal generation circuit; an output circuit which includes a first transistor and a second transistor and outputs a pulse signal in response to a signal output from the first and second input signal generation circuits; a monitor circuit which obtains the threshold voltages of the first and second transistors; and a power supply output circuit which generates a power supply potential raised by a potential higher than or equal to a potential which is equal to or substantially equal to the threshold voltage and supplies the power supply potential to the first and second input signal generation circuits. A shift register includes the pulse signal output circuit.

A low profile hold down assembly is mounted to the exterior surface of a sidewall of a trailer. The hold down assembly includes a cover member formed from the same material from which the sidewall of the trailer is formed and therefore is aesthetically desirable.

A bull ring for a vehicle comprises a top plate coupled to a rotating plate having a tie-down. Two opposing rail flanges extend from the rotating plate and a fastener selectively couples the rotating plate in a securing position relative to the top plate. The rail flanges extend beyond an outer edge of the top plate to define a clamping region with the top plate.

A box stop device includes a base member and a raised member attached to the base member. The base member has a top surface and a bottom surface. The top surface may be flat. The bottom surface may be adapted to attach to a desired surface. The raised member may be attached to the base member and may extend approximately vertically from the top surface. The raised member may include a first side and a second side. The first side and the second side may be attached together at an angle of approximately 90 degrees.

A module in the form of a pallet or a closed container includes a grouping together of the electrical devices in an avionics bay, in which the electrical devices are interconnected and attached so as to facilitate the mounting and thus limit the time it takes to mount the electrical devices in the avionics bay.

Multi-threshold flash Null Convention Logic (NCL) includes one or more high threshold voltage transistors within a flash NCL gate to reduce power consumption due to current leakage by transistors of the NCL gate. High-threshold voltage transistors may be added and/or may be used in place of one or more lower voltage threshold transistors of the NCL gate. A high-Vt device is included in the pull-up path to reduce power when the flash NCL logic gate is in the null state.

Apparatus for glitch-free switching between two clock sources on an integrated circuit. Clock gaters provide a clock from a single source that can be turned on and off without causing partial pulses to be created. Control circuitry going to the individual clock gaters provides the ability to shut all clocks off for a period of time equal to the longest clock period. By combining the clocks with an OR gate and gating all clocks off before switching from one clock to another, a glitch-free train of clock pulses can be created from individual clock inputs. Since clock glitches can cause erratic behavior in integrated circuits, this invention allows one to switch between different (unrelated) clocks without causing erratic behavior.

There is provided a multi power supply type level shifter. The provided multi power supply type level shifter includes a first level shifter and a second level shifter in a two-stage architecture so as to selectively receive first to third power supplies and change a signal level, even when the first to third power supplies are applied in a different sequence from a normal power-on sequence. Output voltages are output without a change in level, and short-circuit currents are not generated in the first and second level shifters.

A multi-chip package may include first and second integrated circuit dies that are each partitioned into multiple logic regions. The logic regions of the first and second dies may be coupled via interconnects. Each integrated circuit die may include at least one spare logic region. Multiple logic groups may be formed with each logic group including logic regions from the first and second integrated circuit dies and the interconnects that couple those logic regions. The logic groups may be evaluated to identify defective logic groups. In response to identifying a defective logic group, the defective logic group may be repaired by configuring the first and second integrated circuit dies to stop using the defective logic group and to use a spare logic group. The spare logic group may include spare logic regions of the first and second dies that are coupled by spare logic region interconnects.

A limited switch dynamic logic (LSDL) circuit includes a dynamic logic circuit and a static logic circuit. The dynamic logic circuit includes a precharge device configured to precharge a dynamic node during a precharge phase of a first evaluation clock signal and a second evaluation clock signal. A first evaluation tree is configured to evaluate the dynamic node to a first logic value in response to one or more first input signals during an evaluation phase of the first evaluation clock signal. A second evaluation tree is configured to evaluate the dynamic node to a second logic value in response to one or more second input signals during an evaluation phase of the second evaluation clock signal. A static logic circuit is configured to provide an output of the LSDL circuit in response to the dynamic node according to an output latch clock signal.

A method for increasing performance in a limited switch dynamic logic (LSDL) circuit includes precharging a dynamic node during a precharge phase of a first and second evaluation clock signal. The dynamic node is evaluated to a first logic value in response to one or more first input signals of a first evaluation tree during an evaluation phase of the first evaluation clock signal. The dynamic node is evaluated to a second logic value in response one or more second input signals of a second evaluation tree during an evaluation phase of the second evaluation clock signal. A signal of the LSDL circuit is outputted in response to the dynamic node according to an output latch clock signal.

Embodiments of the invention are generally directed to a single-ended configurable multi-mode driver. An embodiment of an apparatus includes an input to receive an input signal, an output to transmit a driven signal generated from the input signal on a communication channel, a mechanism for independently configuring a termination resistance of the driver apparatus, and a mechanism for independently configuring a voltage swing of the driven signal without modifying a supply voltage for the apparatus.

A phase locked loop includes a voltage controlled oscillator and a frequency divider or frequency multiplier. The voltage controlled oscillator and the frequency divider/multiplier are coupled together in a stacked configuration. A drive current is supplied to the voltage controlled oscillator. The drive current passes from the voltage controlled oscillator to the frequency divider/multiplier, thereby driving the frequency divider/multiplier with the same drive current that was supplied to the voltage controlled oscillator.

There are provided an accumulator-type fractional N-PLL synthesizer for suppressing the fractional spurious caused by periodically switching a frequency division number of a fractional frequency divider, and a control method thereof. In an accumulator-type fractional N-PLL synthesizer (100), a pulse signal proportional to a fractional phase error occurring between a reference signal and an output signal of a fractional divider (112) for feeding back an output of a VCO (115) of an output stage to a preceding stage is generated using an error signal from an accumulator (120). Through the use of the pulse signal, pulse widths of a UP signal and a DN signal output from a phase detector (140) are controlled so as to reduce a fractional phase error occurring between the UP signal and the DN signal. Thus, the fractional spurious caused by periodically switching the frequency division number of the fractional divider (112) is suppressed.

Embodiments provide a multi-phase voltage controlled oscillator (VCO) that produces a plurality of output signals having a common frequency and different phases. In one embodiment, the VCO may include a passive conductive structure having a first ring and a plurality of taps spaced around the first ring. The VCO may further include a capacitive load coupled to the passive conductive structure, one or more feedback structures coupled between a pair of opposing taps of the plurality of taps, and one or more current injection devices coupled between a pair of adjacent taps of the plurality of taps.

A steplessly adjustable hydraulic insert valve has a housing defining a radial direction and an end side in an installation direction. An inflow connector on the end side is connectable to a pressure medium source. First and second working connectors and a return connector are arranged in the radial direction. The return connector is connectable to a pressure medium tank. The housing has an axial bore and an actuator guided movably therein. The actuator can be held in an axial center position by at least one spring and is adjustable steplessly axially out of the center position by controllable actuation. At least one of the working connectors is fluidically connectable to the return connector by axial adjustment of the actuator. The actuator has a radial widened portion with first and second control edges for steplessly opening and/or closing first and second radial openings, respectively, of the return connector.

A solenoid valve, the magnet armature of which is designed to be movable relative to a first valve-closing element, for which purpose the first valve-closing element is accommodated telescopically in a coupling element attached to the magnet armature, wherein the coupling element is guided along the inner wall of a guide sleeve inserted in the valve housing in order to align the magnet armature precisely with the first valve-closing element in the direction of a second valve-closing element which is likewise accommodated in the guide sleeve.

For a flap assembly, in particular an exhaust gas flap assembly, with the flap mounted on both sides via bearing devices in the housing, the disclosure describes a design in which a bearing body is supported radially against an annular collar of the bearing device and, by way of the annular collar, is held braced in a radially spring-loaded manner in a predefined radial position.

An apparatus and method are provided, for alternatively producing either small or bulk packs of napkins from a stack of folded napkins produced by one folding machine, through use of a pack dispatching arrangement having an inlet, a small pack transfer station and a bulk pack transfer station, and configured for operation in a small pack mode for dispatching a stream of spaced apart small packs of folded sheets separated from the stack of folded sheets, and received at an inlet of the pack dispatching arrangement, to the small pack transfer station, and alternatively operable in a bulk pack mode for dispatching a stream of spaced apart bulk packs of folded sheets separated from the stack of folded sheets, and received at an inlet of the pack dispatching arrangement, to the bulk pack transfer station.

A multi-function binding machine is proposed. The multi-function binding machine (700) comprises a binding station (135) for binding blocks of signatures (105), and a feeding station (115) for receiving signatures in succession, opening the signatures, and feeding the signatures to the binding station; in the solution according to an embodiment of the invention, the multi-function binding machine further comprises a further feeding station (715) for receiving pre-signatures in successions, folding groups of at least one pre-signature into further signatures (729), and feeding the further signatures to the binding station.

Some implementations provide a structure that includes a first package substrate, a first component, a second package substrate, a second component, and a third component. The first package substrate has a first area. The first component has a first height and is positioned on the first area. The second package substrate is coupled to the first package substrate. The second package substrate has second and third areas. The second area of the second package substrate vertically overlaps with the first area of the first package substrate The third area of the second package substrate is non-overlapping with the first area of the first package substrate. The second component has a second height and is positioned on the second area. The third component is positioned on the third area. The third component has a third height that is greater than each of the first and second heights.

An apparatus including a die including a dielectric material on a device side, an insulating layer surrounding a die area and embedding a thickness dimension of the die; and a carrier including a plurality of layers of conductive material disposed on the device side of the die, a first one of the layers of conductive materials being formed on the insulating layer and patterned into traces at least a portion of which are connected to respective contact points on the die. A method including disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; disposing a mold on the sacrificial substrate around; introducing an insulating material into a chase of the mold; removing the mold; forming a carrier on the insulating material adjacent a device side of a die; and separating the die and the carrier from the sacrificial substrate.

A multi-chip package is provided. The multi-chip package includes a plurality of chips including at least one bad chip and at least one good chip that are stacked and a plurality of through electrodes each penetrating the chips. A logic circuit included in the at least one bad chip is isolated from each of the plurality of through electrodes.

The present invention relates to a camera module including: a lens unit mounted with at least one or more lenses; an image sensor mounted with an image pickup device for converting a light converged through the lenses to an electric signal; a PCB (Printed Circuit Board) mounted with the image sensor; and a holder accommodated inside the lens unit for supporting the lens unit, wherein the lens unit is bonded and fixed at an inner surface of the holder, whereby the lens unit mounted with a plurality of lenses is bonded to a lateral surface of a holder to prevent generation of vertical tilting phenomenon at the lens unit caused by a conventional improper coating of epoxy, and particularly, the coating of epoxy on the lateral surface of the holder advantageously enhances adhesive power to increase a bonded area.

A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

A semiconductor device has a protective layer formed over an active surface of a semiconductor wafer. The semiconductor die with pre-applied protective layer are moved from the semiconductor wafer and mounted on a carrier. The semiconductor die and contact pads on the carrier are encapsulated. The carrier is removed. A first insulating layer is formed over the pre-applied protective layer and contact pads. Vias are formed in the first insulating layer and pre-applied protective layer to expose interconnect sites on the semiconductor die. An interconnect structure is formed over the first insulating layer in electrical contact with the interconnect sites on the semiconductor die and contact pads. The interconnect structure has a redistribution layer formed on the first insulating layer, a second insulating layer formed on the redistribution layer, and an under bump metallization layer formed over the second dielectric in electrical contact with the redistribution layer.

A display device includes a display panel including a plurality of pixels arranged in a matrix form, each pixel including a plurality of sub-pixels, a lens module on the display panel, the lens module including a plurality of lenses having a pitch that corresponds to a horizontal pitch of the plurality of sub-pixels, and a driving unit configured to drive the display panel and the lens module to provide an image displayed by the display panel to a left eye of a viewer at a first frame and to provide the image displayed by the display panel to a right eye of the viewer at a second frame.

A liquid crystal display element disclosed includes: a first substrate; a second substrate; a liquid crystal layer sandwiched between the first substrate and the second substrate; a first transparent electrode provided at a display region of the first substrate; and a second transparent electrode provided at a display region of the second substrate, at least one of d1 and d2 being not larger than 60 nm, where d1 represents a thickness of the first transparent electrode and d2 represents a thickness of the second transparent electrode.

A liquid crystal display (LCD) device and a backlight module. The backlight module includes a lightbar, a lightbar heat sink, and a light guide panel (LGP). A light coupling distance is set between the lightbar and the LGP. The backlight module further includes a control structure controlling the light coupling distance. The lightbar is configured with a through hole, the control structure penetrating through the through hole is arranged on the lightbar heat sink, and the lightbar heat sink provides a fixing force that controls a position the LGP.

The present invention provides a backlight module and a liquid crystal display device using the backlight module. The backlight module includes: a backplane (2), a light guide plate (4) arranged in the backplane (2), a backlight source (6) arranged in the backplane (2), an optic film assembly (8) arranged above the light guide plate (4), and a reflection plate (9) arranged between the backplane (2) and the light guide plate (4). The backlight source (6) includes a PCB (62) and a plurality of LED lights (64) mounted on and electrically connected to the PCB (62). The backplane (2) includes a bottom plate (22) and a plurality of side plates (24) perpendicularly connected to the bottom plate (22). The bottom plate (22) of the backplane (2) includes a snap-engagement structure (220) formed thereon. The PCB (62) is snap-fit into and retained by the snap-engagement structure (220). The reflection plate (9) is directly positioned on and supported by the PCB (62).

An optical element includes at least two stacked birefringent layers having respective local optical axes that are rotated by respective twist angles over respective thicknesses of the at least two layers, and are aligned along respective interfaces between the at least two layers. The respective twist angles and/or the respective thicknesses are different. The at least two stacked birefringent layers may be liquid crystal polymer optical retarder layers. Related devices and fabrication methods are also discussed.

A multilayered cell culture apparatus for the culturing of cells is disclosed. The cell culture apparatus is defined as an integral structure having a plurality of cell culture chambers in combination with tracheal space(s). The body of the apparatus has imparted therein gas permeable membranes in combination with tracheal spaces that will allow the free flow of gases between the cell culture chambers and the external environment. The flask body also includes an aperture that will allow access to the cell growth chambers by means of a needle or cannula. The size of the apparatus, and location of an optional neck and cap section, allows for its manipulation by standard automated assay equipment, further making the apparatus ideal for high throughput applications.

A method of expanding and maintaining human embryonic stem cells (ESCs) in an undifferentiated state by culturing the ESCs in a suspension culture under culturing conditions devoid of substrate adherence is provided. Also provided are a method of deriving ESC lines in the suspension culture and methods of generating lineage-specific cells from ESCs which were expanded in the suspension culture of the present invention.