The TicWatch Pro 3 Ultra packs some nifty features, in addition to impressive battery endurance.

The post Save up to 50% with the TicWatch Pro 3 Ultra! appeared first on Phandroid.

Shared by Gator Boys star Paul Bedard, the viral video shows the alligator emerging from his den to the tune of the iconic song.

In this clip, Steve Jobs pauses for 18 seconds to contemplate a question deeply before answering.

Kapil Sharma wasted no time in diving into their personal stories, focusing on how Deepinder met his Mexican wife.

Zomato witnesses approximately 400,000 cancelled orders monthly which prompted it to launch the initiative.

A guidance has been issued to the wealthier students with a list of actions they need to follow to create an inclusive environment.

Positioned near the side of her head, the eye provides an expansive field of vision, while a thick layer of protective blubber shields it from harm and maintains warmth.

The video features models dressed in the latest fashion, strutting like mannequins on a moving runway outside the designer store ITIB.

The $20 Merry Multiplier scratch-off ticket she chose turned out to be a $250,000 top prize winner.

The prankster claims that as many as seven schools fell prey to his prank and made the hats.

A man recently took to Reddit, seeking help identifying an unknown Devanagari text he found at a flea market in Germany.

The post has sparked a heated debate about Bengaluru's rising rental prices and the need for a cap on deposits.

The offer is valid across the US. Some of its international locations - the chain operates in 40 countries - also have World Kindness Day promotions planned.

Wind River, an IoT and industrial operating system owned by Intel will be acquired by TPG, global alternative asset firm. Terms of the deal were not disclosed. Intel had bought Wind River Systems for $884 million in 2009

Wind River operates in several markets, including aerospace and defense, automotive, industrial, medical and networking technologies. Its core products in these markets are operating systems, software infrastructure platforms, device management, and simulation software. The IoT practice of Wind River provides consulting services for customers building IoT applications.

In a statement for Wind River, Nehal Raj, Partner and Head of Technology investing at TPG said “We see a tremendous market opportunity in industrial software driven by the convergence of the Internet of Things (IoT), intelligent devices and edge computing. As a market leader with a strong product portfolio, Wind River is well positioned to benefit from these trends. We are excited about the prospects for Wind River as an independent company, and plan to build on its strong foundation with investments in both organic and inorganic growth.”

Wind River’s main IoT product is Helix Device Cloud, a cloud-offering capable of managing deployed IoT devices and industrial equipment across a machine’s lifecycle. Helix can connect and manage devices remotely.

Helix platform’s key uses cases are gateway management, proactive maintenance, security updates, and device provisioning.

IFTTT (If This Than That), a web-based software that automates and connects over 600 online services/software raised a $24M Series C led by Salesforce. Other investors include IBM and the Chamberlain Group and Fenox Venture Capital.

The latest round brings IFTTT’s funding to $63M and it will use the funding proceeds to provide integration for enterprise and IoT services and hiring. In IFTTT’s platform, applets are code/script users need to deploy to integrate two or more services (such Google Drive’s integration with Twitter/Facebook).

Investment in IFTTT reveals that Salesforce is consolidating its presence in enterprise IoT space. It also acquired Mulesoft, an integration platform that rivals Microsoft’s BizTalk.

IBM’s investment in IFTTT is also noteworthy as the former is pushing its IBM Watson IoT platform. The following statement also shows its keen interest in IFTTT.

Other recent investments in IoT companies include $30M Series B of Armis and Myriota's $15M for its IoT satellite-based connectivity platform.

For latest IoT funding and product news, please visit our IoT news section.

Vesper, the maker of piezoelectric sensors used in microphone production and winner of CES Innovation Award 2018 raised a $23M Series B round. American Family Ventures led the investment with participation from Accomplice, Amazon Alexa Fund, Baidu, Bose Ventures, Hyperplane, Sands Capital, Shure, Synaptics, ZZ Capital and some undisclosed investors.

Vesper’s innovative sensors can be used in consumer electronics like TV remote controls, smart speakers, smartphones, intelligent sensor nodes, and hearables. The company will use the funding proceeds to scale-up its functions like mass production of its microphones and support expanded research and development, hiring, and establishing international sales offices.

The main product of Vesper is VM1000, a low noise, high range,single-ended analog output piezoelectric MEMS microphone. It consists of a piezoelectric sensor and circuitry to buffer and amplify the output.

The hot-selling product of Vesper is VM1010 with ZeroPower Listening which is the first MEMS microphone that enables voice activation to battery-powered consumer devices.

The unique selling point of Vesper’s products is they are built to operate in rugged environments that have dust and moisture.

"Vesper's ZeroPower Listening capabilities coupled with its ability to withstand water, dust, oil, and particulate contaminants enables users that have never before been possible," said Katelyn Johnson, principal of American Family Ventures. "We are excited about Vesper's quest to transform our connected world, including IoT devices."

Other recent funding news include $24 raised by sensor-based baby sock maker Owlet, IFTTT banks $24M from Salesforce to scale its IoT Enterprise offering, and Intel sells its Wind River Software to TPG.

Amber Solutions, an IoT product company that sells smart outlets, switches and circuit breakers closed Series A Preferred Stock round of financing that equals $3.3M in gross proceeds. Amber will use the funds to support the commercial development of Amber's core technologies.

One of Amber’s product is solid-state circuit interrupter (GFCI) that basically stops harmful levels of electricity from passing through a person. It operates as a safety device alerting the homeowner of electrocution incidents in real time.

Amber Solutions’ core markets are builders that prepare smart home/smart building ready infrastructure, certified electrical contractors or remodelers, and electrical manufacturers.

Other latest funding news include Owlet’s $24M Series B, Axonize’s $6M Series A round and addition of Deutsche Telekom as its strategic investor, and $30M Series B raised by Palo Alto-based Armis.

Smart baby monitor company Nanit raised a $14M Series B round led by Jerusalem Venture Partners (JVP). Other investors that participated include existing investors Upfront Ventures, RRE Ventures, Vulcan Capital and Vaal Investment Partners. The latest investment brings total equity funding of Nanit to $30M.

Nanit announced it will use the funding proceeds to expand its team of computer vision and machine learning engineers and grow its sales in Europe and Canada.

Nanit’s baby monitor helps new parents oversee nursery conditions as it has built-in temperature and humidity sensors. The camera lets parents remotely monitor baby’s crib whereas sound and motion are detected via smart sensors.

The monitor’s insights can be accessed via an accompanying mobile app. Nanit charges $10 per month for its premium package.

The key use cases of Nanit’s baby monitoring technology include sleep insights, behavioral analysis, expert guidance, and nightly video summaries. The company currently sells its smart monitors via its website.

Arduino’s MKR family of products got two new wireless connectivity boards added to its range of products. These include MKR WiFi 1010 and MKR NB 1500, both aimed at streamlining IoT product/service development.

Arduino’s blog notes that “the Arduino MKR WiFi 1010 is the new version of the MKR1000 with ESP32 module on board made by U-BLOX.”

MKR WiFi 1010: For prototyping of WI-FI based IoT applications

The core difference of MKR WiFi 1010 compared to MKR WiFi 1000 is that the former can be put to use in production-grade IoT apps and it has ESP32-based module manufactured by u-blox. The former enables to add 2.4GHz WiFi and Bluetooth capability to the application. Additionally, it comes with a programmable dual-processor system (an ARM processor and a dual-core Espressif IC).

MKR NB 1500: For on-field monitoring systems and remote-controlled LTE-enabled modules

The Arduino MKR NB 1500 is based on new low-power NB-IoT (narrowband IoT) standard. This makes it appropriate for IoT apps running over cellular/LTE networks.

Key use cases of this board are remote monitoring systems and remote-controlled LTE-enabled modules. It supports AT&T, T-Mobile USA, Telstra, Verizon over the Cat M1/NB1 deployed bands 2, 3, 4, 5, 8, 12, 13, 20 and 28.

Arduino also pitches this board to be used in IoT apps which used to rely on alternative IoT networks such as LoRa and Sigfox. It promises to save power compared to GSM or 3G cellular-based connections.

Siemens Building Technologies division announced it will acquire Enlighted Inc., a smart IoT building technology provider. The transaction is expected to close in Q3’18.

Enlighted Inc.’s core element is an advanced lighting control application. It is based on a patented, software-defined smart sensor that collects and monitors real-time occupancy, light levels, temperatures and energy usage.

The sensor can gauge temperature, light level, motion, energy, and has Bluetooth connectivity.

The Enlighted system works by collecting temperature, light and motion data via its smart sensors. A gateway device carries the information to Energy Manager, a secure browser-based interface to create profiles and adjust settings of the entire Enlighted Advanced Lighting Control System. The Energy manager operates as an analytics device.

The whole system consists of multi-function sensors, distributed computing, a network, and software applications run by Enlighted Inc.

Enlighted Inc.’s main target market is commercial real estate. Key use cases of its intelligent Lighting Control System are energy efficiency, controlling heating, ventilation and air conditioning, and building utilization reports.

Use the Postscapes 'Connected Products Framework' to understand the smart home and buildings eco-system.

Smart Lock Company LockState raised $5.8M Series A in new investment to fund its aggressive sales and marketing and partner development plan. The company previously raised $740K seed round and $1M in a round led by angel investors. The lead investor in latest round was Iron Gate Capital. Other investors include Kozo Keikaku Engineering Inc, Nelnet and Service Provider Capital.

The company’s Wi-Fi-enabled RemoteLock is used by 1000s of Airbnb and other vacation rental hosts. It helps hosts remotely provide access to guests. Locking/unlocking codes can be generated via a host’s computer or smartphone.

RemoteLock’s prices start at $299 which is its algorithmic ResortLock. The most pricey lock by LockState is its ‘RemoteLock 7i Black WiFi Commercial Smart Lock’ which costs $479.

Another core product of LockState is its cloud-based remote access platform for internet-enabled locks. It implies users can remotely manage their (internet-enabled) locks via LockState’s cloud platform.

Unlike smartphones and watches, customers don’t look forward to upgrading their smart locks or buying one when new models are launched. Thus, smart lock companies offset this disadvantage by partnering with property management and short-term rental companies to get new customers.

LockState has partnered with vacation rental brands like Airbnb, HomeAway, and other listing partners to automate guest access.

Igloohome a Singapore-based smart lock company also raised an investment of $4M in April this year.

This new Corporate Social Responsibility (CSR) Practices in India Report 2020 is a must read

[SAPS] - The Acting Provincial Commissioner of the SAPS in Mpumalanga Major General (Dr) Zeph Mkhwanazi has welcomed the 15 years imprisonment term handed down to Bongani Motha (24) by Middleburg Regional Court on Wednesday, 05 November 2024.

[SAPS] - A former company Director (57) is expected to appear in the Thabamoopo Magistrates Court in Lebowakgomo on 11 November 2024 for allegedly defrauding a pensioner an amount of R378 000.00 in the name of business.

[SAPS] One hundred and seventy one (171) murder suspects, 261 attempted murder suspects and 250 suspected rapists were among 12 593 suspects who were arrested during various operations by police in KwaZulu-Natal in the month of October. During such operations police also managed to recover 345 firearms and 2 998 rounds of ammunition of various calibre of firearms. Among the recovered firearms were 23 rifles and 17 homemade illegal guns.

[GroundUp] Former Lavender Hill gangster died on 29 October

[allAfrica] We are excited to share the momentous news that Cape Town Pride has officially won the bid to host WorldPride 2028. This significant event is a global celebration of LGBTQ+ pride and rights, marking a pivotal milestone not only for the LGBTQ+ community in the city but also for the entire African continent. This victory positions Cape Town as a leading symbol of inclusivity and diversity, showcasing its commitment to advancing a welcoming environment for all.

[The Conversation Africa] South Africa's finance minister, Enoch Godongwana, announced in his October mid-term budget policy statement that cabinet had approved funding for an early retirement programme to reduce the public sector wage bill. R11 billion (about US$627 million) will be allocated over the next two years to pay for the exit costs of 30,000 civil servants while retaining critical skills and promoting the entry of younger talent.

[DA] Note to editors: Please find attached soundbite by Ian Cameron MP.

[State Department] U.S. Ambassador-at-Large to Monitor and Combat Trafficking in Persons Cindy Dyer will travel to Madagascar November 13-16 and South Africa November 17-21.

[Daily Maverick] Office of the Chief Justice reveals Constitutional Court has been unable to sit because of unreliable water supply. This article is free to read.Sign up for free or sign in to continue reading.Unlike our competitors, we don't force you to pay to read the news but we do need your email address to make your experience better.Create your free account or sign in FAQ | Contact Us Nearly there! Create a password to finish signing up with us: You want to receive First Thing, our flagship daily newsletter. Opt

[allAfrica]

[Parliament of South Africa] Parliament, Tuesday, 12 November 2024 - The National Assembly (NA) will hold a plenary session scheduled to start at 10:00. Among the items on the agenda from 10:00 to 13:00 is the statement by the Minister of Water and Sanitation on water security in the country and a debate on 16 Days of Activism for no violence against women and children. The debate will be held under the theme, "Marking 30 years of democratic rights for women and fostering national unity to end gender-based violence".

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which are themselves parts of a whole silicon system, offer unparalleled potential for improving system performance, reducing manufacturing costs, and accelerating time-to-market in the automotive sector. However, the transition to working with chiplets in automotive electronics is not without its challenges.

Designers must now grapple with a new set of considerations, such as die-to-die interconnect standards, complex processes, and the integration of diverse IPs. Advanced toolsets and standardized design approaches are required to meet these challenges head-on and elevate the potential of chiplets in automotive innovation. In the following discourse, we will explore in detail the significance of chiplets in the context of automotive electronics, the obstacles designers face when working with this paradigm, and how Cadence comprehensive suite of IPs, tools, and flows is pioneering solutions to streamline the chiplet design process.

Unveiling Chiplets in Automotive Electronics

For automotive electronics, chiplets offer a methodology to modularize complex functionalities, integrate different chiplets into a package, and significantly enhance scalability and manufacturability. By breaking down semiconductor designs into a collection of chiplets, each fulfilling specific functions, automotive manufacturers can mix and match chiplets to rapidly prototype new designs, update existing ones, and specialize for the myriad of use cases found in vehicles today.

The increasing significance of chiplets in automotive electronics comes as a response to several industry-impacting phenomena. The most obvious among these is the physical restriction of Moore's Law, as large die sizes lead to poor yields and escalating production costs. Chiplets with localized process specialization can offer superior functionality at a more digestible cost, maintaining a growth trajectory where monolithic designs cannot. Furthermore, chiplets support the assembly of disparate technologies onto a single subsystem, providing a comprehensive yet adaptive solution to the diverse demands present in modern vehicles, such as central computing units, advanced driver-assistance systems (ADAS), infotainment units, and in-vehicle networks. This chiplet-based approach to functional integration in automotive electronics necessitates intricate design, optimization, and validation strategies across multiple domains.

The Complexity Within Chiplets

Yet, with the promise of chiplets comes a series of intricate design challenges. Chiplets necessitate working across multiple substrates and technologies, rendering the once-familiar 2-dimensional design space into the complex reality of multi-layered, sometimes even three-dimensional domains. The intricacies embedded within this design modality mandate devoting considerable attention to partitioning trade-offs, signal integrity across multiple substrates, thermal behavior of stacked dies, and the emergence of new assembly design kits to complement process design kits (PDKs).

To effectively address these complexities, designers must wield sophisticated tools that facilitate co-design, co-analysis, and the creation of a robust virtual platform for architectural exploration. Standardizations like the Universal Chip Interconnect Express (UCIe) have been influential, providing a die-to-die interconnect foundation for chiplets that is both standardized and automotive-ready. The availability of UCIe PHY and controller IP from Cadence and other leading developers further eases the integration of chiplets in automotive designs.

The Role of Foundries and Packaging in Chiplets

Foundries have also pivoted their services to become a vital part of the chiplet process, providing specialized design kits that cater to the unique requirements of chiplets. In tandem, packaging has morphed from being a mere logistical afterthought to a value-added aspect of chiplets. Organizations now look to packaging to deliver enhanced performance, reduced power consumption, and the integrity required by the diverse range of technologies encompassed in a single chip or package. This shift requires advanced multiscale design and analysis strategies that resonate across a spectrum of design domains.

Tooling Up for Chiplets with Cadence

Cadence exemplifies the rise of comprehensive tooling and workflows to facilitate chiplet-based automotive electronics design. Their integrations address the challenges that chiplet-based SoCs present, ensuring a seamless design process from the initial concept to production. The Cadence suite of tools is tailored to work across design domains, ensuring coherence and efficiency at every step of the chiplet integration process.

For instance, Cadence Virtuoso RF subflows have become critical in navigating radio frequency (RF) challenges within the chiplets, while tools such as the Integrity 3D-IC Platform and the Allegro Advanced Multi-Die Package Design Solution have surfaced to enable comprehensive multi-die package designs. The Integrity Signal Planner extends its capabilities into the chiplet ecosystem, providing a centralized platform where system-wide signal integrity can be proactively managed. Sigrity and Celsius, on the other hand, offer universally applicable solutions that take on the challenges of chiplets in signal integrity and thermal considerations, irrespective of the design domain. Each of these integrated analysis solutions underscores the intricate symphony between technology, design, and packaging essential in unlocking the potential of chiplets for automotive electronics.

Cadence portfolio includes solutions for system analysis, optimization, and signoff to complement these domain-specific tools, ensuring that the challenges of chiplet designs don't halt progress toward innovative automotive electronics. Cadence enables designers to engage in power- and thermal-aware design practices through their toolset, a necessity as automotive systems become increasingly sophisticated and power-efficient.

A Standardized Approach to Success with Chiplets

Cadence’s support for UCIe underscores the criticality of standardized approaches for heterogeneous integration by conforming to UCIe standards, which numerous industry stakeholders back. By co-chairing the UCIe Automotive working group, Cadence ensures that automotive designs have a universal and standardized Die-to-Die (D2D) high-speed interface through which chiplets can intercommunicate, unleashing the true potential of modular design.

Furthermore, Cadence champions the utilization of virtual platforms by providing transaction-level models (TLMs) for their UCIe D2D IP to simulate the interaction between chiplets at a higher level of abstraction. Moreover, individual chiplets can be simulated within a chiplet-based SoC context leveraging virtual platforms. Utilizing UVM or SCE-MI methodologies, TLMs, and virtual platforms serve as first lines of defense in identifying and addressing issues early in the design process before physical silicon even enters the picture.

Navigating With the Right Tools

The road to chiplet-driven automotive electronics is one paved with complexity, but with a commitment to standards, it is a path that promises significant rewards. By leveraging Cadence UCIe Design and Verification IP, tools, and methodologies, automotive designers are empowered to chart a course toward chiplets and help to establish a chiplet ecosystem. With challenges ranging from die-to-die interconnect to standardization, heterogeneous integration, and advanced packaging, the need for a seamless integrated flow and highly automated design approaches has never been more apparent. Companies like Cadence are tackling these challenges, providing the key technology for automotive designers seeking to utilize chiplets for the next-generation E/E architecture of vehicular technology.

In summary, chiplets have the potential to revolutionize the automotive electronics industry, breathing new life into the way vehicles are designed, manufactured, and operated. By understanding the significance of chiplets and addressing the challenges they present, automotive electronics is poised for a paradigm shift—one that combines the art of human ingenuity with the power of modular and scalable microchips to shape a future that is not only efficient but truly intelligent.

Learn more about how Cadence can help to enable automakers and OEMs with various aspects of automotive design.

We live in a rapidly growing “digitalized world,” with an ever-increasing need for video/music streaming, gaming, AI/machine learning, etc. All of these propel demand on modern SoC design to quickly evolve the SoC by fitting more sophisti...(read more)

The automotive industry is currently on the cusp of a radical evolution, steering towards a future where cars are not just vehicles but sophisticated, software-defined vehicles (SDV). This shift is marked by an increased reliance on automation and a significant increase in the use of sensors to improve safety and reliability. However, the increasing number of sensors has led to higher compute demands and poses challenges in managing a wide variety of data. The traditional method of using separate processors to manage each sensor's data is becoming obsolete. The current trends necessitate a unified processing system that can deal with multimodal sensor data, utilizing traditional Digital Signal Processing (DSP) and AI-driven algorithms. This approach allows for more efficient and reliable sensor fusion, significantly enhancing vehicle perception. Developers often face difficulties adhering to stringent power, performance, area, and cost (PPAC) and timing constraints while designing automotive SoCs.

Cadence, with its groundbreaking products and AI-powered processors, is enabling designers and automotive manufacturers to meet the future sensor fusion demands within the automotive sector. At the recent CadenceLive Silicon Valley 2024, Amol Borkar, product marketing director at Cadence, showcased the company's dedication and forward-thinking solutions in a captivating presentation titled "Addressing Tomorrow’s Sensor Fusion Needs in Automotive Computing with Cadence." This blog aims to encapsulate the pivotal takeaways from the presentation. If you missed the chance to watch this presentation live, please click here to watch it.

Significant Trends in the Automotive Market – Industry Landscape

We are witnessing a revolution in automotive technology. Innovations like occupant and driver monitoring systems (OMS, DMS), 4D radar imaging, LiDAR technology, and 360-degree view are pushing the boundaries of what's possible, leading us into an era of remarkable autonomy levels—ranging from no feet or hands required to eventually no eyes needed on the road.

Sensor Fusion and Increasing Processing Demands—Sensor fusion effectively integrates data from different sensors to help vehicles understand their surroundings better. Its main benefit is in overcoming the limitations of individual sensors. For example, cameras provide detailed visual information but struggle in low-light or lousy weather. On the other hand, radar is excellent at detecting objects in these conditions but lacks the detail that cameras provide. By combining the data from multiple sensors, automotive computing can take advantage of their strengths while compensating for their weaknesses, resulting in a more reliable and robust system overall.

One thing to note is that the increased number of sensors produces various data types, leading to more pre-processing.

On-Device Processing—As the industry moves towards autonomy, there is an increasing need for on-device data processing instead of cloud computing to enable vehicles to make informed decisions. Embracing on-device processing is a significant advancement for facilitating real-time decisions and avoiding round-trip latency.

AI Adoption—AI has become integral to automotive applications, driving safety, efficiency, and user experience advancements. AI models offer superior performance and adaptability, making future-proofing a crucial consideration for automotive manufacturers. AI significantly enhances sensor fusion algorithms, offering scalability and adaptability beyond traditional rule-based approaches. Neural networks enable various fusion techniques, such as early fusion, late fusion, and mid-fusion, to optimize the integration and processing of sensor data.

Future Sensor Fusion Needs

Automotive architectures are continually evolving. With current trends and AI integration into radar and sensor fusion applications, SoCs should be modular, flexible, and programmable to meet market demands.

Heterogeneous Architecture- Today's vehicles are loaded with various sensors, each with a unique processing requirement. Running the application on the most suitable processor is essential to achieve the best PPA. To meet such requirements, modern automotive solutions require a heterogeneous compute approach, integrating domain-specific digital signal processors (DSPs), neural processing units (NPUs), central processing unit (CPU) clusters, graphics processing unit (GPU) clusters, and hardware accelerator blocks. A balanced heterogeneous architecture gives the best PPA solution.

Flexibility and Programmability- The industry has come a long way from using computer vision algorithms such as HOG (Histogram Oriented Gradient) to detect people and objects, HAR classifier to detect faces, etc., to CNN and LSTM-based AI to Transformer models and graphical neural networks (GNN). AI has evolved tremendously over the last ten years and continues to evolve. To keep up with the evolving rate of AI, SoC design must be flexible and programmable for updates if needed in the future.

Addressing the Sensor Fusion Needs with Cadence

Cadence offers a complete suite of hardware and software products to address the increasing compute requirements in automotive. The comprehensive portfolio of Tensilica products built on the robust 32-bit RISC architecture caters to various automotive CPU and AI needs. What makes them particularly appealing is their scalability, flexibility, and configurability, offering many options to meet diverse needs.

The Xtensa family of products offers high-quality, power-efficient CPUs. Tensilica family also includes AI processors like Neo NPUs for the best power, performance, and area (PPA) for AI inference on devices or more extensive applications. Cadence also offers domain-specific products for DSPs such as HIFI DSPs, specialized DSPs and accelerators for radar and vision-based processing, and a general-purpose family of products for floating point applications.

The ConnX family offers a wide range of DSPs, from compact and low-power to high-performance, optimized for radar, lidar, and communications applications in ADAS, autonomous driving, V2X, 5G/LTE/4G, wireless communications, drones, and robotics. Tensilica's ISO26262 certification ensures compliance with automotive safety standards, making it a trusted partner for advanced automotive solutions. The Cadence NeuroWeave Software Development Kit (SDK) provides customers with a uniform, scalable, and configurable ML interface and tooling that significantly improves time to market and better prepares them for a continuously evolving AI market. Cadence Tensilica offers an entire ecosystem of software frameworks and compilers for all programming styles.

Tensilica's comprehensive software stack supports programming for DSPs, NPUs, and accelerators using C++, OpenCL, Halide, and various neural network approaches. Middleware libraries facilitate applications such as SLAM, radar processing, and Eigen libraries, providing robust support for automotive software development.

Conclusion

Cadence’s Tensilica products offer a development toolchain and various IPs tailored for the automotive industry, covering audio, vision, radar, unified DSPs, and NPUs. With ISO certification and a robust partner ecosystem, Tensilica solutions are designed to meet the future needs of automotive computing, ensuring safety, efficiency, and innovation.

Learn More

• Cadence Automotive Solutions
• Cadence Automotive IP
• Sensor Fusion and ADAS in TSMC Automotive Processes
• Revolution on the Road: How Cadence is Driving the Future of Automotive Design!
• Taming Design Complexity in Chiplet-Based Automotive Electronics
• UCIe and Automotive Electronics: Pioneering the Chiplet Revolution

Cadence tapes out 32G UCIe interface IP for high speed, highly efficient chiplet designs and demonstrate high data rate performance in TSMC's 3nm technology(read more)

LEF allows the same port with multiple shape definitions. Does anybody know if innovus can create multiple duplicate shapes associated with the same port? Assume they are connected outside the block with perfect timing synchronization. Thank you!

I am working with innovus on a huge design. I found some cells are placed far away from both timing start points and timing end points. I suspect some other timing paths may be near-critical that results in this sub-optimal cell placement; or innovus has to place the cell far away due to congestion of placement or routing.

Is there a way to see why innovus places/moves the cell during place_opt_design or ccopt_design?

Also, is there a way to highlight all timing start points or timing end points that go through a cell? There may be thousands of timing paths through this cell. I tried using report_timing and timing debugger but it is very painful to click the highlight box and highlight the timing paths one by one.

Thank you for your help!

Hi everyone,

I'm designing a digital chip that will be fabricated. I have a HDL top module that includes several submodules inside it. I want to define the position of some of the submodules during the PnR so that later I can specify there positions in the Micrograph photo after the IC fabrication. When I perform the PnR using Innovus, I always got a layout shape where the submodules seems to be flatted. I wonder if there is a way to specify the placement of each submodule in my top module  (maybe in the tcl file) during the PnR so later I can define there positions in the micrograph photo. 

Thanks in Advance!

for debug I use suspend in my tcl script to debug，here is the code

after that the innovus command screen become 

how to quit the SUSPEND status？ thanks