1 Brunei Dollar = 0.9996 Singapore Dollar

1 Brunei Dollar = 2.4273 Papua New Guinean Kina

1 Brunei Dollar = 75.4822 Japanese Yen

Modern systems-on-a-chip (SoCs) continue to increase in complexity, adding more components and calculation power to accommodate new performance-hungry applications such as machine learning and autonomous driving.  With increased number of SoC components, such as CPUs, GPUs, accelerators and I/O devices, comes increased demand to correctly model interoperability of various components. Traditional simulation of complex systems requires accurate models of all components comprising the system and normally results in very long simulation times. A better way is to create a set of typical traffic profiles which describe behavior of system’s masters and slaves. Such profiles should be abstract to be applied to various protocols and interfaces and be portable to be applied throughout different SoC design and verification cycles.

To address the challenges outlined above, Arm has recently announced availability of the AMBA® Adaptive Traffic Profiles (AMBA ATP) specification which lays foundation of a new synthetic traffic framework. The AMBA ATP specification includes detailed information of various transaction types and timing characteristics of those transactions. The traffic profiles defined in the specification are abstract in nature and thus could be used to generate stimuli for various standard AMBA protocols and in various environments such as RTL-based simulation, FPGA prototyping and final SoC verification. The traffic profiles outlined in the specification include a set of parameters to define timing relationships between transactions as well as timing relationships within individual transactions. Even though the traffic profile represents the behavior of a single agent it could be applied either in a concurrent manner (e.g. write and read traffic profiles running in parallel) or in a sequential manner (e.g. when one traffic completes before the next one start). Moreover, when simulating a reasonably complex system, it is possible to coordinate traffic profiles generated by multiple components. While providing abstract definition of traffic profiles, the AMBA ATP specification focuses on the use of traffic profiles with an AMBA AXI interface, outlining signaling, timing relationships between different transaction phases and between different transactions. The same application principles could be used to map the abstract traffic profiles to other AMBA protocols such as AMBA5 CHI protocol.  

To facilitate adoption of the AMBA Adaptive Traffic Profiles, Cadence has recently announced availability of SystemVerilog UVM ATP Sequence Layer which automatically implements mapping of an abstract ATP traffic to AMBA protocol specific traffic, generated by Cadence AMBA Verification IP. The ATP layer is implemented as a SystemVerilog UVM virtual sequence with the sequence item including all ATP transaction parameters as defined in the specification.

Using the provided sequence infrastructure, users can write tests to define and coordinate traffic profiles for various components in the system. The ATP Layer automatically converts the abstract traffic profile into AMBA protocol-specific traffic, e.g., AMBA5 CHI protocol traffic.

 A sample code below, shows an example of a read profile translated by Cadence ACE Verification IP in ACE protocol traffic.

   `uvm_do_with(ace_atp_vseq,                                            

                       {ace_atp_vseq.agentId == agent_id;                                // ATP agent id

                        ace_atp_vseq.atpDirection == ATP_READ;                    // direction of bursts issued by virtual sequence

                        ace_atp_vseq.startAddress == start_address;                // start of address range being accessed

                        ace_atp_vseq.endAddress == end_address;                  // end of address range being accessed

                        ace_atp_vseq.atpDomain == atp_domain;                      // domain to use for transactions

                        ace_atp_vseq.addressPattern == ATP_SEQUENTIAL;  // address pattern

                        ace_atp_vseq.transactionSize == 64;                             // number of bytes in each burst

                        ace_atp_vseq.dataSize == 4;                                          // number of bytes in each transfer

                        ace_atp_vseq.rate == 150.0/(50.0);                                // requestedBandwidth / clkFrequency

                        ace_atp_vseq.start == ATP_EMPTY;                              // start condition of the ATP FIFO

                        ace_atp_vseq.full == 128;                                               // full level of the ATP FIFO

                        ace_atp_vseq.numOfTransactions == 500;                    // number of bursts issued by this sequence

                        ace_atp_vseq.ARTV == 2;                                              // sub-transaction delay

                        ace_atp_vseq.RBR == 3;                                                // sub-transaction delay

                       });

In addition to the ATP Layer for Cadence Simulation-Based AMBA Verification IP, Cadence supports the ATP functionality in Acceleration-Based AMBA Verification IP. For detailed information about ATP support in Cadence Simulation-Based and Acceleration-Based Verification IP, visit ip.cadence.com.

PCI-SIG DevCon 2019 APAC tour has come to Tokyo and Taipei this year. The focus is predominantly around the latest updates for PCIe Gen 5 which its version 1.0 specification was just released this year in May.  A series of presentations provided by PCI-SIG on the day 1 with comprehensive information covering all aspects of Gen 5 specification, including protocol, logical, electrical, compliance updates. On the day 2 (only in Taipei), several member companies shared their view on Testing, PCB analysis and Signal integrity. The exhibit is also another spotlight of this event where the member companies showcased their latest PCIe solutions.

Presentation Track (Taipei), Exhibit (Tokyo), Exhibit (Taipei) 

Cadence, as the market leading PCIe IP vendor, participated APAC tour this year with bringing in its latest PCIe IP solution offering (Gen 5/4) to the region as well as showcasing two live demo setups in the exhibit floor. One setup is the PCIe software development kit (SDK) while the other is the Interop/compliance/debug platform. Both come with the Cadence PCIe Gen 4 hardware setup and its corresponding software kit.

The SDK can be used for Device Driver Development, Firmware Development, and for pre-silicon emulation as well. It supports Xtensa and ARM processor with Linux OS and it also equip with Ethernet interface which can be used for remote debugging. It also supports PCIe stress tests for Speed change, link enable/disable, entry/exist for lower power states, …etc. 

Cadence PCIe 4.0 Software Development Kit

The “System Interop/Compliance/Debug platform” was set up to test with multiple endpoint and System platforms. This system come with integrated Cadence software for basic system debug without the need for analyzer to perform the analysis, such as LTSSM History, TS1/TS2 transmitted/received with time stamp, Link training phases, Capturing Packet errors details, Capturing PHY TX/RX internal state machine details, ...etc.

Cadence PCIe System Interop/Compliance/Debug Platform

The year 2019 is certainly a "fruitful year" for the PCIe as more Gen 4 products are now available in the market, Gen 5 v1.0 specification got officially ratified, and PCI-SIG's revealing of Gen 6 specification development. We were glad to be part of this APAC tour with the chance to further introduce Cadence’s complete and comprehensive PCIe IP solution.

See you all next year in APAC again!

More Information

For more information on Cadence's PCIe IP offerings, see our PCI Express page.

For more information on PCIe in general, and on the various PCI standards, see the PCI-SIG website.

Related Posts

• Blog: Did You “Stress Test” Yet? Essential Step to Ensure a Quality PCIe 4.0 Product
• Blog: PCIe Gen4: It’s Official, We’re Compliant
• Blog: PCIe 3.0 Still Shines While PCIe Keeps Evolving
• Blog: The PCIe 4.0 Era Continues at PCI-SIG Developers Conference 2016

Verifying lane adapter state machine in a router design is quite an involved task and needs verification from several aspects including that for its link training functionality.

The diagram below shows two lane adapters connected to each other and each going through the link training process. Each training sub-state transition is contingent on conditions for both transmission and reception of relevant ordered sets needed for a transition. Until conditions for both are satisfied an adapter cannot transition to the next training sub-state.

As deduced from the lane adapter state machine section of USB4 specification, the reception condition for the next training sub-state transition is less strict than that of the transmission condition. For ex., for LOCK1 to LOCK2 transition, the reception condition requires only two SLOS symbols in a row being detected, while the transmission condition requires at least four complete SLOS1 ordered sets to be sent.

From the above conditions in the specification, it is a possibility that a lane adapter A may detect the two SLOS or TS ordered sets, being sent by the lane adapter B on the other end, in the very beginning as soon as it starts transmitting its own SLOS or TS ordered sets. On the other hand, it is also a possibility that these SLOS or TS ordered sets are not yet detected by lane adapter A even when it has met the condition of sending minimum number of SLOS or TS ordered sets.

In such a case, lane adapter A, even though it has satisfied the transmission condition cannot transition to the next sub-state because the reception condition is not yet met. Hence lane adapter A must first wait for the required number of ordered sets to be detected by it before it can go to the next sub-state. But this wait cannot be endless as there are timeouts defined in the specification, after which the training process may be re-attempted.

This interlocked way of operation also ensures that state machine of a lane adapter does not go out of sync with that of the other lane adapter. Such type of scenarios can occur whenever lane adapter state machine transitions to the training state from other states.

Cadence has a mature Verification IP solution for the verification of various aspects of the logical layer of a USB4 router design, with verification capabilities provided to do a comprehensive verification of it.

HI!

I want to use map_to_mux pragma for a particular logic in my code, which is in generate block. 

module xyz

parameter P_IN_WIDTH= 100

parameter P_OUT_WIDTH =100

parameter P_XXX = 1

parameter P_ZZZ=1

parameter P_IN_OFFSET_WD = 10

input [P_IN_WD-1:0]  in_data;

input [P_IN_OFFSET_WD-1:0] in_offset;

output [P_IN_WD-1:0]  out_data;

generate
if (P_XXX == 1)

// cadence infer_mux "MUX"
// cadence map_to_mux "MUX"

begin : XXX

assign c_out = (in_data >> in_offset*P_ZZZ);
end
else

// cadence infer_mux "MUX"
// cadence map_to_mux "MUX"
begin : YYY
assign c_out = (in_data << in_offset*P_ZZZ);
end
endgenerate

endmodule

It's been a while since you've heard from me...it has been a busy year for sure. One of the reasons I've been so quiet is that I was part of a team working diligently on our latest best kept secret: The MMSIM 12.1.1/MMSIM 13.1 Documentation has...(read more)

Hello Spectre RF Users, Next week is my all time favorite technical conference - the International Microwave Symposium IMS2016 , May 22-27 in San Francisco, CA at the Moscone Center. If you're at the conference, please stop by the Cadence booth and...(read more)

In the world of analog design, IP3—the third order intercept point, is a known parameter that is used to measure the linearity in the radio frequency (RF) components. The extracted IP3 values are very essential to determine the operating power ...(read more)

Hello,

I have created an appForm with  the following attachmentList and size:

?attachmentList list(hicLeftPositionSet | hicRightPositionSet ; field 1
                     hicLeftPositionSet | hicRightPositionSet ; field 2
etc.

?initialSize    800:800
?minSize        800:800
?maxSize       1600:800

If I reduce the minimum y-size (?minSize        800:200), scrollbars are not inserted, unless I remove the attachmentList constraints.

Is it possible to have both scrollbars and "hicLeftPositionSet | hicRightPositionSet"? 

Thank you,

Best regards,

Aldo

Hi,

I am running simulation in ADEXL and need a custom function for VIVA to apply same procedure to all signals saved in output. For instance, I have clock nets and I want to get all of them and look at the duty-cycle, edge rate etc.

It is a little more involved than about part since I have some regex and setof to filter before processing but if I can get all signals for current history, I can postprocess them later.

In ocean, I am just doing outputs() and getting all saved signals but I was able to do this in VIVA calculator due to the difficulties in getting current history, test name and opening result directory

thanks

yayla

Version Info:

ICADV12.3 64b 500.21

spectre -W =>

Tool 'cadenceMMSIM' Current project version '16.10.479'
sub-version  16.1.0.479.isr9

I could not find info about the highlight shapes/layers in the cadence doc directory, forum, support library.

I have a script that creates highlight shapes on the y* drawing layer.

My understand is the highlight is a virtual shape. The shapes go away when the cadence session is closed or when you close data of that cellview if it is not global.

If they are vitual shapes it would be okay to use valid or process layers when I create the highlight set with geCreateHilightSet.

Ex: ( The command I use to create the hiighlight set       geCreateHilightSet(cv list(lay purp) nil) )

Current y0-9 drawing 

To N-P_implant drawing

Paul

Learn about the challenges and solutions for integrating and verification PCIe(r) Gen4 into an Arm-Based Server SoC. Listen to this relatively short webinar by Arm and Cadence, as they describe the collaboration and results, including methodology and...(read more)

Is there any way I can find duplicated shapes?

I would like to find two or more shapes are identical and they are placed in the same location.

Hi all,

I have a question regarding the manufacture : how to check a cluster of same net vias spacing, with have no shape or cline covered

Those who work in the IC Packaging design space have some unique challenges. We bridge between the IC design world (90/45-degree traces with rectangular and octagonal pins) and the PCB domain...

[[ Click on the title to access the full blog on the Cadence Community site. ]]

Today, we are living in the era where whatever we think of as an idea is not far from being implemented…thanks to machine learning (ML) and artificial intelligence (AI) entering into the...

[[ Click on the title to access the full blog on the Cadence Community site. ]]

You can't read anything about technology these days without reading about 5G. But before there was 5G, there was 4G. And before that 3G, 2G, and 1G. A 0G even. For the next few Thursdays,...

[[ Click on the title to access the full blog on the Cadence Community site. ]]

Our customers’ tests have become more complex, longer, and consume more resources than before. This increases the need to optimize the regression while not compromising on coverage. Some advanced...

[[ Click on the title to access the full blog on the Cadence Community site. ]]

Looking to learn? There's a bunch of new RAKs (Rapid Adoption Kits) available online now!

1) Indago 19.09 Better Driver Tracing and More

Are you new to Indago and not sure where to start? Luckily, there’s a new Rapid Adoption Kit for you: the Indago 19.09 Overview RAK! This neat package contains everything you need to get your debugging started through Indago. In four short labs, plus a brief introductory lab, you’ll have all the basics of Indago 19.09 down—the Indago working environment, the SmartLog, how Indago interacts with the rest of the Cadence Verification Suite, and how Indago uses HDL driver tracing.

Lab 1 discusses the various debugging tools included in Indago and teaches you how to customize your Indago windows and environment settings. Lab 2 covers the SmartLog feature and talks about analyzing and filtering its messages to suit your needs, as well as how to interact with the waveform marker. Lab 3 is an interactive Indago debugging experience—it’ll walk you through how to use Indago and its features in an actual working environment: setting breakpoints, using simulator commands in the Indago console, toolbars, switches, and more. Lab 4 is all things HDL tracing—recording debug data, an introduction to debug assertions, waveform visualizations, driving expression analysis, and single-step driver tracing, among other things.

Interested? Check out the RAK here.

2) IXCOM MSIE: Faster Palladium Build Time

Got several testbenches you want to compile with the same DUT and tests and you want to do it fast? With IXCOM, all you have to do to compile those different testbenches is use the xrun command for each after compiling your DUT. But what exactly is IXCOM, and how does one start using it? This quick RAK can help—here, you’ll learn the basics of using MSIE features with IXCOM, complete with an example to get you started. Using MSIE can vastly improve your build times with Palladium and using IXCOM is the best way to shrink that tedious rebuild time as small as it can get. Check out this RAK here.

3)  JasperGold Control and Status Register Verification App Automates UVM Register Map Verification

New to the JasperGold Control and Status Register (CSR) Verification App for your UVM testbenches? Don’t worry; there’s a RAK for that! This eponymous RAK can get you up and running with this in no time, helping you automate your checks from UVM register map specs. With this RAK, you’ll learn the basics of the JasperGold CSR, how to use JasperGold CSR’s Proof Accelerator, and more. CSR features a model-based approach to predicting a register’s expected value, supports pipeline interfaces, all IP-XACT access policies, and it can fully model any expected register value. It also supports register aliases, read and write semantics, and separate read/write data latencies in any given field.

If this functionality sounds up your alley, you can take a look at this RAK here.

Our customers’ tests have become more complex, longer, and consume more resources than before. This increases the need to optimize the regression while not compromising on coverage.

Some advanced customers of Specman use Machine Learning based solutions to optimize the regressions while some use simpler solutions. Based on a request of an advanced customer, we added a new Coverage API in Specman 19.09 called Coverage Callback. In 20.03, we have further enhanced this API by adding more options. Now there are two Coverage APIs that provide coverage information during the run (the old scan_cover API and this new Callback API). This blog presents these two APIs and compares between them while focusing on the newer one.

Before we get into the specifics of each API, let’s discuss what is common between these APIs and why we need them. Typically, people observe the coverage model after the test ends, and get to know the overall contribution of the test to the coverage. With these two APIs, you can observe the coverage model during the test, and hence, get more insight into the test progress.

Are you wondering about what you can do with this information? Let’s look at some examples.

1. Recognize cases when the test continues to run long after it already reached its coverage goal.
2. View the performance of the coverage curve. If a test is “stuck” at the same grade for a long time, this might indicate that the test is not very good and is just a waste of resource.

These analyses can be performed in the test itself, and then a test can decide to either stop the run, or change something in it configuration, or – post run. You can also present them visually for some analysis, as shown in the blog: Analyze Your Coverage with Python.

scan_cover API (or “Scanning the Coverage Model”)

With this API you can get the current status for any cover group or item you are interested in at any point in time during the test (by calling scan_cover()). It is very simple to use; however it has performance penalty. For getting the coverage grade of any cover group during the test, you should
1. Trigger the scan_cover at any time when you want the coverage model to be scanned.
2. Implement the scan_cover related methods, such as start_item() and end_bucket(). In these methods, you can query the current grade of group/item/bucket.
The blog mentioned earlier: Analyze Your Coverage with Python describes the details and provides an example.

Callback API

The Callback API enables you to get a callback for a desired cover group(s), whenever it is sampled. This API also provides various query methods for getting coverage related information such as what the current sampled value is. So, in essence, it is similar to scan_cover API, but as the phrase says: “same same but different”:

1. Callback API has almost no performance penalty while scan_cover API does.
2. Callback API contains a richer set of query methods that provide a lot of information about the current sampled value (vs just the grade with scan_cover).
3. Using scan_cover API, you decide when you want to query the coverage information (you call scan_cover), while with the Callback API you query the coverage information when the coverage is sampled (from do_callback). So, scan_cover gives you more flexibility, but you do need to find the right timing for this call.

There is no absolute advantage of either of these APIs, this only depends on what you want to do.  

Callback API details

The Callback API is based on a predefined struct called: cover_sampling_callback. In order to use this API, you need to:

1. Define a struct inheriting cover_sampling_callback (cover_cb_save_data below)
   1. Extend the predefined do_callback() method. This method is a hook being called whenever any of the cover groups that are registered to the cover_sampling_callback instance is being sampled.
   2. From do_callback() you can access coverage data by using queries such as: is_currently_per_type(), get_current_group_grade() and get_current_cover_group() (as in the example below) and many more such as: get_relevant_group_layers() and get_simple_cross_sampled_bucket_name().
2. Register the desired cover group(s) to this struct instance using the register() method.

Take a look at the following code:

// Define a coverage callback.
// Its behavior – print to screen the current grade.
struct cover_cb_save_data like cover_sampling_callback {
    do_callback() is only {
       // In this example, we care only about the per_type grade, and not per_instance
       if is_currently_per_type() {           
            var cur_grade : real = get_current_group_grade();
            sys.save_data (get_current_cover_group().get_name(), cur_grade);
        };//if
    };//do_callback()
};// cover_cb_send_data


extend sys {
    !cb : cover_cb_save_data;

   // Instantiate the coverage callback, and register to it two of my coverage groups
    run() is also {
       cb  = new  with {
        var gr1:=rf_manager.get_struct_by_name("packet").get_cover_group("packet_cover");
        .register(gr1);
        var gr2:=rf_manager.get_struct_by_name("sys").get_cover_group("mem_cover");
       .register(gr2);
       };//new  
    };//run()

  save_data(group_name : string, group_grade : real) is {
        //here you either print the values to the screen, update a graph you show or save to a db 
  };// save_data
};//sys

In the blog Analyze Your Coverage with Python mentioned above, we show an example of how you can use the scan_cover API to extract coverage information during the run, and then use the Specman-Python API to display the coverage interactively during the run (using plotting Python library - matplotlib). If you find this usage interesting and you want to use the same example, by the Callback API instead of the scan_cover API, you can download the full example from GIT from here: https://github.com/efratcdn/cover_callback.

Specman Team

All engineers can enhance their mixed-signal low-power structural verification productivity by learning while doing with a PIEA RAK (Power Intent Export Assistant Rapid Adoption Kit). They can verify the mixed-signal chip by a generating macromodel for their analog block automatically, and run it through Conformal Low Power (CLP) to perform a low power structural check.  

The power structure integrity of a mixed-signal, low-power block is verified via Conformal Low Power integrated into the Virtuoso Schematic Editor Power Intent Export Assistant (VSE-PIEA). Here is the flow.

Applying the flow iteratively from lower to higher levels can verify the power structure.

Cadence customers can learn more in a Rapid Adoption Kit (RAK) titled IC 6.1.5 Virtuoso Schematic Editor XL PIEA, Conformal Low Power: Mixed-Signal Low Power Structural Verification.

• To read the overview presentation, click on following link: PIEA Overview
• To download this PIEA RAK click on following link: PIEA RAK Download

The RAK includes Rapid Adoption Kit with demo design (instructions are provided on how to setup the user environment). It Introduces the Power Intent Export Assistant (PIEA) feature that has been implemented in the Virtuoso IC615 release.  The power intent extracted is then verified by calling Conformal Low Power (CLP) inside the Virtuoso environment.

• Last Update: 11/15/2012.
• Validated with IC 6.1.5 and CLP 11.1

The RAK uses a sample test case to go through PIEA + CLP flow as follows:

• Setup for PIEA
• Perform power intent extraction
• CPF Import: It is recommended to Import macro CPF, as oppose to designing CPF for sub-blocks. If you choose to import design CPF files please make sure the design CPF file has power domain information for all the top level boundary ports
• Generate macro CPF and design CPF
• Perform low power verification by running CLP

It is also recommended to go through older RAKs as prerequisites.

• Conformal Low Power, RTL Compiler and Incisive: Low Power Verification for Beginners
• Conformal Low Power: CPF Macro Models
• Conformal Low Power and RTL Compiler: Low Power Verification for Advanced Users

To access all these RAKs, visit our RAK Home Page to access Synthesis, Test and Verification flow

Note: To access above docs, use your Cadence credentials to logon to the Cadence Online Support (COS) web site. Cadence Online Support website https://support.cadence.com/ is your 24/7 partner for getting help and resolving issues related to Cadence software. If you are signed up for e-mail notifications, you can receive new solutions, Application Notes (Technical Papers), Videos, Manuals, and more.

You can send us your feedback by adding a comment below or using the feedback box on Cadence Online Support.

Sumeet Aggarwal

I noticed some very interesting news last week, widely reported in the technical press, and you can find the source press release here. In a nutshell, the Embedded Microprocessor Benchmark Consortium (EEMBC) has formed a group to look at benchmarks for ultra low power microcontrollers. Initially chaired by Horst Diewald, chief architect of MSP430^TM microcontrollers at Texas Instruments, the group's line-up is an impressive "who's who" of the microcontroller space, including Analog Devices, ARM, Atmel, Cypress, Energy Micro, Freescale, Fujitsu, Microchip, Renesas, Silicon Labs, STMicro, and TI.

As the press release explains, unlike usual processor benchmark suites which focus on performance, the ULP benchmark will focus on measuring the energy consumed by microcontrollers running various computational workloads over an extended time period. The benchmarking methodology will allow the microcontrollers to enter into their idle or sleep modes during the majority of time when they are not executing code, thereby simulating a real-world environment where products must support battery life measured in months, years, and even decades.

Processor performance benchmarks seem to be as widely criticized as EPA fuel consumption figures for cars - and the criticism is somewhat related. There is a suspicion that manufacturers can tune the performance for better test results, rather than better real-world performance. On the face of it, the task to produce meaningful ultra low power benchmarks seems even more fraught with difficulties. For a start, there is a vast range of possible energy profiles - different ways that computing is spread over time - and a plethora of low power design techniques available to optimize the system for the set of profiles that particular embedded system is likely to experience. Furthermore, you could argue that, compared with performance in a computer system, energy consumption in an ultra low power embedded system has less to do with the controller itself and more to do with other parts of the system like the memories and mixed-signal real-world interfaces.

EEMBC cites that common methods to gauge energy efficiency are lacking in growth applications such as portable medical devices, security systems, building automation, smart metering, and also applications using energy harvesting devices. At Cadence, we are seeing huge growth in these areas which, along with intelligence being introduced into all kinds of previously "dumb" appliances, is becoming known as the "Internet of Things." Despite the difficulties, with which the parties involved are all deeply familiar, I applaud this initiative. While it may be difficult to get to apples-to-apples comparisons for energy consumption in these applications, most of the time today we don't even know where the grocery store is. If the EEMBC effort at least gets us to the produce department, we're going to be better off.

Pete Hardee 

There is no better way other than a self-help training kit -- (rapid adoption kit, or RAK) -- to demonstrate the Incisive Enterprise Simulator's IEEE 1801 / UPF low-power features and its usage. The features include:

• Unique SimVision debugging 
• Patent-pending power supply network visualization and debugging
• Tcl extensions for LP debugging
• Support for Liberty file power description
• Standby mode support
• Support for Verilog, VHDL, and mixed language
• Automatic understanding of complex feedthroughs
• Replay of initial blocks
• ‘x' corruption for integers and enumerated types
• Automatic understanding of loop variables
• Automatic support for analog interconnections

Mickey Rodriguez, AVS Staff Solutions Engineer has developed a low power UPF-based RAK, which is now available on Cadence Online Support for you to download.

• This rapid adoption kit illustrates Incisive Enterprise Simulator (IES) support for the IEEE 1801 power intent standard. 

Patent-Pending Power Supply Network Browser. (Only available with the LP option to IES)

• In addition to an overview of IES features, SimVision and Tcl debug features, a lab is provided to give the user an opportunity to try these out.

The complete RAK and associated overview presentation can be downloaded from our SoC and Functional Verification RAK page:

We are covering the following technologies through our RAKs at this moment:

Synthesis, Test and Verification flow
Encounter Digital Implementation (EDI) System and Sign-off Flow
Virtuoso Custom IC and Sign-off Flow
Silicon-Package-Board Design
Verification IP
SOC and IP level Functional Verification
System level verification and validation with Palladium XP

Please visit https://support.cadence.com/raks to download your copy of RAK.

We will continue to provide self-help content on Cadence Online Support, your 24/7 partner for learning more about Cadence tools, technologies, and methodologies as well as getting help in resolving issues related to Cadence software. If you are signed up for e-mail notifications, you're likely to notice new solutions, application notes (technical papers), videos, manuals, etc.

Note: To access the above documents, click a link and use your Cadence credentials to log on to the Cadence Online Support https://support.cadence.com/ website.

Happy Learning!

Sumeet Aggarwal and Adam Sherer

Hi experts,

I have a problem with my design as below

ERROR: in SHAPE (-2.3622 2.3622)

  class = ETCH

  subclass = TOP 

  Part of Symbol Def SHAPE_4725X4725.

      Which is part of a padstack as a SHAPE symbol.

  ERROR(SPMHDB-187): SHAPE boundary may not cross itself.

   Error cannot be fixed.

       Object has first point location at (-2.3622 2.3622).

Can you tell me how to solve my problem?

Thanks a lot.

Currently I tried this:

axlDBCreateShape(recPolyPlanes t "BOUNDARY/L02" netName sym1)

I get a atom error on car(sym1)

I can do this "static" using ETCH/L02 with out an issue, but I am trying to avoid doing an axlShapeChangeDynamicType().

Thanks,

Jerry

Hi all,

I am creating shapes on plane layers for a coupon and want to void them using axlShapeAutoVoid()

The shapes are attached to a symbol.

I've tried using axlShapeAutoVoid, but this only voids the pins, not the route keepouts created by nc_backdrill.

I also tried selecting the shape, individually, then running axlShapeAutoVoid. That was unsuccessful, also.

planeShapes is a list of shapes I created. The code for voiding:

;run backdrill to get route keepouts
axlShell("setwindow pcb;backdrill setup ;setwindow form.nc_backdrill;FORM nc_backdrill apply ;FORM nc_backdrill close")

foreach(sHape planeShapes
axlShapeAutoVoid(car(sHape))
)

Hi, I'm trying to create a circle from a pin with 10 mil air gap and at 45 degree rotation. The problem that im facing is that, I'm unable to get the bBox upper left coordinates. Because I want my circle to be placed from that coordinate with a 10 mil air gap. And the pins are "regular" and are placed on "Etch/Top" Layer. Kindly help me in solving this issue.

Hi all,

I need to develop a digital design/verification solution to compile,elaborate and simulate SV designs (basically a complex xrun wrapper). I am an experienced user of xrun and I have done a number of these wrappers over the years but this one is to be more of a tool, intented to be used Company-wise, so it needs to be very well thought and engineered.

It needs to be robust, simple and extensible. It needs to support multi-snapshot elaboration, run regressions on machine farms, collect coverage, create reports, etc.

I've been browsing the vast amount of documentation on XCELIUM and, although very good, I can't find any document which puts together all the pieces of what I am trying to achieve. I suppose I am more clear on the elaboration, compilation and simulation part but I am really lacking on the other areas like : LSF, regressions coverage, where does vManager fits in all this, etc.

I'd appreciate if someone can comment on whether there is a document which depicts how such a DV flow can be put together from scratch, or whether there is a kind of RAK with some example xrun wrapper.

Thanks

When I run simulation with irun, it may use may license features. How can I know which feature(s) a product use? I get below message in cdnshelp:

-------------------------------------------------------------

Which Products Are in the License File?

One Cadence product can require more than one license (FEATURE). The product to feature mapping in the license file lists the licenses each product needs.

For example, if the license file lists these features for the NC-VHDL Simulator:

Product Name: Cadence(R) NC-VHDL Simulator
#
Type: Floating Exp Date: 31-jul-2006 Qty: 1
#
Feature: NC_VHDL_Simulator [Version: 9999.999]
#
Feature: Affirma_sim_analysis_env [Version: 9999.999]

-------------------------------------------------------------------

But, in my license file, I can't find such info. There is only "FEATURE" lines in my license file. How can I get product to feature mapping info?

Thanks!

Molding caps aren’t something we talk about too frequently around here. We all know they exist, and they serve an important purpose of protecting the delicate die from potentially harsh environmental conditions. They impact how well heat can be...(read more)

Those who work in the IC Packaging design space have some unique challenges. We bridge between the IC design world (90/45-degree traces with rectangular and octagonal pins) and the PCB domain (any-angle routing, filled planes, and a multitude of pad ...(read more)

Is there a setting for automatically naming nets from port names in a hierarchical design? That is, when creating a netlist for Allegro in Capture.

Here are two screen capture of Before and After Autorouting my board. Padstacks have all been revised and corrected. The Capture Schematic is correct. All Footprints have been verified after Padstack revision. a new NETLIST generation have been done after some corrections made in Capture. I have imported the new Logic. I revised my Layout Cross Section as such: TOP, GND, VCC, BOTTOM. Both VCC and GND shapes have been assigned to their respective logical GND and VCC Nets (verified). Yet, I still have the Autorouter to systematically use extra vias to make GND and VCC connections to the VCC and GND planes. Where a simple utilisation of the part padstack inner layer would have been indicated. What Im I missing ?

Is anyone else using Constraint Manager within Capture? This is my first time using it. I'm finding that it is occasionally changing some of my constraint values in Allegro. It seems random. 

Hi everybody,

I've created a symbol with custom pad shapes. Everything looks correct in the symbol editor.

And the 3d view looks correct (upside down to show placement)

But when I try to place it on the pcb the 2 "T" shaped pads aren't in the correct location.

I have the pad shape centered on the pad...

with no offset on the padstack editor.

Does anybody know how to fix this?

Thank you!

Hi,

I have a new customer that uses Allegro Design entry HDL for the schematic and have a few questions.

1. How do you get pin/gate swaps into the symbols in the schematic ?

2. How do you transfer them to the pcb editor ?

3. How do you back annotate the swaps from the pcb editor to the schematic ?

4. How do you stop the export/Import physical from updating the constraints in the pcb file ? 

Hi

i have generated a BOM of my design and one of the parts is showing wrong information than what I specified in the database. I can see that in CIS database that part has been specified a correct information  but when I exported it to bom it shows wrong values.

Hello,

I am trying to import (in spectre) an spice model of a ceramic capacitor manufactured by Samsung EM. The link that includes the model is here :-

http://weblib.samsungsem.com/mlcc/mlcc-ec.do?partNumber=CL05A156MR6NWR

They proved static spice model and interactive spice model.

I had no problem while including the static model.

However, the interactive model which models voltage and temperature coefficients seems to not be an ordinary spice model. They provide HSPICE, LTSPICE, and PSPICE model files and I failed to include any of them.

Any suggestions ?

Hello,

I am using Virtuoso 6.1.7.

I am performing the parasitic extraction of a MOM cap array of 32 caps. I use Quantus QRC and I enable field solver. I select “QRCFS” for field solver type and “High” for field solver accuracy. The unit MOM cap is horizontally and vertically symmetric. The array looks like the sketch below and there are no other structures except the unit caps:

Rationally speaking, the capacitance values of the unit caps should be symmetric with respect to a vertical symmetry axis that is between cap16 and cap17 (shown with dashed red line). For example,

the capacitance of cap1 should be equal to the capacitance of cap32

the capacitance of cap2 should be equal to the capacitance of cap31

etc. as there are no other structures around the caps that might create some asymmetry.

Nevertheless, what I observe is the following after the parasitic extraction:

As it can be seen, the result is not symmetric contrary to what is expected. I should also add that I do not observe this when I perform parasitic extraction with no filed solver.

Why do I get this result? Is it an artifact resulting from the field solver tool (my conclusion was yes but still it must be verified)? If not, how can something like this happen?

Many thanks in advance.

Best regards,

Can

Several tools can generate power reports based on libraries & stimulus. The issue is what's NEXT?

• Is there any scope to improve power consumption of my design?
• What is the best-case power?
• Pin-point hot spots in my design?
• How to recover wasted power?

And here is the solution in form of Joules RTL Power Exploration. Joules’ framework for power exploration and power implementation/recovery is stimulus based, where analysis is done by Joules and is explored/implemented by user.

Power Exploration capabilities include:

• Efficiency metrics
• Pin point RTL location
• Cross probe to stim
• Centralize all power data

 Do you want to explore more? What is the flow? What commands can be used?

There is a ONE-STOP solution to all these queries in the form of videos on Joules Power Exploration features on https://support.cadence.com (Cadence login required).

Video Links:

How to Analyze Ideal Power Using Joules RTL Power Solution GUI? (Video)

What is Ideal Power Analysis Flow in Joules RTL Power Solution? (Video)

How to Apply Observability Don’t Care (ODC) Technique in Joules? (Video)

How to Debug Wasted Power Using Ideal Power Analyzer Window in Joules GUI? (Video)

Related Resources

Enhance the Joules experience with videos: Joules RTL Power Solution: Video Library

For any questions, general feedback, or future blog topic suggestions, please leave a comment. 

If you have one of those Die layouts, which doesn’t have bumps, but rather uses pad shapes and labels to identify I/O locations, then you might be feeling a bit left out of all of this jazz and tango. Hence, today, I am writing to tell you that, fear not, we have a solution for your Die as well.(read more)

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