Celebrated chef-restaurateur Kyle Itani, who helms both Itani Ramen and Hopscotch Restaurant & Bar in Uptown Oakland, has just launched a brand-new project: a takeout sushi spot.

Operating out of Itani Ramen and serving its fare via pickup and delivery, Nikkei Sushi will be open Wednesday through Sunday, 2 p.m. - 8 p.m. during its soft opening with hours extending in the future.…

Together with a team of volunteers — including the Street Royalty Motorcycle Club — popular pitmaster Matt Horn prepared and served 600 pork and chicken sandwiches to feed the entire staff at Valley Children's Hospital in Fresno.

Rather than lament the delayed opening of his eagerly awaited Horn Barbecue brick-and-mortar restaurant in the heart of Oakland, last month the pitmaster created a philanthropic project, the Horn Initiative, which has since mid-March facilitated the making and serving of over 4,000 meals to frontline workers and others in need.…

Uptown Oakland's alaMar Kitchen & Bar will celebrate its sixth anniversary this Friday, May 1, with a contactless, social-distancing, Covid-19-crisis parade.

"In celebration of this milestone, we are asking all of our fans and supporters to parade in the safety of their cars," management announced in a press release today.…

Celebrated chef-restaurateur Kyle Itani, who helms Itani Ramen and Hopscotch Restaurant & Bar in Uptown Oakland, has just launched a brand-new project: a takeout sushi spot.

Here's a leaked track from Oakland vocalist Karyn Paige.

The 2012 Progressive Opportunities Conference showcased the best work of nonprofits, companies, unions, activists, and government leaders, looking to shed light on some of our most pressing economic issues. The Conference sought to create an opportunity to network and exchange ideas, arming attendees with new tools to make positive economic change.…

California today announced its intent to declare bisphenol A a reproductive hazard. Under a state law known as Prop 65, warning signs would be required for consumer items that contain a certain high level of BPA.…

Stories you shouldn’t miss:

1. Alameda County Public Health Director Muntu Davis contends that gentrification should be examined in terms of health impacts because of the displacement and stress it causes for low-income residents, the Bay Area News Group$ reports.…

If you happen to run into any medical residents anytime soon, they may look a little fatigued and broke, especially if they happen to be residents or pediatricians of UCSF Benioff Children’s Hospital of Oakland. Today, the CIR/SEIU Healthcare union that represents resident physicians and pediatricians said it plans to rally in front of the hospital on Friday at 12:15 p.m. along with nurses and community leaders to demand better wagers and working conditions.…

The city's 911 system can leave callers waiting for more than 120 seconds before an operator ever answers. Seconds of delay in an emergency can lead to death. As a result, 911 calls are supposed to be answered quickly.…

A ceramic electronic component includes an interior part and an exterior part. The interior part includes an interior part dielectric layer and an internal electrode layer. The exterior part includes an exterior part dielectric layer. The exterior part is positioned outside the interior part along a laminating direction thereof. The interior part dielectric layer and the exterior part dielectric layer respectively contain barium titanate as a main component. β−α≧0.20 and α/β≦0.88 are satisfied, where α mol part and β mol part are respectively an amount of a rare earth element contained in the interior and exterior part dielectric layers, provided that an amount of barium titanate contained in the interior and exterior part dielectric layers is respectively 100 mol parts in terms of BaTiO3.

A ceramic electronic component includes a dielectric layer and an electrode layer. The dielectric layer contains a plurality of ceramic particles and grain boundary phases present therebetween. A main component of the ceramic particles is barium titanate. An average thickness of the grain boundary phases is 1.0 nm or more. A thickness variation σ of the grain boundary phases is 0.1 nm or less.

An electric circuit device connecting first and second external elements, the electric circuit device including: a first electronic component; a first bus bar electrically connected to the first electronic component; a second bus bar electrically connected to the electronic component and overlapped with the first bus bar in a direction perpendicular to main surfaces of the first and second bus bars; a first external terminal electrically connecting the first bus bar to the first external element; a second external terminal electrically connecting the second bus bar to the second external element; a first region in the first external terminal electrically coupled to the first external element; and a second region in the second external terminal electrically coupled to the second external element, and at least partially overlapped with the first region in the direction.

A multilayer ceramic electronic component includes a laminated body including dielectric layers and internal electrode layers, and first and second external electrodes. The laminated body further includes a first conductor layer, a first insulating coating layer, a second conductor layer, and a second insulating coating layer. The surface of the first conductor layer closer to a first end surface is partially connected to the first external electrode. The surface of the second conductor layer closer to a second end surface is partially connected to the second external electrode.

The present invention relates to a process for producing an electrolytic capacitor, the process comprising process steps i) ii): i) providing a capacitor body (1) that comprises an electrode body (2) of an electrode material,a dielectric (3) which at least partially covers the surface of this electrode material, anda solid electrolyte (4) at least comprising an electrically conductive material which at least partially covers the dielectric surface; ii) applying a primer solution e) to the capacitor body (1), followed by an application of a solution or dispersion a) comprising a conjugated polymer b) and a solvent or dispersant d), followed by an at least partial removal of the solvent or dispersant d) for the formation of the polymeric outer layer (5) that is formed onto the capacitor body (1); wherein the primer solution e) comprises at least one monofunctional amine and at least one carboxylic acid.

An apparatus is disclosed which includes an electrolytic capacitive element with multiple capacitor sections.

A conductive composite is provided, which includes a conductive conjugated polymer and a mixture. The mixture includes (a) boron oxide, and (b) sulfur-containing compound, nitrogen-containing compound, or a combination thereof. A capacitor is also provided, which includes an anode electrode, a dielectric layer on the anode electrode, a cathode electrode, and an electrolyte between the dielectric layer and the cathode electrode, wherein the electrolyte includes the described conductive composite.

A capacitor structure is provided, which includes a positive electrode, a dielectric layer on the positive electrode, and an organic-inorganic composite layer on the dielectric layer. The capacitor structure also includes a negative electrode, and a conductive conjugated polymer electrolyte disposed between the organic-inorganic composite layer and the negative electrode.

The invention relates to a device for thermally disconnecting or tripping an overvoltage protection device, comprising: a locking element (A1), on which a first force (F1) acts, and which is fixed in such a way that same is released when a limit temperature is exceeded; and a slider (S1) which is blocked in a first state (Z1) by the fixed locking element (A1), and on which a second force (F2) acts in order to transfer same into a second state (Z2) when the locking element (A1) is released.

A mounting member includes a body having a surface including a mounting surface on which an object is mountable, a channel arranged in the body, and a first layer arranged on an inner surface of the channel. The first layer has a higher thermal conductivity than the body.

A rework grid array interposer with direct power is described. The interposer has a foundation layer mountable between a motherboard and a package. A heater is embedded in the foundation layer to provide local heat to reflow solder to enable at least one of attachment or detachment of the package. A connector is mounted on the foundation layer and coupled to the heater and to the package to provide a connection path directly with the power supply and not via the motherboard. One type of interposer interfaces with a package having a solderable extension. Another interposer has a plurality of heater zones embedded in the foundation layer.

A method and system for cooling a device (preferably a micro-device), comprising cooling the device by using a lower critical solution temperature (LCST) mixture. Enhancement of heat transfer rates is achieved during phase separation of a two-component system (two-component mixture) with a LCST. Convective heat transfer rates in small diameter pipes and over a vertical (hot) plate are demonstrated.

Embodiments are generally directed to cooling of electronics using folded foil microchannels. An embodiment of an apparatus includes a semiconductor die; a substrate, the semiconductor die being coupled with the substrate; and a cooling apparatus for the semiconductor die, wherein the cooling apparatus includes a folded foil preform, the folded foil forming a plurality of microchannels, and a fluid coolant system to direct a fluid coolant through the microchannels of the folded foil.

An SSD with a package optimized for semiconductor wafers is configured by thinning a plurality of undiced wafers and stacking the wafers. The wafers are connected to each other by TSV. A subset of the wafers include memory circuits. One of the wafer not in the subset includes peripheral circuits. A casing houses the wafers.

A wiring device includes a housing that encloses a line voltage port and a low-voltage port for providing power to at least one removable load. The removable load can couple to a connector PCB. The connector PCB may include a tongue portion with retention surface features and a body portion with supporting circuitry. The tongue portion may be disposed within a low-voltage port of the wiring device. A plurality of conductive traces may extend from the body to the tongue of the connector PCB. The low voltage port may include sidewalls disposed around the tongue portion to guide the plug of a removable load into engagement with the conductive traces of the tongue portion so that one or more of the plurality of conductive traces electrically contact the removable load to deliver power to the removable load.

A household distribution box comprises a distribution box case; two service lines introduced from a transformer into the distribution box case of a consumer; three main lines installed in the distribution box case and provided with two lines and a second service line; two sub-lines installed in the distribution box case and formed by branching the second service line among the main lines into two lines; a first circuit breaker installed in the distribution box case; a second circuit breaker installed in the distribution box case; and a controller connected to the first circuit breaker.

The present disclosure provides a method and a system for protecting an electrical device. The method includes: acquiring coordinate data of the electronic device; determining whether the coordinate data exceeds a data range corresponding to a preset state of the electronic device; and disabling the electronic device when the coordinate data exceeds the data range corresponding to the preset state.

A junction box is configured to be arranged between a DC power source and a load. The junction box includes a first mechanical relay configured to be connected to a positive terminal of the DC power source, a second mechanical relay configured to be connected to a negative terminal of the DC power source, a semiconductor relay connected in series to at least one of the first mechanical relay and the second mechanical relay, and a controller that controls driving of the first mechanical relay, the second mechanical relay and the semiconductor relay respectively. When an abnormal state occurs, the controller controls the first and second mechanical relays to turn the first and second mechanical relays off after controlling the semiconductor relay to turn the semiconductor relay off.

A ground fault circuit interrupter (GFCI) breaker testing system can include an enclosure having at least one wall that forms a cavity. The system can also include at least one GFCI breaker disposed within the cavity. The system can further include a sensing circuit assembly having at least one switch, where the at least one switch is electrically coupled to the at least one GFCI breaker. The system can also include a user interface assembly disposed, at least in part, outside the cavity, where the user interface assembly is coupled to the sensing circuit assembly, where the user interface assembly instructs the at least one switch to test the at least one GFCI breaker.

A surge suppression device includes a micro electromechanical system (MEMS) switch electrically connected to a current path. Additionally, the surge suppression device includes a transient voltage suppression (TVS) device electrically connected in series to the MEMS switch. The surge suppression device is configured to protect electronic components from voltage surges or current surges.

An overvoltage protection device includes a resistor that is connected in series between an internal signal line connected to a communication terminal of a processor and a communication line, a diode of which a cathode is connected to the internal signal line and an anode is connected to a ground, and a PNP transistor of which a base is connected to a power supply terminal, an emitter is connected to the internal signal line, and a collector is connected to the ground. When a base-emitter voltage (a junction saturation voltage) of the transistor in operation is defined as VBE and a power source is turned on (a voltage V1) by the operation of the transistor, a voltage of the internal signal line is limited to the source voltage V1+VBE. When the power source is turned off (a voltage 0 V), the voltage of the internal signal line is limited to the source voltage 0 V+VBE.

The present invention provides a chip and an electronic device. The chip comprises at least one pin, and the chip comprises at least one ESD (Electrostatic Discharge) protection circuit inside, and the ESD protection circuit is employed to reduce or eliminate a damage of electrostatic to other elements or circuit inside the chip, and the ESD protection circuit is located corresponding to a pin, and the ESD protection circuit is electrically coupled to the pin. The electronic device comprises the aforesaid chip.

An electrical energy receiving end capable of overvoltage protection and a wireless electrical energy transmission device are provided. An electrical energy receiving coil is divided into a first receiving coil and a second receiving coil, so that under normal operation the first receiving coil and the second receiving coil jointly resonate with an impedance matching network to receive energy. When the electrical energy receiving end has an overvoltage, the first receiving coil and the impedance matching network (or the second receiving coil and the impedance matching network) form a loop, and due to the impedance mismatch, the energy received by the electrical energy receiving end is greatly reduced to solve the problem of overvoltage at the electrical energy receiving end.

A switching regulator control circuit is used in a switching regulator that converts an input voltage into an output voltage by the switching of a switching device, and generates a switching signal for controlling the ON/OFF operation of the switching device. The switching regulator control circuit has a fault detector and a fault protector. The fault detector detects, based on the duty ratio of the switching signal or a variable correlated to it and included in a control signal used to generate the switching signal, a fault state where the duty ratio falls outside the normal modulation range. The fault protector stops the switching of the switching device when the fault detector detects a fault state.

In one aspect, a modular sensing apparatus will be described. The modular sensing apparatus includes a flexible substrate and multiple sensors. The flexible substrate is reconfigurable into different shapes that conform to differently shaped structures. The multiple sensors are positioned on the substrate. Various embodiments relate to software, devices and/or systems that involve or communicate with the modular sensing apparatus.

Electronic device heat transfer technology is disclosed. In an example, an electronic device package can include a substrate. The electronic device package can also include a heat transfer component. The electronic device package can further include a heat-generating electronic component coupled to the substrate between the substrate and the heat transfer component. The electronic device package can also include a viscous thermal interface material (TIM) providing a heat transfer pathway between the electronic component and the heat transfer component. In addition, the electronic device package can include a barrier about at least a portion of a periphery of the viscous TIM to maintain the viscous TIM within a confined location in proximity to the electronic component. The TIM is uninterrupted by the barrier within the periphery.

A flexible circuit board includes a first circuit substrate, a second circuit substrate and a bonding layer. The first circuit substrate includes a first base layer, a first circuit layer, a second circuit layer and metal coating layer. The first circuit layer includes a signal line and at least two grounding lines. The metal coating layer encloses the signal line. The second circuit substrate includes a third circuit layer. The bonding layer is located between and bonding the first circuit substrate and the second circuit substrate. The second circuit layer, the third circuit layer are electrically coupled with the grounding lines by a plurality of electrically conductive holes. The first base layer, the bonding layer and the second circuit substrate cooperatively enclose a hermetic medium layer receiving the signal line. The hermitic medium layer is filled with air. A method for manufacturing the flexible circuit board is also provided.

In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.

A package includes a conductive pad, with a plurality of openings penetrating through the conductive pad. A dielectric layer encircles the conductive pad. The dielectric layer has portions filling the plurality of openings. An Under-Bump Metallurgy (UBM) includes a via portion extending into the dielectric layer to contact the conductive pad. A solder region is overlying and contacting the UBM. An integrated passive device is bonded to the UBM through the solder region.

A circuit board upon which to mount an integrated circuit chip may include a first interconnect zone on the surface of the circuit board having first contacts with a first pitch, and a second interconnect zone, surrounding the first zone, having second contacts or traces with a second pitch that is smaller than the first pitch. The first contacts may have a design rule (DR) for direct chip attachment (DCA) to an integrated circuit chip. The first contacts may be formed by bonding a sacrificial substrate having the first contacts to a surface of the board; or by laser scribing trenches where the conductor will be plated to create the first contacts. Such a board allows DCA of smaller footprint processor chips for devices, such as tablet computers, cell phones, smart phones, and value phone devices.

A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad.

A flexible printed circuit board including an annular main board and a plurality of branches connected with the annular main board is provided. Each of the branches includes an extension portion connected with the annular main board and a bonding portion, and an electronic component is adapted to be disposed on the bonding portion. A supporting holder including an annular base, two wing structures, and a plurality of mounting portions is also disclosed, wherein the wing structures extend outward from the annular base and the mounting portions are located on the annular base and the wing structures. Further, a controller including the flexible printed circuit board and the supporting holder aforementioned is disclosed, wherein the annular main board is disposed on the annular base and the branches are disposed on the annular base and the wing structures, such that the bonding portions are located on the mounting portions correspondingly.

A flexible substrate and a flexible display device including the same are disclosed. In one aspect, the flexible substrate includes a first substrate that is flexible and a metal wiring layer over the first substrate and having a first surface facing the first substrate, a second surface opposite to the first surface, and a plurality of holes penetrating the first and second surfaces. The holes are arranged in a plurality of rows. The holes comprise a first hole in an n-th row and a first hole in a (n-1)th row. The first hole of the n-th row is spaced apart from the first hole in the (n-1)th row by a first distance, and an edge of each of the holes is curved.

A stretchable electronic assembly comprising a stretchable body, a plurality of electronic components encapsulated in the stretchable body, at least one meandering conductor connected to at least one electronic component of the plurality of electronic components, at least one hollow pocket formed in the stretchable body, the at least one meandering conductor encapsulated in the stretchable body and the at least one meandering conductor located within the at least one hollow pocket formed in the stretchable body.

Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.

A display device is disclosed. A back cover supports a back surface of a display panel. A bending member is bent at a predetermined curvature and attached to the back surface of the back cover. A curvature-changing unit is coupled to the back surface of the back cover to rotate the bending member and change the curvature of either the display panel or the back cover.

One embodiment provides a deformable housing, including a recess for holding a deformable device; a deformable portion comprising at least two surfaces having a plurality of concave/convex structures; and at least two support parts embedded in the deformable portion. Other aspects are described and claimed.

An automation field device having a housing and a modular field device electronics unit located inside the housing. The electronics unit has a first circuit board having at least one first and one second plug-in connector element, wherein the first plug-in connector element is used to electrically connect a peripheral unit, wherein both the first and the second plug-in connector elements can be contacted essentially from the same preferred plug-in direction, and a second circuit board having at least one third plug-in connector element, wherein the circuit boards are arranged such that the second plug-in connector element is connected to the third plug-in connector element in a detachable manner to electrically connect the peripheral unit to the second circuit board, and the second circuit board has at least one opening, via which the first plug-in connector element of the first circuit board is accessible for connecting the peripheral unit.

According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board, a second circuit board opposed to the first circuit board, a third circuit board opposed to the second circuit board, a first connector connecting the first and second circuit boards to each other, a second connector connecting the second and third circuit boards to each other, and is offset to the first connector in a plane direction, a first spacer between the first and second circuit boards, and a second spacer between the second and third circuit boards. The first spacer includes a support body at a position opposed to the second connector and in contact with the first and second circuit boards.

An apparatus to support a flexible screen of an electronic device includes a plurality of shafts, a plurality of rows of first connecting members, and a plurality of rows of second connecting members. Each first and second connecting member has a top side, a bottom side, a left aperture and a right aperture extending from the top side to the bottom side, with each aperture coupled to a shaft. The width of the apertures for each second connecting member is greater than the width of the apertures for each first connecting member. The plurality of shafts are connected to each other by alternate rows of first connecting members and second connecting members along the length of the shafts. Each connecting member in a row of connecting members overlaps with two connecting members in an adjacent row of connecting members.