How can I place stacked vias with the size exact same cut width without metals around?
As the red part only in the image below?

I need to include Verilog-A files which live outside the Cadence ecosystem (i.e., they are not in veriloga views but rather are just text files) into a veriloga view. These external modules are not compatible with OA (parametized port widths) so I can't put them into cellviews and hook them together using schematics.

Example: I have a cellview "test" which has a symbol and veriloga view. I have three "externaI" modules mod1 (inside an external file mod1.va),  mod2 (inside an external file mod2.va),  and mod3 (inside an external file mod3.va). I instantiate one instance of each module in "module test". The three modules have some parametized ports which are interconnected by parameterized signals p1 and p2. These two signals are strictly local to the module.

At the bottom of the module I use "`include mod1.va", "`mod2.va", etc.

When I check and save test->veriloga it checks all the included modules as well as the "test" module. However, I get a warning:

Warning from spectre during AHDL compile.
WARNING (VACOMP-1047): The Verilog-A file contains more than one module
definition. ADE can process only one module per Verilog-A file. Put
only one module in each Verilog-A file so that ADE can identify pin
names, directions, and hierarchy within each separate module.

Is this just a SUGGESTION that I can safely ignore, or are my included modules going to be ignored?

Hello

i did a sp-Analysis and now i want to extract the maximum value of the s11 trace and the corresponding frequency.

I already tried ymax() in the calculator but i am suspecting it only works on transient Signals.

Hello,
I'm trying to characterize a full adder that use transmission gate.
Unfortunately, the power calculation are wrong for the cell are always negative.
Is there any method or commands that can can help in power calculation or add the power consumption by the input pins to the power calculation ?
Another question, Is liberate support the characterization or transmission gate cells as standard cells or I should use liberate AMS for these type of cells ?
Thanks in advance,
Tareq 

Hello,

I am aware of command script .svcf file that saves signals and loads them in while opening Simvision.

I am wondering, if there is a way for saving signals while we are in an interactive session and loading them next time when we open Simvision interactively.

Any ideas on how to do this?

Thank you in advance.

Swetha. C

Hi,

 I need to call a  c function form specman . I had followed the below steps.


File vb_pattern.e
---------------------------------

 
struct vb_pattern_s
{
  %data_in_ch0 : uint (bits : 4);   // data on channel 0
  %data_in_ch1 : uint (bits : 4);   // data on channed 1
  %data_in_ch2 : uint (bits : 4);   // data on channel 2
  %mode : uint (bits : 1);          // mode 
  %enable : uint (bits : 1);        // enable

};

C export vb_pattern_s;

------

file  x_output_bfm.e
--------------------------------------------

check_patterns()@clk_e is
{

  ...
 exp_viterbi_op();

}

routine exp_viterbi_op() is C routine viterbi_c_func;

---- EOF------

X.c
#include "vb_pattern.h"

void viterbi_c_func ()
{
 SN_TYPE(vb_pattern_s) vb_packet;
 SN_TYPE(mode)   mode;
 vb_packet = SN_SYS->ops
 mode = vb_packet->mode;
 printf(" Printing from C environment MODE = %h ", mode);

}


------------------- EOF----

x_top.e
------------
import  tb/vb_pattern.e;
import  tb/x_input_bfm.e;
import  tb/x_output_bfm.e;
import  tb/x_cover_dut.e;
import  tb/x_env.e;




I  did the following comand


>> sn_compile.sh -h_only x_top.e -o vb_pattern.h
>> gcc -c viterbi.c -o viterbi.o

I am getting the following error


viterbi.c: In function `viterbi_c_func':
viterbi.c:6: error: `t__mode' undeclared (first use in this function)
viterbi.c:6: error: (Each undeclared identifier is reported only once
viterbi.c:6: error: for each function it appears in.)
viterbi.c:6: error: syntax error before "mode"
viterbi.c:7: error: `mode' undeclared (first use in this function)


Please help me resolve this.

Kesav



  

The two macros below introduce new syntax for adding definitions to more than one 'when' determinant value at the same time. The first macro overloads 'extend' keyword and the second is the equivalent for 'when' keyword.

A use example:

extend [HUGE, BIG] packet {
    // definitions that pertain to these subtypes
};

The above code would be expanded in the following (naive) way:

extend HUGE packet {
    // definitions that pertain to these subtypes
};
extend BIG packet {
    // definitions that pertain to these subtypes
};


The macros code:

define 'statement>
       "extend ['name>,...] 'name> ({;...})" as computed {
    for each in 'names> do {
        result = appendf("%sextend %s %s %s;",result,it,'name>,);
    };
    result = appendf("{%s}",result); // required only for versions 6.1.1 or earlier
};

define 'struct_member>
       "when ['name>,...] 'name> ({;...})" as computed {
    for each in 'names> do {
        result = appendf("%swhen %s %s %s;",result,it,'name>,);
    };
    result = appendf("{%s}",result); // required only for versions 6.1.1 or earlier
};

The following macros encapsulates a design pattern that enables constraining data item fields by 'do' actions of a high level sequence. This can be done without presupposing anything about the sequence tree generated under the do-ing sequence.

The tar file consists of 4 files:
- item_constraint_macro.e - the 'item_constraint' and 'sequence_export' macros definition
- item_constraint_example.e and sequence_export_example.e - use examples (one per each new construct)
- packet_seq.e - an auxiliary definition file for the examples

This topic was discussed in a Club-T presentation (Israel, Sophia-Antipolis, Munich). The presentation is also publicly avaiable.

Hi everybody,

The attached package is a tiny code example with a demo for an upcoming Team Specman blog post about writing macros.

Hilmar

Attached is the latest revision of the venerable Specman-Matlab package (Lead Application Engineer Jangook Lee is the latest to have refreshed it for a customer in Asia to support 64 bit mode.  Look for a guest blog post from him on this package shortly.)

There is a README file inside the package that gives a detailed overview, shows how to run a demo and/or validate it’s installed correctly, and explains the general test flow.  The test file included in the package called "test_get_cmp_mdim.e" shows all the capabilities of the package, including:

* Using Specman to initialize and tear down the Matlab engine in batch mode

* Issuing Matlab commands from e-code, using the Specman command prompt to load .m files, initializing variables, and other operational tasks.

* Transfering data to and from the Matlab engine to Specman / an e language test bench

* Comparing data of previously retrieved Matlab arrays

* Accessing Matlab arrays from e-code without converting them to e list data structure

* Convert Matlab arrays into e-lists

Happy coding!

Team Specman

Attached is the latest emacs mode for e/Specman - version 1.23

Please follow the install instructions in the top section of the actual file
(after unzipping it) to install/load this package with your emacs.

If you have seen any images or demonstrations of the 17.4-2019 release, the GUI may look ...(read more)

Do you know if it is possible to define localized back etching (LBE) in EMX? It should be associated to a layer which defines the holes done in the substrate. I've not found any reference for this in the .proc syntax. 

--> Answer found. This is not possible because EMX considers the same dielectric in all x-y plane

Read through this blog to know more about the new Reliability Report view in Virtuoso ADE Assembler and Virtuoso ADE Explorer.(read more)

In this post, we will learn about the most important parameters for the analog simulators that affect the accuracy of the simulation results. We will also understand how each parameter limits the accuracy of the measurements for the DC and transient analyses.(read more)

This blog introduces you to an efficient way to debug interface elements or connect modules in a mixed-signal simulation.(read more)

Read this blog for an overview to the Circuit physical verification and parasitic extraction design stage in the Custom IC Design methodology and the key design steps which can help you achieve this.(read more)

Concurrent Layout Editing enables more than one designer to work in a hierarchy at the same time. Check out this blog to know more. (read more)

Is there a way to set a thru via hole to thru via hole spacing constraint?

I need the hole to hole spacing, nit pad to pad spacing.

I can calculate the spacing using the via pad diameter, but this won't work for multiple via pad sizes.

Hello,

I have a sensitive trace on layer 2 and I would like to prevent any routing along or across it on adjacent layers (L1 and L3).

My idea was to use a route keepout shape on L1 and L3, however that also removed the ground pour on those layers and I would like to keep the ground pour.

Can I get around this somehow or should I use something else than route keepout?

Regards,

Filip

Hi

the signal SPI_SCLK belongs to TWO Spacing CLASSES: CLS_SP_SPI and CLS_SP_SPI_CLOCK

I then assign TWO different SPACING RULES to each class : CLS_SP_SPI  > 2H and CLS_SP_SPI_CLOCK > 3.5H

Which SPACING RULE will inherit the signal SPI_SCLK ??

Is it possible to manually define the PRIORITY on Design Rules ??

The default behaviour of Place replicate update is to select every new net item connected to the replicate module. This leads to an abundant number of clines, vias and shapes being selected, most of which I don't want to add to the replicate group. It is very tedious to unselect all these items and more often than not, I miss one or two items and then end up with a via or cline in a completely different place on the board or outside of the board.

Is there a way to change this rather annoying behaviour? I haven't found any way to disable it or to batch deselect everything the tool has decided to add to the replicate group.

The question has been asked before, but it didn't get any answers and the thread is now locked.

/F

Hi

I have fixed a SPACING RULE (SP1) for a CLASS_DIFF_PAIR whereas for via associated to the net (DP_VIA), the DISTANCE > 60mils respect to ANY other vias (PTH, BB, TEST vias)

Now my problem is that this rules should NOT be applied for GND VIAS (STICHING VIA) which must be placed at a distance < 40mils respect to DP_VIA

How to create an exemption to the SPACING RULE (SP1)?

I am using OrCAD PCB Designer Standard version 17.4-2019. I want to force update the Package_Height_Max property on the place bound top shape. The footprint library that we've created has that property set in the dra file, but I'd like to override that from capture so I can be certain that the height is correct.

This is coming from a place where we have created a very large footprint library over that past ++ years. Everyone who creates a new footprint is supposed to make sure that we add Package_Height_Max to the footprint, but of course footprints get reused for various parts, not all of which will have the same package height. What I want to do is export a list of package heights from our part database and then import the package heights into Capture and override the package height in the footprint.

I have found a post here  Using Height Property from Orcad Capture which says its not possible, but it also says its from 15 years ago, so maybe things have changed?

Hello,

Trying to figure out why this situation does not generate a DRC error.

A resistor was accidently placed so the pad was on top of another pad. See picture:

I have checked the CM and both Spacing Constraint Set and Same Net Spacing Constraint Set have Smd pin to Smd pin set to 0.1 mm.

I'm using Allegro PCB designer 22.1.

If someone has an idea why this does not give a DRC i would appreciate it. Thanks.

Regards,

Filip

Dear Community,

In OrCAD X Profession, the workspace feature enables the users to store the libraries (Schematic Symbol, Footprint and PSpice Models) and Designs (Schematic and PCB layout) in the cloud workspace.

But storing these libraries and design are stored in servers in the USA, Europe, Asia and Japan Servers.

I don't want to store my designs in any of these servers instead I want to create the workspace in my local PC and store all my libraries and designs in the local workspace.

Is this possible, if possible then can anyone provide the steps/procedure or videos of how to do it?

Regards,

Rohit Rohan

Socionext, a leader in SoC design, recently made significant strides in enhancing its design efficiency for a complex billion-gate project. Faced with the initial challenges of lengthy eight-day iterations and a protracted two-month timing signoff process, the objective was to reduce the iteration cycle to just three days. By integrating Cadence's cutting-edge solutions—Certus Closure Solution, Tempus Timing Solution, and Quantus Extraction Solution—Socionext achieved remarkable improvements.

Notably, the Tempus DSTA tool dramatically cut timing closure time by 73%, outperforming conventional single-machine STA methods. This achievement, combined with the synergistic use of Cadence's Certus Closure and Tempus Timing solutions, allowed Socionext to meet their ambitious three-day iteration target and double productivity. Additionally, integrating these solutions significantly decreased both human and machine resource needs, slashing memory and disk costs by up to 90% and halving engineering resources during the optimization and signoff phases.

For more on this collaboration, check out the "Designed with Cadence" success story video on Cadence's website and YouTube channel.

Also, don't miss the on-demand webinar "Fast, Accurate STA for Large-Scale Design Challenges," which provides a deeper dive into Socionext's breakthroughs and the innovative solutions that powered their success.

In an era of abundant and constantly evolving information, the challenge is not just accessing knowledge but understanding and applying it effectively. AI is a transformative technology that is reshaping how we learn, work, and grow. In this blog, we’ll explore how AI accelerates our knowledge acquisition and understand how it can relate to the process of learning, which connects with our daily lives.

The role of AI is to accelerate knowledge by personalizing learning experiences, providing instant access to information, and offering data-driven insights. AI empowers us to learn more efficiently and effectively in many ways. I won't go into much detail, as we are already busy searching for the meaning of AI and what it can do; however, I want to share one inspiring fact about AI. It can analyze vast amounts of data in seconds, making sense of complex information and providing instantaneous actionable insights or concise answers. I understand that humans are looking to speed up things, which can help us understand technology better and perform our tasks faster.

The main reason AI is in focus is because of its ability to perform tasks faster than ever. We aim to enhance the performance of all our products, including the everyday household electronic items we use. Similarly, are we striving to accelerate the learning process? I am committed to assisting you, and one such method is concise, short (minute-long) videos.

In today's fast-paced world, where attention spans are shorter than ever, the rise of social media platforms has made it easier for anyone to create and share short videos. This is where minute videos come in. These bite-sized clips offer a quick and engaging way to deliver information to the audience with a significant impact. Understanding the definitions of technical terms in VLSI Design can often be accomplished in just a minute.

Below are the definitions of the essential stages in the RTL2GDSII Flow. For further reference, these definitions are also accessible on YouTube.

Want to Learn More?

The Cadence RTL-to-GDSII Flow training is available as both "Blended" and "Live" Please reach out to Cadence Training for further information.

And don't forget to obtain your Digital Badge after completing the training!

• You can check out a free Online Version of the training above, which is available 24/7 for all customers with a Cadence Learning ans Support Portal
• You will also have access to our Training Byte Library then which is full of hundres of troubleshooting videos, like the following: What is Digital Implementation?
• You can find more instructions how to get the best out of the Portal in this blog.
• If you would like to stay up-to-date with the latest news and information about Cadence trainings and webinars, subscribe to the Cadence Training emails.

Related Blogs

Training Insights – Why Is RTL Translated into Gate-Level Netlist?

Did You Miss the RTL-to-GDSII Webinar? No Worries, the Recording Is Available!

It’s the Digital Era; Why Not Showcase Your Brand Through a Digital Badge!

Binge on Chip Design Concepts this Weekend!

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