[The Conversation Africa] Despite the flaws in the latest novel by South African writer Nthikeng Mohlele, there is something alluring about Revolutionaries' House. It is Mohlele's most political novel, and the parallels drawn between love and politics - and their pitfalls - are intriguing.

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[GroundUp] The education department says there's only one SETA official assisting all nine provinces

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which are themselves parts of a whole silicon system, offer unparalleled potential for improving system performance, reducing manufacturing costs, and accelerating time-to-market in the automotive sector. However, the transition to working with chiplets in automotive electronics is not without its challenges.

Designers must now grapple with a new set of considerations, such as die-to-die interconnect standards, complex processes, and the integration of diverse IPs. Advanced toolsets and standardized design approaches are required to meet these challenges head-on and elevate the potential of chiplets in automotive innovation. In the following discourse, we will explore in detail the significance of chiplets in the context of automotive electronics, the obstacles designers face when working with this paradigm, and how Cadence comprehensive suite of IPs, tools, and flows is pioneering solutions to streamline the chiplet design process.

Unveiling Chiplets in Automotive Electronics

For automotive electronics, chiplets offer a methodology to modularize complex functionalities, integrate different chiplets into a package, and significantly enhance scalability and manufacturability. By breaking down semiconductor designs into a collection of chiplets, each fulfilling specific functions, automotive manufacturers can mix and match chiplets to rapidly prototype new designs, update existing ones, and specialize for the myriad of use cases found in vehicles today.

The increasing significance of chiplets in automotive electronics comes as a response to several industry-impacting phenomena. The most obvious among these is the physical restriction of Moore's Law, as large die sizes lead to poor yields and escalating production costs. Chiplets with localized process specialization can offer superior functionality at a more digestible cost, maintaining a growth trajectory where monolithic designs cannot. Furthermore, chiplets support the assembly of disparate technologies onto a single subsystem, providing a comprehensive yet adaptive solution to the diverse demands present in modern vehicles, such as central computing units, advanced driver-assistance systems (ADAS), infotainment units, and in-vehicle networks. This chiplet-based approach to functional integration in automotive electronics necessitates intricate design, optimization, and validation strategies across multiple domains.

The Complexity Within Chiplets

Yet, with the promise of chiplets comes a series of intricate design challenges. Chiplets necessitate working across multiple substrates and technologies, rendering the once-familiar 2-dimensional design space into the complex reality of multi-layered, sometimes even three-dimensional domains. The intricacies embedded within this design modality mandate devoting considerable attention to partitioning trade-offs, signal integrity across multiple substrates, thermal behavior of stacked dies, and the emergence of new assembly design kits to complement process design kits (PDKs).

To effectively address these complexities, designers must wield sophisticated tools that facilitate co-design, co-analysis, and the creation of a robust virtual platform for architectural exploration. Standardizations like the Universal Chip Interconnect Express (UCIe) have been influential, providing a die-to-die interconnect foundation for chiplets that is both standardized and automotive-ready. The availability of UCIe PHY and controller IP from Cadence and other leading developers further eases the integration of chiplets in automotive designs.

The Role of Foundries and Packaging in Chiplets

Foundries have also pivoted their services to become a vital part of the chiplet process, providing specialized design kits that cater to the unique requirements of chiplets. In tandem, packaging has morphed from being a mere logistical afterthought to a value-added aspect of chiplets. Organizations now look to packaging to deliver enhanced performance, reduced power consumption, and the integrity required by the diverse range of technologies encompassed in a single chip or package. This shift requires advanced multiscale design and analysis strategies that resonate across a spectrum of design domains.

Tooling Up for Chiplets with Cadence

Cadence exemplifies the rise of comprehensive tooling and workflows to facilitate chiplet-based automotive electronics design. Their integrations address the challenges that chiplet-based SoCs present, ensuring a seamless design process from the initial concept to production. The Cadence suite of tools is tailored to work across design domains, ensuring coherence and efficiency at every step of the chiplet integration process.

For instance, Cadence Virtuoso RF subflows have become critical in navigating radio frequency (RF) challenges within the chiplets, while tools such as the Integrity 3D-IC Platform and the Allegro Advanced Multi-Die Package Design Solution have surfaced to enable comprehensive multi-die package designs. The Integrity Signal Planner extends its capabilities into the chiplet ecosystem, providing a centralized platform where system-wide signal integrity can be proactively managed. Sigrity and Celsius, on the other hand, offer universally applicable solutions that take on the challenges of chiplets in signal integrity and thermal considerations, irrespective of the design domain. Each of these integrated analysis solutions underscores the intricate symphony between technology, design, and packaging essential in unlocking the potential of chiplets for automotive electronics.

Cadence portfolio includes solutions for system analysis, optimization, and signoff to complement these domain-specific tools, ensuring that the challenges of chiplet designs don't halt progress toward innovative automotive electronics. Cadence enables designers to engage in power- and thermal-aware design practices through their toolset, a necessity as automotive systems become increasingly sophisticated and power-efficient.

A Standardized Approach to Success with Chiplets

Cadence’s support for UCIe underscores the criticality of standardized approaches for heterogeneous integration by conforming to UCIe standards, which numerous industry stakeholders back. By co-chairing the UCIe Automotive working group, Cadence ensures that automotive designs have a universal and standardized Die-to-Die (D2D) high-speed interface through which chiplets can intercommunicate, unleashing the true potential of modular design.

Furthermore, Cadence champions the utilization of virtual platforms by providing transaction-level models (TLMs) for their UCIe D2D IP to simulate the interaction between chiplets at a higher level of abstraction. Moreover, individual chiplets can be simulated within a chiplet-based SoC context leveraging virtual platforms. Utilizing UVM or SCE-MI methodologies, TLMs, and virtual platforms serve as first lines of defense in identifying and addressing issues early in the design process before physical silicon even enters the picture.

Navigating With the Right Tools

The road to chiplet-driven automotive electronics is one paved with complexity, but with a commitment to standards, it is a path that promises significant rewards. By leveraging Cadence UCIe Design and Verification IP, tools, and methodologies, automotive designers are empowered to chart a course toward chiplets and help to establish a chiplet ecosystem. With challenges ranging from die-to-die interconnect to standardization, heterogeneous integration, and advanced packaging, the need for a seamless integrated flow and highly automated design approaches has never been more apparent. Companies like Cadence are tackling these challenges, providing the key technology for automotive designers seeking to utilize chiplets for the next-generation E/E architecture of vehicular technology.

In summary, chiplets have the potential to revolutionize the automotive electronics industry, breathing new life into the way vehicles are designed, manufactured, and operated. By understanding the significance of chiplets and addressing the challenges they present, automotive electronics is poised for a paradigm shift—one that combines the art of human ingenuity with the power of modular and scalable microchips to shape a future that is not only efficient but truly intelligent.

Learn more about how Cadence can help to enable automakers and OEMs with various aspects of automotive design.

Cadence tapes out 32G UCIe interface IP for high speed, highly efficient chiplet designs and demonstrate high data rate performance in TSMC's 3nm technology(read more)

anyone know what is "cell with Zero maximum clock transition time"  ?

not zero transition, not maximum transtion, it is zero maximum clock transition time.

it means X0 cell? (drive-strength)

can you explain? 

thanks :-)

We are currently setting up the Tempus flow and have ran into some mismatched data regarding ECO and timing reports. I generated a timing report before running ECO and saw six total setup violations. When running opt_signoff -setup, the initial setup summary that was printed in the shell only showed one violation. I can see that violation from the initial setup summary in my pre-ECO timing report and it is not the worst path. Upon further investigation, I forced the tool to try to fix setup on one of the other five violations from the timing report using the opt_signoff_select_setup_endpoints attribute and the tool said that the endpoint had positive slack and would be ignored.

Has anyone experienced something like this before?

With digital implementation rapidly advancing, how do you think iOS and Android platforms will continue to evolve in industries like healthcare or education? The integration of mobile technology is already revolutionizing these fields, and it would be interesting to discuss where this could lead and what new opportunities might emerge.

for debug I use suspend in my tcl script to debug，here is the code

after that the innovus command screen become 

how to quit the SUSPEND status？ thanks

Hi everyone. 

I'm very a new cadence user. I'm not good at using it and quite lost in finding a way to get the results. With the topic, I would like to ask you for some suggestions to improve my cadence skills.

I have some digital decision logic. Some are combinational logic, some are sequential logic that I would like to import or generate random input combination to the inputs of my decision logic to get the maximum, minimum, and average delay power dissipation and area when feeding the different input combination.

My logic has 8-bit, 16-bit, and 32-bit input. The imported data tends to be decimal numbers.

I would like to ask you:

- which tool(s) are the most appropriate to import and feed the different combination to my decision logic?

- which tool is the most appropriate to synthesis with different number of input? - I have used Genus Synthesis Solution so far. However with my skill right now I can only let Genus synthesize my Verilog code one setup at a time. I'm not sure if I there is anyway I can feed a lot of input at a time and get those results (min, max, average of delay, power dissipation and area)

- which language or scripts I should pick up to use and achieve these results?

-where can I find information to solve my problem? which information shall I look for?

Thank you so much for your time!!

Best Regards

IR criteria:

Static IR (STD) ~2%

Static IR (MEM) ~1%

Dynamic IR (STD) ~10%

Dynamic IR (MEM) ~5%

Anyone knows the reason behind this criteria? >.<

Hi! 

I am attempting to create a very simple test pcell that contains a single Nmos 4 terminal device (Gate, Source, Drain, Backgate). However, unlike other devices I have used in the past, the backgate terminal of the device I wish to include within the pcell is an inherited connection, and the other 3 are physical terminals. Note that for the pcell master, I do not want any inherited connections, just physical pins. Hence I need to drive this inherited connection with a pin within my pcell. I started implementing the symbol and schematic first, ensuring I could obtain the correct connectivity, extract netlist, etc. I thought I had it hooked up correctly, but alas I am failing to export the CDL. Let me explain my current approach.

Schematic:

Create the 4 physical pins using a combination of dbCreateInst (for the pin isnt), dbMakeNet, dbCreateTerm and dbCreatePin.

Create the device instance using dbCreateInstByMasterName and setting the desired cdf parameters + callbacks.

For the physical terminals of the device, I'm using dbCreateConnByName to make the connection to the appropriate net that was created above.

For the inherited connection, I am creating a netSet property like so: dbCreateProp(newinst deviceTermName "netSet" netName)

Symbol:

Create the 4 physical pins using a combination of dbCreateRect, dbMakeNet, dbCreateTerm, dbCreatePin.

And then create whatever symbol design I wish using the likes of dbCreateRect, dbCreateLine, etc. 

Everything works fine when using a device without an inherited connection, so I'm guessing I'm missing something along this line... Also, if I copy the contents of the pcell schematic to a regular schematic view, do a check and save, the view extracts just fine. So I wonder if the check and save it fixing the connectivity that I may not have. 

Thanks for any possibly engagement or suggestions 🙂

Keelan

Hello,

I would like to create a button for my form that prompts the user to click on a cellview and draw a rectangle bounding box, exactly like the one used in the Area and Density Calculator. Can someone please help me with this?

Thanks!

Beto

Hello Community,

I have encountered an issue that is a mystery to me and hope somebody could give me a clue about what is happening in Cadence and maybe even a solution?

I am running a test scripted in a SKILL file that sequentially opens two different projects with MC analyses and in between I get an error message box and also multiple logs in CIW with exactly the same text.

Both projects run a simulation with a call like this:

historyName = maeRunSimulation(?session sessionName ?waitUntilDone t)

After this the script closes the current project, opens the next project and executes the same line with maeRunSimulation() for the second project. Then immediately this error message happens, and also is logged repeatedly in the CIW window

The message box looks like this:

The logs I get in CIW:

nil
hiCancelProgressBox(_axlNetlistCreateProgressBar)
nil
hiCancelProgressBox(_axlUILoadForm)
nil
when(dwindow('axlDataViewessWindow1) hiMapWindow(dwindow('axlDataViewessWindow1)))
t
when(dwindow('axlRunSummaryessWindow1) hiMapWindow(dwindow('axlRunSummaryessWindow1)))
t
ERROR (ASSEMBLER-1600): Cannot find an active session named fnxSession0.
You can only modify an ADE Assembler session that is active.
Perhaps the session name was misspelled or has not yet been created.
Verify the session name matches an existing ADE Assembler session.

1>
ERROR (ASSEMBLER-1600): Cannot find an active session named fnxSession0.
You can only modify an ADE Assembler session that is active.
Perhaps the session name was misspelled or has not yet been created.
Verify the session name matches an existing ADE Assembler session.

*WARNING* hiDisplayAppDBox: modal dbox 'adexlMessageDialog' is already displayed!
ERROR (ASSEMBLER-1600): Cannot find an active session named fnxSession0.
You can only modify an ADE Assembler session that is active.
Perhaps the session name was misspelled or has not yet been created.
Verify the session name matches an existing ADE Assembler session.

*WARNING* hiDisplayAppDBox: modal dbox 'adexlMessageDialog' is already displayed!
ERROR (ASSEMBLER-1600): Cannot find an active session named fnxSession0.
You can only modify an ADE Assembler session that is active.
Perhaps the session name was misspelled or has not yet been created.
Verify the session name matches an existing ADE Assembler session.

Hi,

I want to define a procedure that with @key, and I also want to restrict the variable's datatype, I tried with folloing but I received error in CIW

procedure(tt(handler @key str1 str2 "ssS")
  printf("handler: %L " handler)
)

tt('test)

The error is like: *Error* tt: argument for keyword ?str1 should be a symbol (type template = "ssS") at line 11 of file

Thanks,

James

Hello,

I was looking to destructively and efficiently modify a list that was passed in as an argument to a procedure, by prepending an item to the list.

I noticed that cons lets you do this efficiently, but the operation is non-destructive. Hence this wouldn't work if you are trying to modify a function's list parameter in place.

Here is an example of trying to add "0" to the front of a list:

AWR V22.1 software introduces the Pointer-Hybrid optimization method which uses a combination of optimization methods, switching back and forth between methods to efficiently find the lowest optimization error function cost. The optimization algorithm automatically determines when to switch to a different optimization method, making this a superior method over manual selection of algorithms. This method is particularly robust in regards to finding the global minima without getting stuck in a local minima well.(read more)

Data sets are a powerful and easy-to-use feature in Microwave Office. Data can be effortlessly be swapped in graphs, and circuit schematics.(read more)

Are you ready to revolutionize your RF design experience? Look no further! Cadence AWR software is your gateway to mastering the intricacies of Radio Frequency (RF) circuit design, and now, you can explore its power with our exclusive Free Academic T...(read more)

i want to read from text file two values  on two ports , i wrote  that  code, and i have that error that shown in the image below . and also the data in text file is shown as screenshot

module read_file (a,b);

electrical a,b;
integer in_file_0,data_value, valid, count0,int_value;

analog begin
@(initial_step) begin
in_file_0 = $fopen("/home/hh1667/ee610/my_library/read_file/data2.txt","r");

valid = $fscanf (in_file_0, "%b,%b" ,int_value,count0);
end

V(a) <+ int_value;
V(b) <+ count0;

end

endmodule

I am not able to open 64bit version of simvision using the following :

simvision -64 -wav "path to wav"

This throws the error "  /lib64/libc.so.6: version `GLIBC_2.14' not found"

I am only able to open it without the -64 option.

As a result I am not able to use the source browser feature since the simulation was run in 64 bit mode.

Need suggestion on how to resolve this. Thanks.

Hi, have two designs and would like to copy paste one area of circuit from the old design to the new design, best way/approach and guidance please..

We have a big circuit having 12K gates totally and trying to show it in one page slide visually. But it is so hard for us to shrink it down from gate-level to module-level. Do you have any function like these:

• Toggle wires on and off
• “Right click” elements and group them into black boxes
• Quickly left or right align elements to clean up pictures

I am trying to understand the Linting process. I know that mainly JasperGold is the tool for this purpose. Though I think JasperGold is more suited for later stages of the design. As a RTL Design Engineer, I want to make sure that if another tool has the capability of doing Linting earlier in the flow. for example, does Xcelium, Genus or Confomal support linting. I have seen some contradicting information online regarding this topic, though I can't find anything related to Linting on any of these tools.

Thanks

With the DRAM fabrication advancing from 1x to 1y to 1z and further to 1a, 1b and 1c nodes along with the DRAM device speeds going up to 8533 for Lpddr5/8800 for DDR5, Data integrity is becoming a really important issue that the OEMs and other users have to consider as part of the system that relies on the correctness of data being stored in the DRAMs for system to work as designed.

It’s a complicated problem that requires multiple ways to deal with it.

Traditionally one of the main approaches to deal with data errors is to rely on the ECC. ECC requires additional memory storage in which the ECC codes will calculated and stored at the time of memory write to DRAM. These codes will be read back along with the memory data during to the reads and checked against the data to make sure that there are no errors. Typical ECC schemes use Hamming code that provide for single bit error correction and double bit error detection per burst. Also, while several of previous generation of DRAM required Host to keep aside system memory for ECC storage latest DRAMs like Lpddr5 and DDR5 support on die ECC as part of the normal DRAM function that can be enabled using mode registers. DDR5 further requires Host to run through an ECC Error Check and Scrub (ECS) cycle on an average every tECSint time (Average Periodic ECS Interval) to prevent data errors.

Not meeting the DRAM Refresh requirement is a major reason that can lead to loss of data. This could be challenging as the PVT variation can cause the refresh requirement to change over time. Putting the DRAM in Self Refresh mode can help off-loading Refresh tracking responsibilities to DRAM but may prevent Host to do other scheduling optimizations and should be carefully considered.

Some of the other things that can affect the DRAM data are

1. Row hammer where same or adjacent rows are activated again and again leading to loss or changing of data contents in the rows that has not being addressed. Latest DRAMs like Lpddr5/Ddr5 support Refresh Management (including DRFM and ARFM) that allows the Host to compensate for these problems by issuing dedicated RFM commands helping DRAMs deals with potential Data loss issues arising out of Row hammer attacks.
2. Device temperature is another important factor that the Host needs to be aware of and if the application requires DRAM to operate at elevated temperature. The user needs to check with DRAM Vendor on the temperature range that DRAM can still operate. Data integrity at thresholds greater than certain temperature is not assured regardless of refresh rate unless DRAM is manufactured to withstand that.
3. Loss of power to DRAM will cause DRAM to lose all its contents. If this is a real concern for the system designer, they should consider using NVDIMM-N devices which has an onchip controller and a power source which is just enough to allow the DRAM contents to be copied into a backup non-volatile memory before power is lost. When the power is stored back, the stored memory contents in the non-volatile memory will be written back to the DRAM and system can continue to operate as it was before the power loss event occurred.

For transmissions and manufacturing errors DRAMs support additional features like CRC, DFE, Pre-Emphasis and PPR which will be covered in the next blog.

Cadence MMAV VIPs for DDR5/DDR5 DIMM and LPDDR5 are compressive VIP solutions and supports all of the above-listed Data integrity features including support for ECC error injection and SBE correction/DBE detection to assist with the verification challenges dealing with data integrity issues.

More information on Cadence DDR5/LPDDR5 VIP is available at Cadence VIP Memory Models Website.

Shyam 

The automotive industry revolutionized the definition of a vehicle in terms of safety, comfort, enhanced autonomy, and internet connectivity. With this trend, the automotive industry rapidly adopted automotive Ethernet such as 10Base-T1, 100Base-T1, and in some cases, 1000Base-T1. 

Faster Speed (than CAN-FD), Scalability, embedded security protocols (like MacSec), cost and energy efficiency, and simple yet redundant network made Ethernet an obvious choice over CAN(FD) and FlexRay.  

Ethernet 10Base-T1 

10BASE-T1S is defined under IEEE with 802.3cg. The S in 10BASE-T1S stands for a short distance. 10BASE-T1S uses a multidrop topology, where each node connects to a single cable. Multidrop topology eliminates the need for switches and, as a result, fewer cables/less cost. The primary goal of 10BASE-T1S is a deterministic transmission on a collision-free multidrop network. 10BASE-T1S cables use a pair of twisted wires. As per IEEE, at least eight nodes can connect to each, but more connections are feasible.    

The Physical Layer Collision Avoidance [PLCA] protocol ensures that it uses the entire 10 Mbps bandwidth. In 10BaseTs, Reconciliation Sublayer provides optional Physical Layer Collision Avoidance (PLCA) capabilities among participating stations. Using PLCA-enabled Physical Layers in CSMA/CD half-duplex shared-medium networks can provide enhanced bandwidth and improved access latency under heavily loaded traffic conditions. The working principle of PLCA is that transmit opportunities on a mixing segment are granted in sequence based on a node ID unique to the local collision domain (set by the management entity). 10BASE-T1S also supports an arbitration scheme that guarantees consistent node access to the media within a predefined time.  

The 10BASE-T1S PHY is intended to cover the low-speed/low-cost applications in the industrial and automotive environment. A large number of pins (16) required by the MII interface is one of the significant cost factors that must be addressed to fulfill this objective. The 10BASE-T1S "Transceiver" solution is suited for embedded systems where the digital portion of the PHY is fully integrated, e.g., into an MCU or an Ethernet switch core, leaving only the analog portion (the transceiver) into a separate IC. 

Ethernet 100Base-T1/1000Base-T1 

100Base-T1 and 1000Base-T1 can be used for audio/video information. With Higher bandwidth capacity, 100Base-T1/ 1000Base-T1 paired with AVB (Audio video bridging) can be used for car infotainment systems. 100Base-T1/1000Base-T1 paired with time-sensitive networking [TSN] protocol can be used to fulfill the automotive industry's mission-critical, time-sensitive, and deterministic latency needs. 

 PTP Over MacSec  

With today's automotive network, all the Electronic Control Units connected require timing accuracy and network synchronization, Precision Time Protocol (PTP), defined in IEEE 1588, provides synchronized clocks throughout a network.  While maintaining the timing accuracy for mission-critical applications, protecting the vehicle network from vulnerable threats is mandatory, and PTP over MacSec provides the consolidated solution.  

With the availability of the Cadence Verification IP for 10/100/1000BaseT1 and TSN, adopters can start working with these specifications immediately, ensuring compliance with the standard and achieving the fastest path to IP and SoC verification closure. The 10/100/1000GBaseT1 and TSN provide a full-stack solution, including support to the PHY, MAC, and TSN layers with a comprehensive coverage model and protocol checkers. Ethernet BaseT1 and TSN VIP covers all features required for complete coverage verification closure. More details are available in the Ethernet Verification IP portfolio. 

Krunal 

The increase in compute and data-intensive applications and the need for lower power consumption have resulted in a rapidly growing number of Arm-based devices in various market segments; this requires fast time to market (TTM) and support for off-t...(read more)

To stay ahead in competition in chip design real-time collaborations ensure traceability, speedy innovations at reduced the cost.(read more)

One of the key goals for USB4 is to retain compatibility with the existing ecosystem of USB3.2, USB 2.0 and Thunderbolt  products, and the resulting connection scales to the best mutual capability of the devices being connected. USB4 is designed to work with older versions of USB and Thunderbolt . USB4 Fabric support high throughput interconnects of 10 Gbps (for Gen 2) and 20 Gbps (for Gen 3) and supports Thunderbolt 3-compatible rates of 10.3125 Gbps (for Gen 2) and 20.625 Gbps (for Gen 3). It becomes very important to verify the Thunderbolt  backward compatibility with the designs. Though the support of USB4 Interoperability with Thunderbolt  3 (TBT3) is optional in USB4 host or USB4 peripheral device and required USB4 Hub and USB4 Based Dock but it is very essential to work in the existing ecosystem. 

Few Main features of USB4 Interoperability with Thunderbolt  3 (TBT3) Systems

• Support for Bi-Directional Pins & Retimers: TBT3 Active Cables can contain two bidirectional Re-timers which have the capability to send AT Responses on its RX channel. Router connected directly to such Retimer needs to support A Router that is connected directly to a bidirectional Re-timer shall support reception of Transactions on both TX and RX channels. 

• Bounce Mechanism: This feature is used by Router to access the Register Space of a Cable Re-timer that can only be accessed by its Link Partner.
• Asymmetric Negotiation: The Router which connects with Cable Retimers needs to follow Asymmetric TxFFE in Phase 5 of Lane Initialization. 
• USB4 Link Transitions: In TBT3 mode, the configuration of two independent Single Lane Links can be used non-transient state or Single Lane Link just using the Lane1 Adapter.

Cadence has a mature USB4 Verification IP solution that can help in the verification of USB4 designs with TBT3. Cadence has taken an active part in the Cairo group that defined the USB4 specification and has created a comprehensive Verification IP that is being used by multiple members. If you plan to have a USB4-compatible design, you can reduce the risk of adopting new technology by using our proven and mature USB4 Verification IP. Please contact your Cadence local account team, for more details.

Achieving optimal power transfer in RF PCBs hinges on meticulously routed traces that meet specific impedance requirements. Impedance matching is essential to ensure that traces have the same impedance to prevent signal reflection and inefficient pow...(read more)

Community engagement is a dynamic concept that does not adhere to a singular, universal approach. Its various forms, methods, and objectives can vary significantly depending on the specific context, goals, and desired outcomes. Whether you seek assis...(read more)

Power network design and analysis of 3D-ICs is a major challenge due to the complex nature and large size of the power network. In addition, designers must deal with the complexity of routing power through the interposer, multiple dies, through-silicon vias (TSVs), and through-dielectric vias (TDVs).
Cadence’s Integrity 3D-IC Platform and Voltus IC Power Integrity Solution provide a fully integrated solution for early planning and analysis of 3D-IC power networks, 3D-IC chip-centric power integrity signoff, and hierarchical methods that significantly improve capacity and performance of power integrity (PI) signoff while maintaining a very high level of accuracy at signoff. This blog summarizes the typical design challenges faced by today’s 3D-IC designers, as discussed in our recent webinar, “Addressing 3D-IC Power Integrity Design Challenges.” Please click here to view the full webinar.

Major Trends in Advanced Chip Design

From chips to chiplets, stacked die, 3D-ICs, and more, three major trends are impacting advanced semiconductor packaging design. The first is heterogenous integration, which we define as a disaggregated approach to designing systems on chip (SoCs) from multiple chiplets. This approach is similar to system-in-package (SiP) design, except that instead of integrating multiple bare die – including 3D stacking – on a single substrate, multiple IPs are integrated in the form of chiplets on a single substrate.

The second major trend is around new silicon manufacturing techniques that leverage silicon vias (TSVs) and high-density fanout RDL. These advancements mean that silicon is becoming a more attractive material for packaging, especially when high bandwidth and form factor become key attributes in the end design. This brings new design and verification challenges to most packaging engineers who typically work with organic and ceramic substrate materials.

Finally, on the ecosystem side, all the large semiconductor foundries now offer their own versions of advanced packaging. This brings new ways of supporting design teams with technologies like reference flows and PDKs, concepts that have typically been lacking in the packaging community. Cadence has worked with many of the leading foundries and outsourced semiconductor assembly and test facilities (OSATs) to develop multi-chip(let) packaging reference flows and package assembly design kits. The downside is that, with the time restrictions designers are under today, there isn’t enough time to simulate the details of these flows and PDKs further.

For those who must make the best electro/thermal/physical decisions to achieve the best power/performance/area/cost (PPAC), factors can include accurate die size estimations, thermal feasibility, die-to-die interconnect planning, interposer planning (silicon/organic), front-to-front and front-to-back (F2F/F2B) planning, layer stack and electromigration/ IR drop (EMIR)/TSV planning, IO bandwidth feasibility, and system-level architecture selection.

3D-IC Power Network Design and Analysis

The key to success in 3D-IC design is early power integrity planning and analysis. Cadence’s Integrity 3D-IC platform is a high-capacity 3D-IC platform that enables 3D design planning, implementation, and system analysis in a single, unified cockpit. Cadence’s Voltus IC Power Integrity Solution is a comprehensive full chip electromigration, IR drop, and power analysis solution. With its fully distributed architecture and hierarchical analysis capabilities, Voltus provides very fast analysis and has the capacity to handle the largest designs in the industry. Typically, 3D-IC PDN design and analysis is performed in four phases, as shown in Figure 1.

Phase 1 - Perform early power delivery network (PDN) exploration with each fabric’s PDN cascaded in system PI with early circuit models.

Phase 2 – Plan 3D-IC PDNs in Cadence’s Integrity 3D-IC platform, including micro bumps, TSVs, and through dielectric vias (TDVs), power grid synthesis for dies, and early rail analysis and optimization.

Phase 3 – Perform full chip-centric signoff in Voltus with detailed die, interposer, and package models, including chip die models, while keeping some dies flat.

Phase 4 – Perform full system-level signoff with Cadence’s Sigrity SystemPI using detailed extracted package models from Sigrity XtractIM, board models from Sigrity PowerSI or Clarity 3D Solver, interposer models from XtractIM or Voltus, and chip power models from Voltus.

Figure 1. 3D-IC PDN design and analysis phases

3D-IC Chip-Centric Signoff

The integration of Integrity 3D-IC and Voltus enables chip-centric early analysis and signoff. Figure 2 and Figure 3 highlight the chip centric early PI optimization and signoff flows. In early analysis, the on-chip power networks are synthesized, and the micro bumps and TSVs can be placed and optimized. In the signoff stage, all the detailed design data is used for power analysis, and detailed models are extracted and used for package, interposer, and on-die power networks.

Figure 2. Early chip-centric PI analysis and optimization flow

Figure 3. Chip-centric 3D-IC PI signoff

Hierarchical 3D-IC PI Analysis

To improve the capacity and performance of 3D-IC PI analysis, Voltus enables hierarchical analysis using chiplet models. Chiplet models can be reduced chip models in spice format or more accurate xPGV models which are highly accurate proprietary models generated by Voltus. With xPGV models, the hierarchical PI analysis has almost the same accuracy as flat analysis but offers 10X or higher benefit in runtime and memory requirements.

Conclusion

This blog has highlighted the major design trends enabled by advanced 3D packaging and the design challenges arising from these advancements. The design of power delivery networks is one of these major challenges. We have discussed Cadence solutions to overcome this PI challenge. To learn more, view our recent webinar, "Addressing 3D-IC Power Integrity Design Challenges" and visit the Voltus web page.

When it comes to system integration, PCB designers need to collaborate with the signal analysis or integrity team to run pre-route or post-route analysis and modify constraints, floorplan, or topology based on the results. Allegro PCB Edito...(read more)

Live Doc is an advanced automated PCB documentation generation tool integrated with OrCAD X Presto designed to streamline the creation of PCB documentation. By automating the generation of PCB fabrication and assembly drawings, Live Doc significantly...(read more)

At times, there might arise a condition in the design where you need to push the net of selected pins to all its physically connected objects. For example, a few pins are updated with a new net, and it is required to push the new net to all its connected objects. At times, you might update the die or copy routing to other components, when a portion of routing gets the wrong net.

To propagate the net of the pin to all its physically connected objects, Allegro X APD uses the standalone command, Push Connectivity.

You can call the command through Logic > Push Connectivity.

Alternately, you can use the push connectivity command at the command line. Once the command is active, it lets you select pins or symbols that will be used to push net connectivity to all connected objects.

Presently, dynamic shapes and filled rectangles are not considered as part of connectivity. Static shapes are supported.

When things go wrong with your package design flow, it can sometimes be difficult to understand the cause of the issue. This can be something like a die component is wrongly identified as a BGA, a via stack has an alignment issue, or there are duplicate bondwires. These are just a few examples of issues; there can be many more. When interactive messages and log files do not help determine the problem, the Package Design Integrity Check tool becomes very handy. This feature lets you run integrity checks, which ensures that the database is configured correctly. 

To invoke the command from Allegro X Advanced Package Designer, use the Tools > Package Design Integrity menu. 

Or type package integrity at the Command  prompt. 

The Package Design Integrity Checks dialog box includes all categories and checks currently registered for the currently running product. You can enable all these categories and checks or only the one that you want to run. This utility can fix errors automatically (where possible). Errors and warnings are written to the “package_design_check.log” file.  

The utility can also be extended with your own custom rules based on your specific flows and needs. 

Display Stream Compression (DSC) is a lossless or near-lossless image compression standard developed by the Video Electronics Standards Association (VESA) for reducing the bandwidth required to transmit high-resolution video and images. DSC compresses video streams in real-time, allowing for higher resolutions, refresh rates, and color depths while minimizing the data load on transmission interfaces such as DisplayPort, HDMI, and embedded display interfaces.

Why Is DSC Needed?

In the ever-evolving landscape of display technology, the pursuit of higher resolutions and better visual quality is relentless. As display capabilities advance, so do the challenges of managing the immense amounts of data required to drive these high-performance screens. This is where DSC steps in. DSC is designed to address the challenges of transmitting ultra-high-definition content without sacrificing quality or performance. As displays grow in resolution and capability, the amount of data they need to transmit increases exponentially. DSC addresses these issues by compressing video streams in real-time, significantly reducing the bandwidth needed while preserving image quality.
 

DSC Use in End-to-end System

DSC Key Features

• Encoding tools:
  • Modified Median-Adaptive Prediction (MMAP)
  • Block Prediction (BP)
  • Midpoint Prediction (MPP)
  • Indexed color history (ICH)
  • Entropy coding using delta size unit-variable length coding (DSU-VLC)

• The DSC bitstream and decoding process are designed to facilitate the decoding of 3 pixels/clock in practical hardware decoder implementations. Hardware encoder implementations are possible at 1 pixel/clock.
• DSC uses an intra-frame, line-based coding algorithm, which results in very low latency for encoding and decoding.

DSC encoding algorithm
 

• Compression can be done to a fractional bpp. The compressed bits per pixel ranges from 6 to 63.9375.
• For validation/compliance certification of DSC compression and decompression engines, cyclic redundancy checks (CRCs) are used to verify the correctness of the bitstream and the reconstructed image.
• DSC supports more color bit depths, including 8, 10, 12, 14, and 16 bpc.
• DSC supports RGB and YCbCr input format, supporting 4:4:4, 4:2:2, and 4:2:0 sampling.
• Maximum decompressor-supported bits/pixel values are as listed in the Maximum Allowed Bit Rate column in the table below

• DP DSC Source device shall program the bit rate within the range of Minimum Allowed Bit Rate column in the table:

Summary

Display Stream Compression (DSC) is a technology used in DisplayPort to enable higher resolutions and refresh rates while maintaining high image quality. It works by compressing the video data transmitted from the source to the display, effectively reducing the bandwidth required. DSC uses a visually lossless algorithm, meaning that the compression is designed to be imperceptible to the human eye, preserving the fidelity of the image. This technology allows for smoother, more detailed visuals at higher resolutions, such as 4K or 8K, without requiring a significant increase in data bandwidth.

More Information

• Cadence has a very mature Verification IP solution. Verification over many different configurations can be used with DisplayPort 2.1 and DisplayPort 1.4 designs, so you can choose the best version for your specific needs.
• The DisplayPort VIP provides a full-stack solution for Sink and Source devices with a comprehensive coverage model, protocol checkers, and an extensive test suite.
• More details are available on the DisplayPort Verification IP product page, Simulation VIP pages.
• If you have any queries, feel free to contact us at talk_to_vip_expert@cadence.com

Verisium SimAI App harnesses the power of machine learning technology with the Cadence Xcelium Logic Simulator - the ultimate breakthrough in accelerating verification closure. It builds models from regressions run in the Xcelium simulator, enabling the generation of new regressions with specific targets. The Verisium SimAI app also features cousin bug hunting, a unique capability that uses information from difficult-to-hit failures to expose cousin bugs. With these advanced machine learning techniques, Verisium SimAI offers the potential for a significant boost in productivity, promising an exciting future for our users.

Figure 1: Regression compression and coverage maximization with Verisium SimAI 

What can I do with Verisium SimAI?

You can exercise different use cases with Verisium SimAI as per your requirements. For some users, the goal might be regression compression and improving coverage regain. Coverage maximization and hitting new bins could be another goal. Other users may be interested in exposing hard-to-hit failures, bug hunting for difficult to find issues. Verisium SimAI allows users to take on any of these challenges to achieve the desired results.

Let's go into some more details of these use cases and scenarios where using SimAI can have a big positive impact.

1. Using SimAI for Regression Compression and Coverage Regain

Unlock up to 10X compute savings with SimAI!

Verisium SimAI can be used to compress regressions and regain coverage. This flow involves setting up your regression environment for SimAI, running your random regressions with coverage and randomization data followed by training, and finally, synthesizing and running the SimAI-generated compressed regressions. The synthesized regression may prune tests that do not help meet the goal and add more runs for the most relevant tests, as well as add run-specific constraints. This flow can also be used to target specific areas like areas involving a high code churn or high complexity.

You can check out the details of this flow with illustrative examples in the following Rapid Adoption Kits (RAK) available on the Cadence Learning and Support Portal (Cadence customer credentials needed):

• Using SimAI with vManager (For Regression Compression and Coverage Regain) (RAK) 
• Using SimAI with a Generic Runner (For Regression Compression and Coverage Regain) (RAK)

2. Using SimAI for Coverage Maximization and Targeting coverage holes

Reduce your Functional Coverage Holes by up to 40% using SimAI!

Verisium SimAI can be used for iterative coverage maximization. This is most effective when regressions are largely saturated, and SimAI will explicitly try to hit uncovered bins, which may be hard-to-hit (but not impossible) coverage holes. This is achieved using iterative learning technology where with each iteration, SimAI does some exploration and determines how well it performed. This technique can also be used for bug hunting by using holes as targets of interest.

See more details on the Cadence Learning and Support Portal:

• Using SimAI for Coverage Maximization - vManager flow (RAK) 
• Using SimAI for Coverage Maximization - Generic Runner Flow (RAK)

3. Using SimAI for Bug Hunting

Discover and fix bugs faster using SimAI!

Verisium SimAI has a new bug hunting flow which can be used to target the goal of exposing hard-to-hit failure conditions. This is achieved using an iterative framework and by targeting failures or rare bins. The goal to target failures is best exercised when the overall failure rate is typically low (below 5%). Iterative learning can be used to improve the ability to target specific areas. Use the SimAI bug hunting use case to target rare events, low hit coverage bins, and low hit failure signatures.

See more details on the Cadence Learning and Support Portal:

• Using SimAI for Bug Hunting with vManager (RAK) 
• Using SimAI for Bug Hunting – Generic runner flow (RAK) 

Unlock compute savings, reduce your functional coverage holes, and discover and fix bugs faster with the power of machine learning technology now enabled by Verisium SimAI!

Please keep visiting  https://support.cadence.com/raks to download new RAKs as they become available.

Please note that you will need the Cadence customer credentials to log on to the Cadence Online  Support  https://support.cadence.com/, your 24/7 partner for getting help in resolving issues related to Cadence software or learning Cadence tools and technologies.

Happy Learning!

As technology continues to evolve at a rapid pace, the importance of robust and efficient interconnect standards cannot be overstated. Peripheral Component Interconnect Express (PCIe) has been a cornerstone in high-speed data transfer, enabling seamless communication between various hardware components.   

With the advent of PCIe 6.1 ECN, a significant advancement in speed and efficiency, ensuring the accuracy and reliability of its operations is paramount. One critical aspect of this is the verification of shared credit updates. For detailed understanding on Shared Credit, please refer Understanding PCIe 6.0 Shared Flow Control. 

In this blog, we will discuss why this verification is essential and what it entails.  

Introduction 

PCIe 6.1 ECN brings numerous advancements over earlier versions, such as increased bandwidth and faster data transfer speeds.   

A crucial mechanism for efficient data transmission in PCIe 6.0 is the credit-based flow control system. In this system, devices monitor credits, representing the buffer capacity available for incoming data.   

When a device transmits data, it uses credits, which are replenished or adjusted once the data is received and processed. This system ensures that the sender does not overload the receiver.  

Given the critical role of shared credit updates in maintaining the integrity and efficiency of data transfers, verification of these updates is crucial.  Proper management of credit updates is essential to ensure data integrity, as any discrepancies can lead to data loss, corruption, or system crashes.   

Verification also guarantees efficient resource allocation, preventing scenarios where some components are starved of credit while others have an excess, thus avoiding inefficiencies.  Credit inefficiencies pose issues in low power negotiations by preventing devices from entering low power states. Additionally, verification involves checking for proper error handling mechanisms, ensuring that the system can recover gracefully from errors in credit updates and maintain overall stability.   

PCIe 6.1 ECN Flow Control Optimizations Over PCIe 6.0

PCIe 6.1 ECN builds on the FLIT-based architecture introduced in PCIe 6.0, further optimizing flow control mechanisms to handle increased data rates and improved efficiency.  PCIe 6.1 ECN introduced refinements in credit management, making the allocation and advertisement of credits more precise, which helps in reducing bottlenecks and improving data flow efficiency.  Enhancements in flow control protocols ensure better management of buffer spaces and more efficient credit allocation. These enhancements are designed to handle the increased data rates and throughput demands of next-generation applications, ensuring robust and efficient data flow across PCIe devices.  

Below are some major updates: 

1. There have been improvements in error detection and correction mechanisms in PCIe 6.1 ECN to enhance flow control reliability by ensuring that corrupted data packets are detected and handled appropriately without disrupting the flow of valid packets.  
2. The merged credit system, which was a key feature introduced int PCIe 6.0 to simplify and optimize credit management, was further enhanced in PCIe 6.1 ECN to improve performance and efficiency.  
3. PCIe 6.1 ECN introduced better algorithms for allocating and reclaiming merged credits to handle high data rates, introduced more robust error detection and correction mechanism reducing the degradation or system instability. 
4. PCIe 6.1 ECN provided clear guidelines on how to implement the merged credit system correctly, helping developers to implement more reliable systems. For more details, please refer to Specifications section 2.6.1 Flow Control (FC) Rules.

Summary 

In summary, PCIe 6.0 is a complex protocol with many verification challenges. You must understand many new Spec changes and think about the robust verification plan for the new features and backward compatible tests impacted by new features. Cadence’s PCIe 6.0 Verification IP is fully compliant with the latest PCIe Express 6.0 specifications and provides an effective and efficient way to verify the components interfacing with the PCIe 6.0 interface. Cadence VIP for PCIe 6.0 provides exhaustive verification of PCIe-based IP and SoCs, and we are working with early adopter customers to speed up every verification stage.   

More Information

For more info on how Cadence PCIe Verification IP and Triple Check VIP enable users to confidently verify PCIe 6.0, see VIP for PCI Express, VIP for Compute Express Link  and TripleCheck for PCI Express    

See the PCI-SIG website for more details on PCIe in general and the different PCI standards.  

For more information on PCIe 6.0 new features, please visit PCIeLaneMargin, PCIe6.0LaneMargin, and Demonstrating PCIe 6.0 Equalization Procedure.

Cadence PCIe/CXL VIP support for Partial Header Encryption in Integrity and Data Encryption.(read more)

In SoC development, the verification cycle is a crucial phase that ensures products meet their specifications and function correctly. However, the complexity of modern SoC projects, with their constant data flow, multiple validation teams working in parallel, and tight schedules, presents significant challenges. This article explores these challenges and introduces Verisium Manager as a solution that embodies the 'One Tool Fits All' concept. This means that Verisium Manager is designed to handle all aspects of the verification process for SoC development, from planning to coverage analysis to regression testing, thereby addressing the complex needs of SoC verification.

The Hurdles in Traditional Validation Cycles

 A typical validation process involves planning, coverage analysis, and regression testing. This complexity is compounded by using separate tools for each activity, leading to multiple control environments, APIs, and databases, not to mention the array of tool owners. Such fragmentation results in constant data transfer and translation between systems, from the planning tool to the coverage analysis tool and then to the regression testing tool. This continuous movement of data causes delays, system instability, poor user experiences, and, ultimately, a dip in the quality of the validation process.

The use of multiple platforms leads to inefficiency and reduced productivity. What's needed is a unified system that can streamline the workflow, simplify the verification process, and enhance its effectiveness.

Envisioning the Ideal Solution: Verisium Manager

 The cornerstone of an efficient validation cycle is integration and simplicity. The ideal solution is a singular platform that consolidates planning, coverage analysis, and regression management into one smooth, unified process. Verisium Manager emerges as this much-needed solution, encompassing all the functionalities necessary to streamline the validation process. Its comprehensive nature instills confidence in its ability to handle all aspects of the verification cycle. It can be fully customized to address and enforce any validation methodology and can facilitate smooth integration into any customer environment.

Features that stand out in Verisium Manager include: 

• Unified Workflow: It acts as a single cockpit from which all activities are orchestrated, ensuring the validation teams' work is uninterrupted and seamlessly integrated.
• Customization and Integration: Verisium Manager supports customizing test-plan structures and mapping results per project, ensuring a perfect fit for various project requirements. Its ability to smoothly integrate into the project's environment and compute platforms is unparalleled.
• Support for Continuous Updates and Migration: The tool accommodates constant updates to project data and supports the migration of legacy data, ensuring that no historical data is lost in the transition to a new system.

Addressing Project-Specific Needs

 Verisium Manager recognizes diversity in different projects and offers project-specific solutions, including:

 Enforcing Project Test-Plan Structures and Attributes: It supports and enforces each project's unique test-plan structure and mapping guidelines.

• Unified Data Views and Measurements: Verisium Manager promotes a unified view of data across all teams and enforces unified measurements, ensuring consistency and clarity in the validation process.
• Enabling Project-Specific Actions and Integrations: The tool is designed to support project-specific actions directly from its graphical user interface and allows for smooth integration with in-house databases, dashboards, and the project execution stack.

Verisium Manager is the epitome of efficiency in software/hardware validation. Its differentiating features, such as support for customization, unified data view, and comprehensive coverage and regression requirements, make it an indispensable tool for any validation team looking to elevate their workflow.

The application of real-time data processing or responsiveness is crucial, such as in high-performance computing, data centers, or applications requiring low-latency data transfers. It enables efficient use of PCIe bandwidth and resources by intelligently managing memory write operations based on system dynamics and workload priorities. By effectively leveraging Deferrable Memory Write [DMWr], Devices can achieve optimized performance and responsiveness, aligning with the evolving demands of modern computing applications.

What Is Deferrable Memory Write?

Deferrable Memory Write (DMWr) ECN introduced this new memory transaction type, which was later officially incorporated in PCIe 5.0 to CXL2.0. This enhanced type of memory transaction is Deferrable Memory Write [DMWr], which flows as another type of existing Read/Write memory transaction; the major difference of this Deferrable Memory Write, where the Requester attempts to write to a given location in Memory Space using the non-posted DMWr TLP Type, it Postponing their completion of memory write transactions to improve overall system efficiency and performance, those memory write operation can be delay or deferred until other priority task complete.

The Deferrable Memory Write (DMWr) requires the Completer to return an acknowledgment to the Requester and provides a mechanism for the recipient to defer (temporarily refuse to service) the Request.

DMWr provides a mechanism for Endpoints and hosts to choose to carry out or defer incoming DMWr Requests. This mechanism can be used by Endpoints and Hosts to simplify the design of flow control, reduce latency, and improve throughput. The Deferrable Memory writes TLP format in Figure A.

(Fig A) Deferrable Memory writes TLP format.

Example Scenario

Here's how the DMWr works with a simplified example: Imagine a system with an endpoint device (Device A) and a host CPU (Device B). Device B wants to write data to Device A's memory, but due to varying reasons such as system bus congestion or prioritization of other transactions, Device A can defer the completion of the memory write request. Just follow these steps:

1. Initiation of Memory Write: Device B initiates a memory write transaction to Device A. This involves sending the memory write request along with the data payload over the PCIe physical layer link.
2. Acknowledgment and Deferral: Upon receiving the memory write request, Device A acknowledges the transaction but may decide to defer its completion. Device A sends an acknowledgment (ACK) back to Device B, indicating it has received the data and intends to complete the write operation but not immediately.
3. Deferred Completion: Device A defers the completion of the memory write operation to a later, more opportune time. This deferral allows Device A to prioritize other transactions or optimize the use of system resources, such as memory bandwidth or processor availability.
4. Completion and Response: At a later point, Device A completes the deferred memory write operation and sends a completion indication back to Device B. This completion typically includes any status updates or additional information related to the transaction.

Usage or Importance of DMWr

Deferrable Memory Write usage provides the improvement in the following aspects:

• Reduced Latency: By deferring less critical memory write operations, more critical transactions can be processed with lower latency, improving overall system responsiveness.
• Improved Efficiency: Optimizes the utilization of system resources such as memory bandwidth and CPU cycles, enhancing the efficiency of data transfers within the PCIe architecture.
• Enhanced Performance: Allows devices to manage and prioritize transactions dynamically, potentially increasing overall system throughput and reducing contention.

Challenges in the Implementation of DMWr Transactions

The implementation of deferrable memory writes (DMWr) introduces several advancements and challenges in terms of usage and verification:

1. Timing and Synchronization: DMWr allows transactions to be deferred, complicating timing requirements or completing them within acceptable timing windows to avoid protocol violations. Ensuring proper synchronization between devices becomes critical to prevent data loss or corruption.
2. Protocol Compliance: Verification must ensure compliance with ECN PCIe 6.0 and CXL specifications regarding when and how DMWr transactions can be initiated and completed.
3. Performance Optimization: While DMWr can improve overall system performance by reducing latency, verifying its impact on system performance and ensuring it meets expected benchmarks is crucial.
4. Error Handling: Handling errors related to deferred transactions adds complexity. Verifying error detection and recovery mechanisms under various scenarios (e.g., timeout during deferral) is essential.

Verification Challenges of DMWr Transactions

The challenges to verifying the DMWr transaction consist of all checks with respect to Function, Timing, Protocol compliance, improvement, Error scenario, and security usage on purpose, as well as Data integrity at the PCIe and CXL.

1. Functional Verification: Verifying the correct implementation of DMWr at both ends of the PCIe link (transmitter and receiver) to ensure proper functionality and adherence to specifications.
2. Timing Verification: Validating timing constraints associated with deferring writes and ensuring transactions are completed within specified windows without violating protocol rules.
3. Protocol Compliance Verification: Checking that DMWr transactions adhere to PCIe and CXL protocol rules, including ordering rules and any restrictions on deferral based on the transaction type.
4. Performance Verification: Assessing the impact of DMWr on overall system performance, including latency reduction and bandwidth utilization, through simulation and testing.
5. Error Scenario Verification: Creating and testing scenarios to verify error handling mechanisms related to DMWr, such as timeouts, retries, and recovery procedures.
6. Security Considerations: Assessing potential security vulnerabilities related to DMWr, such as data integrity risks during deferred transactions or exposure to timing-based attacks.

Major verification challenges and approaches are timing and synchronization verification in the context of implementing deferrable memory writes (DMWr), which is crucial due to the inherent complexities introduced by deferred transactions. Here are the key issues and approaches to address them:

Timing and Synchronization Issues

1. Transaction Completion Timing:
   • Issue: Ensuring deferred transactions are completed within the specified time window without violating protocol timing constraints.
   • Approach: Design an internal timer and checker to model worst-case scenarios where transactions are deferred and verify that they are complete within allowable latency limits. This involves simulating various traffic loads and conditions to assess timing under different scenarios.
2. Ordering and Dependencies:
   • Issue: Verifying that transactions deferred using DMWr maintain the correct ordering and dependencies relative to non-deferred transactions.
   • Approach: Implement test scenarios that include mixed traffic of DMWr and non-DMWr transactions. Verify through simulation or emulation that dependencies and ordering requirements are correctly maintained across the PCIe link.
3. Interrupt Handling and Response Times:
   • Issue: Verify the handling of interrupts and ensure timely responses from devices involved in DMWr transactions.
   • Approach: Implement test cases that simulate interrupt generation during DMWr transactions. Measure and verify the response times to interrupts to ensure they meet system latency requirements.

In conclusion, while deferrable memory writes in PCIe and CXL offer significant performance benefits, their implementation and verification present several challenges related to timing, protocol compliance, performance optimization, and error handling. Addressing these challenges requires rigorous testing and testbench of traffic, advanced verification methodologies, and a thorough understanding of PCIe specifications and also the motivation behind introducing this Deferrable Write is effectively used in the CXL further. Outcomes of Deferrable Memory Write verify that the performance benefits of DMWr (reduced latency, improved throughput) are achieved without compromising timing integrity or violating protocol specifications.

In summary, PCIe and CXL are complex protocols with many verification challenges. You must understand many new Spec changes and consider the robust verification plan for the new features and backward compatible tests impacted by new features. Cadence's PCIe 6.0 Verification IP is fully compliant with the latest PCIe Express 6.0 specifications and provides an effective and efficient way to verify the components interfacing with the PCIe 6.0 interface. Cadence VIP for PCIe 6.0 provides exhaustive verification of PCIe-based IP and SoCs, and we are working with Early Adopter customers to speed up every verification stage.

More Information

• For more info on how Cadence PCIe Verification IP and TripleCheck VIP enable users to confidently verify PCIe 6.0, see our VIP for PCI Express, VIP for Compute Express Link, and TripleCheck for PCI Express
• See the PCI-SIG website for more details on PCIe in general and the different PCI standards.

The Sigrity and Systems Analysis (SIGRITY/SYSANLS) 2024.1 release is now available for download at Cadence Downloads . For the list of CCRs fixed in this release, see the README.txt file in the installation hierarchy. SIGRITY/SYSANLS 2024.1 Here is a list of some of the key updates in the SIGRITY/SYSANLS 2024.1 release: For more details about these and all the other new and enhanced features introduced in this release , refer to the following document: Sigrity Release Overview and Common Tools What's New . Supported Platforms and Operating Systems Platform and Architecture X86_64 (lnx86) Windows (64 bit) Development OS RHEL 8.4 Windows Server 2022 Supported OS RHEL 8.4 and above RHEL 9 SLES 15 (SP3 and above) Windows 10 Windows 11 Windows Server 2019 Windows Server 2022 Systems Analysis 2024.1 Clarity 3D Solver Clarity 3D Layout Structure Optimization Workflow : A new workflow, Clarity 3D Layout Structure Optimization Workflow, has been added to Clarity 3D Layout. This workflow integrates Allegro PCB Designer with Clarity 3D Layout for high-speed structure optimization. Component Geometry Model Editor : The new Clarity 3D Layout editor lets you set up ports, solder bumps/balls/extrusions, and two-terminal and multi-terminal circuits using a single GUI. Coaxial Open Port Option Added to Port Setup Wizard : The Coaxial Open Port option lets you create ports for each target net pin and reference net pin in Clarity 3D Layout. The nearby reference net pins are then used as a reference for each target net pin, reducing the number of ports needed. In addition, the ports of unused reference net pins are shorted to the ground. Parametric Import Option Added : Two new options, Parametric Import and Default Import , have been added to the Tools – Launch Clarity3DWorkbench menu. The Parametric Import option lets you import the design along with its parameters into Clarity 3D Workbench. The Default Import option lets you ignore the parameters when importing the design into Clarity 3D Workbench. Component Library Added to Generate 3D Components : Clarity 3D Workbench now includes a new component library that lets you use predefined 3D component templates or add existing 3D components to create 3D designs and simulation models. AI-Powered Content Search Capability : Clarity 3D Workbench and Clarity 3D Transient Solver now support an AI-powered capability for searching the content and displaying relevant information. Expression Parser to Handle Undefined Parameters : Clarity 3D Workbench and Clarity 3D Transient Solver support writing expressions or equations containing undefined parameters in the Property window to describe a simulation variable. The improved expression parser automatically detects any undefined parameter in an expression and prompts users to specify their values. This capability lets you define a model or a simulation variable as a function instead of specifying static values. For detailed information, refer to Clarity 3D Layout User Guide and Clarity 3D Workbench User Guide on the Cadence Support portal. Clarity 3D Transient Solver Mesh Processing Improved to Simulate Large Use Cases : Clarity 3D Transient Solver leverages a new meshing algorithm that enhances overall mesh processing, specifically for large designs and use cases. The new algorithm dramatically improves the mesh quality, minimum mesh size, number of mesh key points, total mesh number, and memory usage. Advanced Material Processing Engine : The material processing capability has been enhanced to handle thin outer metal, which previously resulted in open and short issues in some designs. In addition, the material processing engine offers improved mode extraction for particular use cases, including waveguide and coaxial designs. Characteristic Impedance Calculation Improved : The solver engine now uses a new analytical calculation method to calculate the characteristic impedance of coaxial designs with improved accuracy. For detailed information, refer to Clarity 3D Transient Solver User Guide on the Cadence Support portal. Celsius Studio Celsius Interchange Model Introduced : Celsius Studio now supports Celsius Interchange Model generation, which is a 3D model derived from detailed physical designs for multi-physics and multi-scale analysis. This Celsius Interchange Model file ( .cim ) serves as a design information carrier across Celsius Studio tools, enabling a variety of simulation and analysis tasks . Celsius 3DIC Thermal Workflow Improvements : The Thermal Simulation workflows in Celsius 3DIC have been significantly enhanced. Key improvements include: Advanced Power Setup with Transient Power Function and Multi Mode options Enhanced GUI for the Mesh Control and Simulation Control tabs Improved meshing capabilities Celsius Interchange Model ( .cim ) generation Material library support for block and connections Import of Heat Transfer Coefficients (HTCs) from a CFD file Bump creation through the Bump Array Wizard Layer Stackup CSV file generation Celsius 3DIC Warpage and Stress Workflow Enhancements : The Warpage and Stress workflow in Celsius 3DIC has undergone significant improvements, such as: Improved multi-stage warpage simulation flow for 3DIC packaging process Enhanced GUI for the Mesh Control , Simulation Control , and Stress Boundary Conditions tabs Support for large deformations and temperature profiles Bump creation through the Bump Array Wizard New constraint types Enhanced meshing capabilities Geometric Nonlinearity Support in Warpage and Stress Analysis : Large deformation analysis is now supported in warpage and stress studies. This study uses the Total Lagrangian approach to model geometric nonlinearities in simulation, which allows accurate prediction of final deformations. Thermal Network Extraction and Simulation : In the solid extraction flow in Celsius 3D Workbench, you can now import area-based power map files to create terminals. For designs with multiple blocks, this capability allows automatic terminal creation, eliminating the need to manually create and set up 2D sheets individually. Additionally, thermal throttling feature is now supported in Celsius Thermal Network. This makes it ideal for preliminary analyses or when a quick estimation is required. It runs significantly faster than 3D models, allowing for quicker iterations and more efficient decision-making. For detailed information, refer to the Celsius 3DIC User Guide , Celsius Layout User Guide and Celsius 3D Workbench User Guide on the Cadence Support portal. Sigrity 2024.1 Layout Workbench Improved Graphical User Interface : A new option, Use Improved User Interface , has been added in the Themes page of the Options dialog box in the Layout Workbench GUI. In the new GUI, the toolbar icons and menu options have been enhanced and rearranged. For detailed information, refer to Layout Workbench User Guide on the Cadence Support portal. Broadband SPICE Python Script Integration with Command Line for Simulation Tasks : Broadband SPICE lets you run Python scripts directly from the command line for performing simulation and analysis. The new -py and *.py options make it easier to integrate Python scripts with the command-line operations. This update streamlines the process of automating and customizing simulations from the command line, which makes your simulation tasks faster and easier. For detailed information, refer to Broadband SPICE User Guide on the Cadence Support portal. Celsius PowerDC Block Power Assignment (BPA) File Format Support : PowerDC now supports the BPA file format. Similar to the Pin Location (PLOC) file, the BPA file is a current assignment file that defines the total current of a power grid cell, which is then equally distributed across the power pins within the cell. This provides better control over the power distribution. Ability to Run Multiple IR Drop Cases Sequentially : You can now select multiple result sinks from the Current-Limited IR Drop flow and run IR Drop analysis for them sequentially. PowerDC automatically runs the simulations in sequence after you select multiple result sinks. This saves time by automating the process. Enhanced Support for Mixed Conversion Devices : PowerDC now supports mixing different conversion devices, such as switching regulators and linear regulators within a single DC-DC/LDO instance. This enhancement offers added flexibility by letting you configure each instance in your design according to your specific needs. For detailed information, refer to PowerDC User Guide on the Cadence Support portal. PowerSI Monte Carlo Method Added : A new option, Monte Carlo Method, has been added in the Optimality dialog box. This option lets you create multiple random samples to depict variations in the input parameters and assess the output. Channel Check Optimization Added : The S-Parameter Assessment workflow in PowerSI now supports Channel Check Optimization . It uses the AI-driven Multidisciplinary Analysis and Optimization (MDAO) technology that lets you optimize your design quickly and efficiently with no accuracy loss. For detailed information, refer to PowerSI User Guide on the Cadence Support portal. SPEEDEM Multi-threaded Matrix Solver Support Added : The Enable Multi-threaded Matrix Solver check box has been added that lets you accelerate the simulation speed for high-performance computing. This check box provides two options, Automatic and Always, to include the -lhpc4 or -lhpc5 parameter, respectively, in the SPEEDEM Simulator (SPDSIM) before running the simulation. For detailed information, refer to the SPEEDEM User Guide on the Cadence Support portal. XtractIM Options to Skip or Calculate Special DC-R Simulation Results : The Skip DC_R of Each Path and Only DC_R of Each Path options have been added to the Setup menu. Skip DC_R of Each Path : This option lets you skip the calculation of the DC-R result during the simulation. Other results, such as SPICE T-model , RL_C of Each Path , Coupling of Each Path , etc., are still calculated. Only DC_R of Each Path : This option lets you calculate the DC-R result only during the simulation. Other results, such as SPICE T-model , RL_C of Each Path , Coupling of Each Path , etc., are not calculated. Color Assignment for Pin Matching : The MCP Auto Connection window includes the Display Color Editor , which lets you assign a color for pin matching. It helps you easily identify the matching pins in the left and right sections of the MCP Auto Connection window . Ability to Save Simulations Individually : The Save each simulation individually check box has been added to the Tools - Options - Edit Options - Simulation (Basic) - General form. Select this check box and run the simulation to generate a simulation results folder containing files and logs with a timestamp for each simulation. Reuse of SPD File Settings : The XtractIM setup check box lets you import an existing package setup to reuse the configurations and settings from one .spd file to another. For detailed information, refer to XtractIM User Guide on the Cadence Support portal. Documentation Enhancements Cloud-Based Help System Upgraded The cloud-based help system, Doc Assistant, has been upgraded to version 24.10, which contains several new features and enhancements over the previous 2.03 version. Sigrity Release Team Please send your questions and feedback to sigrity_rmt@cadence.com .

Wild River Technology (WRT), the leading supplier of signal integrity measurement and optimization test fixtures for high-speed channels at data rates of up to 224G, has announced the availability of a new advanced channel modeling solution that helps achieve extreme signal integrity design to 70GHz. Read the press release. The CMP-70 program continues the industry-first simulation-to-measurement collaboration with Cadence that was initially established with the CMP-50. Significant resources were dedicated to the development of the CMP-70 by Cadence and WRT over almost three years. The CMP-70 will be on display at DesignCon 2025 , January 28-30, in Cadence booth 827 to benchmark the Cadence Clarity 3D Solver . “I am not a fan of hype-based programs that simply get attention,” remarked Alfred P. Neves, WRT’s co-founder and chief technical officer. “Both Cadence and Wild River brought substantial skills to the table in this project as we continued our industry-first simulation-to-measurement collaboration. The result is a proven, robust and accurate platform that brings extreme signal integrity to 70GHz designs. This application package has also been instrumental in demonstrating the robust 3D EM simulation capability of the Cadence Clarity solver.” “We’re delighted to continue the joint development and validation program with WRT that started with the CMP-50,” said Gary Lytle, product management director at Cadence. “The skilled and experienced signal integrity technologists that both companies bring to the program results in a superior signal integrity solution for our mutual customers.” CMP-70 Solution Features The solution is available both in a standard configuration and as a custom solution for customer-specific stackups and fabrication. The primary target application is to support a 3D EM solver analysis modeling versus the time- and frequency-domain measurement methodologies. The solution features include: The CMP-70 platform, assembled and 100% TDR NIST traceable tested, with custom stands Material Identification overview web-based meeting including anisotropic 3D material identification A cross-section PCB report and structures for using as-fabricated geometries Measured S-parameters, pre-tested for quality (passivity/causality and resampled for time domain simulations) A host of novel crosstalk structures suited for 112G HD level project analysis PCB layout design files (NDA required) An EDA starter library including loss models with industry-first accurate surface roughness models Comprehensive training available for 3D EM analysis – correspondence, material ID in X-Y and Z axis for a host of EDA tools Industry-First Hausdorff Technique The WRT application package also includes an industry-first modified Hausdorff (MHD) technique , included as MATLAB code. This algorithmic approach provides an accurate way to compare two sets of measurements in multi-dimensional space to determine how well they match. The technique is used to compare the results simulated by the Clarity solver with those measured on the CMP-70 platform. The methodology and initial results are shown in the figure below, where the figure of merit (FOM) is calculated from 10, 35, and finally to 50GHz. The MHD algorithm requires a MATLAB license, but WRT also accommodates customer data as another option, where WRT provides the comparison between measured and simulated data. Additional Resources If you are attending DesignCon 2025 , be sure to stop by Cadence booth 827 to see WRT’s CMP-70 advanced channel modeling solution in action with the Clarity 3D Solver. Check out our on-demand webinar, " Validating Clarity 3D Solver Accuracy Through Measurement Correlation ." Learn more about the CMP-70 solution and the Clarity 3D Solver . For more information about Cadence’s full suite of integrated multiphysics simulation solutions, download our Multiphysics System Analysis Solutions Portfolio .

As a verification engineer, you’re surely looking for ways to automate the debugging process. Have you developed your own scripts to ease specific debugging steps that tools don’t offer? Working with scripts locally and manually is challenging—so is reusing and organizing them. What if there was a way to create your own app with the required functionality and register it with the tool? The answer to that question is “Yes!” The Verisium Debug Python App Store lets you instantly add additional features and capabilities to your Verisium Debug Application using Python Apps that interact with Verisium Debug via the Python API. Join me, Principal Education Application Engineer Bhairava Prasad, for this Training Webinar and discover the Verisium Debug Python App Store. The app store allows you to search for existing apps, learn about them, install or uninstall them, and even customize existing apps. Date and Time Wednesday, November 20, 2024 07:00 PST San Jose / 10:00 EST New York / 15:00 GMT London / 16:00 CET Munich / 17:00 IST Jerusalem / 20:30 IST Bangalore / 23:00 CST Beijing REGISTER To register for this webinar, sign in with your Cadence Support account (email ID and password) to log in to the Learning and Support System*. Then select Enroll to register for the session. Once registered, you’ll receive a confirmation email containing all login details. A quick reminder: If you haven’t received a registration confirmation within one hour of registering, please check your spam folder and ensure your pop-up blockers are off and cookies are enabled. For issues with registration or other inquiries, reach out to eur_training_webinars@cadence.com . Like this topic? Take this opportunity and register for the free online course related to this webinar topic: Verisium Debug Training To view our complete training offerings, visit the Cadence Training website Want to share this and other great Cadence learning opportunities with someone else? Tell them to subscribe . Hungry for Training? Choose the Cadence Training Menu that’s right for you. Related Courses Xcelium Simulator Training Course | Cadence Related Blogs Unveiling the Capabilities of Verisium Manager for Optimized Operations - Verification - Cadence Blogs - Cadence Community Verisium SimAI: SoC Verification with Unprecedented Coverage Maximization - Corporate News - Cadence Blogs - Cadence Community Verisium SimAI: Maximizing Coverage, Minimizing Bugs, Unlocking Peak Throughput - Verification - Cadence Blogs - Cadence Community Related Training Bytes Introducing Verisium Debug (Video) (cadence.com) Introduction to UVM Debug of Verisium Debug (Video) (cadence.com) Verisium Debug Customized Apps with Python API Please see course learning maps a visual representation of courses and course relationships. Regional course catalogs may be viewed here . *If you don’t have a Cadence Support account, go to Cadence User Registration and complete the requested information. Or visit Registration Help .

This year, the Cadence Giving Foundation (CGF) launched Fem.AI to achieve a more inclusive tech sector, and the inaugural Fem.AI Summit that took place on October 1 was a luminary in a world where technology is evolving at an unprecedented pace. The summit not only excelled in its mission to enlighten, empower, and mobilize stakeholders across various industries on the issue of gender disparity in high tech and AI, but was a celebration of innovation, diversity, and empowerment. As we reflect on the moments that made the summit unforgettable, it's clear that the event was more than just a meeting of minds—it was a movement for change! Shaping Tomorrow Together Cadence’s president and CEO, Anirudh Devgan, stated, “Women’s talent and perspectives are crucial to shaping the future of AI.” Devgan’s words epitomized the driving force behind the first-ever Fem.AI Summit which brought together innovators, educators, business leadership, and investors across industries to create an ecosystem that ensures women can fully participate in the AI revolution and burgeoning AI economy. The energy of pioneers ready to collectively disrupt the status quo filled the air, and as the day-long summit began, it became clear that we were part of something truly groundbreaking. The event's lineup of speakers held discussions that went beyond the technical aspects of AI, emphasizing the vital importance of diversity in technology. Such insights were lent by leading voices from MIT, Stanford, and UC Berkeley, who set the stage for inspiring discussions with speakers like Dr. Joy Buolamwini, Founder of the Algorithmic Justice League, and Reshma Saujani, Founder and CEO of Moms First and Girls Who Code. Included in this lineup of leading figures was Dr. Chelsea Clinton, Vice Chair of the Clinton Foundation, who left us with her hopes for the future of women in AI: “I’m hoping because of company-wide commitments like what we’re experiencing here today thanks to Cadence, that the people who will be part of designing [future technologies] will have a different group of people around the proverbial table or the computer screens doing that… and that women will be more integral into the conceptualization and then the actualization of AI-driven enterprises.” The hopes and visions for women in AI cannot manifest in a vacuum, they must be achieved with the support of individuals and systems from education all the way to the upper echelons of leadership. It is with this understanding, that Fem.AI is committed to investing in women at every stage of their STEM journey. Breaking Barriers It is with this ideal that we were honored to hear from women breaking through barriers of gender, race, and class in achieving pinnacles of success in areas of science and technology. Dr. Sarah H. Chen, Postdoctoral Researcher at Stanford and Thriving Stars Scholar at MIT, Niki Karanikola, Machine Learning Engineer and Break Through Tech AI Scholar at MIT, and Katya Echazarreta, NASA’s first Mexican Astronaut, showcased the resilience and determination that drive progress within and beyond our industry. Through their stories of persevering despite all odds, we were reminded that supporting students in STEM can create generational change with impacts beyond the realms of AI and technology. The final speaker at the Cadence Fem.AI Summit, the trailblazing Brandi Chastain, Founder of Bay FC, World Cup Champion, and Olympic Gold Medalist, left us with a powerful reminder that when faced with this opportunity: “Our purpose needs to be intentional” especially in building the future of technology and AI where “diversity is not something to be afraid of, but something to be embraced.” Echoing this sentiment, summit attendees left the event reminded of the crucial role we collectively play in ensuring women are part of this tech revolution. Moving Forward While the summit may have concluded, its impact will continue through individuals, companies, and communities aspiring to achieve an equitable tech sector. This is just the start, and we must take collective action now. We hope that you will join Cadence to ensure that we clear the path and catalyze women's role in the AI revolution! Meet Our Partners Our partners are making Fem.AI’s vision a reality through their important work advancing women in technology, including fostering STEM excellence in higher education, launching STEM careers, and achieving gender diversity in leadership. Learn more about the important work of each of our partners by visiting their pages: Break Through Tech Last Mile Education Fund Fast Forward Generation VC Include Global Semiconductor Alliance Join the Fem.AI Alliance Joining the Fem.AI Alliance signals that your company or institution is committed to evolving the AI workforce. By increasing the representation of women in AI, we aim to broaden the talent pool and the perspective so that AI represents us all. Through the Fem.AI Alliance, companies and institutions can share best practices, guidance, and inspiration. Since its launch, companies like the Equinix Foundation, NetApp, NVIDIA, Unity Technologies, and Workday have joined the Alliance in their commitment to Fem.AI’s work and mission. Visit Fem.AI to get involved today or contact Fem.AI@cadence.com .

In this edition of the Women in CFD series, we feature Vassiliki Moschou, aka Vicky, senior supervisor at BETA CAE, now part of Cadence. Her career journey serves as an inspiration for anyone who believes that studying in one field and working in another is less desirable. Vicky demonstrates how knowledge gained in one discipline can be effectively applied in another, often providing fresh and intriguing insights. Join us in this conversation to learn more about Vicky, her career path, and her advice for those considering a career in a field different from their studies. Tell us something about yourself. I've lived all my 41 years in the vibrant city of Thessaloniki, Greece. I’m married to my high school sweetheart, and together we're raising two incredible daughters who are 11 and almost 8 years old. These girls are absolutely the center of my world, and every day with them feels like a gift. My entire life, including where I have built my career and family, is deeply rooted in Thessaloniki. It's not just where I am from; it's a big part of who I am. Could you share your educational background and how you first became interested in computational fluid dynamics (CFD)? In 2001, I started my academic journey at the Computer Science Department of Aristotle University of Thessaloniki , where I focused on studying signal processing and artificial intelligence. This field fascinated me, and I pursued a master’s degree in the same area to further my expertise. Concurrently, I was involved in European research programs on signal/audio processing and machine learning methodologies. It became evident early on that my career would revolve around software engineering, a path I was fully prepared to pursue. However, everything took a turn when I joined BETA CAE in 2008. It was there that I was introduced to the field of CFD, which was completely unfamiliar to me at the time. This presented a new challenge that I eagerly accepted. I received support from all my colleagues, but I was primarily mentored by two brilliant and dedicated engineers, Michael Giannakidis and Vangelis Skaperdas , who introduced me to the world of CFD. Over time, what was once an unknown territory for me has become my passion. My journey through CFD has been a significant part of my professional growth. In my 30s, I pursued and completed a PhD in systems physiology in collaboration with the Medical and Computer Science Departments of Aristotle University of Thessaloniki. Our research focused on examining the EGF-activated MAPK pathway (often associated with cancer) from the perspective of complex self-organizing systems. Using graph theory, signal processing, and machine learning, we extracted information from the signals observed in this dynamic, distributed biological system to target novel drug development. What are the different positions you have held within the company, and what responsibilities do you currently hold? I started my career as a junior engineer at BETA CAE (now Cadence). It was a role that plunged me deep into the fascinating worlds of software and CFD, a crucial time of my career filled with learning and growth. My hard work and dedication didn't go unnoticed, and after a few years, I was promoted. That promotion was the first step on a career ladder that I've been ascending ever since. Now, I'm in the position of a senior supervisor. Though my job now involves a wide range of managerial tasks, I'm still deeply passionate about the technical side of things. I love writing code and working through the complexities of our projects, merging my leadership responsibilities with my enthusiasm for the technical facets of our work. What would you be doing if not working in CFD? Had my career taken a different trajectory, I envision myself in a role deeply embedded in human connections—perhaps as the owner of a quaint bakery or a cozy hotel, a teacher, or even venturing into human resources. There's a certain allure in careers that foster direct engagement with people, creating experiences and memories. In fact, I have an inherent desire to connect and communicate with people, aspects that are fundamentally different yet equally fulfilling as my current career. What are some of your favorite pastimes and hobbies? Family is at the center of my leisure time. We love taking short trips to the village, hanging out with our friends, and connecting. Our activities range from solving puzzles in escape rooms to passionately cheering at basketball games, especially since my older daughter has taken up the sport. But beyond these activities, being a mother is my most cherished pastime. The moments I share with my daughters, the lessons we learn together, and the joy we find in everyday adventures are what I hold dear. What are your thoughts on women in technical fields? The landscape for women in technical fields is gradually transforming, a change I observe with optimism and hope. In Greece, the increasing presence of women in engineering is a positive sign. In Cadence specifically, the representation of women is high compared to other tech companies. As a mother to two daughters, I am acutely aware of the importance of being a role model to them. It's crucial to demonstrate that aspirations should not be limited by gender and that the technical field is as much a place for women as it is for men. Encouraging this mindset is vital for the progress of our society and for the empowerment of the next generation of women in technology. Advice from Vicky for those considering a career in a field different from their studies: Learning is a lifelong journey. Embrace every challenge as an opportunity to grow and learn something new. Stay curious and adaptable to navigate the ever-evolving landscape of technology. Being labeled an 'expert' is less important than the willingness to learn and adapt. Finding happiness in your work can lead to natural success. In the epoch of artificial intelligence, train the most powerful neural network: your brain. At Cadence, our commitment is towards establishing an inclusive workspace where women feel empowered to achieve their professional best. Anchored by our One Cadence—One Team ethos, we take pride in fostering a community where our driven, devoted, and skilled women employees excel, making exceptional contributions to our customers, communities, and one another. Are you just like Vicky, venturing beyond your academic background, and considering a career in a different domain while being surrounded by an encouraging and uplifting atmosphere? Then, you won't want to miss exploring career opportunities at Cadence—celebrated as 'A Great Place for Women to Work'! Click the button below to discover your next adventure! Learn more about Cadence Fem.AI Alliance, which aims to lead the gender equity revolution in the AI workforce.

Hearing is one of the most essential senses for engaging with the world. It enables us to converse, appreciate music, and remain alert to our surroundings. Hearing loss is a prevalent issue affecting millions of individuals globally and disconnecting them from a world where sound is vital to others and the environment. The World Health Organization (WHO) reports that over 5% of the global population requires hearing rehabilitation, a striking statistic highlighting this issue's pervasive nature. Technology has transformed audiology, evolving from simple ear trumpets to sophisticated modern hearing aids. This advancement began with the invention of the transistor, paving the way for devices that are fully wearable inside or behind the ear. Although hearing aids have been available for many years, historically, access to these critical devices has been insufficient, resulting in numerous individuals lacking the necessary support. However, recent advances in hearing aid technology promise improved acoustic experiences, employing modern techniques like binaural processing and neural networks. These innovations demand sophisticated architecture to balance high memory needs with low power consumption in a user-friendly design. Cadence is at the forefront of this technological evolution, offering tools and IP solutions that enhance the accessibility, efficiency, and impact of hearing aids, paving the way for a more inclusive future. This blog explores how Cadence's advanced DSPs are transforming hearing aid design and making them more accessible, efficient, and impactful. Hearing Aids: A Testament to Human Ingenuity The transition from analo g to digital technology in the late 20th century further transformed hearing aids, offering superior sound quality, customization, and the ability to connect to various electronic devices, thus enhancing the user experience markedly. Today's hearing aids are highly effective, versatile, and nearly invisible, a significant advancement from early attempts to address hearing loss. They also feature advanced noise cancellation and connectivity options, allowing users to integrate seamlessly into the digital world. This progression not only highlights the industry's commitment to improving user experience and accessibility but also offers a glimpse into a future where hearing loss is no longer a barrier. Challenges Despite advancements and sophistication, there are several challenges related to hearing aid design and adoption. Users demand smaller, more discreet devices that don't sacrifice performance. While the shift towards sleeker designs is aesthetically pleasing, it introduces substantial complexities in product design. Designers face the challenges of integrating essential components, such as batteries and peripherals, into increasingly compact spaces. Power consumption remains a critical concern, as these devices must remain operational throughout the day. Leveraging neural networks to enhance the signal-to-noise ratio (SNR) for better quality demands additional memory capacity. Consequently, there is a pressing need for flexible, low-power architectures that incorporate all necessary memory and peripherals without compromising the device’s compact size. Adopting AI for adjusting hearing aid volume to fit an individual's specific auditory requirements is a significant challenge and demands more memory and effort. Besides this, reliability and cost are significant challenges for manufacturers. Cadence's Role in Transforming Hearing Aids In hearing aid development, the capacity to evaluate the energy efficiency of SoCs across different frequencies in real time is crucial. These applications demand cohesive, energy-efficient solutions that can uphold high performance. The Cadence Tensilica HiFi and Fusion F1 DSP family emphasize minimal power usage while providing robust performance, ideally suited for a wide range of audio and voice applications. The Cadence Tensilica HiFi DSP family, a high-performance audio technology with AI acceleration and advanced DSP capability, offers feature-rich audio, speech, and imaging for wearables, automotive, home entertainment, digital assistants, and ASR. The Tensilica HiFi DSP family accelerates innovation with its comprehensive instruction set and supports fixed- and floating-point data types. Simplifying software development, it offers C/C++ programming, an auto-vectorizing compiler, and a rich DSP software library through the Cadence Tensilica Xplorer development environment. With the flexibility to customize and enhance performance through additional instructions and better I/O bandwidth, the Tensilica HiFi and Fusion DSP families offer a robust, low-energy audio solution compatible across an expansive software ecosystem for various applications and devices. Conclusion Technological advancements are driving hearing aid evolution; the future of hearing aids lies in further miniaturization and functionality enhancement. Cadence's ongoing innovations aim to improve signal processing and noise reduction, even in challenging environments. The integration of neural networks promises more apparent sound transmission and greater adaptability. Cadence is working on improving how these devices process signals and reduce noise and has initiated a collaborative venture with distinguished entities like GlobalFoundries (GF), Hoerzentrum Oldenburg gGmbH, and Leibniz University Hannover. This collaboration has borne fruit in the form of the industry's first binaural hearing aid system-on-chip (SoC) prototype, the Smart Hearing Aid Processor ( SmartHeAP ). Learn More Cadence, GlobalFoundries, Hoerzentrum Oldenburg and Leibniz University Hannover Collaborate to Advance Hearing Aid Technology Cadence Extends Battery Life and Improves User Experience for Next-Generation Hearables, Wearables and Always-On Devices Advancing the Future of Hearing Aids with Cadence Bluetooth LE Audio, Hearing Aids, and Mindtree

The demand for higher compute performance, energy efficiency, and faster time-to-market drove the conversations at this year's Open Compute Project (OCP) Global Summit in San Jose, California. It was the scene of showcasing groundbreaking innovations, expert-led sessions, and networking opportunities to drive the future of data center technology. For those who didn't get to attend or stop by our booth, here's a recap of Cadence's comprehensive solutions that enable next-generation compute technology, AI data center design, analysis, and optimization. Optimized Data Center Design and Operations As the data center community increasingly faces demands for enhanced efficiency, thermal management, sustainability, and performance optimization, data center operators, IT managers, and executives are looking for solutions to these challenges. At the Cadence booth, attendees explored the Cadence Reality Digital Twin Platform and Celsius EC Solver. These technologies are pivotal in achieving high-performance standards for AI data centers, providing advanced digital twin modeling capabilities that redefine next-generation data center design and operation. The Celsius EC Solver demonstration showed how it solves challenging thermal and electronics cooling management problems with precision and speed. CadenceCONNECT: Take the Heat Out of Your AI Data Center Cadence hosted a networking reception on October 16 titled "Take the Heat Out of Your AI Data Center." In today's AI era, managing the heat generated by high-density computing environments is more critical than ever. This reception offered insights into current and emerging data center technologies, digital twin cooling strategies that deliver energy-saving operations, and a chance to engage with industry leaders, Cadence experts, and peers to explore the latest cooling, AI, and GPU acceleration advancements. Here's a recap: Researcher, author, and entrepreneur Dr. Jon Koomey highlighted the inefficiency of data centers in his talk "The Rise of Zombie Data Centers," noting that 20-30% of their capacity is stranded and unused. He advocated for organizational changes and technological solutions like digital twins to reduce wasted energy and improve computational effectiveness as AI deployments increase. In "A New Millennium in Multiphysics System Analysis," Cadence Corporate VP Ben Gu explained the company's significant strides in multiphysics system analysis, evolving from chip simulation to a broader application of computational software for simulating various physical systems, including entire data centers. He noted that the latest Cadence venture, a digital twin platform for data center optimization, opened the opportunity to use simulation technology to optimize the efficiency of data centers. Senior Software Engineering Group Director Albert Zeng highlighted the Cadence Reality DC suite's ability to transform data center operations through simulation, emphasizing its multi-phase engine for optimal thermal performance and the integration of AI capabilities for enhanced design and management. A panel discussion titled "Turning AI Factory Blueprints into Reality at the Speed of Light" featured industry experts from NVIDIA, Norman Wright Precision Environmental and Power, NV5, Switch Data Centers, and Cadence, who explored the evolving requirements and multidimensional challenges of AI factories, emphasizing the need for collaboration across the supply chain to achieve high-performing and sustainable data centers. Watch the highlights. Transforming Designs from Chips to Data Centers The OCP Global Summit 2024 has reaffirmed its status as a pivotal event for data center professionals seeking to stay at the forefront of technological advancements. Cadence's contributions, from groundbreaking digital twin technologies to innovative cooling strategies, have shed light on the path forward for efficient, sustainable data centers. For data center professionals, IT managers, and engineers, the insights gained at this summit are invaluable in navigating the challenges and opportunities presented by the burgeoning AI era. Partnering with Arm Arm Total Design Cadence is a member of the Arm Total Design program. At an invitation-only special Arm event, Cadence's VP of Research and Development, Lokesh Korlipara, delivered a presentation focusing on data center challenges and design solutions with Arm Neoverse Compute Subsystem (CSS). The session highlighted: Efficient integration of Arm Neoverse CSS into system on chips (SoCs) with pre-integrated connectivity IP Performance analysis and verification of the Neoverse CSS integration into the SoC through Cadence's System VIP verification suite and automated testbench creation, enhancing both quality and productivity Jumpstarting designs through Cadence's collaboration with Arm for 3D-IC system planning, chiplets, and interposers Design Services readiness and global scale to support and/or deliver the most demanding Arm Neoverse CSS-based SoC design projects Cadence Supports Arm CSS in Arm Booth During the event, Cadence conducted a demo in the Arm booth that showcased the Cadence System VIP verification suite. The demo highlighted automated testbench creation and performance analysis for integrating the Arm CSS into SoCs while enhancing verification quality and productivity. Summary Cadence offers data center solutions for designing everything from the compute and networking chips to the board, racks, data centers, and campuses. Stay connected with Cadence and other industry leaders to continue exploring the innovations set to redefine the future of data centers. Learn More Cadence Joins Arm Total Design Cadence Arm-Based Solutions Cadence Reality Digital Twin Platform