Hi Team,

I am using the following command in my SKILL script to flatten the hierarchical layouts, it's working fine for all the instances and mosaics but not for techLib via's please help me with the command to use for flattening the techLib via.

dbFlattenInst( inst 2 nil)

dbFlattenInst( inst1 2 t t nil nil t t)

Regards,

MT.

Hi there

I am trying to make cross-probe btw layout and schematic view.

so when I execute the code in schematic using bindkey, the code will raise the layout view (hiRaiseWindow)

and then I want to descend to the same hierarchy as schematic. (geSelectFig, leHiEditInPlace)

But looks like current cellview still stays at schematic view.

I got this error msg, and when I print current cell view name at where I got this msg, it replys schematic.

*Error* geSelectFig: argument #1 should be a database object (type template = "d") - nil

is there any way to change the current cellview to layout view?

I also added this code, but didn't work.

geGetEditCellView(geGetCellViewWindow(cvId)) ;cvId is layout view

I don't want to close the schematic view, just want to move the focus or make geSelectFig works.

Thanks in advance.

When starting a new design, it's important to take the time to consider design recommendations that prevent problems that can arise later in the design cycle. This two-part compilation of guidelines for starting a new design is the result of years of Cadence AWR Design Environment platform Support experience with designs. Pre-design decisions for user interface, simulation, layout, and library configuration lay the groundwork for a successful and efficient AWR design. This blog covers the user interface (UI) and simulation considerations designers should note prior to starting a design.(read more)

AWR V22.1 software introduces the Pointer-Hybrid optimization method which uses a combination of optimization methods, switching back and forth between methods to efficiently find the lowest optimization error function cost. The optimization algorithm automatically determines when to switch to a different optimization method, making this a superior method over manual selection of algorithms. This method is particularly robust in regards to finding the global minima without getting stuck in a local minima well.(read more)

When starting a new design, it's important to take the time to consider design recommendations that prevent problems that can arise later in the design cycle. This two-part compilation of guidelines for starting a new design is the result of years of Cadence AWR Design Environment platform Support experience with designs. Pre-design decisions for user interface, simulation, layout, and library configuration lay the groundwork for a successful and efficient AWR design. This blog, part 2, covers the layout and component library considerations designers should note prior to starting a design.(read more)

Microwave Office is Cadence’s tool-of-choice for RF and microwave designers designing everything from III-V 5G chips, to RF systems in board and package technologies. These types of designs require close interaction between the schematic and its layout. A new Training Byte demonstrates how the schematic-layout connections is built into Microwave Office.(read more)

New online training course for AXIEM EM Simulator in AWR Microwave Office is available.(read more)

Hello All:

I am looking for help on the following, as I am new to Cadence tools [I have to use Cadence Innovus for Physical Design after Logic Synthesis using Synopsys Design Compiler, using Nangate 45 nm Open Cell Library]: while using Cadence Innovus, I would need to select a few specific nets to be routed through a specific metal layer. How can I do this on Innovus [are there any command(s)]? Also, would writing and sourcing a .tcl script [containing the command(s)] on the Innovus terminal after the Placement Stage of Physical Design be fine for this?

Secondly, is there a way in Innovus to manipulate layout components, such as changing some pin placements, wire directions (say for example, wire direction changed to facing east from west, etc.) or moving specific closely placed cells around (without violating timing constraints of course) using any command(s)/.tcl script? If so, would pin placement changes and constraining some closely placed cells to be moved apart be done after Floorplanning/Powerplanning (that is, prior to Placement) and the wire direction changes be done after Routing? 

While making the necessary changes, could I use the usual Innovus commands to perform Physical Design of the remaining nets/wires/pins/cells, etc., or would anything need modification for the remaining components as well?

I would finally need to dump the entire design containing all of this in a .def file.

I tried looking up but could only find matter on Virtuoso and SKILL scripting, but I'd be using Innovus GUI/terminal with Nangate 45 nm Open Cell Library. I know this is a lot, but I would greatly appreciate your help. Thanks in advance.

Riya

Hi,

I have synthesized a verilog code. When performing the pnr in innovus it is showing the error "Instance g5891__718 (similar for other) of the cell AND2_X6 has no physical library or has wrong dimension  values (<=0). Check your design setup to make sure the physical library is loaded in and attribute specified in library are correct.

When importing synthesized netlist in virtuoso then it says " Module AND2_X6, instantiated in the top module decoder, is not defined. Therefore the top module decoder will be imported as functional."

Please help what's going on here? 

The increase in compute and data-intensive applications and the need for lower power consumption have resulted in a rapidly growing number of Arm-based devices in various market segments; this requires fast time to market (TTM) and support for off-t...(read more)

Learn how Xcelium PowerPlayback App enables the massively parallel Xcelium replay of waveforms for glitch-accurate power estimation of multi-billion gate SoC designs.(read more)

To stay ahead in competition in chip design real-time collaborations ensure traceability, speedy innovations at reduced the cost.(read more)

Speed increase requirements keep on flowing by in all the domains surrounding us. The same applies to memory storage too. Earlier mobile devices used eMMC based flash storage, which was a significantly slower technology. With increased SoC processing speed, pairing it with slow eMMC storage was becoming a bottleneck. That is when modern storage technology Universal Flash Storage (UFS) started to gain popularity. 

UFS is a simple and high-performance mass storage device with a serial interface. It is primarily used in mobile systems between host processing and mass storage memory devices. Another important reason for the usage of UFS in mobile systems like smartphones and tablets is minimum power consumption. 

To achieve the highest performance and most power-efficient data transport, JEDEC UFS works in collaboration with industry-leading specifications from the MIPI® Alliance to form its Interconnect Layer. MIPI UniPro is used as a transport layer, and MIPI MPHY is used as a physical layer with the serial DpDn interface. 

UFS 4.0 specification is the latest specification from JEDEC, which leverages UniPro 2.0 and MPHY 5.0 specification standards to achieve the following major improvements:

• Enables up to 4200 Mbps read/write traffic with MPHY 5.0, allowing 23.29 Gbps data rate. 
• High Speed Link Startup, along with Out of Order Data Transfer and BARRIER Command, were introduced to improve system latencies. 
• Data security is enhanced with Advanced RPMB. Advance RPMB also uses the EHS field of the header, which reduces the number of commands required compared to normal RPMB, increasing the bandwidth. 
• Enhanced Device Error History was introduced to ease system integration. 
• File Based Optimization (FBO) was introduced for performance enhancement. 

Along with many major enhancements, UFS 4.0 also maintains backward compatibility with UFS 3.0 and UFS 3.1. 

JEDEC has just announced the UFS 4.0 specification release, quoting Cadence support as a constant contributor in the JEDEC UFS Task Group, actively participating in these specifications development.  

With the availability of the Cadence Verification IP for JEDEC UFS 4.0, MIPI MPHY 5.0 and MIPI UniPro 2.0, early adopters can start working with the provisional specification immediately, ensuring compliance with the standard and achieving the fastest path to IP and SoC verification closure.  

More information on Cadence VIP is available at the Cadence VIP Website. 

Yeshavanth B N 

It has become challenging to ensure that the designs are complete, correct, and adhere to necessary coding rules before handing them off for RTL verification and implementation. RTL Designer Signoff Solution from Cadence helps the user identify RTL bugs at a very early development stage, saving a lot of effort and cost for the design and verification team. Our reputed customers have confirmed that using RTL signoff for their design IP helped save up to 4 weeks and reduce the late-stage RTL changes by up to 80%.(read more)

NAND Flash memory is now a widely accepted non-volatile memory in many application areas for data storage such as digital cameras, USB drive, SSD and smartphones. One form of NAND flash memory, Toggle NAND, was introduced to transmit high-speed data asynchronously thus consuming less power and increasing the density of the NAND flash device. 

The initial Toggle NAND versions had memory arranged in terms of SLC (Single Level Cell) or MLC (Multi Level Cell) mode that was considered as a 2D scalar stack and their frequency of operation was also less. The ever-growing demand of high memory capacity and high throughput required further research in the areas like the shrinking size of cell, performance to fill-in these gaps.

Some of these new requirements were incorporated, leading to newer versions of Toggle NAND, namely 3.0 and 4.0, with a re-arrangement of the internal memory developing a 3D layer of memory. With such structures, higher capacity of the memory was possible, but performance was the primary challenge as the latency of the write/read of memory quadrupled with the same frequency.

The key to improving the performance and run the device at very high speed in low power mode was to enhance the frequency of operation for faster read/writes to the memory and reduce the voltage levels.

But with every technology advancement comes some other problems, the next being the data sampling at that high frequency that can cause setup/hold time issues. To overcome these concerns, different types of trainings on the signal interface were made mandatory that shall assist in proper sampling of the data. Few other features for improving the integrity of the signals were added.

The current set of commands were applicable to access the SLC and MLC memory modes but with the 3D layering, these commands were lacking access to the entire set of TLC (Triple Level Cell) and QLC (Quad Level Cell) memory modes. Thus, more commands were required to make sure that the 3D layering was fully written/read.

Main features of Toggle NAND 4.0 :

• High Density of Memory
• High Frequency of operation, greater than 800 MHz
• Data Trainings

Cadence Verification IP for Flash Toggle NAND 4.0 is available to support the newer version of Flash Toggle NAND 4.0, allowing to simulate the memory device for efficient IP, SoC, and system-level design verification. Semiconductor companies can start using it to fully verify their controller design and achieve functional verification closure on it within no time. 
 
Gaurav 

OrCAD X is the next-generation integrated PCB design platform. It brings to you a powerful cloud-enabled design solution that includes design and library data management integrated with the proven PCB design and analysis product portfolio of Cad...(read more)

Introduction

Multiphysics is an integral part of the concepts around digital twins. In this post, I want to discuss the mechanical aspects of multiphysics in system simulations, which are critical for 3D-IC, multi-die, and chiplet design.

The physical world in which we live is growing ever more electrified. Think of the transformation that the cell phone has brought into our lives, as has the present-day migration to electronic vehicles (EVs). These products are not only feats of electronic engineering but of mechanical as well, as the electronics find themselves in new and novel forms such as foldable phones and flying cars (eVOTLs). Here, engineering domains must co-exist and collaborate to bring about the best end products possible.

Start with the electronics—chips, chiplets, IC packaging, PCB, and modules. But now put these into a new form factor that can be dropped or submerged in water or accelerated along a highway. What about drop testing, aerodynamics, and aeroacoustics? These largely computational fluid dynamics (CFD) and/or mechanical multiphysics phenomena must also be accounted for. And then how does the drop testing impact the electrical performance? The world of electronics and its vast array of end products is pushing us beyond pure electrical engineering to be more broadly minded and develop not only heterogeneous products but heterogeneous engineering teams as well.

Cadence's Unique Expertise

It's at this crossroad of complexity and electronic proliferation that Cadence shines. Let's take, for example, the latest push for higher-performing high-bandwidth memory (HBM) devices and AI data center expansion. These technologies are growing from several layers to 12, and I can't emphasize enough the importance of teamwork and integrated solutions in tackling the challenges of advanced packaging technologies and how collaboration is shaping the future of semiconductor innovation and paving the way for cutting-edge developments in the industry.

These layered electronics are powered, and power creates heat. Heat needs to be understood, and thus, the thermal integrity issues uncovered along the way must be addressed. However, electronic thermal issues are just the first domino in a chain of interdependencies. What about the thermal stress and warpage that can be caused by the powering of these stacked devices? How does that then lend to mechanical stress and even material fatigue as the temperature cycles from high to low and back through the use of the electronic device? This is just one example in a long list of many...

Cadence Multiphysics Analysis Offerings

The confluence of electrical, mechanical, and CFD is exactly why Cadence expanded into multiphysics at a significant rate starting in 2019 with the announcement of the Clarity 3D Solver and Celsius Thermal Solver products for electromagnetic (EM) and thermal multiphysics system simulations. Recent acquisitions of Numeca, Pointwise, and Cascade (now branded within Cadence as the Fidelity CFD Platform) as well as Future Facilities (now the Cadence Reality Digital Twin product line) are all adding CFD expertise. The recent addition of Beta CAE brings mechanical multiphysics to the suite of solutions available from Cadence. The full breadth of these multiphysics system analyses, spanning EM, thermal, signal integrity/power integrity (SI/PI), CFD, and now mechanical, creates a platform for digital twinning across a wide array of applications. You can learn more by viewing Cadence's Reality Digital Twin platform launch on the keynote stage at NVIDIA's GTC in March, as well as this Designed with Cadence video: NV5, NVIDIA, and Cadence Collaboration Optimizes Data Centers.

Conclusion

Ever more sophisticated electronic designs are in demand to fulfill the needs of tomorrow's technologies, driving a convergence of electrical and mechanical aspects of multiphysics in system simulations. To successfully produce the exciting new products of the future, both domains must be able to collaborate effectively and efficiently. Cadence is fully committed to developing and providing our customers with the software products they need to enable this electrical/mechanical evolution. From EM, to thermal, to SI/PI, CFD, and mechanical, Cadence is enabling digital twinning across a wide array of applications that are forging pathways to the future.

For more information on Cadence's multiphysics system analysis offerings, visit our webpage and download our brochure.

The OrCAD X and Allegro X 24.1 release is now available at Cadence Downloads. This blog post provides links to access the release and describes some major changes and new features.   OrCAD X /Allegro X 24.1 (SPB241) Here is a representative li...(read more)

Does anyone know how to not include a pbar in a constraint manager analysis? I have some relative delay constraints applied on a group of differential nets. When I analyze the design these all show an error. If I delete the plating bar from the design they are all passing. The plating bar gets generated on the Substrate Geometry / Plating_Bar class. I understand that I could just delete the plating bar to verify the constraint but the issue is when I archive this design I would like it to be clean meaning it is in the final state for manufacturing AND passing all constraints according to design reviews.

Anyone have an idea? 

Thank you!

Have you ever thought of a handy utility to specify all necessary transmission line parameters to decide upon the stackup?   

Starting SPB 23.1, a handy feature Transmission Line Calculator, is built into Allegro X Advanced Package Designer (Allegro X APD). This feature will require either an SiP Layout license or can be accessed through SiP Layout Bundle. 

From the Analyze dropdown menu in the 23.1 Allegro X APD toolbar, you can choose Transmission Line Calculator. 

You can use this calculator to help decide constraints and stackup for laminate-based PCB or Packages. You can calculate the correct stackup material and width/spacing to meet any requirements that may be later entered in a constraint. This is truly a calculated number and not a true field solver. 

The different types of calculations that the Transmission Line Calculator can provide are Microstrip, Embedded microstrip, Stripline, CPW (Coplanar), FGCPW (frequency-dependent Coplanar), Asymmetric stripline, Coupled microstrip (Differential Pair), Coupled stripline (Differential Pair), and Dual striplines. 

This feature is important for customers relying on fabricators/spreadsheets to provide this information or need to test a quick spacing/width as per the impedance value. 

Let us know your comments on this new feature in 23.1 Allegro X APD. 

In a package design, designers often need to perform degassing. This is typically done at the end of the design process before sending the design to the manufacturer.

Degassing is a process where you perforate power planes, voltage planes, and filled shapes in your design. Degassing holes let the gas escape from beneath the metal during manufacturing of the substrate. The perforations or holes for degassing are generally small, having a specified size and shape, and are spaced regularly across the surface of the plane. If the degassing process is not done, it may result in the formation of gas bubbles under the metal, which may cause the surface of the metal to become uneven. After you degas the design, it is recommended to perform electrical verification.

Allegro X APD has degassing features that allow users to automate the process and place holes in the entire shape.

In today’s topic, we will talk about how to avoid adding  degassing holes on a particular shape.

Sometimes, a designer may need to avoid adding degassing holes to a particular shape on a layer. All other shapes on the layer can have degassing holes but not this shape. Using the Layer Based Degassing Parameters option, the designer can set the degassing parameters for all shapes on the layer. Now, the designer would like to defer adding degassing holes for this particular shape.

You may wonder if there is an easy way to achieve this. We will now see how this can be done with the tool.

Once the degassing parameters are set, performing Display > Element on any of the shapes on that layer will show the degassing parameters set.

You can apply the Degas_Not_Allowed property to a shape to specify that degassing should not be performed on this shape, even if the degassing requirements are met. Select the shape and add the property as shown below.

Switch to Shape Edit application mode (Setup > Application mode > Shape Edit) and window-select all shapes on the layer. Then, right-click and select Deferred Degassing > All Off.

Now, all shapes on the layer will have degassing holes except for the shape which has the Degas_Not_Allowed property attached to it.

By default, a dielectric must separate each pair of conductor layers in the cross-section of a design. In rare cases, this does not represent the real, manufactured substrate.

If your design requires you to have conductor layers that are not separated by a dielectric (such as, for half-etch designs), there is a variable that needs to be set in Allegro X APD. You must set this by enabling the variable icp_allow_adjacent_conductors. This entry, and its location in the User Preferences Editor, are shown in the following image.

The Objects on adjacent conductor layers do not electrically connect together, automatically. A via must be used to establish the inter-layer connections.

When enabling this option, it is recommended to exercise caution because excluding dielectric layers from your cross-section can lead to inaccurate calculations, including the calculations for signal integrity and via heights. It is important that your cross-section accurately reflect the finished product to ensure the most accurate results possible. Any dielectric layers present in the manufactured part need to be in the cross-section for accurate extraction, 3D viewing, and so on.

Let us know your comments on the various designs that would require adjacent conductor layers.

When working on a complex design, it is common to have very many net ratlines. Quantities like 1000 ratlines are possible. It can result in a cluttered view while routing. Therefore, it is useful to make all other ratlines invisible while routing interactively. You would like to make all ratlines visible again when each route action is completed.

You can easily do this by enabling the Auto-blank other rats option during routing. When enabled, all rats other than the primary ones are suppressed during the Add Connect command.

Display Stream Compression (DSC) is a lossless or near-lossless image compression standard developed by the Video Electronics Standards Association (VESA) for reducing the bandwidth required to transmit high-resolution video and images. DSC compresses video streams in real-time, allowing for higher resolutions, refresh rates, and color depths while minimizing the data load on transmission interfaces such as DisplayPort, HDMI, and embedded display interfaces.

Why Is DSC Needed?

In the ever-evolving landscape of display technology, the pursuit of higher resolutions and better visual quality is relentless. As display capabilities advance, so do the challenges of managing the immense amounts of data required to drive these high-performance screens. This is where DSC steps in. DSC is designed to address the challenges of transmitting ultra-high-definition content without sacrificing quality or performance. As displays grow in resolution and capability, the amount of data they need to transmit increases exponentially. DSC addresses these issues by compressing video streams in real-time, significantly reducing the bandwidth needed while preserving image quality.
 

DSC Use in End-to-end System

DSC Key Features

• Encoding tools:
  • Modified Median-Adaptive Prediction (MMAP)
  • Block Prediction (BP)
  • Midpoint Prediction (MPP)
  • Indexed color history (ICH)
  • Entropy coding using delta size unit-variable length coding (DSU-VLC)

• The DSC bitstream and decoding process are designed to facilitate the decoding of 3 pixels/clock in practical hardware decoder implementations. Hardware encoder implementations are possible at 1 pixel/clock.
• DSC uses an intra-frame, line-based coding algorithm, which results in very low latency for encoding and decoding.

DSC encoding algorithm
 

• Compression can be done to a fractional bpp. The compressed bits per pixel ranges from 6 to 63.9375.
• For validation/compliance certification of DSC compression and decompression engines, cyclic redundancy checks (CRCs) are used to verify the correctness of the bitstream and the reconstructed image.
• DSC supports more color bit depths, including 8, 10, 12, 14, and 16 bpc.
• DSC supports RGB and YCbCr input format, supporting 4:4:4, 4:2:2, and 4:2:0 sampling.
• Maximum decompressor-supported bits/pixel values are as listed in the Maximum Allowed Bit Rate column in the table below

• DP DSC Source device shall program the bit rate within the range of Minimum Allowed Bit Rate column in the table:

Summary

Display Stream Compression (DSC) is a technology used in DisplayPort to enable higher resolutions and refresh rates while maintaining high image quality. It works by compressing the video data transmitted from the source to the display, effectively reducing the bandwidth required. DSC uses a visually lossless algorithm, meaning that the compression is designed to be imperceptible to the human eye, preserving the fidelity of the image. This technology allows for smoother, more detailed visuals at higher resolutions, such as 4K or 8K, without requiring a significant increase in data bandwidth.

More Information

• Cadence has a very mature Verification IP solution. Verification over many different configurations can be used with DisplayPort 2.1 and DisplayPort 1.4 designs, so you can choose the best version for your specific needs.
• The DisplayPort VIP provides a full-stack solution for Sink and Source devices with a comprehensive coverage model, protocol checkers, and an extensive test suite.
• More details are available on the DisplayPort Verification IP product page, Simulation VIP pages.
• If you have any queries, feel free to contact us at talk_to_vip_expert@cadence.com

The Cadence Palladium Emulation Platform is a hardware system that implements the design, accelerating its execution and verification. Itoffers the highest performance and fastest bring-up times for pre-silicon validation of billion-gate designs, using a custom processor built by Cadence.

This Palladium Introduction course is based on the Palladium 23.03 ISR4 version and covers the following modules:

• Introduction
• Palladium flow
• Running a design on the Palladium system

This course starts with an “Introduction” module that explains Palladium and other verification platforms to show its place in the big picture. It also compares Palladium with Protium and simulation and discusses its usage and limitations.

The “Palladium Flow” module includes two stages at a high level, which are Compile and Run. Then, it covers these stages in detail. First, it covers the ICE compile flow and IXCOM compile flow steps in detail. Then it explains Run, which is common for both ICE and IXCOM modes.

The third module, “Running Design on the Palladium System,” covers all the items required for running your design on the Palladium system, including:

• Software stack requirements
• Basic concepts required to understand the flow
• Compute machine requirements

In addition, this course contains labs for both the ICE and IXCOM flows with detailed steps to exercise the features provided by the Palladium system. The lab explains a practical example of multiple counters and exercising their signals for force, monitor, and deposit features, along with frequency calculation using a real-time clock. The course is available on the Cadence support page:

There is also a Digital Badge available. You will find the Badge exam opportunity when you enroll in the Online training or after you have taken the training as "live" training.

For questions and inquiries, or issues with registration, reach out to us at Cadence Training. Want to stay up to date on webinars and courses? Subscribe to Cadence Training emails. To view our complete training offerings, visit the Cadence Training website.

Related Training Bytes

• Palladium: What Are Verification Platforms
• Palladium: What Is Processor Based Emulation
• Palladium: Comparing Emulation (Z2) and Prototyping (X2)
• Palladium: What Are ICE and IXCOM Compile Flow
• Palladium: How to Process a Design to Run on Palladium
• Palladium: XCOM Compile Flow (TB+RTL to Palladium Database)
• Palladium: ICE Compile Flow (RTL to Palladium Database)
• Palladium: Legacy ICE Compile Flow
• Palladium: Cadence Software Releases for Palladium and Protium Flow
• Palladium: Setting of PATHs for Using Palladium
• Palladium: Z2 Hardware Structure (Blade and Boards)
• Palladium: What Is Sourceless and Loadless nets
• Palladium: Design Clocks
• Palladium: Step Count and Step Clock
• Palladium: Steps for Running the Design on Palladium Z2

Related Courses

• Verilog Language and Application Training
• SystemVerilog for Design and Verification
• Xcelium Simulator

Related Blogs

• Training Insights – A New Free Online Course on the Protium System for Beginner and Advanced Users
• It’s the Digital Era; Why Not Showcase Your Brand Through a Digital Badge!
• Training Insights - Free Online Courses on Cadence Learning and Support Portal

The Sigrity and Systems Analysis (SIGRITY/SYSANLS) 2024.1 release is now available for download at Cadence Downloads . For the list of CCRs fixed in this release, see the README.txt file in the installation hierarchy. SIGRITY/SYSANLS 2024.1 Here is a list of some of the key updates in the SIGRITY/SYSANLS 2024.1 release: For more details about these and all the other new and enhanced features introduced in this release , refer to the following document: Sigrity Release Overview and Common Tools What's New . Supported Platforms and Operating Systems Platform and Architecture X86_64 (lnx86) Windows (64 bit) Development OS RHEL 8.4 Windows Server 2022 Supported OS RHEL 8.4 and above RHEL 9 SLES 15 (SP3 and above) Windows 10 Windows 11 Windows Server 2019 Windows Server 2022 Systems Analysis 2024.1 Clarity 3D Solver Clarity 3D Layout Structure Optimization Workflow : A new workflow, Clarity 3D Layout Structure Optimization Workflow, has been added to Clarity 3D Layout. This workflow integrates Allegro PCB Designer with Clarity 3D Layout for high-speed structure optimization. Component Geometry Model Editor : The new Clarity 3D Layout editor lets you set up ports, solder bumps/balls/extrusions, and two-terminal and multi-terminal circuits using a single GUI. Coaxial Open Port Option Added to Port Setup Wizard : The Coaxial Open Port option lets you create ports for each target net pin and reference net pin in Clarity 3D Layout. The nearby reference net pins are then used as a reference for each target net pin, reducing the number of ports needed. In addition, the ports of unused reference net pins are shorted to the ground. Parametric Import Option Added : Two new options, Parametric Import and Default Import , have been added to the Tools – Launch Clarity3DWorkbench menu. The Parametric Import option lets you import the design along with its parameters into Clarity 3D Workbench. The Default Import option lets you ignore the parameters when importing the design into Clarity 3D Workbench. Component Library Added to Generate 3D Components : Clarity 3D Workbench now includes a new component library that lets you use predefined 3D component templates or add existing 3D components to create 3D designs and simulation models. AI-Powered Content Search Capability : Clarity 3D Workbench and Clarity 3D Transient Solver now support an AI-powered capability for searching the content and displaying relevant information. Expression Parser to Handle Undefined Parameters : Clarity 3D Workbench and Clarity 3D Transient Solver support writing expressions or equations containing undefined parameters in the Property window to describe a simulation variable. The improved expression parser automatically detects any undefined parameter in an expression and prompts users to specify their values. This capability lets you define a model or a simulation variable as a function instead of specifying static values. For detailed information, refer to Clarity 3D Layout User Guide and Clarity 3D Workbench User Guide on the Cadence Support portal. Clarity 3D Transient Solver Mesh Processing Improved to Simulate Large Use Cases : Clarity 3D Transient Solver leverages a new meshing algorithm that enhances overall mesh processing, specifically for large designs and use cases. The new algorithm dramatically improves the mesh quality, minimum mesh size, number of mesh key points, total mesh number, and memory usage. Advanced Material Processing Engine : The material processing capability has been enhanced to handle thin outer metal, which previously resulted in open and short issues in some designs. In addition, the material processing engine offers improved mode extraction for particular use cases, including waveguide and coaxial designs. Characteristic Impedance Calculation Improved : The solver engine now uses a new analytical calculation method to calculate the characteristic impedance of coaxial designs with improved accuracy. For detailed information, refer to Clarity 3D Transient Solver User Guide on the Cadence Support portal. Celsius Studio Celsius Interchange Model Introduced : Celsius Studio now supports Celsius Interchange Model generation, which is a 3D model derived from detailed physical designs for multi-physics and multi-scale analysis. This Celsius Interchange Model file ( .cim ) serves as a design information carrier across Celsius Studio tools, enabling a variety of simulation and analysis tasks . Celsius 3DIC Thermal Workflow Improvements : The Thermal Simulation workflows in Celsius 3DIC have been significantly enhanced. Key improvements include: Advanced Power Setup with Transient Power Function and Multi Mode options Enhanced GUI for the Mesh Control and Simulation Control tabs Improved meshing capabilities Celsius Interchange Model ( .cim ) generation Material library support for block and connections Import of Heat Transfer Coefficients (HTCs) from a CFD file Bump creation through the Bump Array Wizard Layer Stackup CSV file generation Celsius 3DIC Warpage and Stress Workflow Enhancements : The Warpage and Stress workflow in Celsius 3DIC has undergone significant improvements, such as: Improved multi-stage warpage simulation flow for 3DIC packaging process Enhanced GUI for the Mesh Control , Simulation Control , and Stress Boundary Conditions tabs Support for large deformations and temperature profiles Bump creation through the Bump Array Wizard New constraint types Enhanced meshing capabilities Geometric Nonlinearity Support in Warpage and Stress Analysis : Large deformation analysis is now supported in warpage and stress studies. This study uses the Total Lagrangian approach to model geometric nonlinearities in simulation, which allows accurate prediction of final deformations. Thermal Network Extraction and Simulation : In the solid extraction flow in Celsius 3D Workbench, you can now import area-based power map files to create terminals. For designs with multiple blocks, this capability allows automatic terminal creation, eliminating the need to manually create and set up 2D sheets individually. Additionally, thermal throttling feature is now supported in Celsius Thermal Network. This makes it ideal for preliminary analyses or when a quick estimation is required. It runs significantly faster than 3D models, allowing for quicker iterations and more efficient decision-making. For detailed information, refer to the Celsius 3DIC User Guide , Celsius Layout User Guide and Celsius 3D Workbench User Guide on the Cadence Support portal. Sigrity 2024.1 Layout Workbench Improved Graphical User Interface : A new option, Use Improved User Interface , has been added in the Themes page of the Options dialog box in the Layout Workbench GUI. In the new GUI, the toolbar icons and menu options have been enhanced and rearranged. For detailed information, refer to Layout Workbench User Guide on the Cadence Support portal. Broadband SPICE Python Script Integration with Command Line for Simulation Tasks : Broadband SPICE lets you run Python scripts directly from the command line for performing simulation and analysis. The new -py and *.py options make it easier to integrate Python scripts with the command-line operations. This update streamlines the process of automating and customizing simulations from the command line, which makes your simulation tasks faster and easier. For detailed information, refer to Broadband SPICE User Guide on the Cadence Support portal. Celsius PowerDC Block Power Assignment (BPA) File Format Support : PowerDC now supports the BPA file format. Similar to the Pin Location (PLOC) file, the BPA file is a current assignment file that defines the total current of a power grid cell, which is then equally distributed across the power pins within the cell. This provides better control over the power distribution. Ability to Run Multiple IR Drop Cases Sequentially : You can now select multiple result sinks from the Current-Limited IR Drop flow and run IR Drop analysis for them sequentially. PowerDC automatically runs the simulations in sequence after you select multiple result sinks. This saves time by automating the process. Enhanced Support for Mixed Conversion Devices : PowerDC now supports mixing different conversion devices, such as switching regulators and linear regulators within a single DC-DC/LDO instance. This enhancement offers added flexibility by letting you configure each instance in your design according to your specific needs. For detailed information, refer to PowerDC User Guide on the Cadence Support portal. PowerSI Monte Carlo Method Added : A new option, Monte Carlo Method, has been added in the Optimality dialog box. This option lets you create multiple random samples to depict variations in the input parameters and assess the output. Channel Check Optimization Added : The S-Parameter Assessment workflow in PowerSI now supports Channel Check Optimization . It uses the AI-driven Multidisciplinary Analysis and Optimization (MDAO) technology that lets you optimize your design quickly and efficiently with no accuracy loss. For detailed information, refer to PowerSI User Guide on the Cadence Support portal. SPEEDEM Multi-threaded Matrix Solver Support Added : The Enable Multi-threaded Matrix Solver check box has been added that lets you accelerate the simulation speed for high-performance computing. This check box provides two options, Automatic and Always, to include the -lhpc4 or -lhpc5 parameter, respectively, in the SPEEDEM Simulator (SPDSIM) before running the simulation. For detailed information, refer to the SPEEDEM User Guide on the Cadence Support portal. XtractIM Options to Skip or Calculate Special DC-R Simulation Results : The Skip DC_R of Each Path and Only DC_R of Each Path options have been added to the Setup menu. Skip DC_R of Each Path : This option lets you skip the calculation of the DC-R result during the simulation. Other results, such as SPICE T-model , RL_C of Each Path , Coupling of Each Path , etc., are still calculated. Only DC_R of Each Path : This option lets you calculate the DC-R result only during the simulation. Other results, such as SPICE T-model , RL_C of Each Path , Coupling of Each Path , etc., are not calculated. Color Assignment for Pin Matching : The MCP Auto Connection window includes the Display Color Editor , which lets you assign a color for pin matching. It helps you easily identify the matching pins in the left and right sections of the MCP Auto Connection window . Ability to Save Simulations Individually : The Save each simulation individually check box has been added to the Tools - Options - Edit Options - Simulation (Basic) - General form. Select this check box and run the simulation to generate a simulation results folder containing files and logs with a timestamp for each simulation. Reuse of SPD File Settings : The XtractIM setup check box lets you import an existing package setup to reuse the configurations and settings from one .spd file to another. For detailed information, refer to XtractIM User Guide on the Cadence Support portal. Documentation Enhancements Cloud-Based Help System Upgraded The cloud-based help system, Doc Assistant, has been upgraded to version 24.10, which contains several new features and enhancements over the previous 2.03 version. Sigrity Release Team Please send your questions and feedback to sigrity_rmt@cadence.com .

Wild River Technology (WRT), the leading supplier of signal integrity measurement and optimization test fixtures for high-speed channels at data rates of up to 224G, has announced the availability of a new advanced channel modeling solution that helps achieve extreme signal integrity design to 70GHz. Read the press release. The CMP-70 program continues the industry-first simulation-to-measurement collaboration with Cadence that was initially established with the CMP-50. Significant resources were dedicated to the development of the CMP-70 by Cadence and WRT over almost three years. The CMP-70 will be on display at DesignCon 2025 , January 28-30, in Cadence booth 827 to benchmark the Cadence Clarity 3D Solver . “I am not a fan of hype-based programs that simply get attention,” remarked Alfred P. Neves, WRT’s co-founder and chief technical officer. “Both Cadence and Wild River brought substantial skills to the table in this project as we continued our industry-first simulation-to-measurement collaboration. The result is a proven, robust and accurate platform that brings extreme signal integrity to 70GHz designs. This application package has also been instrumental in demonstrating the robust 3D EM simulation capability of the Cadence Clarity solver.” “We’re delighted to continue the joint development and validation program with WRT that started with the CMP-50,” said Gary Lytle, product management director at Cadence. “The skilled and experienced signal integrity technologists that both companies bring to the program results in a superior signal integrity solution for our mutual customers.” CMP-70 Solution Features The solution is available both in a standard configuration and as a custom solution for customer-specific stackups and fabrication. The primary target application is to support a 3D EM solver analysis modeling versus the time- and frequency-domain measurement methodologies. The solution features include: The CMP-70 platform, assembled and 100% TDR NIST traceable tested, with custom stands Material Identification overview web-based meeting including anisotropic 3D material identification A cross-section PCB report and structures for using as-fabricated geometries Measured S-parameters, pre-tested for quality (passivity/causality and resampled for time domain simulations) A host of novel crosstalk structures suited for 112G HD level project analysis PCB layout design files (NDA required) An EDA starter library including loss models with industry-first accurate surface roughness models Comprehensive training available for 3D EM analysis – correspondence, material ID in X-Y and Z axis for a host of EDA tools Industry-First Hausdorff Technique The WRT application package also includes an industry-first modified Hausdorff (MHD) technique , included as MATLAB code. This algorithmic approach provides an accurate way to compare two sets of measurements in multi-dimensional space to determine how well they match. The technique is used to compare the results simulated by the Clarity solver with those measured on the CMP-70 platform. The methodology and initial results are shown in the figure below, where the figure of merit (FOM) is calculated from 10, 35, and finally to 50GHz. The MHD algorithm requires a MATLAB license, but WRT also accommodates customer data as another option, where WRT provides the comparison between measured and simulated data. Additional Resources If you are attending DesignCon 2025 , be sure to stop by Cadence booth 827 to see WRT’s CMP-70 advanced channel modeling solution in action with the Clarity 3D Solver. Check out our on-demand webinar, " Validating Clarity 3D Solver Accuracy Through Measurement Correlation ." Learn more about the CMP-70 solution and the Clarity 3D Solver . For more information about Cadence’s full suite of integrated multiphysics simulation solutions, download our Multiphysics System Analysis Solutions Portfolio .

Celebrated for their unparalleled engineering expertise and pioneering mindset, McLaren stands at the forefront of innovation. Theirs is a story of engineering excellence, a symphony of speed driven by the relentless pursuit of aerodynamic perfection. In 2022, Cadence was named an Official Technology Partner of the McLaren Formula 1 Team. The multi-year partnership between McLaren and Cadence has helped redefine the boundaries of what’s possible in Formula 1 aerodynamics. Shaving off a fraction of a second per lap can make all the difference in a podium finish, and track conditions bring layers of complexity to the design process. That’s where Cadence steps in with Fidelity CFD Software. The Cadence Fidelity CFD software is a comprehensive suite of computational fluid dynamics (CFD) solutions. Access to this solution allows the McLaren F1 team to accelerate their CFD workflow, enabling them to assess designs faster and more precisely. It also allows them to investigate airflows and tackle design projects that require advanced compute power and precision. With Fidelity Flow’s solver capabilities and Python-driven automation, Cadence’s CFD software aids the advancement of aerodynamic simulations that go into McLaren’s F1 cars. With a customized, high-quality, multi-block meshing strategy and optimized workflow, Fidelity CFD makes design exploration more automated, thereby helping establish a strong foundation for McLaren’s future success on the track. Lando Norris, F1 driver for McLaren, said, “As a driver, I saw the impact of every decision made in the design room in every simulation run. The work on aerodynamics directly translates to the confidence I have on track, the grip in every turn, and the speed on every straight. This partnership, this technology, is what will give us the edge. It's not just about battling opponents; it's about mastering the airflow around the car in every driving condition on every track.” If you’re interested in learning more about the importance of CFD in McLaren’s racing success, be sure to attend our upcoming webinar, “CFD and Experimental Aerodynamics in McLaren F1 Engineering.” Christian Schramm, McLaren’s director of advanced projects, and Cadence’s Benjamin Leroy will be the main speakers for the event. Register today to secure your spot! For more insights on the Formula 1 car design process, take a look at the case study, “ McLaren Formula 1 Car Aerodynamics Simulation with Cadence Fidelity CFD Software .” Learn more about how McLaren and Cadence are engineering success . “Designed with Cadence” is a series of videos that showcases creative products and technologies that are accelerating industry innovation using Cadence tools and solutions. For more Designed with Cadence videos, check out the Cadence website and YouTube channel .

An increasing number of embedded designs are multi-core systems. At the pre-silicon stage, customers use a simulation platform for architectural exploration and software development. Architects want to quantify the impact of the number of cores, local memory size, system memory latency, and interconnect bandwidth. Software teams wish to have a practical development platform that is not excruciatingly slow. This blog shares a recipe for simulating Cadence DSPs in a multi-core design as separate x86 processes. The purpose is to reduce simulation time for customers with simple multi-core models where cores interact only through shared memory. It uses a Vision Q8 multi-core design to share details of the XTSC (Xtensa SystemC) model, software application, commands, and debugging. Note the details shared are for a simulation run on an Ubuntu Linux machine, Xtensa tools version RI-2023.11, and core configuration XRC_Vision_Q8_AODP. Complex vs. Simple Model A complex model (Figure 1) is one in which one core accesses another core's local memory, or there are inter-core interrupts. Simulation runs as a single x86 process. Figure 1 A simple model (Figure 2) is one in which cores interact only through shared memory. Shared memory is a file on the Linux host. Figure 2 Multiple x86 Process – Simple Model As depicted in Figure 3, each core is simulated using a separate x86 process. Cores use barriers and locks placed in shared memory for synchronization and data sharing. Locks are placed in un-cached memory that support exclusive subordinate access. The XTSC memory component, xtsc_memory , supports exclusive subordinate access. Cadence software tools provide a way to define memory regions as cached or uncached. For more details, please refer to Cadence's Linker Support Packages (LSP) Reference Manual for Xtensa SDK . Figure 3 Demo Application A demo application performs a 128x128 matrix multiplication. Work is divided so that each of the 32 cores computes four rows of the 128x128 result matrix. Cores use barriers to synchronize. Cadence tools provide APIs for synchronization and locking. Please refer to Cadence's System Software Reference Manual for more details. Note without a higher-level lock, prints from all cores will get mixed up. Therefore, in the demo application, only core#0 prints. SystemC Simulation The following sample command runs the 32-core simulation in such a way that each core is a separate x86 process. It runs a matrix multiplication application in cycle-accurate mode with logging off. >>for (( N=0; N >xtsc-run -define=NumCores=32 -define=N=0 -define=LOGGING=0 -define=TURBO=0 --xxdebug=sync -i=coreNN.inc -sc_main=sc_main.cpp -no_sim Modify the sc_main.cpp generated for core#0 to create a generic sc_main.cpp to build a single simulation executable for all cores. The Xtensa SDK includes Makefile targets to build custom simulations. By default, the simulation runs in cycle-accurate mode. Fast functional (Turbo) mode provides additional improvement over cycle-accurate mode. Note that the fast functional mode has an initialization phase, so gains are visible only when running an application with longer run times. Simulation Wall Time The table captures simulation wall time improvements. Note that these are illustrative wall time numbers. Actual wall time numbers and improvements will depend on your host machine's performance and your application. Simulation Type Wall Time Comments Single process cycle accurate mode 17500 seconds Multiple x86 processes cycle accurate mode 1385 seconds 12X faster than single process Multiple x86 processes turbo mode 415 seconds 3X faster than cycle accurate mode Debugging Attaching a debugger to each of the individual x86 core simulation processes is possible. Synchronous stop/resume and core-specific breakpoints are also supported. Configure the Xplorer launch configuration and attach it to the running simulation processes as follows (Figure 5) Figure 5 Figure 6 shows 32 debug contexts. Figure 6 As shown, using Xtensa SDK, you can create a multi-core simulation that functions as a practical software development platform. Please visit the Cadence support site for information on building and simulating multi-core Xtensa systems.

Each November, we are reminded of the bravery and dedication of those who have served our country. At Cadence, we thank our Veteran employees for their patriotism by reaffirming our commitment to honoring their sacrifices and recognizing their contributions to our business success. Our diverse and inclusive culture is strengthened by the unique perspective of our Veteran employees, and we are proud to support the Veterans Inclusion Group as a space for community members and their allies to connect. In celebration of Veterans Day, we were excited to catch up with Johnathan Edmonds, Veterans Inclusion Group Lead and Design Engineering Director, for a heartfelt chat on his journey through military service to leadership within Cadence. Throughout the conversation, he shared the importance of creating space for Veterans, the skills they offer, and his aspirations for what the Veterans Inclusion Group will achieve in the years ahead. Oh yeah, and he flies planes, too! Join us as we dive into what makes this holiday special for so many across the nation and how we can respectfully commemorate it together. Johnathan, you’re a retired Air Force Reservist, pilot, and now a Design Engineering Director. Can you tell us about your journey from the military to your current role at Cadence? I started my military and electronics journey in the Navy. I enlisted at 18 and served for six years as an aviation electronics technician. During this time, I was able to learn about and repair electronics on planes. This set me up for success, and when I was honorably discharged, I attended Virginia Tech to study computer engineering. Once I graduated, I continued my career as an engineer, but I still wanted to be a military pilot. From my past experience, I knew the reserves were an option where I could learn to fly and still have a civilian career. Not only was I lucky enough to get selected to go to pilot training, but after I returned from flight school, my luck grew, and I was hired at Cadence. Cadence has supported me throughout my military career, which has been a great benefit, as many companies don’t support reservists. The best thing about serving and being employed at Cadence is how I could blend my skill sets to further the Air Force’s mission and achieve great things in engineering. As the first lead of Cadence’s Veterans Inclusion Group, you played an integral part in growing our culture and building community at the company since launching the group four years ago. What inspired you to take on the role of Inclusion Group Lead? I was inspired by three things: camaraderie, service, and outreach. I wanted to see if we could achieve a similar sense of community through the Veterans Inclusion Group as we had during our service life. I also wanted to see how we could better serve our Veterans here at Cadence. I wanted to explore any benefits that could be expanded, roles that could be developed by Vets, and, lastly, I wanted to serve a broader community. COVID-19 put a damper on some of the community support, but we are getting back on track with Veteran employment programs and volunteer efforts like Carry the Load and Gold Star Families. Why is it important to have this space dedicated to Veteran employees? There are many reasons! Networking, for one, creates a stronger, more unified Cadence culture. Two, Vets face a variety of issues not generally understood by those who have not served, such as PTSD, where to get help for disabilities, how to get an old medical record, etc. As I mentioned, I’m also passionate about connecting Veterans with employment and job opportunities. It is so nice to work for a company that actively recruits Vets. We have our own “language,” if you will, so it’s nice to have a space to talk in the language that we are familiar with. What have been some of your favorite moments leading this group over the past few years? Are there any “wins” that you would like to recognize? We have a lot of wins. Events held during COVID-19 and getting past COVID-19, donating to worthwhile causes, and hosting guest speakers are all fantastic milestones and accomplishments. That said, the biggest win is the hiring of new Veteran employees. Mark Murphy, Corporate VP of Sales Operations, and I have both welcomed Vets to our team during this time, and it is such a joy to watch what someone can do when given the opportunity to succeed in the right environment. As you are set to transition out of the lead role next year, what do you hope to see the Veterans Inclusion Group accomplish next? My hope is that the Veterans Inclusion Group partners with other companies, expanding our reach externally and exploring new opportunities to engage Veterans outside of Cadence. Johnathan (left) speaks on an inclusion group panel, along with David Sallard (center), lead of Cadence's Black Inclusion Group and Sr. Principal Application Engineer; Christina Jamerson (on screen), lead of Cadence's Abilities Inclusion Group and Demand Generation Director; and Dianne Rambke (right), lead of Cadence's Latinx Inclusion Group and Marketing Communications Director. What are the important ways that people can signal inclusion and respectfully honor Veterans at work? What are the most meaningful or impactful actions employees everywhere can take to support Veteran coworkers? I think there is one answer to both questions. I recommend that people engage with their companies’ employee resource groups (ERGs) and have conversations with them. Opening up the lines of communication will lead to new paths in their journeys. What are you looking forward to in 2025, both personally and professionally? In 2025, professionally, I am looking forward to taking mixed-signal systems and verification to another level by including emulation, automatic model generation, and seeing which boundaries we can push in our SerDes and Chiplets products. Personally, I am looking forward to making my SXS street legal so I can drive places without getting a ticket, seeing my children participate in sports, church, and school, and taking my wife on vacation to Europe or somewhere else we can unplug. Learn more about Cadence’s Inclusion Groups, diverse culture, and commitment to belonging.

I'm trying to simulate a practice code . Verilog verification of my code do not give any error.But when I try to elaborate, this error is being showed:

ncelab: *E,CUVHNF (./FSM_test.v,17|20): Hierarchical name component lookup failed at 'l'

What does this mean? How can I debug this error ? Is there any archive or list of possible error list so that I don't have to ask in forum to understand the errors. 

Hello,

I'm using OrCad 17.2 and in the company I'm wokring at there was a change in the database folder (from driver F to G for example) and it effects the option of synchronise using the Part Manager. and changing manually each part in the Desgin Cahce can be a pain.

Is there any way I can make a TCL script that will run and replace a part cahce with other? Better if I can call from a table to read, and write from other collum.

I would really be happy for an example.

Thanks for the help.

hi,

     I save the waveform file of the oscilloscope as CSV file format.

     Now, I need to use this waveform file as the source of the low-pass filter .

     I searched and read the PSPICE help documents, and did not find any  methods. 

     How to realize it?

     Are there any reference documents or examples?

     Thanks!

Cadence_SPB_17.4-2019 + Matlab R2019a

请参考本文档中的步骤进行操作

1，打开BJT_AMP.opj

2，设置Matlab路径

3，打开BJT_AMP_SLPS.slx

4，打开后，设置PSpiceBlock，出现或CEFSimpleUI.exe停止工作

5，添加模块

6，相同

7，打开pspsim.slx

8，相同

9，打开C： Cadence Cadence_SPB_17.4-2019 tools bin

orCEFSimpleUI.exe和orCEFSimple.exe

10，相同

我想问一下如何解决，非常感谢！

Hello,

I am new in formal verification and I have a concept question about how to verify an I2C Slave block.

I think the response should be valid for any serial interface which needs to receive information for several clocks before making an action.

The the protocol description is the following: 

I have a serial clock (SCL), Serial Data Input (SDI) and Serial Data Output (SDO), all are ports of the I2C Slave block.

The protocol looks like this:

The first byte which is received by the slave consists in 7bits of sensor address and the 8th bit is the command 0/1 Write/Read.

After the first 8 bits, the slave sends an ACK (SDO = 1 for 1 clock) if the sensor address is correct.

Lets consider only this case, where I want to verify that the slave responds with an ACK if the sensor address is correct.

The only solution I found so far was to use the internal buffer from the block which saves the received bits during 8 clocks. The signal is called shift_s.

I also needed to use internal chip state (state_s) and an internal counter (shift_count_s).

Instead of doing an direct check of the SDO(sdo_o) depending on SDI (sdi_d_i), I used the internal shift_s register.

My question is if my approach is the correct one or there is a possibility to write the verification at a blackbox level.

Below you have the 2 properties: first checks connection from SDI to internal buffer, the second checks the connection between internal buffer and output.

property prop_i2c_sdi_store;
  @(posedge sclk_n_i)
  $past(i2c_bl.state_s == `STATE_RECEIVE_I2C_ADDR)
    |-> i2c_bl.shift_s == byte'({ $past(i2c_bl.shift_s), $past(sdi_d_i)});
endproperty
APF_I2C_CHECK_SDI_STORE: assert property(prop_i2c_sdi_store);

property prop_i2c_sensor_addr(sens_addr_sel, sens_addr);
@(posedge sclk_n_i) (i2c_bl.state_s == `STATE_RECEIVE_I2C_ADDR) && (i2c_addr_i == sens_addr_sel) && (i2c_bl.shift_count_s == 7)
  ##1 (i2c_bl.shift_s inside {sens_addr, sens_addr+1}) |-> sdo_o;
endproperty
APF_I2C_CHECK_SENSOR_ADDR0: assert property(prop_i2c_sensor_addr(0, `I2C_SENSOR_ADDRESS_A0));
APF_I2C_CHECK_SENSOR_ADDR1: assert property(prop_i2c_sensor_addr(1, `I2C_SENSOR_ADDRESS_A1));
APF_I2C_CHECK_SENSOR_ADDR2: assert property(prop_i2c_sensor_addr(2, `I2C_SENSOR_ADDRESS_A2));
APF_I2C_CHECK_SENSOR_ADDR3: assert property(prop_i2c_sensor_addr(3, `I2C_SENSOR_ADDRESS_A3));

PS: i2c_addr_i is address selection for the slave (there are 4 configurable sensor addresses, but this is not important for the case).

Thank you!

use the DBO function DboLib_RepalceCache to do the job of "Replace cache" 

in order to easy the job ,  type the code below . the code is a wrapper of the function metioned above

set lStatus [DboState]
set lSession $::DboSession_s_pDboSession
DboSession -this $lSession
set lDesignsIter [$lSession NewDesignsIter $lStatus]
set lDesign [$lDesignsIter NextDesign $lStatus]
set lNullObj NULL

set oldLibName [DboTclHelper_sMakeCString "E:\PROJECT_WORKLIB.OLB"]
set newLibName [DboTclHelper_sMakeCString "E:\MCU_PARTS_LIB.OLB"]

#DboLib_ReplaceCache wrapper
proc ReplaceCacheByName {partName} {
    global oldLibName
    global newLibName
    global lDesign
    set lPartStr [DboTclHelper_sMakeCString $partName]
    #set lNewStr [DboTclHelper_sMakeCString $newName]
    $lDesign ReplaceCache $lPartStr $oldLibName $lPartStr $newLibName 0 1
}

then use the tcl command like below to do the real job :

ReplaceCacheByName "CL10B104KB8NNNC_C12"

This is the 17th installment of The Rationalist, my column for the Times of India.

One of my favourite English words comes from chess. If it is your turn to move, but any move you make makes your position worse, you are in ‘Zugzwang’. Narendra Modi was in zugzwang after the Pulwama attacks a few days ago—as any Indian prime minister in his place would have been.

An Indian PM, after an attack for which Pakistan is held responsible, has only unsavoury choices in front of him. He is pulled in two opposite directions. One, strategy dictates that he must not escalate. Two, politics dictates that he must.

Let’s unpack that. First, consider the strategic imperatives. Ever since both India and Pakistan became nuclear powers, a conventional war has become next to impossible because of the threat of a nuclear war. If India escalates beyond a point, Pakistan might bring their nuclear weapons into play. Even a limited nuclear war could cause millions of casualties and devastate our economy. Thus, no matter what the provocation, India needs to calibrate its response so that the Pakistan doesn’t take it all the way.

It’s impossible to predict what actions Pakistan might view as sufficient provocation, so India has tended to play it safe. Don’t capture territory, don’t attack military assets, don’t kill civilians. In other words, surgical strikes on alleged terrorist camps is the most we can do.

Given that Pakistan knows that it is irrational for India to react, and our leaders tend to be rational, they can ‘bleed us with a thousand cuts’, as their doctrine states, with impunity. Both in 2001, when our parliament was attacked and the BJP’s Atal Bihari Vajpayee was PM, and in 2008, when Mumbai was attacked and the Congress’s Manmohan Singh was PM, our leaders considered all the options on the table—but were forced to do nothing.

But is doing nothing an option in an election year?

Leave strategy aside and turn to politics. India has been attacked. Forty soldiers have been killed, and the nation is traumatised and baying for blood. It is now politically impossible to not retaliate—especially for a PM who has criticized his predecessor for being weak, and portrayed himself as a 56-inch-chested man of action.

I have no doubt that Modi is a rational man, and knows the possible consequences of escalation. But he also knows the possible consequences of not escalating—he could dilute his brand and lose the elections. Thus, he is forced to act. And after he acts, his Pakistan counterpart will face the same domestic pressure to retaliate, and will have to attack back. And so on till my home in Versova is swallowed up by a nuclear crater, right?

Well, not exactly. There is a way to resolve this paradox. India and Pakistan can both escalate, not via military actions, but via optics.

Modi and Imran Khan, who you’d expect to feel like the loneliest men on earth right now, can find sweet company in each other. Their incentives are aligned. Neither man wants this to turn into a full-fledged war. Both men want to appear macho in front of their domestic constituencies. Both men are masters at building narratives, and have a pliant media that will help them.

Thus, India can carry out a surgical strike and claim it destroyed a camp, killed terrorists, and forced Pakistan to return a braveheart prisoner of war. Pakistan can say India merely destroyed two trees plus a rock, and claim the high moral ground by returning the prisoner after giving him good masala tea. A benign military equilibrium is maintained, and both men come out looking like strong leaders: a win-win game for the PMs that avoids a lose-lose game for their nations. They can give themselves a high-five in private when they meet next, and Imran can whisper to Modi, “You’re a good spinner, bro.”

There is one problem here, though: what if the optics don’t work?

If Modi feels that his public is too sceptical and he needs to do more, he might feel forced to resort to actual military escalation. The fog of politics might obscure the possible consequences. If the resultant Indian military action causes serious damage, Pakistan will have to respond in kind. In the chain of events that then begins, with body bags piling up, neither man may be able to back down. They could end up as prisoners of circumstance—and so could we.

***

Also check out:

Why Modi Must Learn to Play the Game of Chicken With Pakistan—Amit Varma
The Two Pakistans—Episode 79 of The Seen and the Unseen
India in the Nuclear Age—Episode 80 of The Seen and the Unseen

The India Uncut Blog © 2010 Amit Varma. All rights reserved.
Follow me on Twitter.

This is the 18th installment of The Rationalist, my column for the Times of India.

The man who gave us our national anthem, Rabindranath Tagore, once wrote that nationalism was “a great menace.” He went on to say, “It is the particular thing which for years has been at the bottom of India’s troubles.”

Not just India’s, but the world’s: In his book The Open Society and its Enemies, published in 1945 as Adolf Hitler was defeated, Karl Popper ripped into nationalism, with all its “appeals to our tribal instincts, to passion and to prejudice, and to our nostalgic desire to be relieved from the strain of individual responsibility which it attempts to replace by a collective or group responsibility.”

Nationalism is resurgent today, stomping across the globe hand-in-hand with populism. In India, too, it is tearing us apart. But must nationalism always be a bad thing? A provocative new book by the Israeli thinker Yael Tamir argues otherwise.

In her book Why Nationalism, Tamir makes the following arguments. One, nation-states are here to stay. Two, the state needs the nation to be viable. Three, people need nationalism for the sense of community and belonging it gives them. Four, therefore, we need to build a better nationalism, which brings people together instead of driving them apart.

The first point needs no elaboration. We are a globalised world, but we are also trapped by geography and circumstance. “Only 3.3 percent of the world’s population,” Tamir points out, “lives outside their country of birth.” Nutopia, the borderless state dreamed up by John Lennon and Yoko Ono, is not happening anytime soon.

If the only thing that citizens of a state have in common is geographical circumstance, it is not enough. If the state is a necessary construct, a nation is its necessary justification. “Political institutions crave to form long-term political bonding,” writes Tamir, “and for that matter they must create a community that is neither momentary nor meaningless.” Nationalism, she says, “endows the state with intimate feelings linking the past, the present, and the future.”

More pertinently, Tamir argues, people need nationalism. I am a humanist with a belief in individual rights, but Tamir says that this is not enough. “The term ‘human’ is a far too thin mode of delineation,” she writes. “Individuals need to rely on ‘thick identities’ to make their lives meaningful.” This involves a shared past, a common culture and distinctive values.

Tamir also points out that there is a “strong correlation between social class and political preferences.” The privileged elites can afford to be globalists, but those less well off are inevitably drawn to other narratives that enrich their lives. “Rather than seeing nationalism as the last refuge of the scoundrel,” writes Tamir, “we should start thinking of nationalism as the last hope of the needy.”

Tamir’s book bases its arguments on the West, but the argument holds in India as well. In a country with so much poverty, is it any wonder that nationalism is on the rise? The cosmopolitan, globe-trotting elites don’t have daily realities to escape, but how are those less fortunate to find meaning in their lives?

I have one question, though. Why is our nationalism so exclusionary when our nation is so inclusive?

In the nationalism that our ruling party promotes, there are some communities who belong here, and others who don’t. (And even among those who ‘belong’, they exploit divisions.) In their us-vs-them vision of the world, some religions are foreign, some values are foreign, even some culinary traditions are foreign – and therefore frowned upon. But the India I know and love is just the opposite of that.

We embrace influences from all over. Our language, our food, our clothes, our music, our cinema have absorbed so many diverse influences that to pretend they come from a single legit source is absurd. (Even the elegant churidar-kurtas our prime minister wears have an Islamic origin.) As an example, take the recent film Gully Boy: its style of music, the clothes its protagonists wear, even the attitudes in the film would have seemed alien to us a few decades ago. And yet, could there be a truer portrait of young India?

This inclusiveness, this joyous khichdi that we are, is what makes our nation a model for the rest of the world. No nation embraces all other nations as ours does. My India celebrates differences, and I do as well. I wear my kurta with jeans, I listen to ghazals, I eat dhansak and kababs, and I dream in the Indian language called English. This is my nationalism.

Those who try to divide us, therefore, are the true anti-nationals. We must reclaim nationalism from them.

The India Uncut Blog © 2010 Amit Varma. All rights reserved.
Follow me on Twitter.

This is the 21st installment of The Rationalist, my column for the Times of India.

When all political parties agree on something, you know you might have a problem. Giriraj Singh, a minister in Narendra Modi’s new cabinet, tweeted this week that our population control law should become a “movement.” This is something that would find bipartisan support – we are taught from school onwards that India’s population is a big problem, and we need to control it.

This is wrong. Contrary to popular belief, our population is not a problem. It is our greatest strength.

The notion that we should worry about a growing population is an intuitive one. The world has limited resources. People keep increasing. Something’s gotta give.

Robert Malthus made just this point in his 1798 book, An Essay on the Principle of Population. He was worried that our population would grow exponentially while resources would grow arithmetically. As more people entered the workforce, wages would fall and goods would become scarce. Calamity was inevitable.

Malthus’s rationale was so influential that this mode of thinking was soon called ‘Malthusian.’ (It is a pejorative today.) A 20th-century follower of his, Harrison Brown, came up with one of my favourite images on this subject, arguing that a growing population would lead to the earth being “covered completely and to a considerable depth with a writhing mass of human beings, much as a dead cow is covered with a pulsating mass of maggots.”

Another Malthusian, Paul Ehrlich, published a book called The Population Bomb in 1968, which began with the stirring lines, “The battle to feed all of humanity is over. In the 1970s hundreds of millions of people will starve to death in spite of any crash programs embarked upon now.” Ehrlich was, as you’d guess, a big supporter of India’s coercive family planning programs. ““I don’t see,” he wrote, “how India could possibly feed two hundred million more people by 1980.”

None of these fears have come true. A 2007 study by Nicholas Eberstadt called ‘Too Many People?’ found no correlation between population density and poverty. The greater the density of people, the more you’d expect them to fight for resources – and yet, Monaco, which has 40 times the population density of Bangladesh, is doing well for itself. So is Bahrain, which has three times the population density of India.

Not only does population not cause poverty, it makes us more prosperous. The economist Julian Simon pointed out in a 1981 book that through history, whenever there has been a spurt in population, it has coincided with a spurt in productivity. Such as, for example, between Malthus’s time and now. There were around a billion people on earth in 1798, and there are around 7.7 billion today. As you read these words, consider that you are better off than the richest person on the planet then.

Why is this? The answer lies in the title of Simon’s book: The Ultimate Resource. When we speak of resources, we forget that human beings are the finest resource of all. There is no limit to our ingenuity. And we interact with each other in positive-sum ways – every voluntary interactions leaves both people better off, and the amount of value in the world goes up. This is why we want to be part of economic networks that are as large, and as dense, as possible. This is why most people migrate to cities rather than away from them – and why cities are so much richer than towns or villages.

If Malthusians were right, essential commodities like wheat, maize and rice would become relatively scarcer over time, and thus more expensive – but they have actually become much cheaper in real terms. This is thanks to the productivity and creativity of humans, who, in Eberstadt’s words, are “in practice always renewable and in theory entirely inexhaustible.”

The error made by Malthus, Brown and Ehrlich is the same error that our politicians make today, and not just in the context of population: zero-sum thinking. If our population grows and resources stays the same, of course there will be scarcity. But this is never the case. All we need to do to learn this lesson is look at our cities!

This mistaken thinking has had savage humanitarian consequences in India. Think of the unborn millions over the decades because of our brutal family planning policies. How many Tendulkars, Rahmans and Satyajit Rays have we lost? Think of the immoral coercion still carried out on poor people across the country. And finally, think of the condescension of our politicians, asserting that people are India’s problem – but always other people, never themselves.

This arrogance is India’s greatest problem, not our people.

The India Uncut Blog © 2010 Amit Varma. All rights reserved.
Follow me on Twitter.

This is the 22nd installment of The Rationalist, my column for the Times of India.

Trade wars are on the rise, and it’s enough to get any nationalist all het up and excited. Earlier this week, Narendra Modi’s government announced that it would start imposing tariffs on 28 US products starting today. This is a response to similar treatment towards us from the US.

There is one thing I would invite you to consider: Trump and Modi are not engaged in a war with each other. Instead, they are waging war on their own people.

Let’s unpack that a bit. Part of the reason Trump came to power is that he provided simple and wrong answers for people’s problems. He responded to the growing jobs crisis in middle America with two explanations: one, foreigners are coming and taking your jobs; two, your jobs are being shipped overseas.

Both explanations are wrong but intuitive, and they worked for Trump. (He is stupid enough that he probably did not create these narratives for votes but actually believes them.) The first of those leads to the demonising of immigrants. The second leads to a demonising of trade. Trump has acted on his rhetoric after becoming president, and a modern US version of our old ‘Indira is India’ slogan might well be, “Trump is Tariff. Tariff is Trump.”

Contrary to the fulminations of the economically illiterate, all tariffs are bad, without exception. Let me illustrate this with an example. Say there is a fictional product called Brump. A local Brump costs Rs 100. Foreign manufacturers appear and offer better Brumps at a cheaper price, say Rs 90. Consumers shift to foreign Brumps.

Manufacturers of local Brumps get angry, and form an interest group. They lobby the government – or bribe it with campaign contributions – to impose a tariff on import of Brumps. The government puts a 20-rupee tariff. The foreign Brumps now cost Rs 110, and people start buying local Brumps again. This is a good thing, right? Local businesses have been helped, and local jobs have been saved.

But this is only the seen effect. The unseen effect of this tariff is that millions of Brump buyers would have saved Rs 10-per-Brump if there were no tariffs. This money would have gone out into the economy, been part of new demand, generated more jobs. Everyone would have been better off, and the overall standard of living would have been higher.

That brings to me to an essential truth about tariffs. Every tariff is a tax on your own people. And every intervention in markets amounts to a distribution of wealth from the people at large to specific interest groups. (In other words, from the poor to the rich.) The costs of this are dispersed and invisible – what is Rs 10 to any of us? – and the benefits are large and worth fighting for: Local manufacturers of Brumps can make crores extra. Much modern politics amounts to manufacturers of Brumps buying politicians to redistribute money from us to them.

There are second-order effects of protectionism as well. When the US imposes tariffs on other countries, those countries may respond by imposing tariffs back. Raw materials for many goods made locally are imported, and as these become expensive, so do those goods. That quintessential American product, the iPhone, uses parts from 43 countries. As local products rise in price because of expensive foreign parts, prices rise, demand goes down, jobs are lost, and everyone is worse off.

Trump keeps talking about how he wants to ‘win’ at trade, but trade is not a zero-sum game. The most misunderstood term in our times is probably ‘trade-deficit’. A country has a trade deficit when it imports more than what it exports, and Trump thinks of that as a bad thing. It is not. I run a trade deficit with my domestic help and my local grocery store. I buy more from them than they do from me. That is fine, because we all benefit. It is a win-win game.

Similarly, trade between countries is really trade between the people of both countries – and people trade with each other because they are both better off. To interfere in that process is to reduce the value created in their lives. It is immoral. To modify a slogan often identified with libertarians like me, ‘Tariffs are Theft.’

These trade wars, thus, carry a touch of the absurd. Any leader who imposes tariffs is imposing a tax on his own people. Just see the chain of events: Trump taxes the American people. In retaliation, Modi taxes the Indian people. Trump raises taxes. Modi raises taxes. Nationalists in both countries cheer. Interests groups in both countries laugh their way to the bank.

What kind of idiocy is this? How long will this lose-lose game continue?

The India Uncut Blog © 2010 Amit Varma. All rights reserved.
Follow me on Twitter.

This is the 24th installment of The Rationalist, my column for the Times of India.

Back in the last decade, I was a cricket journalist for a few years. Then, around 12 years ago, I quit. I was jaded as hell. Every game seemed like déjà vu, nothing new, just another round on the treadmill. Although I would remember her fondly, I thought me and cricket were done.

And then I fell in love again. Cricket has changed in the last few years in glorious ways. There have been new ways of thinking about the game. There have been new ways of playing the game. Every season, new kinds of drama form, new nuances spring up into sight. This is true even of what had once seemed the dullest form of the game, one-day cricket. We are entering into a brave new world, and the team leading us there is England. No matter what happens in the World Cup final today – a single game involves a huge amount of luck – this England side are extraordinary. They are the bridge between eras, leading us into a Golden Age of Cricket.

I know that sounds hyperbolic, so let me stun you further by saying that I give the IPL credit for this. And now, having woken up you up with such a jolt on this lovely Sunday morning, let me explain.

Twenty20 cricket changed the game in two fundamental ways. Both ended up changing one-day cricket. The first was strategy.

When the first T20 games took place, teams applied an ODI template to innings-building: pinch-hit, build, slog. But this was not an optimal approach. In ODIs, teams have 11 players over 50 overs. In T20s, they have 11 players over 20 overs. The equation between resources and constraints is different. This means that the cost of a wicket goes down, and the cost of a dot ball goes up. Critically, it means that the value of aggression rises. A team need not follow the ODI template. In some instances, attacking for all 20 overs – or as I call it, ‘frontloading’ – may be optimal.

West Indies won the T20 World Cup in 2016 by doing just this, and England played similarly. And some sides began to realise was that they had been underestimating the value of aggression in one-day cricket as well.

The second fundamental way in which T20 cricket changed cricket was in terms of skills. The IPL and other leagues brought big money into the game. This changed incentives for budding cricketers. Relatively few people break into Test or ODI cricket, and play for their countries. A much wider pool can aspire to play T20 cricket – which also provides much more money. So it makes sense to spend the hundreds of hours you are in the nets honing T20 skills rather than Test match skills. Go to any nets practice, and you will find many more kids practising innovative aggressive strokes than playing the forward defensive.

As a result, batsmen today have a wider array of attacking strokes than earlier generations. Because every run counts more in T20 cricket, the standard of fielding has also shot up. And bowlers have also reacted to this by expanding their arsenal of tricks. Everyone has had to lift their game.

In one-day cricket, thus, two things have happened. One, there is better strategic understanding about the value of aggression. Two, batsmen are better equipped to act on the aggressive imperative. The game has continued to evolve.

Bowlers have reacted to this with greater aggression on their part, and this ongoing dialogue has been fascinating. The cricket writer Gideon Haigh once told me on my podcast that the 2015 World Cup featured a battle between T20 batting and Test match bowling.

This England team is the high watermark so far. Their aggression does not come from slogging. They bat with a combination of intent and skills that allows them to coast at 6-an-over, without needing to take too many risks. In normal conditions, thus, they can coast to 300 – any hitting they do beyond that is the bonus that takes them to 350 or 400. It’s a whole new level, illustrated by the fact that at one point a few days ago, they had seven consecutive scores of 300 to their name. Look at their scores over the last few years, in fact, and it is clear that this is the greatest batting side in the history of one-day cricket – by a margin.

There have been stumbles in this World Cup, but in the bigger picture, those are outliers. If England have a bad day in the final and New Zealand play their A-game, England might even lose today. But if Captain Morgan’s men play their A-game, they will coast to victory. New Zealand does not have those gears. No other team in the world does – for now.

But one day, they will all have to learn to play like this.

The India Uncut Blog © 2010 Amit Varma. All rights reserved.
Follow me on Twitter.

Virtuoso Studio IC23.1 ISR7 production release is now available for download.(read more)

During a mixed-signal simulation, the analog engine usually dominates the simulation time and resources. If you need to run only the analog engine in several windows, or if you would like to to run multiple tests of the same circuit with different stimuli or test pattern, then you need to run the simulation multiple times. View this blog to know more about the the two advanced technologies that Spectre AMS Designer provides to help you improve the efficiency of your mixed-signal designs and to increase the simulation speed.(read more)

This blog describes an efficient way to name the histories saved by the simulation runs in Virtuoso ADE Assembler.(read more)

Have you ever wanted to write a DRC rule deck to check for space or width constraints on polygons? Or have you wondered how the multiple lines of an LVS rule deck extract and conduct a comparison between the schematic and layout? Maybe you've been curious about the role of rule deck writers in creating high-quality designs ready for tape-out.

If any of these questions interest you, there is good news: the latest version (v23.1) of the Physical Verification Rules Writer (PVLRW) course is designed to teach you rule deck writing. This free 16-hour online course includes audio and labs designed to make your learning experience comfortable and flexible. Whether you are new to the concept or an experienced CAD/PDK engineer, the course is structured to enhance your rule deck writing skills.

The PVLRW course covers six core modules: Layer Processing, DRC Rules, Layout Extraction, ERC and LVS Rules, Schematic Netlisting, and Coloring Rules. There are also three optional appendix sections. Each module explains relevant rules with syntax, concepts, graphics, examples, and case studies.

This course is based on tool versions PEGASUS231 and Virtuoso Studio IC231.

Pegasus Input and Output

Pegasus is a cloud-ready physical verification signoff solution that enables engineers to support faster delivery of advanced-node integrated circuits (ICs) to market.

Pegasus requires input data in the form of layout geometry, schematic netlists, and rules that direct the tool operation. The rules fall into two categories: those that describe the fabrication process and those that control the job-specific operation.

Pegasus provides log and report files, netlists, databases, and error databases as output.

Overview of Pegasus Rule File

The rule decks written in Physical Verification Language (PVL) work for the Cadence PV signoff tools Pegasus and PVS (Physical Verification System).   

The PVL rules are placed in a file that gets selected in a run from the GUI or the command line, as the user directs. PVL rules may be on separate lines within the file and can also be contained in named rule blocks.

Each line of code starts with a PVL rule that uses prefix type notation. It consists of a keyword followed by options, input layer or variable names, and output layer or variable names.

A rule block has the format of the keyword rule, followed by a rule name you wish to give it, followed by an opening curly brace. You enter the rules you wish to perform, followed by a closing curly brace on the last separate line.

  Sample Rule deck with individual lines of code and rule blocks.

DRC Rules

The first step in a typical Pegasus flow is a Design Rule Check (DRC), which verifies that layout geometries conform to the minimum width, spacing, and other fabrication process rules required by an IC foundry. Each foundry specifies its own process-dependent rules that must be met by the layout design.

There are three types of DRC rules: layer definition rules, layer derivation rules, and DRC design check rules. Layer definition rules identify the layers contained in the input layout database, and layer derivation rules derive additional layers from the original input layers, allowing the tool to test the design against specific foundry requirements using the design check rules.

A sample DRC Rule deck

A layout view displaying the DRC violations

LVS Rules

The Pegasus Layout Versus Schematic (LVS) tool compares the layout netlist with the schematic netlist to check for discrepancies.

There are two essential LVS rule sets: LVS extraction rules and comparison rules. LVS extraction rules help extract drawn devices and connectivity information from the input layout geometry data and outputs into a layout netlist. The LVS extraction rule set also includes the layer definition, derivation, extraction, connectivity, and net listing rules.

LVS comparison rules are associated with comparing the extracted layout netlist to a schematic netlist.

A sample LVS Rule deck. 

TCL, Macros, and Conditional commands

Tcl is supported and used in various Pegasus functionalities, such as Pegasus rule files and Pegasus configurator. Macros are functional templates that are defined once and can be used multiple times in a rule file. Conditional Commands are used to process or skip specific commands in the rule file.

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• On the Cadence Support portal, select Register Now and provide the requested information on the Registration page.
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• If you need help with registration, contact support@cadence.com.

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About Knowledge Booster Training Bytes

Knowledge Booster Training Bytes is an online journal that relays information about Cadence Training videos, online courses, and upcoming webinars in the Learning section of the Cadence Learning and Support portal. This blog category brings you direct links to these videos, courses, and other related material on a regular basis. Subscribe to receive email notifications about our latest Custom IC Design blog posts.

Virtuoso Studio IC23.1 ISR8 production release is now available for download.(read more)

Virtuoso Studio IC23.1 ISR9 production release is now available for download.(read more)

The SPECTRE 24.1 release is now available for download at Cadence Downloads. For information on supported platforms and other release compatibility information, see the README.txt file in the installation hierarchy.(read more)

Virtuoso Studio IC23.1 ISR10 production release is now available for download.(read more)