An oscillating device includes a temperature compensated oscillator that compensates a frequency temperature characteristic in a temperature compensation range including apart of a first temperature range, and a temperature control circuit that includes a heater and controls a temperature of a quartz crystal resonator of the temperature compensated oscillator into a second temperature range included in the temperature compensation range. Further, the temperature compensation range of the temperature compensated oscillator may include a part of the first temperature range in which compensation can be performed by first-order approximation.

A phase locked loop includes a voltage controlled oscillator and a frequency divider or frequency multiplier. The voltage controlled oscillator and the frequency divider/multiplier are coupled together in a stacked configuration. A drive current is supplied to the voltage controlled oscillator. The drive current passes from the voltage controlled oscillator to the frequency divider/multiplier, thereby driving the frequency divider/multiplier with the same drive current that was supplied to the voltage controlled oscillator.

There are provided an accumulator-type fractional N-PLL synthesizer for suppressing the fractional spurious caused by periodically switching a frequency division number of a fractional frequency divider, and a control method thereof. In an accumulator-type fractional N-PLL synthesizer (100), a pulse signal proportional to a fractional phase error occurring between a reference signal and an output signal of a fractional divider (112) for feeding back an output of a VCO (115) of an output stage to a preceding stage is generated using an error signal from an accumulator (120). Through the use of the pulse signal, pulse widths of a UP signal and a DN signal output from a phase detector (140) are controlled so as to reduce a fractional phase error occurring between the UP signal and the DN signal. Thus, the fractional spurious caused by periodically switching the frequency division number of the fractional divider (112) is suppressed.

A digitally controlled oscillator has a high-order ΔΣ modulator configured to be of at least an order higher than a first order and configured to input a digital control signal and output a pseudorandom digital output signal, a first-order ΔΣ modulator configured to input the pseudorandom digital output signal and generate a control pulse signal including a pulse width corresponding to the pseudorandom digital output signal, a low pass filter configured to pass a low frequency component of the control pulse signal, and an oscillator configured to generate a high-frequency output signal whose frequency is controlled based on the control pulse signal outputted by the low pass filter so as to be a frequency corresponding to the digital control signal.

An integrated circuit (10) has an internal RC-oscillator (20) for providing an internal clock signal (CLI) having an adjustable oscillator frequency. The integrated circuit (10) further comprises terminals (101, 102) for connecting an external LC tank (30) having a resonance frequency and a calibration circuit (40) which is configured to adjust the oscillator frequency based on the resonance frequency of the LC tank (30) connected during operation of the integrated circuit (10). An internal auxiliary oscillator (46) is connected to the terminals (101, 102) in a switchable fashion and is configured to generate an auxiliary clock signal (CLA) based on the resonance frequency. The calibration circuit (40) comprises a frequency comparator (47) which is configured to determine a trimming word (TRW) based on a frequency comparison of the internal clock signal (CLI) and the auxiliary clock signal (CLA). The LC tank (30) to be connected is an antenna for receiving a radio signal.

The invention concerns an oscillator generating a wave composed of a frequency of on the order of terahertz from a beat of two optical waves generated by a dual-frequency optical source. The oscillator includes a modulator the transfer function of which is non-linear for generating harmonics with a frequency of less than one terahertz for each of the optical waves generated by the dual-frequency optical source, an optical detector able to detect at least one harmonic for each of the optical waves generated by the dual-frequency optical source and transforming the harmonics detected into an electrical signal, a phase comparator for comparing the electrical signal with a reference electrical signal, and a module for controlling at least one element of the dual-frequency optical source with a signal obtained from the signal resulting from the comparison.

A digitally-controlled oscillator includes a base frequency generator having an odd number of base inverters connected end-to-end to generate an output signal that oscillates at a predetermined frequency and a frequency-adjusting unit connected to the base frequency generator. The frequency-adjusting unit includes a first string of switchable inverters connected in series with each other, the switchable inverters having sizes that decrease from an input end of the first string to the output end of the first string.

Embodiments provide a multi-phase voltage controlled oscillator (VCO) that produces a plurality of output signals having a common frequency and different phases. In one embodiment, the VCO may include a passive conductive structure having a first ring and a plurality of taps spaced around the first ring. The VCO may further include a capacitive load coupled to the passive conductive structure, one or more feedback structures coupled between a pair of opposing taps of the plurality of taps, and one or more current injection devices coupled between a pair of adjacent taps of the plurality of taps.

The present invention discloses an Oven Controlled Crystal Oscillator and a manufacturing method thereof. The Oven Controlled Crystal Oscillator comprises a thermostatic bath, a heating device, a PCB and a signal generating element, where the signal generating element is used for generating a signal of a certain frequency, the heating device, the PCB and the signal generating element are mounted in the thermostatic bath, the signal generating element is mounted in a groove formed on one side of the PCB, while the heating device is mounted against the other side of the PCB that is opposite to the groove. The signal generating element may be a passive crystal resonator or an active crystal oscillator. The Oven Controlled Crystal Oscillator according to the invention is advantageous for a small volume and a high temperature control precision.

An oscillator outputs a control signal to suppress an influence caused by temperature characteristic of f1 based on a differential signal corresponding to difference between an oscillation output f1 of a first oscillator circuit and an oscillation output f2 of a second oscillator circuit treated as a temperature detection value. A switching unit switches between a first state and a second state. The first state is a state where a first connecting end and a second connecting end are connected to a storage unit for access from an external computer to the storage unit. The second state is a state where the first connecting end and the second connecting end are connected to a first signal path and a second signal path such that the respective f1 and f2 are retrieved from the first connecting end and the second connecting end to an external frequency measuring unit.

An atomic oscillator includes: a gas cell which includes two window portions having a light transmissive property and in which metal atoms are sealed; a light emitting portion that emits excitation light to excite the metal atoms in the gas cell; a light detecting portion that detects the excitation light transmitted through the gas cell; a heater that generates heat; and a connection member that thermally connects the heater and each window portion of the gas cell to each other.

An oscillator configured to oscillate an electromagnetic wave, including: a negative resistance device; a microstrip resonator configured to determine an oscillation frequency of an electromagnetic wave excited by the negative resistance device; a resistance device and a capacitance device, which form a low-impedance circuit configured to suppress parasitic oscillation; and a strip conductor configured to connect the capacitance device of the low-impedance circuit and the microstrip resonator to each other, in which an inductance L of the strip conductor and a capacitance C of the microstrip resonator produce a resonance frequency of ½π√LC, and ¼ of an equivalent wavelength of the resonance frequency is larger than a distance between the negative resistance device and the resistance device of the low-impedance circuit via the strip conductor, is provided.

An oscillator module includes a first MOS transistor and a capacitor. The capacitor is coupled between a gate and source of the first MOS transistor. The drain of the first MOS transistor receives a first bias current and generates an oscillating output signal. A switching circuit operates in response to the oscillating output signal to selective charge and discharge the capacitor. A current sourcing circuit is configured to generate the bias current. The current sourcing circuit includes a second MOS transistor which has an identical layout to the first MOS transistor and receives a second bias current. A resistor is coupled between a gate and source of the second MOS transistor. The current sourcing circuit further includes a current mirror having an input configured to receive a reference current passing through the resistor and generate the first and second bias currents.

An oscillation device is provided. The oscillation device includes: a main circuit portion, a heating unit, first and second crystal units, first and second oscillator circuits, a frequency difference detector, a first addition unit, an integration circuit unit, a circuit unit configured to control an electric power to be supplied to the heating unit, a compensation value obtaining unit, and a second addition unit. The compensation value obtaining unit is configured to obtain a frequency compensation value for compensating an output frequency of the main circuit portion based on an integrated value output from the integration circuit unit, and based on a change in the clock signal due to a difference between the temperature of the atmosphere and the temperature setting value of the heating unit. The second addition unit is configured to add the frequency compensation value to a frequency setting value.

A method, an apparatus, and a computer program product are provided. The apparatus tunes a frequency provided by a VCO. The apparatus determines a relative capacitance change associated with a first frequency and a desired frequency from a look-up table. The apparatus adjusts a capacitor circuit in the VCO based on the determined relative capacitance change determined from the look-up table in order to tune from the first frequency to the desired frequency. The apparatus determines that the frequency provided by the VCO is a second frequency different than the desired frequency after adjusting the capacitor circuit. The apparatus performs an iterative search to further adjust the capacitor circuit when a difference between the second frequency and the desired frequency is greater than a threshold.

A system is disclosed for a voltage controlled oscillator (“VCO”) having a large frequency range and a low gain. Passive or active circuitry is introduced between at least one VCO cell in the voltage controlled oscillator and the voltage source for the VCO cell which reduces a gain value for the VCO to maintain stability of the system.

An oscillator includes: a piezoelectric material to vibrate; a first inverting amplifier; a second inverting amplifier; a first output electrode to apply an output signal of the first inverting amplifier to the piezoelectric material; a second output electrode to apply an output signal of the second inverting amplifier to the piezoelectric material; a first input electrode to receive a voltage signal generated by the piezoelectric material and output the voltage signal to the first inverting amplifier; and a second input electrode to receive the voltage signal and output the voltage signal to the second inverting amplifier, wherein the first and second output electrodes are coupled to the piezoelectric material so that faces of the piezoelectric material move in opposite directions, and the first and second input electrodes are coupled to the piezoelectric material so that the voltage signals are input to the first and second input electrodes.

An injection locking oscillator (ILO) comprising a tank circuit having a digitally controlled capacitor bank, a cross-coupled differential transistor pair coupled to the tank circuit, at least one signal injection node, and at least one output node configured to provide an injection locked output signal; a digitally controlled injection-ratio circuit having an injection output coupled to the at least one signal injection node, configured to accept an input signal and to generate an adjustable injection signal applied to the at least one injection node; and, an ILO controller connected to the capacitor bank and the injection-ratio circuit configured to apply a control signal to the capacitor bank to adjust a resonant frequency of the tank circuit and to apply a control signal to the injection-ratio circuit to adjust a signal injection ratio.

Embodiments of the present invention provide a temperature compensation method and a crystal oscillator, where the crystal oscillator includes a crystal oscillation circuit unit, a temperature sensor unit, an oscillation controlling unit, a relative temperature calculating unit, and a temperature compensating unit. The temperature sensor unit measures a measured temperature of the crystal oscillation circuit unit; the relative temperature calculating unit obtains a temperature difference between the measured temperature and a reference temperature; the temperature compensating unit obtains a temperature compensation value corresponding to the temperature difference from a temperature-frequency curve; and the oscillation controlling unit generates a frequency control signal, according to a frequency tracked by a communications AFC device and the temperature compensation value, thereby controlling a frequency of the crystal oscillation circuit unit to work on the tracked frequency.

Various techniques for generating an output clock based on a reference clock. This disclosure relates to generating an output clock signal based on a reference clock signal. In one embodiment, a method includes generating, using information received from a control circuit, an output clock signal using both a first number of edges or an input clock signal and a second, different number of edges of the input clock signal. In this embodiment, the control circuit runs at a frequency that is less than a frequency of the input clock signal. The received information may indicate, for a pulse of the output clock signal, whether the pulse should be generated using the first number of edges or the second number of edges. In some cases, the second number of edges may be the first number of edges plus one. The first and second number of edges may be programmable quantities.

A current output control device is provided that includes: a current cell array section including plural current cell circuits that are each connected in parallel between a first terminal (power source) and a second terminal (ground) that connect between the first terminal and the second terminal in by operation ON so as to increase control current flowing between the first terminal and the second terminal; and a code conversion section (decoder) that generates signals (row codes, column codes) to ON/OFF control current cells so as to change the number of current cells that connect the first terminal and the second terminal according to change in an externally input code and that inputs the generated signals to the current cell array section.

This invention discloses a crystal oscillator, in which by appropriately designing the gain of an amplifier to achieve high trans-conductance and low power consumption. This crystal oscillator includes a first pad, coupled to a first node of a crystal, for receiving a crystal oscillating signal outputted from the crystal; an amplifier, coupled to the first pad, for amplifying the crystal oscillating signal to generate an amplifying signal; an inverter, coupled to the amplifier, for inverting the amplifying signal; and a second pad, coupled to a second node of the crystal, for outputting an oscillating signal to the crystal.

A ring oscillator circuit causing a pulse signal to circulate around a circle to which an even number of inverting circuits are connected in a ring, wherein one of the inverting circuits is a first starting inverting circuit, which drives a first pulse signal according to a control signal, another of the inverting circuits is a second starting inverting circuit, which drives a second pulse signal based on a leading edge of the first pulse signal, still another is a third starting inverting circuit, which drives a third pulse signal based on the leading edge of the first pulse signal after the second pulse signal is driven, and the first to third starting inverting circuits are arranged within the circle of the inverting circuits in order of the third, second, and first pulse signals in traveling directions of the pulse signals.

An integrated oscillator circuit comprises an oscillator configured to be switched between a first frequency and a second frequency. A switching circuit receives an input representing a target frequency and switches the oscillator between the first and second frequencies at intervals determined by the input, so as to cause the average output frequency of the oscillator to approximate the target frequency.

The switching element is provided in a state of being electromagnetically coupled to the cavity resonator of the high frequency oscillator; the bias voltage applying terminal is connected to one electrode of the switching element; another electrode of the switching element is electrically connected to the cavity resonator (the anode shell in FIG. 1); the metal plate having a size enough for reflecting an electric wave to be transmitted before and after the switching element in a high-frequency manner is provided at any one end of the switching element; and by applying a bias voltage to the switching element and varying that, a reactance of the switching element is changed and a resonance frequency of the cavity resonator is varied. By this method, an oscillation frequency can be varied greatly relative to a small change in a bias voltage.

An enhanced negative resistance voltage controlled oscillator (VCO) circuit is provided, in which a parallel connection of a capacitor and a resistor configured to provide frequency-dependent transconductance is present across source nodes of a first pair of field effect transistors in which gate nodes and drain nodes are cross-coupled. The source nodes of the first pair of field effect transistors are electrically shorted to drain nodes of a second pair of field effect transistors of which the gate nodes are electrically shorted to the gate nodes of the first pair of field effect transistors. The parallel connection of the capacitor and the resistor includes a parallel connection of a capacitor and a resistor such that the net transconductance of the first pair of field effect transistors is less at low frequencies where thermal noise and flicker noise are dominant part of the phase noise than at the operational frequency range.

A vibration element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge, and a third thick section provided along another first outer edge. An inclined outer edge section that intersects with each of an X axis and a Z' axis is provided in a tip section of the piezoelectric substrate.

A crystal controlled oscillator includes a crystal package and an IC chip board that includes an IC chip integrating an oscillator circuit. The crystal package includes a first container, a crystal resonator, a lid body, and an external terminal at an outer bottom surface of the first bottom wall layer of the first container. The IC chip integrates an oscillator circuit disposed at an outer bottom surface of the first bottom wall layer of the crystal package. The oscillator circuit connects to the lower side excitation electrode of the crystal resonator from the external terminal to an input side with high impedance. The oscillator circuit connects to the upper side excitation electrode to an output side with low impedance. The upper side excitation electrode is a shielding electrode of the crystal resonator.

An apparatus is disclosed that includes a first cross-coupled transistor pair, a second cross-coupled transistor pair, at least one capacitance unit, and an inductive unit. The first cross-coupled transistor pair and second cross-coupled transistor pair are coupled to a pair of first output nodes and a pair of second output nodes, respectively. The at least one capacitance unit is coupled to at least one of the pair of first output nodes and the pair of second output nodes. The inductive unit is coupled to the first cross-coupled transistor pair at the first output nodes and coupled to the second cross-coupled transistor pair at the second output nodes. The inductive unit generates mutual magnetic coupling between one of the first output nodes and one of the second output nodes and between the other of the first output nodes and the other of the second output nodes.

An electronic oscillator circuit has a first oscillator, for supplying a first oscillation signal, a second oscillator, for supplying a second oscillation signal, a first controller for delivering the first control signal as a function of a phase difference between a first controller input and a second controller input of the first controller; a second controller for delivering the second control signal as a function of a phase difference between a first controller input of the second controller and a second controller input of the second controller; a resonator; at least a second resonance frequency, with a first phase shift dependent on the difference between the frequency of a second exciting signal and the second resonance frequency and processing means, for receiving the first oscillator signal and the second oscillator signal, determining their mutual proportion, looking up a frequency compensation factor in a prestored table and outputting a compensated oscillation signal.

An outflow valve (10) for an aircraft has a frame (12) for arrangement in an opening (14) of an outer shell (16) of the aircraft, a first flap (18) pivotably arranged in the frame (12) for controlling a flow cross-section of at least one first inflow opening (24) and at least one outflow opening (15). To achieve a simplified construction of the ventilation system of the aircraft, the outflow valve (10) has a second inflow opening (26) configured to be closable by means of a drivable adjustable member (28).

In a method for operating a fluid valve for controlling or regulating a fluid, having at least one movable valve component is displaceable with the aid of at least one electrical actuating signal which contains at least one first actuating signal portion which causes an oscillating valve motion of the valve component. Pressure oscillations generated in the fluid due to the oscillating valve motion are detected, and are used for regulation of the oscillating valve motion caused by the first actuating signal portion.

A method of isolating a section of pipe includes the steps of locating a seal unit having two seal elements in a pipe via a penetration in the pipe, such as a branch or tee. The seal unit is then positioned in the pipe downstream of the penetration. The seal elements are activated using a primary activation mechanism to engage the pipe wall and then maintained in an activated condition using a secondary activation mechanism.

In a control device for a technical processing plant, a pneumatically driven actuator having an actuator stem is provided together with a valve operated by the actuator, the valve having a valve stem. A valve element is attached to the valve stem. A stem connector connects the two stems to each other for a forced transmission of axial actuating movements and for modifying an axial distance between adjacent ends of the valve stem and the actuator stem to adjust a total axial length of the two stems. The stem connector comprises two half-shells connected to each other, and two positioning devices are provided for a friction-locking coupling of the half-shells to the respective ends. At least one of the positioning devices is designed to modify an axial attachment position of the half-shells along one of the stems.

A solenoid valve, the magnet armature of which is designed to be movable relative to a first valve-closing element, for which purpose the first valve-closing element is accommodated telescopically in a coupling element attached to the magnet armature, wherein the coupling element is guided along the inner wall of a guide sleeve inserted in the valve housing in order to align the magnet armature precisely with the first valve-closing element in the direction of a second valve-closing element which is likewise accommodated in the guide sleeve.

For a flap assembly, in particular an exhaust gas flap assembly, with the flap mounted on both sides via bearing devices in the housing, the disclosure describes a design in which a bearing body is supported radially against an annular collar of the bearing device and, by way of the annular collar, is held braced in a radially spring-loaded manner in a predefined radial position.

Disclosed is an image forming system including: the relay apparatus; the image forming device which is connected to the first communication control unit of the relay apparatus and which acquires the sheet interval information of the downstream post-processing device through the first communication system; and the second post-processing device which is connected to the second communication control unit of the relay apparatus, the second post-processing device being compliant with the second communication system.

Disclosed is an image forming system including: an image forming device to notify a downstream post-processing device of sheet information relating to a sheet on which an image is formed, before the sheet is discharged, and to notify the downstream post-processing device of set separation information indicating a final sheet of each set of document in synchronization with the sheet information relating to the final sheet of each set in case that a plurality of sets of document are printed, the image forming device being compliant with a first communication system; a post-processing device which is connected to a downstream of the image forming device and is compliant with a second communication system which is different from the first communication system; and the relay apparatus which is connected to the image forming device through the first communication system and is connected to the post-processing device through the second communication system.

A land grid array (LGA) package including a substrate having a plurality of lands formed on a first surface of the substrate, a semiconductor chip mounted on a second surface of the substrate, a connection portion connecting the semiconductor chip and the substrate, and a support layer formed on part of a surface of a first land.

Maskless hybrid laser scribing and plasma etching wafer dicing processes are described. In an example, a method of dicing a semiconductor wafer having a front surface with a plurality of integrated circuits thereon and having a passivation layer disposed between and covering metal pillar/solder bump pairs of the integrated circuits involves laser scribing, without the use of a mask layer, the passivation layer to provide scribe lines exposing the semiconductor wafer. The method also involves plasma etching the semiconductor wafer through the scribe lines to singulate the integrated circuits, wherein the passivation layer protects the integrated circuits during at least a portion of the plasma etching. The method also involves thinning the passivation layer to partially expose the metal pillar/solder bump pairs of the integrated circuits.

An apparatus including a die including a dielectric material on a device side, an insulating layer surrounding a die area and embedding a thickness dimension of the die; and a carrier including a plurality of layers of conductive material disposed on the device side of the die, a first one of the layers of conductive materials being formed on the insulating layer and patterned into traces at least a portion of which are connected to respective contact points on the die. A method including disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; disposing a mold on the sacrificial substrate around; introducing an insulating material into a chase of the mold; removing the mold; forming a carrier on the insulating material adjacent a device side of a die; and separating the die and the carrier from the sacrificial substrate.

The present invention relates to a camera module including: a lens unit mounted with at least one or more lenses; an image sensor mounted with an image pickup device for converting a light converged through the lenses to an electric signal; a PCB (Printed Circuit Board) mounted with the image sensor; and a holder accommodated inside the lens unit for supporting the lens unit, wherein the lens unit is bonded and fixed at an inner surface of the holder, whereby the lens unit mounted with a plurality of lenses is bonded to a lateral surface of a holder to prevent generation of vertical tilting phenomenon at the lens unit caused by a conventional improper coating of epoxy, and particularly, the coating of epoxy on the lateral surface of the holder advantageously enhances adhesive power to increase a bonded area.

A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

A III-N device is described with a III-N material layer, an insulator layer on a surface of the III-N material layer, an etch stop layer on an opposite side of the insulator layer from the III-N material layer, and an electrode defining layer on an opposite side of the etch stop layer from the insulator layer. A recess is formed in the electrode defining layer. An electrode is formed in the recess. The insulator can have a precisely controlled thickness, particularly between the electrode and III-N material layer.

The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object originally having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.

Embodiments generally relate to optoelectronic devices and more specifically, to textured layers in optoelectronic devices. In one embodiment, a method for providing a textured layer in an optoelectronic device includes depositing a first layer of a first material and depositing an island layer of a second material on the first layer. Depositing the island layer includes forming one or more islands of the second material to provide at least one textured surface of the island layer, where the textured surface is operative to cause scattering of light.

A semiconductor device has a protective layer formed over an active surface of a semiconductor wafer. The semiconductor die with pre-applied protective layer are moved from the semiconductor wafer and mounted on a carrier. The semiconductor die and contact pads on the carrier are encapsulated. The carrier is removed. A first insulating layer is formed over the pre-applied protective layer and contact pads. Vias are formed in the first insulating layer and pre-applied protective layer to expose interconnect sites on the semiconductor die. An interconnect structure is formed over the first insulating layer in electrical contact with the interconnect sites on the semiconductor die and contact pads. The interconnect structure has a redistribution layer formed on the first insulating layer, a second insulating layer formed on the redistribution layer, and an under bump metallization layer formed over the second dielectric in electrical contact with the redistribution layer.

When forming sophisticated semiconductor-based gate electrode structures of transistors, the pre-doping of one type of gate electrode structure may be accomplished after the actual patterning of the electrode material by using an appropriate mask or fill material for covering the active regions and using a lithography mask. In this manner, a high degree of flexibility is provided with respect to selecting an appropriate patterning regime, while at the same time a uniform and superior cross-sectional shape for any type of gate electrode structure is obtained.

A protective film to a polarizer including a cellulose acylate and satisfying the following requirement (1) or (2): (1): The surface of the film has a pH of from 3.0 to 4.5.(2): The surface of the film has a pH of more than 4.5 and at most 6.0, and the film has a moisture permeability of at least 2800 g/m2·day.

The present invention provides an electroconductive sheet and a touch panel which do not impair visibility in a vicinity of an electrode terminal in a sensing region. In an electroconductive sheet which has an electrode pattern constructed of a metal thin wire and an electrode terminal that is electrically connected to an end of the electrode pattern, a transmittance of the electrode pattern is 83% or more, and when the transmittance of the electrode pattern is represented by a %, a transmittance of the electrode terminal is controlled to be (a-20)% or more and (a-3)% or less.