I got "no simulation data for marker" for each A<B, A=B and A>B markers. Simulation output doesn't show these outputs but the inputs shown. How can I solve this error?

We have a big circuit having 12K gates totally and trying to show it in one page slide visually. But it is so hard for us to shrink it down from gate-level to module-level. Do you have any function like these:

• Toggle wires on and off
• “Right click” elements and group them into black boxes
• Quickly left or right align elements to clean up pictures

One of the key goals for USB4 is to retain compatibility with the existing ecosystem of USB3.2, USB 2.0 and Thunderbolt  products, and the resulting connection scales to the best mutual capability of the devices being connected. USB4 is designed to work with older versions of USB and Thunderbolt . USB4 Fabric support high throughput interconnects of 10 Gbps (for Gen 2) and 20 Gbps (for Gen 3) and supports Thunderbolt 3-compatible rates of 10.3125 Gbps (for Gen 2) and 20.625 Gbps (for Gen 3). It becomes very important to verify the Thunderbolt  backward compatibility with the designs. Though the support of USB4 Interoperability with Thunderbolt  3 (TBT3) is optional in USB4 host or USB4 peripheral device and required USB4 Hub and USB4 Based Dock but it is very essential to work in the existing ecosystem. 

Few Main features of USB4 Interoperability with Thunderbolt  3 (TBT3) Systems

• Support for Bi-Directional Pins & Retimers: TBT3 Active Cables can contain two bidirectional Re-timers which have the capability to send AT Responses on its RX channel. Router connected directly to such Retimer needs to support A Router that is connected directly to a bidirectional Re-timer shall support reception of Transactions on both TX and RX channels. 

• Bounce Mechanism: This feature is used by Router to access the Register Space of a Cable Re-timer that can only be accessed by its Link Partner.
• Asymmetric Negotiation: The Router which connects with Cable Retimers needs to follow Asymmetric TxFFE in Phase 5 of Lane Initialization. 
• USB4 Link Transitions: In TBT3 mode, the configuration of two independent Single Lane Links can be used non-transient state or Single Lane Link just using the Lane1 Adapter.

Cadence has a mature USB4 Verification IP solution that can help in the verification of USB4 designs with TBT3. Cadence has taken an active part in the Cairo group that defined the USB4 specification and has created a comprehensive Verification IP that is being used by multiple members. If you plan to have a USB4-compatible design, you can reduce the risk of adopting new technology by using our proven and mature USB4 Verification IP. Please contact your Cadence local account team, for more details.

Power network design and analysis of 3D-ICs is a major challenge due to the complex nature and large size of the power network. In addition, designers must deal with the complexity of routing power through the interposer, multiple dies, through-silicon vias (TSVs), and through-dielectric vias (TDVs).
Cadence’s Integrity 3D-IC Platform and Voltus IC Power Integrity Solution provide a fully integrated solution for early planning and analysis of 3D-IC power networks, 3D-IC chip-centric power integrity signoff, and hierarchical methods that significantly improve capacity and performance of power integrity (PI) signoff while maintaining a very high level of accuracy at signoff. This blog summarizes the typical design challenges faced by today’s 3D-IC designers, as discussed in our recent webinar, “Addressing 3D-IC Power Integrity Design Challenges.” Please click here to view the full webinar.

Major Trends in Advanced Chip Design

From chips to chiplets, stacked die, 3D-ICs, and more, three major trends are impacting advanced semiconductor packaging design. The first is heterogenous integration, which we define as a disaggregated approach to designing systems on chip (SoCs) from multiple chiplets. This approach is similar to system-in-package (SiP) design, except that instead of integrating multiple bare die – including 3D stacking – on a single substrate, multiple IPs are integrated in the form of chiplets on a single substrate.

The second major trend is around new silicon manufacturing techniques that leverage silicon vias (TSVs) and high-density fanout RDL. These advancements mean that silicon is becoming a more attractive material for packaging, especially when high bandwidth and form factor become key attributes in the end design. This brings new design and verification challenges to most packaging engineers who typically work with organic and ceramic substrate materials.

Finally, on the ecosystem side, all the large semiconductor foundries now offer their own versions of advanced packaging. This brings new ways of supporting design teams with technologies like reference flows and PDKs, concepts that have typically been lacking in the packaging community. Cadence has worked with many of the leading foundries and outsourced semiconductor assembly and test facilities (OSATs) to develop multi-chip(let) packaging reference flows and package assembly design kits. The downside is that, with the time restrictions designers are under today, there isn’t enough time to simulate the details of these flows and PDKs further.

For those who must make the best electro/thermal/physical decisions to achieve the best power/performance/area/cost (PPAC), factors can include accurate die size estimations, thermal feasibility, die-to-die interconnect planning, interposer planning (silicon/organic), front-to-front and front-to-back (F2F/F2B) planning, layer stack and electromigration/ IR drop (EMIR)/TSV planning, IO bandwidth feasibility, and system-level architecture selection.

3D-IC Power Network Design and Analysis

The key to success in 3D-IC design is early power integrity planning and analysis. Cadence’s Integrity 3D-IC platform is a high-capacity 3D-IC platform that enables 3D design planning, implementation, and system analysis in a single, unified cockpit. Cadence’s Voltus IC Power Integrity Solution is a comprehensive full chip electromigration, IR drop, and power analysis solution. With its fully distributed architecture and hierarchical analysis capabilities, Voltus provides very fast analysis and has the capacity to handle the largest designs in the industry. Typically, 3D-IC PDN design and analysis is performed in four phases, as shown in Figure 1.

Phase 1 - Perform early power delivery network (PDN) exploration with each fabric’s PDN cascaded in system PI with early circuit models.

Phase 2 – Plan 3D-IC PDNs in Cadence’s Integrity 3D-IC platform, including micro bumps, TSVs, and through dielectric vias (TDVs), power grid synthesis for dies, and early rail analysis and optimization.

Phase 3 – Perform full chip-centric signoff in Voltus with detailed die, interposer, and package models, including chip die models, while keeping some dies flat.

Phase 4 – Perform full system-level signoff with Cadence’s Sigrity SystemPI using detailed extracted package models from Sigrity XtractIM, board models from Sigrity PowerSI or Clarity 3D Solver, interposer models from XtractIM or Voltus, and chip power models from Voltus.

Figure 1. 3D-IC PDN design and analysis phases

3D-IC Chip-Centric Signoff

The integration of Integrity 3D-IC and Voltus enables chip-centric early analysis and signoff. Figure 2 and Figure 3 highlight the chip centric early PI optimization and signoff flows. In early analysis, the on-chip power networks are synthesized, and the micro bumps and TSVs can be placed and optimized. In the signoff stage, all the detailed design data is used for power analysis, and detailed models are extracted and used for package, interposer, and on-die power networks.

Figure 2. Early chip-centric PI analysis and optimization flow

Figure 3. Chip-centric 3D-IC PI signoff

Hierarchical 3D-IC PI Analysis

To improve the capacity and performance of 3D-IC PI analysis, Voltus enables hierarchical analysis using chiplet models. Chiplet models can be reduced chip models in spice format or more accurate xPGV models which are highly accurate proprietary models generated by Voltus. With xPGV models, the hierarchical PI analysis has almost the same accuracy as flat analysis but offers 10X or higher benefit in runtime and memory requirements.

Conclusion

This blog has highlighted the major design trends enabled by advanced 3D packaging and the design challenges arising from these advancements. The design of power delivery networks is one of these major challenges. We have discussed Cadence solutions to overcome this PI challenge. To learn more, view our recent webinar, "Addressing 3D-IC Power Integrity Design Challenges" and visit the Voltus web page.

Cadence is super excited to announce SPB 23.1 release —Your freedom to design boldly!  

These tools help engineers build better PCBs faster with the new 3D engine and optimized interface.  

We have been hard at work to bring you this release and believe that it will help you take control of the PCB design process with the powerful new features in Allegro X APD like: 

• Packaging Support in 3DX Canvas 

• 3DX Wire DRCs 

• Aligning Components by Offset 

• Text Wizard Enhancements 

• Device File Reuse for Existing Components for Netlist and Logic Import 

Watch this space to know all about What’s New in SPB 23.1.  

Regards 

Team PCBTech 

Cadence Design System 

For individuals, small businesses, or teams, START YOUR FREE TRIAL. 

Starting SPB 23.1, Allegro Package Designer Plus (APD+) has been rebranded as Allegro X Advanced Package Designer (Allegro X APD).

The splash screen for Allegro X APD will appear as shown below, instead of showing APD+ 2023:

For the Windows Start menu in 23.1, it will display as Allegro X APD 2023 instead of APD+ 2023, as shown below

23.1 Start menu 

In the Product Choices window for 23.1, you will see Allegro X Advanced Package Designer in the place of Allegro Package Designer +, as shown below: 

23.1 product title

Have you heard that starting SPB 23.1, Allegro Package Designer Plus (APD+) will be renamed as Allegro X Advanced Package Designer (Allegro X APD)? 

Allegro X APD offers multiple new features and enhancements on topics like Via Structures, Wirebond, Etchback, Text Wizards, 3D Canvas, and more. 

This post presents the new 3DX Canvas introduced in SPB 23.1. This can be invoked from Allegro X APD (from the menu item View > 3DX Canvas). 

Some of the key benefits of the new canvas: 

• This canvas addresses the scale and complexity in large modern package designs. It provides highly efficient visual representation and implementation of packages. 
  
• The new architecture enables high-performance 3D incremental updates by utilizing GPU for fast rendering. 
  
  
• Real-time 3D incremental updates are supported, which means that the 3D view is in sync with all changes to the database. 
  
  
• The new canvas provides 3D visualization support for packaging objects such as wire bonds, ball, die bump/pillar geometries, die stacks, etch back, and plating bar. 
  
  
• This release also introduces the interactive measurement tool for a 3D view of packages. Once you open 3DX Canvas, press the Alt key and you can select the objects you want to measure. 
  
• 3DX Canvas provides new 3D DRC Bond Wire Clearances with Real 3D DRC Checks. True 3D DRC in Constraint Manager has been introduced. If you open Constraint Manager, there will be a new worksheet added. Following DRC checks are supported: 

  Wire to Wire 
  Wire to Finger 
  Wire to Shape 
  Wire to Cline 
  Wire to Component

The course "Jasper Formal Fundamentals v24.03" introduces formal analysis to those who want to use formal analysis for design or verification. 

To optimally benefit from this course, you must already have sufficient knowledge of the System Verilog assertions to be capable of writing properties for formal verification. Hence, this training provides a module on formal analysis to help cover this essential background. 

In this course, you will learn how to code efficient SVA Properties for formal analysis, understand formal complexity and how to overcome it, and learn the basics of formal coverage.

After completing this course, you will be able to:

• Define reusable, functionally correct SVA properties that are efficient for formal tools. These shall use abstract auxiliary code to simplify descriptions, make code maintenance easier, reduce debug time, and reduce tool-proof runtime.
• Set up, run, and analyze results from formal analysis.
• Identify designs upon which formal is likely to be successful while understanding formal complexity issues and how to identify and overcome them.
• Use a systematic property development process to approach a completely new verification problem.
• Understand the basics of formal coverage.

 The most recently updated release includes new modules on:

• "Basic complexity handling" which discusses the complexity in formal and how to identify and handle them.
• "Complexity reduction methods” which discusses the complexity reduction methods and which is suitable for which type of complexity problem.
• “Coverage in formal” which discusses the basics of coverage in formal verification and how coverage can be used in formal.   

Take this course to learn the basics of formal verification. 

What's Next? 

You can check out the complete training: Jasper Formal Fundamentals. There is a free online version of the training available 24/7 for all customers with a Cadence Learning and Support Portal account. If you are interested in an instructor-led version of the training, please contact Cadence Training. And don't forget to obtain your digital badge after completing the training!

You can also check Jasper University page for more materials on formal analysis and Jasper apps. 

Related Trainings 

Jasper Formal Expert Training Course | Cadence

Verilog Language and Application Training Course | Cadence

SystemVerilog for Design and Verification Training Course | Cadence

SystemVerilog Assertions Training Course | Cadence

Related Training Bytes 

Jasper Formal Property Verification (FPV) App: Basic Usage Demo (Video)

Jasper Formal Methodology playlist

Related Training Blogs

It’s the Digital Era; Why Not Showcase Your Brand Through a Digital Badge!

Training Insights: Introducing the C++ Course for All Your C++ Learning Needs!

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Hey, is it suitable to post here? I wanted a small yet robust amp for practicing while I travel. I wanted something that would fit in my pocket yet still be loud enough to hear.

Presented here is a amplifier based upon the LM386 Audio Amplifier.

There is a standard circuit in the data sheet that is an excellent place to start.

Materials needed:
1 - HM359 project box
1 - 668-1237 speaker
1 - BS6I battery conn
1 - CP1-3515 stereo jack
1 - SC1316 stereo jack
2 - 450-1742 knob
1 - 679-1856 switch
1- 3mm LED
1 - 10 ohm 1/4W resistor
1 - 10uF ceramic cap
1 - .05 uF ceramic cap
1 - 420 uF electrolytic cap
1 - 8 ohm resistor
2 - 51AADB24 10K pot
1 - HM1252 circuit board
1 - LM386N-4 amplifier

Wire and Solder
Step 1: Prep the enclosure

Careful planning is required the first time you free build a circuit. The circuit board has solder pads but not traces. You will have to use thin wire to make the connections for the circuit to work.

Begin by laying out the components on the circuit board that will need to pass through the enclosure. This enclosure has a removable top panel which will be used for the volume, gain and 1/4 inch stereo jack.

Space is limited to check for fit before drilling.

All drilling of the plastic should be done with a step drill bit. This will make the cleanest holes without breaking the plastic.

Lay out the pots a few spaces back but still in line with the desired position. mark the center of each pot shaft then drill with a step drill tot he tightest fitting hole size. Make a center mark between the pot holes then drill for the stereo jack

On the inside of the top cover position and mark where the speaker will go.

Make a template on grid paper the same size as the speaker.

Tape the template to the inside of the cover as shown then use a step bit to drill holes on the center of every square in the grid. This will form the speaker grille. clean up the holes.

Step 2: place the major components

Solder the pots to the circuit board as shown. then place the stereo jack(note in order to get the final fit I had to trim and modify the stereo jack housing a little)

Next, position and solder the switch on the circuit board and mark a space on the top cover that will need to be cut for the switch opening. Use a small file to cut the opening.

Use a sharp knife to bevel the edges of the switch hole to allow for easier operation.

Drill a hole in the side of the upper case for the headphone jack and fasten it in place. ( I had to recess the hole a bit for the retaining nut to grab)

Step 3: Build the circuit

The speaker is held in place by using 2 small brackets that come with the serial cable connector hood. ( I had a bunch around that would never be used)

Refer the the circuit shown from the datasheet and the datasheet for the LM386. The basic circuit only has the volume control while the datasheet shows how to add a gain control across pins 1 and 8 of the amplifier.

The speaker is wired in series with the headphone jack. The headphone jack has internal switches that shut the speaker off when the phones are plugged in.

I chose to use a chip socket for the amplifier which make prototyping easier since you do not have to worry about solder heating as much.

Carefully lay the circuit out on the board and begin wiring components together. I added a second pot and cap in series between pins 1 and 8 of the amp to be able to manually set the gain in addition to volume.

Check you connections with a multimeter before adding the amplifier.

I chose to add a LED indicator for power. This was done by using one side of switch contacts from the battery. The LED is in series with a 220 ohm resistor.

Assemble the case and insert the battery.

Step 4: Final notes

If the speaker is noisy while the headphones work normally, try reversing the speaker connections. If it does not correct the issue, connect a 8 ohm resistor across the speaker contacts.

You may have to place an insulating layer between the speaker and the place where the stereo jack comes through to prevent contact. This will be noted by a loud buzz.

You may have to add some foam in the battery compartment to stop the battery from banging around.

For reference, I've also read an article about amplifiers: http://www.apogeeweb.net/article/60.html

Thanks for reading!
​

Hi,

I'm looking to download Tensilica SDK for evaluation, but I can't get past the registration form:

Virtuoso Studio IC23.1 ISR7 production release is now available for download.(read more)

Virtuoso Studio IC23.1 ISR8 production release is now available for download.(read more)

This blog explores how Virtuoso Studio Net Tracer can help you perform a design review.

We’ll use the net connectivity option, which allows the user to get a clean highlighted net. You can use the Net Tracer tool to highlight the nets. You can find the Net Tracer command under the connectivity pulldown menu in the layout window.

Trace manager and the ability to display different islands on the same net with other colors, you can identify and connect the unconnected islands as you wish.

The Net Tracer utility traces the nets in the physical view (layout). The trace is a highlighted net, which is a non-selectable object. The Net Tracer utility is available from Virtuoso Layout Suite XL onwards. You can use this utility based on your specific needs and preferences.

For a better understanding of the Net Tracer feature, let’s see one scenario between the circuit designer and layout engineer for a layout design review.

Circuit designer: Can we go through the routed input nets “inm” and “inp”?

Layout engineer: From the below layout view where they are highlighted using the XL connectivity, today I will use Net Tracer utility for the design review.

Circuit designer: I have never heard of this feature. Let's see how it works.

Layout engineer: Sure, now we turn on the Net Tracer toolbar using the below option.

You see the Net Tracer options form here:

As you can see on my screen, I have opened the layout view and engaged the Net Tracer utility.

Net Tracer allows shapes to be traced on a net in two tracing modes, namely, physical and logical, where shapes on the same net are physically or logically connected.

Physical tracing gathers all the shapes physically connected on the same net.

Logical tracing gathers all the shapes assigned to the same net. It highlights the net as in the source design (schematic). It will highlight shapes on the same net, even if they are isolated shapes that are not physically connected.

For this scenario, let us use physical tracing for input nets “inm” and “inp."

Highlighted nets are shown below:

Net “inm”                    Net “inp”                   Nets “inm” and “inp” 

Net Tracer has features like physical and logical tracing, preview, step-by-step mode, ease of tracing a net on a shape out of multiple underlying shapes, and so on.

Let us explore logical tracing for output nets “outm” and “outp”:

Here, you can see how to enable true color and halo before enabling logical tracing to identify the metal route. After enabling the true color halo, enable the logical trace.

Here, I am opening the trace manager to search “outm” and “outp” and click trace. That will trace the particular nets as shown.

Net Tracer has a preview feature, which is helpful in terms of the number of previewed objects. This preview capability hints at how the trace would appear when you create it. This useful feature in Virtuoso Studio highlights both completed and incomplete nets, helping the user better understand the status of the highlighted nets.

Circuit designer: Thanks for the design review. You have done good work. Net Tracer clearly shows both types of tracing, and it was even easy for the circuit designer to understand.

Layout engineer: Let me share the link to the Net Tracer RAK, where other layout engineers can explore many more amazing features of the Net Tracer.

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• On the Cadence Support portal, select Register Now and provide the requested information on the Registration page.
• You will need an email address and host ID to sign up.
• If you need help with registration, contact support@cadence.com.

To stay up to date with the latest news and information about Cadence training and webinars, subscribe to the Cadence Training emails.

If you have questions about courses, schedules, online, public, or live onsite training, reach out to us at Cadence Training.

For any questions, general feedback, or future blog topic suggestions, please leave a comment.

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Cadence Training Services now offers digital badges for this training course. These badges indicate proficiency in a certain technology or skill and give you a way to validate your expertise to managers and potential employers. You can highlight your expertise by adding these digital badges to your email signature or any social media platform, such as Facebook or LinkedIn. To become Cadence Certified, you can find additional information here.

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About Knowledge Booster Training Bytes

Knowledge Booster Training Bytes is an online journal that relays information about Cadence Training videos, online courses, and upcoming webinars that are available in the Learning section of the Cadence Learning and Support portal. This blog category brings you direct links to these videos, courses, and other related material on a regular basis.

Sandhya.

On behalf of the Cadence Training team

Virtuoso Studio IC23.1 ISR9 production release is now available for download.(read more)

Welcome back to the Doc Assistant A-Z blog series!

Since the launch of Doc Assistant, we've been gathering feedback and input from our customers regarding their experiences with our latest documentation viewer. My interaction with Ralf was particularly useful and interesting.

Ralf is a design engineer who works on complex schematics and intricate layouts. For each release, he is challenged with the task of verifying the tool and feature changes across multiple releases. He shared with me that he has been using Doc Assistant’s capabilities to help him achieve this.

Ralf explained that he utilizes Doc Assistant to open and compare documents from different releases side-by-side, seamlessly tracking updates across multiple releases and verifying those updates in his Cadence tools. Additionally, in Doc Assistant’s online mode, he compares documents across previous tool versions, ensuring a thorough review of any changes. Finally, he was happy to share with me that Doc Assistant features have helped him significantly reduce the time he spends on identifying such changes.

You, of course, can also achieve such productivity gains using several Doc Assistant features designed to help simplify such tasks!

In previous editions of this blog series, we looked at some key features and benefits of Doc Assistant. If you've missed these editions, I would highly recommend that you read them:

• Doc Assistant A-Z: Making the Most of the Cadence Cloud-Based Help Viewer: Part 1
• Doc Assistant A-Z: Making the Most of the Cadence Cloud-Based Help Viewer: Part 2
  

In this third installment, we're diving into some more of Doc Assistant's key capabilities.

To learn more about how to use the above features, check out the Doc Assistant User Guide.

These are just a few of the productivity gain features in Doc Assistant. We’ll cover more in the next blog in the series.

Want to Know More?

If you have any feedback on Doc Assistant or would like to request more information or a demo, please contact docassistant.support@cadence.com.

Subscribe to receive email notifications about our latest Custom IC Design blog posts.

Happy reading!

- Priya Sriram, on behalf of the Doc Assistant Team

Virtuoso Studio IC23.1 ISR10 production release is now available for download.(read more)

Hello Fellow PCB Designers,

We have a 10 layer PCB design that originated in Pads and was converted over to Allegro 17.4, this is an old design but is manufacturable and works perfectly fine.  When I try to generate a Gerber for the Top or Bottom layers

the Gerber comes out fine.  But Most of the middle layers are Etch's and via's for power and grounds, but the Gerber's come mostly blank, there might be some details, but in the Gerber view everything is displayed correctly.

The design does have many close spacings, I have not changed anything in the constrains manager yet, turned off a lot of the DRC's, but thinking there might be something wrong with the constrains.

  I find that the CSet is set to 2_18, not sure yet what this means, also there are many of these definitions, PCS 3,4,5,ect, are the same as CSet 2_18 any suggestions would be great, we are currently looking into this, have seen

that even small change in constraint manager can cause long processing and even Allegro crashing, this is a large project.

Thanks Much, Thanks, Mike Pollock.

I'm not able to export a CIS Standard BOM to a Microsoft 365 Excel (business subscription, version 2111).
Selecting the "Export BOM report to Excel" option opens a new Excel window, but OrCAD (17.4-2019 S023) won't fill it with any data...

I tried it on a different PC with Microsoft Office Professional Plus 2019 Excel (strangely the version number is the same: 2111) and with OrCAD 17.4-2019 S016 and it worked flawlessly.

Does anybody experiencing the same issue?
Does the Excel variant, the OrCAD version or the PC itself causing this?
Thanks for any help!

I'm trying to use Jasper for checking parameter propagation in a large design. I have a list of top-level parameters, each with a HDL path of a module parameter somewhere lower in the hierarchy that's supposed to receive its value from the top-level module. The FPV app seems like an excellent tool for this, but elaborating the entire design in it is extremely time-consuming and memory-intensive. So, I'm trying to black-box everything but the interesting HDL paths. I thought using `elaborate -top dut_module_name -bbox_i * -no_bbox_i inst_foo -no_bbox_i inst_bar (...)` would work, but it doesn't. Jasper just starts flooding the log with warnings from modules that are definitely not on the whitebox list, and eventually dies due to insufficient memory. When I use -bbox_m * it correctly elaborates the top-level module with all of its sub-modules black-boxed. But then the -no_bbox_i switches have no effect. Could anyone suggest a working solution for this use case?

Hello All,

Following is the einstein's puzzle solved by cadence Incisive92  (solved in less than 3 seconds -> FAST!!!!!!)

Thanks,

Vinay Honnavara

Verification engineer at Keyu Tech

vinayh@keyutech.com

 // Author: Vinay Honnavara

// Einstein formulated this problem : he said that only 2% in the world can solve this problem
// There are 5 different parameters each with 5 different attributes
// The following is the problem

// -> In a street there are five houses, painted five different colors (RED, GREEN, BLUE, YELLOW, WHITE)

// -> In each house lives a person of different nationality (GERMAN, NORWEGIAN, SWEDEN, DANISH, BRITAIN)

// -> These five homeowners each drink a different kind of beverage (TEA, WATER, MILK, COFFEE, BEER),

// -> smoke different brand of cigar (DUNHILL, PRINCE, BLUE MASTER, BLENDS, PALL MALL)

// -> and keep a different pet (BIRD, CATS, DOGS, FISH, HORSES)


///////////////////////////////////////////////////////////////////////////////////////
// *************** Einstein's riddle is: Who owns the fish? ***************************
///////////////////////////////////////////////////////////////////////////////////////

/*
Necessary clues:

1. The British man lives in a red house.
2. The Swedish man keeps dogs as pets.
3. The Danish man drinks tea.
4. The Green house is next to, and on the left of the White house.
5. The owner of the Green house drinks coffee.
6. The person who smokes Pall Mall rears birds.
7. The owner of the Yellow house smokes Dunhill.
8. The man living in the center house drinks milk.
9. The Norwegian lives in the first house.
10. The man who smokes Blends lives next to the one who keeps cats.
11. The man who keeps horses lives next to the man who smokes Dunhill.
12. The man who smokes Blue Master drinks beer.
13. The German smokes Prince.
14. The Norwegian lives next to the blue house.
15. The Blends smoker lives next to the one who drinks water.
*/




typedef enum bit [2:0]  {red, green, blue, yellow, white} house_color_type;
typedef enum bit [2:0]  {german, norwegian, brit, dane, swede} nationality_type;
typedef enum bit [2:0]  {coffee, milk, water, beer, tea} beverage_type;
typedef enum bit [2:0]  {dunhill, prince, blue_master, blends, pall_mall} cigar_type;
typedef enum bit [2:0]  {birds, cats, fish, dogs, horses} pet_type;




class Einstein_problem;

    rand house_color_type house_color[5];
    rand nationality_type nationality[5];
    rand beverage_type beverage[5];
    rand cigar_type cigar[5];
    rand pet_type pet[5];
        rand int arr[5];
    
    constraint einstein_riddle_solver {
    
        
    
        foreach (house_color[i])
            foreach (house_color[j])
               if (i != j)
                house_color[i] != house_color[j];
        foreach (nationality[i])
            foreach (nationality[j])
               if (i != j)
                nationality[i] != nationality[j];
        foreach (beverage[i])
            foreach (beverage[j])
               if (i != j)
                beverage[i] != beverage[j];
        foreach (cigar[i])
            foreach (cigar[j])
               if (i != j)
                cigar[i] != cigar[j];
        foreach (pet[i])
            foreach (pet[j])
               if (i != j)
                pet[i] != pet[j];
    
    
        //1) The British man lives in a red house.
        foreach(nationality[i])
                (nationality[i] == brit) -> (house_color[i] == red);
                
        
        //2) The Swedish man keeps dogs as pets.
        foreach(nationality[i])
                (nationality[i] == swede) -> (pet[i] == dogs);
                
                
        //3) The Danish man drinks tea.        
        foreach(nationality[i])
                (nationality[i] == dane) -> (beverage[i] == tea);
        
        
        //4) The Green house is next to, and on the left of the White house.
        foreach(house_color[i])        
                 if (i<4)
                    (house_color[i] == green) -> (house_color[i+1] == white);
        
        
        //5) The owner of the Green house drinks coffee.
        foreach(house_color[i])
                (house_color[i] == green) -> (beverage[i] == coffee);
                
        
        //6) The person who smokes Pall Mall rears birds.
        foreach(cigar[i])
                (cigar[i] == pall_mall) -> (pet[i] == birds);
        
        
        //7) The owner of the Yellow house smokes Dunhill.
        foreach(house_color[i])
                (house_color[i] == yellow) -> (cigar[i] == dunhill);
        
        
        //8) The man living in the center house drinks milk.
        foreach(house_color[i])
                if (i==2) // i==2 implies the center house (0,1,2,3,4) 2 is the center
                    beverage[i] == milk;
        
        
        
        //9) The Norwegian lives in the first house.
        foreach(nationality[i])        
                if (i==0) // i==0 is the first house
                    nationality[i] == norwegian;
        
        
        
        //10) The man who smokes Blends lives next to the one who keeps cats.
        foreach(cigar[i])        
                if (i==0) // if the man who smokes blends lives in the first house then the person with cats will be in the second
                    (cigar[i] == blends) -> (pet[i+1] == cats);
        
        foreach(cigar[i])        
                if (i>0 && i<4) // if the man is not at the ends he can be on either side
                    (cigar[i] == blends) -> (pet[i-1] == cats) || (pet[i+1] == cats);
        
        foreach(cigar[i])        
                if (i==4) // if the man is at the last
                    (cigar[i] == blends) -> (pet[i-1] == cats);
        
        foreach(cigar[i])        
                if (i==4)
                    (pet[i] == cats) -> (cigar[i-1] == blends);
        
        
        //11) The man who keeps horses lives next to the man who smokes Dunhill.
        foreach(pet[i])
                if (i==0) // similar to the last case
                    (pet[i] == horses) -> (cigar[i+1] == dunhill);
        
        foreach(pet[i])        
                if (i>0 & i<4)
                    (pet[i] == horses) -> (cigar[i-1] == dunhill) || (cigar[i+1] == dunhill);
                    
        foreach(pet[i])        
                if (i==4)
                    (pet[i] == horses) -> (cigar[i-1] == dunhill);
                    


        //12) The man who smokes Blue Master drinks beer.
        foreach(cigar[i])
                (cigar[i] == blue_master) -> (beverage[i] == beer);
        
        
        //13) The German smokes Prince.
        foreach(nationality[i])        
                (nationality[i] == german) -> (cigar[i] == prince);
        

        //14) The Norwegian lives next to the blue house.
        foreach(nationality[i])
                if (i==0)
                    (nationality[i] == norwegian) -> (house_color[i+1] == blue);
        
        foreach(nationality[i])        
                if (i>0 & i<4)
                    (nationality[i] == norwegian) -> (house_color[i-1] == blue) || (house_color[i+1] == blue);
        
        foreach(nationality[i])        
                if (i==4)
                    (nationality[i] == norwegian) -> (house_color[i-1] == blue);
        

        //15) The Blends smoker lives next to the one who drinks water.            
        foreach(cigar[i])            
                if (i==0)
                    (cigar[i] == blends) -> (beverage[i+1] == water);
        
        foreach(cigar[i])        
                if (i>0 & i<4)
                    (cigar[i] == blends) -> (beverage[i-1] == water) || (beverage[i+1] == water);
                    
        foreach(cigar[i])        
                if (i==4)
                    (cigar[i] == blends) -> (beverage[i-1] == water);
        
    } // end of the constraint block
    


    // display all the attributes
    task display ;
        foreach (house_color[i])
            begin
                $display("HOUSE : %s",house_color[i].name());
            end
        foreach (nationality[i])
            begin
                $display("NATIONALITY : %s",nationality[i].name());
            end
        foreach (beverage[i])
            begin
                $display("BEVERAGE : %s",beverage[i].name());
            end
        foreach (cigar[i])
            begin
                $display("CIGAR: %s",cigar[i].name());
            end
        foreach (pet[i])
            begin
                $display("PET : %s",pet[i].name());
            end
        foreach (pet[i])
            if (pet[i] == fish)
                $display("THE ANSWER TO THE RIDDLE : The %s has %s ", nationality[i].name(), pet[i].name());
    
    endtask // end display
    
    
endclass




program main ;

    initial
        begin
            Einstein_problem ep;
            ep = new();
            if(!ep.randomize())
                $display("ERROR");
            ep.display();
        end
endprogram // end of main

        

Using the EMX solver, X-FAB design engineers can efficiently develop next-generation RF technology for the latest communication standards (including sub-6GHz 5G, mmWave, UWB, etc.), which are enabling technologies for communications and electric vehicle (EV) wireless applications. (read more)

With the latest release (Sigrity and Systems Analysis 2022.1 HF2) of Clarity  3D Solver, support for encrypted component models is now available. With this functionality, vendors that supply 3D components, such as connectors, can now merge their...(read more)

The silkscreen layer plays a crucial role in the assembly, repair, and testing of a PCB. You can add a variety of information to this layer, such as the location of the components, polarity, component orientation, on-off switches, LEDs, and testpoint...(read more)

Hi! I'm using EMX with 2 design kits. In one works fine. With another, I do not see the mesh or current view. The menu item is not shown. This happens only with one DK. With the other one I'm able to run Paraview without any issue. 

Besides, I would like to know if there is any way to see the 3D view without mesh and current. Just a nice 3D view. 

I've also tried to install the latest version (EMX2023_2) but nothing changes. 

Hi

I'm learning Hb analysis for the IIP3 simulation of a gilbert mixer. My f_RF=5GHz, f_LO=4GHz and f_IF=1GHz . I'm a bit confused about setting the 1st order and 3rd order harmonic at the Direct plot form. I have set 1st order harmonic = 1GHz and 3rd order harminic = 2*f_LO-f_RF = 3GHz and it gives me the following results.

This is my 1dB compression point result

Hb analysis window

Direct plot window

Please let me know if my harmonic selection is correct and whether I'm getting a correct IIP3 and P1db curve

I get multiple results at the same frequency in a 3-tone simulation.

I try to determine the IP3 of a mixer. I have 3 large signal tones: 0.75 GHz, 1.25 GHz and 1.26 GHz.

At the IM3 frequency of 490 MHz I observe 4 results, see also the screenshot of the table output. The frequencies are exactly the same (even when I subtract 490 MHz by using xval() ).

Which of the values do I have to use to determine the correct IP3?

Is there an option to merge these results?

Sample clues

5 across: The US president’s bird (3,5,3)

11 down: Group once known as the Quarrymen (7)

10 across: Cavalry sword (5)

19 across: Masonic ritual (5,6)

1 down: Pioneer of Ostpolitik (6)

Extrowords © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic

Sample clues

14 across: FDR’s baby (3,4)

1 down: A glitch in the Matrix? (4,2)

4 down: Slanted character (6)

5 down: New Year’s venue in New York (5,6)

16 down: Atmosphere of melancholy (5)

Extrowords © 2007 IndiaUncut.com. All rights reserved.
India Uncut * The IU Blog * Rave Out * Extrowords * Workoutable * Linkastic

I have a small shape for connecting three SMD pads, but it won't connect to one of the pads (0.2x0.6 mm). Thermal relief connects are set to Full contact for SMD pin in Shape parameters, but that doesn't help.

However, if I decrease the Minimum aperture for gap width in Void controls in Shape parameters to something below 0.2 mm the shape connects to the pad. But it is a little contracted at the pad entrance. Just 0.002 mm. What is going on here? 

Tried to attach some pictures, but I get: "An error occurred. Please try again or contact your administrator.". Will try later again.

/F

Has anyone experienced the same situation?

Designing 3D-ICs with integrity involves a commitment to ethical practices, reliability, and sustainability throughout the design and manufacturing process. This includes using environmentally friendly materials, ensuring robust and efficient performance, and incorporating thorough testing and verification. By prioritizing transparency, responsibility, and long-term sustainability, designers can create advanced integrated circuits that meet high standards of quality and social responsibility.

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• You will design the interposer from scratch in the new Integrity System Planner and the Integrity 3D-IC implementation environment.
• You will examine the ASIC and interposer designs using some of the new 3D-IC multi-die design features.
• You will route the interposer using some of the new advanced routing capabilities with NanoRoute

—and this in only two days!

WATCH VIDEO

Interested? Get an overview in less than two minutes.

Are you primarily interested in selected snippets instead? Then, take our Training Bytes, which—like the online training course—are available to Cadence customers for free 24/7 in the Cadence Learning and Support portal.

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Related Resources

• 3D-IC Introduction (Video)
• 3D-IC Development Process With Challenges. (Video)
• Demo: How to Create the Interposer Contact Pads and Die Connectivity Using the Integrity 3D-IC? (Video)
• Demo: How To Pull The Interposer Design From System Planner Into Integrity 3D-IC Layout? (Video)
• Demo: Routing The Interposer Design Using The Integrity 3D-IC Layout_Part 1 (Video)
• Demo: Routing The Interposer Design Using The Integrity 3D-IC Layout_Part 2 (Video)
• Demo: How To Create C4 Bumps For NC Connections And Generating C4 Dummy Cover Bumps In Integrity 3D-IC? (Video)

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