Power network design and analysis of 3D-ICs is a major challenge due to the complex nature and large size of the power network. In addition, designers must deal with the complexity of routing power through the interposer, multiple dies, through-silicon vias (TSVs), and through-dielectric vias (TDVs).
Cadence’s Integrity 3D-IC Platform and Voltus IC Power Integrity Solution provide a fully integrated solution for early planning and analysis of 3D-IC power networks, 3D-IC chip-centric power integrity signoff, and hierarchical methods that significantly improve capacity and performance of power integrity (PI) signoff while maintaining a very high level of accuracy at signoff. This blog summarizes the typical design challenges faced by today’s 3D-IC designers, as discussed in our recent webinar, “Addressing 3D-IC Power Integrity Design Challenges.” Please click here to view the full webinar.

Major Trends in Advanced Chip Design

From chips to chiplets, stacked die, 3D-ICs, and more, three major trends are impacting advanced semiconductor packaging design. The first is heterogenous integration, which we define as a disaggregated approach to designing systems on chip (SoCs) from multiple chiplets. This approach is similar to system-in-package (SiP) design, except that instead of integrating multiple bare die – including 3D stacking – on a single substrate, multiple IPs are integrated in the form of chiplets on a single substrate.

The second major trend is around new silicon manufacturing techniques that leverage silicon vias (TSVs) and high-density fanout RDL. These advancements mean that silicon is becoming a more attractive material for packaging, especially when high bandwidth and form factor become key attributes in the end design. This brings new design and verification challenges to most packaging engineers who typically work with organic and ceramic substrate materials.

Finally, on the ecosystem side, all the large semiconductor foundries now offer their own versions of advanced packaging. This brings new ways of supporting design teams with technologies like reference flows and PDKs, concepts that have typically been lacking in the packaging community. Cadence has worked with many of the leading foundries and outsourced semiconductor assembly and test facilities (OSATs) to develop multi-chip(let) packaging reference flows and package assembly design kits. The downside is that, with the time restrictions designers are under today, there isn’t enough time to simulate the details of these flows and PDKs further.

For those who must make the best electro/thermal/physical decisions to achieve the best power/performance/area/cost (PPAC), factors can include accurate die size estimations, thermal feasibility, die-to-die interconnect planning, interposer planning (silicon/organic), front-to-front and front-to-back (F2F/F2B) planning, layer stack and electromigration/ IR drop (EMIR)/TSV planning, IO bandwidth feasibility, and system-level architecture selection.

3D-IC Power Network Design and Analysis

The key to success in 3D-IC design is early power integrity planning and analysis. Cadence’s Integrity 3D-IC platform is a high-capacity 3D-IC platform that enables 3D design planning, implementation, and system analysis in a single, unified cockpit. Cadence’s Voltus IC Power Integrity Solution is a comprehensive full chip electromigration, IR drop, and power analysis solution. With its fully distributed architecture and hierarchical analysis capabilities, Voltus provides very fast analysis and has the capacity to handle the largest designs in the industry. Typically, 3D-IC PDN design and analysis is performed in four phases, as shown in Figure 1.

Phase 1 - Perform early power delivery network (PDN) exploration with each fabric’s PDN cascaded in system PI with early circuit models.

Phase 2 – Plan 3D-IC PDNs in Cadence’s Integrity 3D-IC platform, including micro bumps, TSVs, and through dielectric vias (TDVs), power grid synthesis for dies, and early rail analysis and optimization.

Phase 3 – Perform full chip-centric signoff in Voltus with detailed die, interposer, and package models, including chip die models, while keeping some dies flat.

Phase 4 – Perform full system-level signoff with Cadence’s Sigrity SystemPI using detailed extracted package models from Sigrity XtractIM, board models from Sigrity PowerSI or Clarity 3D Solver, interposer models from XtractIM or Voltus, and chip power models from Voltus.

Figure 1. 3D-IC PDN design and analysis phases

3D-IC Chip-Centric Signoff

The integration of Integrity 3D-IC and Voltus enables chip-centric early analysis and signoff. Figure 2 and Figure 3 highlight the chip centric early PI optimization and signoff flows. In early analysis, the on-chip power networks are synthesized, and the micro bumps and TSVs can be placed and optimized. In the signoff stage, all the detailed design data is used for power analysis, and detailed models are extracted and used for package, interposer, and on-die power networks.

Figure 2. Early chip-centric PI analysis and optimization flow

Figure 3. Chip-centric 3D-IC PI signoff

Hierarchical 3D-IC PI Analysis

To improve the capacity and performance of 3D-IC PI analysis, Voltus enables hierarchical analysis using chiplet models. Chiplet models can be reduced chip models in spice format or more accurate xPGV models which are highly accurate proprietary models generated by Voltus. With xPGV models, the hierarchical PI analysis has almost the same accuracy as flat analysis but offers 10X or higher benefit in runtime and memory requirements.

Conclusion

This blog has highlighted the major design trends enabled by advanced 3D packaging and the design challenges arising from these advancements. The design of power delivery networks is one of these major challenges. We have discussed Cadence solutions to overcome this PI challenge. To learn more, view our recent webinar, "Addressing 3D-IC Power Integrity Design Challenges" and visit the Voltus web page.

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Does anyone know whether it is possible to have multiple contact points for a bond wire on a large die pad? Note: This is different from adding multiple wires which I will also be doing. I need to add multiple bond connections to the same large die pad for redundancy connections to each pad for each wire. I have a large die pad which I need to have 5 wires with each wire having 3 bond connections to the same die pad.

Starting SPB 23.1, Allegro Package Designer Plus (APD+) has been rebranded as Allegro X Advanced Package Designer (Allegro X APD).

The splash screen for Allegro X APD will appear as shown below, instead of showing APD+ 2023:

For the Windows Start menu in 23.1, it will display as Allegro X APD 2023 instead of APD+ 2023, as shown below

23.1 Start menu 

In the Product Choices window for 23.1, you will see Allegro X Advanced Package Designer in the place of Allegro Package Designer +, as shown below: 

23.1 product title

Have you heard that starting SPB 23.1, Allegro Package Designer Plus (APD+) will be renamed as Allegro X Advanced Package Designer (Allegro X APD)? 

Allegro X APD offers multiple new features and enhancements on topics like Via Structures, Wirebond, Etchback, Text Wizards, 3D Canvas, and more. 

This post presents the new 3DX Canvas introduced in SPB 23.1. This can be invoked from Allegro X APD (from the menu item View > 3DX Canvas). 

Some of the key benefits of the new canvas: 

• This canvas addresses the scale and complexity in large modern package designs. It provides highly efficient visual representation and implementation of packages. 
  
• The new architecture enables high-performance 3D incremental updates by utilizing GPU for fast rendering. 
  
  
• Real-time 3D incremental updates are supported, which means that the 3D view is in sync with all changes to the database. 
  
  
• The new canvas provides 3D visualization support for packaging objects such as wire bonds, ball, die bump/pillar geometries, die stacks, etch back, and plating bar. 
  
  
• This release also introduces the interactive measurement tool for a 3D view of packages. Once you open 3DX Canvas, press the Alt key and you can select the objects you want to measure. 
  
• 3DX Canvas provides new 3D DRC Bond Wire Clearances with Real 3D DRC Checks. True 3D DRC in Constraint Manager has been introduced. If you open Constraint Manager, there will be a new worksheet added. Following DRC checks are supported: 

  Wire to Wire 
  Wire to Finger 
  Wire to Shape 
  Wire to Cline 
  Wire to Component

Have you ever encountered ERROR(SPMHNI-67) while importing logic? If yes, you might already know that you had to export libraries of the design and make sure that paths (devpath, padpath, and psmpath) include the location of exported files.  

Starting in SPB23.1, if you go to File > Import > Logic/Netlist and click on the Other tab, you will see an option, Reuse device files for existing components. 

After selecting this option, ERROR(SPMHNI-67) will no longer be there in the log file, because the tool will automatically extract device files and seamlessly use them for newly imported data. In other words, SPB_23.1 lets you reuse the device / component definitions already in the design without first having to dump libraries manually. An excellent improvement, don’t you think?  

Starting from SPB23.1, a new option, Allow DRCs to surrounding metal, has been added in the Etch-Back form to allow DRCs to the surrounding objects. form to allow DRCs to the surrounding objects.

The Allow DRCs to surrounding metal option lets you see and adjust objects instead of the current behavior, which sacrifices the width of the mask for the trace.

• When this option is turned off, it maintains the EB mask to another object clearance.
• When this option is enabled, it keeps the EB mask to the EM trace edge clearance and shows a DRC if the EB mask to another object spacing is out of rule.

Starting SPB 23.1, a new pin property, WIREBOND_PROFILE_NAME is introduced. This property can be used to define a wirebond profile to a die pin. When adding a wirebond, the pin will use the profile defined in the WIREBOND_PROFILE_NAME property associated to the die pin.

Assign the WIREBOND_PROFILE_NAME property to the die pin using Edit > Properties and set the desired wirebond profile name in the Value field.

The following image displays the WIREBOND_PROFILE_NAME property assigned to the pin and wire profile of the Wire Bond for that pin.

Have you ever thought of a handy utility to specify all necessary transmission line parameters to decide upon the stackup?   

Starting SPB 23.1, a handy feature Transmission Line Calculator, is built into Allegro X Advanced Package Designer (Allegro X APD). This feature will require either an SiP Layout license or can be accessed through SiP Layout Bundle. 

From the Analyze dropdown menu in the 23.1 Allegro X APD toolbar, you can choose Transmission Line Calculator. 

You can use this calculator to help decide constraints and stackup for laminate-based PCB or Packages. You can calculate the correct stackup material and width/spacing to meet any requirements that may be later entered in a constraint. This is truly a calculated number and not a true field solver. 

The different types of calculations that the Transmission Line Calculator can provide are Microstrip, Embedded microstrip, Stripline, CPW (Coplanar), FGCPW (frequency-dependent Coplanar), Asymmetric stripline, Coupled microstrip (Differential Pair), Coupled stripline (Differential Pair), and Dual striplines. 

This feature is important for customers relying on fabricators/spreadsheets to provide this information or need to test a quick spacing/width as per the impedance value. 

Let us know your comments on this new feature in 23.1 Allegro X APD. 

Starting SPB 23.1, Allegro X APD lets you import/export the symbol and component properties by using Die Text-In/Out wizards. 

Exporting the symbol 

You can export the symbol by using File > Export > Die Text-Out Wizard. 

In the Die Text-Out Wizard window, you can see the newly added options, that is, Component Properties and Symbol Properties. 

This entire information including the properties will be saved in a text file. 

Importing the symbol 

You can import the same text file in Allegro X APD by using Die Text-In Wizard. 

Choose the text file you want to import. 

Symbol properties added in the text file will be visible in the Die Text-In Wizard window. 

At times, there might arise a condition in the design where you need to push the net of selected pins to all its physically connected objects. For example, a few pins are updated with a new net, and it is required to push the new net to all its connected objects. At times, you might update the die or copy routing to other components, when a portion of routing gets the wrong net.

To propagate the net of the pin to all its physically connected objects, Allegro X APD uses the standalone command, Push Connectivity.

You can call the command through Logic > Push Connectivity.

Alternately, you can use the push connectivity command at the command line. Once the command is active, it lets you select pins or symbols that will be used to push net connectivity to all connected objects.

Presently, dynamic shapes and filled rectangles are not considered as part of connectivity. Static shapes are supported.

In a package design, designers often need to perform degassing. This is typically done at the end of the design process before sending the design to the manufacturer.

Degassing is a process where you perforate power planes, voltage planes, and filled shapes in your design. Degassing holes let the gas escape from beneath the metal during manufacturing of the substrate. The perforations or holes for degassing are generally small, having a specified size and shape, and are spaced regularly across the surface of the plane. If the degassing process is not done, it may result in the formation of gas bubbles under the metal, which may cause the surface of the metal to become uneven. After you degas the design, it is recommended to perform electrical verification.

Allegro X APD has degassing features that allow users to automate the process and place holes in the entire shape.

In today’s topic, we will talk about how to avoid adding  degassing holes on a particular shape.

Sometimes, a designer may need to avoid adding degassing holes to a particular shape on a layer. All other shapes on the layer can have degassing holes but not this shape. Using the Layer Based Degassing Parameters option, the designer can set the degassing parameters for all shapes on the layer. Now, the designer would like to defer adding degassing holes for this particular shape.

You may wonder if there is an easy way to achieve this. We will now see how this can be done with the tool.

Once the degassing parameters are set, performing Display > Element on any of the shapes on that layer will show the degassing parameters set.

You can apply the Degas_Not_Allowed property to a shape to specify that degassing should not be performed on this shape, even if the degassing requirements are met. Select the shape and add the property as shown below.

Switch to Shape Edit application mode (Setup > Application mode > Shape Edit) and window-select all shapes on the layer. Then, right-click and select Deferred Degassing > All Off.

Now, all shapes on the layer will have degassing holes except for the shape which has the Degas_Not_Allowed property attached to it.

By default, a dielectric must separate each pair of conductor layers in the cross-section of a design. In rare cases, this does not represent the real, manufactured substrate.

If your design requires you to have conductor layers that are not separated by a dielectric (such as, for half-etch designs), there is a variable that needs to be set in Allegro X APD. You must set this by enabling the variable icp_allow_adjacent_conductors. This entry, and its location in the User Preferences Editor, are shown in the following image.

The Objects on adjacent conductor layers do not electrically connect together, automatically. A via must be used to establish the inter-layer connections.

When enabling this option, it is recommended to exercise caution because excluding dielectric layers from your cross-section can lead to inaccurate calculations, including the calculations for signal integrity and via heights. It is important that your cross-section accurately reflect the finished product to ensure the most accurate results possible. Any dielectric layers present in the manufactured part need to be in the cross-section for accurate extraction, 3D viewing, and so on.

Let us know your comments on the various designs that would require adjacent conductor layers.

Hi，

Can you tell me which setting is causing this?

In the general edit. I try slide via to other position. but the slide is wrong.

in the cm，i set pad-pad connect is all allowed，and i turn off via to pad spacing in the same net spacing. only turn on via to via spacing in the same net spacing，set to via to via spacing =0.

default the via is closer to the pad edge, I think the correct location is show in the pic2.

Power and Ground rings are exposed rings of metal surrounding a die that supply power/ground to the die and create a low-impedance path for the current flow. These rings ensure stable power distribution and reduce noise. Allegro X Package Designer Plus has a utility called Power/Ground Ring Generator which lets you define and place one or more shapes in the form of a ring around a die.

 To run the PWR/GND Generator Wizard, go to Route > Power/Ground Ring Generator or type "pring wizard" in the APD command window to invoke the Wizard.

This Wizard lets you define and place one or more shapes in the form of a ring around a die. The Power/Ground Ring Wizard creates up to 12 rings (shapes) at a time. If you require more rings, you can run the Power/Ground Ring Wizard as many times as needed. This command displays a wizard in which you can specify:

• The number of rings to be generated
• The creation of the first ring as a die flag (Die flag is the boundary of the die like the power ring.)
  • If you create a die flag and the first ring is the same net as the flag, you can enter a negative distance to overlap the ring and the die flag.
• Multiple options for placement of the rings with respect to:
  • Origination point
  • Distance from the edge of the die
  • Distance from the nearest die pin on each die side
• The reference designator of the die with which the rings will be used
• The distance between rings
• The width of each ring
• The corner types on each ring (arc, chamfer, and right-angle)
• An assigned net name for each ring
• A label for each ring

The rings are basic in nature. For other shape geometries or split rings, choose Shape > Polygon or Shape > Compose/Decompose Shape from the menu in the design window.

Depending on the options selected, the Power/Ground Ring Wizard UI changes, representing how the rings will be created. Verify the Wizard settings to ensure that the rings are created as intended.

1. When the Power/Ground Ring Wizard appears, set the number of rings to 2, accept the other defaults, and click Next. You can set Create first ring as die flag to create a basic die flag.

         2. Define Ring 1 and the net associated with it.

              a) Browse and choose Vss in the Net Names dialog box.

            b) Click OK.

            c) Specify the label as VSS.

            d) Click Next.

             The first ring should appear in your design. It is associated with the proper net; in this case, VSS.

2. For the second ring, choose the net as Vdd and specify the label as VDD.
3. Click Next.
4. Click Finish in the Result Verification screen to complete the process.

The completed rings appear as shown below.

Now, when you click on Power and Ground Die Pin and add wirebonds, you will see that the wirebonds are placed directly on the Power and Ground rings.

When working on a complex design, it is common to have very many net ratlines. Quantities like 1000 ratlines are possible. It can result in a cluttered view while routing. Therefore, it is useful to make all other ratlines invisible while routing interactively. You would like to make all ratlines visible again when each route action is completed.

You can easily do this by enabling the Auto-blank other rats option during routing. When enabled, all rats other than the primary ones are suppressed during the Add Connect command.

Hello, SKILL experts. 

I'm studying SKILL language to build some useful function in APD+.

Now, I want to execute 'Import Sub-drawing' function in new form.

But I cannot find how to do execute APD+ embedded function in a field of new form. 

Has anyone experienced this or idea to solve this problem? 

Display Stream Compression (DSC) is a lossless or near-lossless image compression standard developed by the Video Electronics Standards Association (VESA) for reducing the bandwidth required to transmit high-resolution video and images. DSC compresses video streams in real-time, allowing for higher resolutions, refresh rates, and color depths while minimizing the data load on transmission interfaces such as DisplayPort, HDMI, and embedded display interfaces.

Why Is DSC Needed?

In the ever-evolving landscape of display technology, the pursuit of higher resolutions and better visual quality is relentless. As display capabilities advance, so do the challenges of managing the immense amounts of data required to drive these high-performance screens. This is where DSC steps in. DSC is designed to address the challenges of transmitting ultra-high-definition content without sacrificing quality or performance. As displays grow in resolution and capability, the amount of data they need to transmit increases exponentially. DSC addresses these issues by compressing video streams in real-time, significantly reducing the bandwidth needed while preserving image quality.
 

DSC Use in End-to-end System

DSC Key Features

• Encoding tools:
  • Modified Median-Adaptive Prediction (MMAP)
  • Block Prediction (BP)
  • Midpoint Prediction (MPP)
  • Indexed color history (ICH)
  • Entropy coding using delta size unit-variable length coding (DSU-VLC)

• The DSC bitstream and decoding process are designed to facilitate the decoding of 3 pixels/clock in practical hardware decoder implementations. Hardware encoder implementations are possible at 1 pixel/clock.
• DSC uses an intra-frame, line-based coding algorithm, which results in very low latency for encoding and decoding.

DSC encoding algorithm
 

• Compression can be done to a fractional bpp. The compressed bits per pixel ranges from 6 to 63.9375.
• For validation/compliance certification of DSC compression and decompression engines, cyclic redundancy checks (CRCs) are used to verify the correctness of the bitstream and the reconstructed image.
• DSC supports more color bit depths, including 8, 10, 12, 14, and 16 bpc.
• DSC supports RGB and YCbCr input format, supporting 4:4:4, 4:2:2, and 4:2:0 sampling.
• Maximum decompressor-supported bits/pixel values are as listed in the Maximum Allowed Bit Rate column in the table below

• DP DSC Source device shall program the bit rate within the range of Minimum Allowed Bit Rate column in the table:

Summary

Display Stream Compression (DSC) is a technology used in DisplayPort to enable higher resolutions and refresh rates while maintaining high image quality. It works by compressing the video data transmitted from the source to the display, effectively reducing the bandwidth required. DSC uses a visually lossless algorithm, meaning that the compression is designed to be imperceptible to the human eye, preserving the fidelity of the image. This technology allows for smoother, more detailed visuals at higher resolutions, such as 4K or 8K, without requiring a significant increase in data bandwidth.

More Information

• Cadence has a very mature Verification IP solution. Verification over many different configurations can be used with DisplayPort 2.1 and DisplayPort 1.4 designs, so you can choose the best version for your specific needs.
• The DisplayPort VIP provides a full-stack solution for Sink and Source devices with a comprehensive coverage model, protocol checkers, and an extensive test suite.
• More details are available on the DisplayPort Verification IP product page, Simulation VIP pages.
• If you have any queries, feel free to contact us at talk_to_vip_expert@cadence.com

Verisium SimAI App harnesses the power of machine learning technology with the Cadence Xcelium Logic Simulator - the ultimate breakthrough in accelerating verification closure. It builds models from regressions run in the Xcelium simulator, enabling the generation of new regressions with specific targets. The Verisium SimAI app also features cousin bug hunting, a unique capability that uses information from difficult-to-hit failures to expose cousin bugs. With these advanced machine learning techniques, Verisium SimAI offers the potential for a significant boost in productivity, promising an exciting future for our users.

Figure 1: Regression compression and coverage maximization with Verisium SimAI 

What can I do with Verisium SimAI?

You can exercise different use cases with Verisium SimAI as per your requirements. For some users, the goal might be regression compression and improving coverage regain. Coverage maximization and hitting new bins could be another goal. Other users may be interested in exposing hard-to-hit failures, bug hunting for difficult to find issues. Verisium SimAI allows users to take on any of these challenges to achieve the desired results.

Let's go into some more details of these use cases and scenarios where using SimAI can have a big positive impact.

1. Using SimAI for Regression Compression and Coverage Regain

Unlock up to 10X compute savings with SimAI!

Verisium SimAI can be used to compress regressions and regain coverage. This flow involves setting up your regression environment for SimAI, running your random regressions with coverage and randomization data followed by training, and finally, synthesizing and running the SimAI-generated compressed regressions. The synthesized regression may prune tests that do not help meet the goal and add more runs for the most relevant tests, as well as add run-specific constraints. This flow can also be used to target specific areas like areas involving a high code churn or high complexity.

You can check out the details of this flow with illustrative examples in the following Rapid Adoption Kits (RAK) available on the Cadence Learning and Support Portal (Cadence customer credentials needed):

• Using SimAI with vManager (For Regression Compression and Coverage Regain) (RAK) 
• Using SimAI with a Generic Runner (For Regression Compression and Coverage Regain) (RAK)

2. Using SimAI for Coverage Maximization and Targeting coverage holes

Reduce your Functional Coverage Holes by up to 40% using SimAI!

Verisium SimAI can be used for iterative coverage maximization. This is most effective when regressions are largely saturated, and SimAI will explicitly try to hit uncovered bins, which may be hard-to-hit (but not impossible) coverage holes. This is achieved using iterative learning technology where with each iteration, SimAI does some exploration and determines how well it performed. This technique can also be used for bug hunting by using holes as targets of interest.

See more details on the Cadence Learning and Support Portal:

• Using SimAI for Coverage Maximization - vManager flow (RAK) 
• Using SimAI for Coverage Maximization - Generic Runner Flow (RAK)

3. Using SimAI for Bug Hunting

Discover and fix bugs faster using SimAI!

Verisium SimAI has a new bug hunting flow which can be used to target the goal of exposing hard-to-hit failure conditions. This is achieved using an iterative framework and by targeting failures or rare bins. The goal to target failures is best exercised when the overall failure rate is typically low (below 5%). Iterative learning can be used to improve the ability to target specific areas. Use the SimAI bug hunting use case to target rare events, low hit coverage bins, and low hit failure signatures.

See more details on the Cadence Learning and Support Portal:

• Using SimAI for Bug Hunting with vManager (RAK) 
• Using SimAI for Bug Hunting – Generic runner flow (RAK) 

Unlock compute savings, reduce your functional coverage holes, and discover and fix bugs faster with the power of machine learning technology now enabled by Verisium SimAI!

Please keep visiting  https://support.cadence.com/raks to download new RAKs as they become available.

Please note that you will need the Cadence customer credentials to log on to the Cadence Online  Support  https://support.cadence.com/, your 24/7 partner for getting help in resolving issues related to Cadence software or learning Cadence tools and technologies.

Happy Learning!

As technology continues to evolve at a rapid pace, the importance of robust and efficient interconnect standards cannot be overstated. Peripheral Component Interconnect Express (PCIe) has been a cornerstone in high-speed data transfer, enabling seamless communication between various hardware components.   

With the advent of PCIe 6.1 ECN, a significant advancement in speed and efficiency, ensuring the accuracy and reliability of its operations is paramount. One critical aspect of this is the verification of shared credit updates. For detailed understanding on Shared Credit, please refer Understanding PCIe 6.0 Shared Flow Control. 

In this blog, we will discuss why this verification is essential and what it entails.  

Introduction 

PCIe 6.1 ECN brings numerous advancements over earlier versions, such as increased bandwidth and faster data transfer speeds.   

A crucial mechanism for efficient data transmission in PCIe 6.0 is the credit-based flow control system. In this system, devices monitor credits, representing the buffer capacity available for incoming data.   

When a device transmits data, it uses credits, which are replenished or adjusted once the data is received and processed. This system ensures that the sender does not overload the receiver.  

Given the critical role of shared credit updates in maintaining the integrity and efficiency of data transfers, verification of these updates is crucial.  Proper management of credit updates is essential to ensure data integrity, as any discrepancies can lead to data loss, corruption, or system crashes.   

Verification also guarantees efficient resource allocation, preventing scenarios where some components are starved of credit while others have an excess, thus avoiding inefficiencies.  Credit inefficiencies pose issues in low power negotiations by preventing devices from entering low power states. Additionally, verification involves checking for proper error handling mechanisms, ensuring that the system can recover gracefully from errors in credit updates and maintain overall stability.   

PCIe 6.1 ECN Flow Control Optimizations Over PCIe 6.0

PCIe 6.1 ECN builds on the FLIT-based architecture introduced in PCIe 6.0, further optimizing flow control mechanisms to handle increased data rates and improved efficiency.  PCIe 6.1 ECN introduced refinements in credit management, making the allocation and advertisement of credits more precise, which helps in reducing bottlenecks and improving data flow efficiency.  Enhancements in flow control protocols ensure better management of buffer spaces and more efficient credit allocation. These enhancements are designed to handle the increased data rates and throughput demands of next-generation applications, ensuring robust and efficient data flow across PCIe devices.  

Below are some major updates: 

1. There have been improvements in error detection and correction mechanisms in PCIe 6.1 ECN to enhance flow control reliability by ensuring that corrupted data packets are detected and handled appropriately without disrupting the flow of valid packets.  
2. The merged credit system, which was a key feature introduced int PCIe 6.0 to simplify and optimize credit management, was further enhanced in PCIe 6.1 ECN to improve performance and efficiency.  
3. PCIe 6.1 ECN introduced better algorithms for allocating and reclaiming merged credits to handle high data rates, introduced more robust error detection and correction mechanism reducing the degradation or system instability. 
4. PCIe 6.1 ECN provided clear guidelines on how to implement the merged credit system correctly, helping developers to implement more reliable systems. For more details, please refer to Specifications section 2.6.1 Flow Control (FC) Rules.

Summary 

In summary, PCIe 6.0 is a complex protocol with many verification challenges. You must understand many new Spec changes and think about the robust verification plan for the new features and backward compatible tests impacted by new features. Cadence’s PCIe 6.0 Verification IP is fully compliant with the latest PCIe Express 6.0 specifications and provides an effective and efficient way to verify the components interfacing with the PCIe 6.0 interface. Cadence VIP for PCIe 6.0 provides exhaustive verification of PCIe-based IP and SoCs, and we are working with early adopter customers to speed up every verification stage.   

More Information

For more info on how Cadence PCIe Verification IP and Triple Check VIP enable users to confidently verify PCIe 6.0, see VIP for PCI Express, VIP for Compute Express Link  and TripleCheck for PCI Express    

See the PCI-SIG website for more details on PCIe in general and the different PCI standards.  

For more information on PCIe 6.0 new features, please visit PCIeLaneMargin, PCIe6.0LaneMargin, and Demonstrating PCIe 6.0 Equalization Procedure.

The application of real-time data processing or responsiveness is crucial, such as in high-performance computing, data centers, or applications requiring low-latency data transfers. It enables efficient use of PCIe bandwidth and resources by intelligently managing memory write operations based on system dynamics and workload priorities. By effectively leveraging Deferrable Memory Write [DMWr], Devices can achieve optimized performance and responsiveness, aligning with the evolving demands of modern computing applications.

What Is Deferrable Memory Write?

Deferrable Memory Write (DMWr) ECN introduced this new memory transaction type, which was later officially incorporated in PCIe 5.0 to CXL2.0. This enhanced type of memory transaction is Deferrable Memory Write [DMWr], which flows as another type of existing Read/Write memory transaction; the major difference of this Deferrable Memory Write, where the Requester attempts to write to a given location in Memory Space using the non-posted DMWr TLP Type, it Postponing their completion of memory write transactions to improve overall system efficiency and performance, those memory write operation can be delay or deferred until other priority task complete.

The Deferrable Memory Write (DMWr) requires the Completer to return an acknowledgment to the Requester and provides a mechanism for the recipient to defer (temporarily refuse to service) the Request.

DMWr provides a mechanism for Endpoints and hosts to choose to carry out or defer incoming DMWr Requests. This mechanism can be used by Endpoints and Hosts to simplify the design of flow control, reduce latency, and improve throughput. The Deferrable Memory writes TLP format in Figure A.

(Fig A) Deferrable Memory writes TLP format.

Example Scenario

Here's how the DMWr works with a simplified example: Imagine a system with an endpoint device (Device A) and a host CPU (Device B). Device B wants to write data to Device A's memory, but due to varying reasons such as system bus congestion or prioritization of other transactions, Device A can defer the completion of the memory write request. Just follow these steps:

1. Initiation of Memory Write: Device B initiates a memory write transaction to Device A. This involves sending the memory write request along with the data payload over the PCIe physical layer link.
2. Acknowledgment and Deferral: Upon receiving the memory write request, Device A acknowledges the transaction but may decide to defer its completion. Device A sends an acknowledgment (ACK) back to Device B, indicating it has received the data and intends to complete the write operation but not immediately.
3. Deferred Completion: Device A defers the completion of the memory write operation to a later, more opportune time. This deferral allows Device A to prioritize other transactions or optimize the use of system resources, such as memory bandwidth or processor availability.
4. Completion and Response: At a later point, Device A completes the deferred memory write operation and sends a completion indication back to Device B. This completion typically includes any status updates or additional information related to the transaction.

Usage or Importance of DMWr

Deferrable Memory Write usage provides the improvement in the following aspects:

• Reduced Latency: By deferring less critical memory write operations, more critical transactions can be processed with lower latency, improving overall system responsiveness.
• Improved Efficiency: Optimizes the utilization of system resources such as memory bandwidth and CPU cycles, enhancing the efficiency of data transfers within the PCIe architecture.
• Enhanced Performance: Allows devices to manage and prioritize transactions dynamically, potentially increasing overall system throughput and reducing contention.

Challenges in the Implementation of DMWr Transactions

The implementation of deferrable memory writes (DMWr) introduces several advancements and challenges in terms of usage and verification:

1. Timing and Synchronization: DMWr allows transactions to be deferred, complicating timing requirements or completing them within acceptable timing windows to avoid protocol violations. Ensuring proper synchronization between devices becomes critical to prevent data loss or corruption.
2. Protocol Compliance: Verification must ensure compliance with ECN PCIe 6.0 and CXL specifications regarding when and how DMWr transactions can be initiated and completed.
3. Performance Optimization: While DMWr can improve overall system performance by reducing latency, verifying its impact on system performance and ensuring it meets expected benchmarks is crucial.
4. Error Handling: Handling errors related to deferred transactions adds complexity. Verifying error detection and recovery mechanisms under various scenarios (e.g., timeout during deferral) is essential.

Verification Challenges of DMWr Transactions

The challenges to verifying the DMWr transaction consist of all checks with respect to Function, Timing, Protocol compliance, improvement, Error scenario, and security usage on purpose, as well as Data integrity at the PCIe and CXL.

1. Functional Verification: Verifying the correct implementation of DMWr at both ends of the PCIe link (transmitter and receiver) to ensure proper functionality and adherence to specifications.
2. Timing Verification: Validating timing constraints associated with deferring writes and ensuring transactions are completed within specified windows without violating protocol rules.
3. Protocol Compliance Verification: Checking that DMWr transactions adhere to PCIe and CXL protocol rules, including ordering rules and any restrictions on deferral based on the transaction type.
4. Performance Verification: Assessing the impact of DMWr on overall system performance, including latency reduction and bandwidth utilization, through simulation and testing.
5. Error Scenario Verification: Creating and testing scenarios to verify error handling mechanisms related to DMWr, such as timeouts, retries, and recovery procedures.
6. Security Considerations: Assessing potential security vulnerabilities related to DMWr, such as data integrity risks during deferred transactions or exposure to timing-based attacks.

Major verification challenges and approaches are timing and synchronization verification in the context of implementing deferrable memory writes (DMWr), which is crucial due to the inherent complexities introduced by deferred transactions. Here are the key issues and approaches to address them:

Timing and Synchronization Issues

1. Transaction Completion Timing:
   • Issue: Ensuring deferred transactions are completed within the specified time window without violating protocol timing constraints.
   • Approach: Design an internal timer and checker to model worst-case scenarios where transactions are deferred and verify that they are complete within allowable latency limits. This involves simulating various traffic loads and conditions to assess timing under different scenarios.
2. Ordering and Dependencies:
   • Issue: Verifying that transactions deferred using DMWr maintain the correct ordering and dependencies relative to non-deferred transactions.
   • Approach: Implement test scenarios that include mixed traffic of DMWr and non-DMWr transactions. Verify through simulation or emulation that dependencies and ordering requirements are correctly maintained across the PCIe link.
3. Interrupt Handling and Response Times:
   • Issue: Verify the handling of interrupts and ensure timely responses from devices involved in DMWr transactions.
   • Approach: Implement test cases that simulate interrupt generation during DMWr transactions. Measure and verify the response times to interrupts to ensure they meet system latency requirements.

In conclusion, while deferrable memory writes in PCIe and CXL offer significant performance benefits, their implementation and verification present several challenges related to timing, protocol compliance, performance optimization, and error handling. Addressing these challenges requires rigorous testing and testbench of traffic, advanced verification methodologies, and a thorough understanding of PCIe specifications and also the motivation behind introducing this Deferrable Write is effectively used in the CXL further. Outcomes of Deferrable Memory Write verify that the performance benefits of DMWr (reduced latency, improved throughput) are achieved without compromising timing integrity or violating protocol specifications.

In summary, PCIe and CXL are complex protocols with many verification challenges. You must understand many new Spec changes and consider the robust verification plan for the new features and backward compatible tests impacted by new features. Cadence's PCIe 6.0 Verification IP is fully compliant with the latest PCIe Express 6.0 specifications and provides an effective and efficient way to verify the components interfacing with the PCIe 6.0 interface. Cadence VIP for PCIe 6.0 provides exhaustive verification of PCIe-based IP and SoCs, and we are working with Early Adopter customers to speed up every verification stage.

More Information

• For more info on how Cadence PCIe Verification IP and TripleCheck VIP enable users to confidently verify PCIe 6.0, see our VIP for PCI Express, VIP for Compute Express Link, and TripleCheck for PCI Express
• See the PCI-SIG website for more details on PCIe in general and the different PCI standards.

Cadence Protium prototyping platforms rapidly bring up an SoC or system prototype and provide a pre-silicon platform for early software development, SoC verification, system validation, and hardware regressions. In this Training W ebinar, we will explore debugging using Save/Restart on Protium X2 . This feature saves execution time and lets you focus on actual debugging. The system state can be saved before the bug appears and restartS directly from there without spending time in initial execution. We’ll cover key concepts and applications, explore Save/Restart performance metrics, and provide examples to help you understand the concepts. Agenda: The key concepts of debugging using save/restart Capabilities, limitations, and performance metrics Some examples to enable and use save/restart on the Protium X2 system Date and Time Thursday, November 7, 2024 07:00 PST San Jose / 10:00 EST New York / 15:00 GMT London / 16:00 CET Munich / 17:00 IST Jerusalem / 20:30 IST Bangalore / 23:00 CST Beijing REGISTER To register for this webinar, sign in with your Cadence Support account (email ID and password) to log in to the Learning and Support System*. Then select Enrol to register for the session. Once registered, you’ll receive a confirmation email containing all login details. A quick reminder: If you haven’t received a registration confirmation within 1 hour of registering, please check your spam folder and ensure your pop-up blockers are off and cookies are enabled. For issues with registration or other inquiries, reach out to eur_training_webinars@cadence.com . Want to See More Webinars? You can find recordings of all past webinars here Like This Topic? Take this opportunity and register for the free online course related to this webinar topic: Protium Introduction Training The course includes slides with audio and downloadable lab exercises designed to emphasize the topics covered in the lecture. There is also a Digital Badge available for the training. Want to share this and other great Cadence learning opportunities with someone else? Tell them to subscribe . Hungry for Training? Choose the Cadence Training Menu that’s right for you. To view our complete training offerings, visit the Cadence Training website . Related Courses Protium Introduction Training Course | Cadence Palladium Introduction Training Course | Cadence Related Blogs Training Insights – A New Free Online Course on the Protium System for Beginner and Advanced Users Training Insights – Palladium Emulation Course for Beginner and Advanced Users Related Training Bytes Protium Flow Steps for Running Design on Protium System ICE and IXCOM mode comparison ICE compile flow IXCOM compile flow PATH settings for using Protium System Please see the course learning maps for a visual representation of courses and course relationships. Regional course catalogs may be viewed here

The Sigrity and Systems Analysis (SIGRITY/SYSANLS) 2024.1 release is now available for download at Cadence Downloads . For the list of CCRs fixed in this release, see the README.txt file in the installation hierarchy. SIGRITY/SYSANLS 2024.1 Here is a list of some of the key updates in the SIGRITY/SYSANLS 2024.1 release: For more details about these and all the other new and enhanced features introduced in this release , refer to the following document: Sigrity Release Overview and Common Tools What's New . Supported Platforms and Operating Systems Platform and Architecture X86_64 (lnx86) Windows (64 bit) Development OS RHEL 8.4 Windows Server 2022 Supported OS RHEL 8.4 and above RHEL 9 SLES 15 (SP3 and above) Windows 10 Windows 11 Windows Server 2019 Windows Server 2022 Systems Analysis 2024.1 Clarity 3D Solver Clarity 3D Layout Structure Optimization Workflow : A new workflow, Clarity 3D Layout Structure Optimization Workflow, has been added to Clarity 3D Layout. This workflow integrates Allegro PCB Designer with Clarity 3D Layout for high-speed structure optimization. Component Geometry Model Editor : The new Clarity 3D Layout editor lets you set up ports, solder bumps/balls/extrusions, and two-terminal and multi-terminal circuits using a single GUI. Coaxial Open Port Option Added to Port Setup Wizard : The Coaxial Open Port option lets you create ports for each target net pin and reference net pin in Clarity 3D Layout. The nearby reference net pins are then used as a reference for each target net pin, reducing the number of ports needed. In addition, the ports of unused reference net pins are shorted to the ground. Parametric Import Option Added : Two new options, Parametric Import and Default Import , have been added to the Tools – Launch Clarity3DWorkbench menu. The Parametric Import option lets you import the design along with its parameters into Clarity 3D Workbench. The Default Import option lets you ignore the parameters when importing the design into Clarity 3D Workbench. Component Library Added to Generate 3D Components : Clarity 3D Workbench now includes a new component library that lets you use predefined 3D component templates or add existing 3D components to create 3D designs and simulation models. AI-Powered Content Search Capability : Clarity 3D Workbench and Clarity 3D Transient Solver now support an AI-powered capability for searching the content and displaying relevant information. Expression Parser to Handle Undefined Parameters : Clarity 3D Workbench and Clarity 3D Transient Solver support writing expressions or equations containing undefined parameters in the Property window to describe a simulation variable. The improved expression parser automatically detects any undefined parameter in an expression and prompts users to specify their values. This capability lets you define a model or a simulation variable as a function instead of specifying static values. For detailed information, refer to Clarity 3D Layout User Guide and Clarity 3D Workbench User Guide on the Cadence Support portal. Clarity 3D Transient Solver Mesh Processing Improved to Simulate Large Use Cases : Clarity 3D Transient Solver leverages a new meshing algorithm that enhances overall mesh processing, specifically for large designs and use cases. The new algorithm dramatically improves the mesh quality, minimum mesh size, number of mesh key points, total mesh number, and memory usage. Advanced Material Processing Engine : The material processing capability has been enhanced to handle thin outer metal, which previously resulted in open and short issues in some designs. In addition, the material processing engine offers improved mode extraction for particular use cases, including waveguide and coaxial designs. Characteristic Impedance Calculation Improved : The solver engine now uses a new analytical calculation method to calculate the characteristic impedance of coaxial designs with improved accuracy. For detailed information, refer to Clarity 3D Transient Solver User Guide on the Cadence Support portal. Celsius Studio Celsius Interchange Model Introduced : Celsius Studio now supports Celsius Interchange Model generation, which is a 3D model derived from detailed physical designs for multi-physics and multi-scale analysis. This Celsius Interchange Model file ( .cim ) serves as a design information carrier across Celsius Studio tools, enabling a variety of simulation and analysis tasks . Celsius 3DIC Thermal Workflow Improvements : The Thermal Simulation workflows in Celsius 3DIC have been significantly enhanced. Key improvements include: Advanced Power Setup with Transient Power Function and Multi Mode options Enhanced GUI for the Mesh Control and Simulation Control tabs Improved meshing capabilities Celsius Interchange Model ( .cim ) generation Material library support for block and connections Import of Heat Transfer Coefficients (HTCs) from a CFD file Bump creation through the Bump Array Wizard Layer Stackup CSV file generation Celsius 3DIC Warpage and Stress Workflow Enhancements : The Warpage and Stress workflow in Celsius 3DIC has undergone significant improvements, such as: Improved multi-stage warpage simulation flow for 3DIC packaging process Enhanced GUI for the Mesh Control , Simulation Control , and Stress Boundary Conditions tabs Support for large deformations and temperature profiles Bump creation through the Bump Array Wizard New constraint types Enhanced meshing capabilities Geometric Nonlinearity Support in Warpage and Stress Analysis : Large deformation analysis is now supported in warpage and stress studies. This study uses the Total Lagrangian approach to model geometric nonlinearities in simulation, which allows accurate prediction of final deformations. Thermal Network Extraction and Simulation : In the solid extraction flow in Celsius 3D Workbench, you can now import area-based power map files to create terminals. For designs with multiple blocks, this capability allows automatic terminal creation, eliminating the need to manually create and set up 2D sheets individually. Additionally, thermal throttling feature is now supported in Celsius Thermal Network. This makes it ideal for preliminary analyses or when a quick estimation is required. It runs significantly faster than 3D models, allowing for quicker iterations and more efficient decision-making. For detailed information, refer to the Celsius 3DIC User Guide , Celsius Layout User Guide and Celsius 3D Workbench User Guide on the Cadence Support portal. Sigrity 2024.1 Layout Workbench Improved Graphical User Interface : A new option, Use Improved User Interface , has been added in the Themes page of the Options dialog box in the Layout Workbench GUI. In the new GUI, the toolbar icons and menu options have been enhanced and rearranged. For detailed information, refer to Layout Workbench User Guide on the Cadence Support portal. Broadband SPICE Python Script Integration with Command Line for Simulation Tasks : Broadband SPICE lets you run Python scripts directly from the command line for performing simulation and analysis. The new -py and *.py options make it easier to integrate Python scripts with the command-line operations. This update streamlines the process of automating and customizing simulations from the command line, which makes your simulation tasks faster and easier. For detailed information, refer to Broadband SPICE User Guide on the Cadence Support portal. Celsius PowerDC Block Power Assignment (BPA) File Format Support : PowerDC now supports the BPA file format. Similar to the Pin Location (PLOC) file, the BPA file is a current assignment file that defines the total current of a power grid cell, which is then equally distributed across the power pins within the cell. This provides better control over the power distribution. Ability to Run Multiple IR Drop Cases Sequentially : You can now select multiple result sinks from the Current-Limited IR Drop flow and run IR Drop analysis for them sequentially. PowerDC automatically runs the simulations in sequence after you select multiple result sinks. This saves time by automating the process. Enhanced Support for Mixed Conversion Devices : PowerDC now supports mixing different conversion devices, such as switching regulators and linear regulators within a single DC-DC/LDO instance. This enhancement offers added flexibility by letting you configure each instance in your design according to your specific needs. For detailed information, refer to PowerDC User Guide on the Cadence Support portal. PowerSI Monte Carlo Method Added : A new option, Monte Carlo Method, has been added in the Optimality dialog box. This option lets you create multiple random samples to depict variations in the input parameters and assess the output. Channel Check Optimization Added : The S-Parameter Assessment workflow in PowerSI now supports Channel Check Optimization . It uses the AI-driven Multidisciplinary Analysis and Optimization (MDAO) technology that lets you optimize your design quickly and efficiently with no accuracy loss. For detailed information, refer to PowerSI User Guide on the Cadence Support portal. SPEEDEM Multi-threaded Matrix Solver Support Added : The Enable Multi-threaded Matrix Solver check box has been added that lets you accelerate the simulation speed for high-performance computing. This check box provides two options, Automatic and Always, to include the -lhpc4 or -lhpc5 parameter, respectively, in the SPEEDEM Simulator (SPDSIM) before running the simulation. For detailed information, refer to the SPEEDEM User Guide on the Cadence Support portal. XtractIM Options to Skip or Calculate Special DC-R Simulation Results : The Skip DC_R of Each Path and Only DC_R of Each Path options have been added to the Setup menu. Skip DC_R of Each Path : This option lets you skip the calculation of the DC-R result during the simulation. Other results, such as SPICE T-model , RL_C of Each Path , Coupling of Each Path , etc., are still calculated. Only DC_R of Each Path : This option lets you calculate the DC-R result only during the simulation. Other results, such as SPICE T-model , RL_C of Each Path , Coupling of Each Path , etc., are not calculated. Color Assignment for Pin Matching : The MCP Auto Connection window includes the Display Color Editor , which lets you assign a color for pin matching. It helps you easily identify the matching pins in the left and right sections of the MCP Auto Connection window . Ability to Save Simulations Individually : The Save each simulation individually check box has been added to the Tools - Options - Edit Options - Simulation (Basic) - General form. Select this check box and run the simulation to generate a simulation results folder containing files and logs with a timestamp for each simulation. Reuse of SPD File Settings : The XtractIM setup check box lets you import an existing package setup to reuse the configurations and settings from one .spd file to another. For detailed information, refer to XtractIM User Guide on the Cadence Support portal. Documentation Enhancements Cloud-Based Help System Upgraded The cloud-based help system, Doc Assistant, has been upgraded to version 24.10, which contains several new features and enhancements over the previous 2.03 version. Sigrity Release Team Please send your questions and feedback to sigrity_rmt@cadence.com .

This November, the engineering and simulation community is set to converge in China for an event that promises to be nothing short of revolutionary. The 2024 BETA CAE Systems China Open Meeting, taking place in the vibrant cities of Beijing and Shanghai on November 5 and 7 , respectively, is a must-attend for anyone looking to stay at the forefront of technological innovation in simulation solutions. Prepare to be inspired by Ben Gu , the visionary Corporate VP of Research and Development at Cadence. He will lead both meetings in Beijing and Shanghai with his keynote on " A New Millennium in Multiphysics System Analysis ." This thought-provoking keynote is expected to provide attendees with a glimpse into the future of engineering simulation and analysis. What sets the BETA CAE Systems Open Meetings apart is not just the high caliber of speakers but also the hands-on training sessions designed to enhance your technical expertise with the BETA CAE software suite. Whether you are an inexperienced individual seeking to acquire fundamental knowledge or an accomplished professional endeavoring to hone your expertise, these training sessions following the open meetings are meticulously tailored to meet your needs. Join Us at the BETA CAE Systems Open Meeting in Beijing The BETA CAE Systems Open Meeting in Beijing will feature a keynote speech by Peng Qiao , Senior Engineer at Great Wall Motors Co., Ltd, on Multidisciplinary Optimization Techniques for Automotive Control Arms . ( View detailed agenda for Beijing. ) When: November 5, 2024 Where: Grand Metropark Hotel Beijing If this sounds interesting, register today for the BETA CAE Systems Beijing Open Meeting by clicking the button below. Don't Miss Out on the BETA CAE Systems Open Meeting in Shanghai After the BETA CAE Systems Open Meeting in Beijing, the next meeting in China will be in Shanghai. During this event, Liu Deping, CAE Engineer from Zhejiang Geely Automobile Research Institute Co., Ltd, will deliver a keynote speech on the Application of ANSA in the Simulation Development Cycle . ( View detailed agenda for Shanghai. ) When: November 7, 2024 Where: InterContinental Shanghai Jing'an Following the open meeting on November 7 will be an exclusive training day on November 8. This session will provide attendees with practical experience using the BETA CAE software to improve their technical skills and provide hands-on knowledge of the software. If you find this intriguing, register now for the BETA CAE Systems Shanghai Open Meeting by clicking the button below. Why Attend? Gain firsthand insights into the latest developments in simulation technology Learn from real-world applications and success stories from various industries Connect and exchange ideas with experts in a collaborative environment Mark your calendars for this unparalleled opportunity to explore the forefront of simulation technology. Whether you're aiming to broaden your knowledge, enhance your technical skills, or connect with industry leaders, the BETA CAE Systems Open Meetings are your gateway to the future of engineering. Join us and be part of shaping the next wave of innovation in the simulation world.

Wild River Technology (WRT), the leading supplier of signal integrity measurement and optimization test fixtures for high-speed channels at data rates of up to 224G, has announced the availability of a new advanced channel modeling solution that helps achieve extreme signal integrity design to 70GHz. Read the press release. The CMP-70 program continues the industry-first simulation-to-measurement collaboration with Cadence that was initially established with the CMP-50. Significant resources were dedicated to the development of the CMP-70 by Cadence and WRT over almost three years. The CMP-70 will be on display at DesignCon 2025 , January 28-30, in Cadence booth 827 to benchmark the Cadence Clarity 3D Solver . “I am not a fan of hype-based programs that simply get attention,” remarked Alfred P. Neves, WRT’s co-founder and chief technical officer. “Both Cadence and Wild River brought substantial skills to the table in this project as we continued our industry-first simulation-to-measurement collaboration. The result is a proven, robust and accurate platform that brings extreme signal integrity to 70GHz designs. This application package has also been instrumental in demonstrating the robust 3D EM simulation capability of the Cadence Clarity solver.” “We’re delighted to continue the joint development and validation program with WRT that started with the CMP-50,” said Gary Lytle, product management director at Cadence. “The skilled and experienced signal integrity technologists that both companies bring to the program results in a superior signal integrity solution for our mutual customers.” CMP-70 Solution Features The solution is available both in a standard configuration and as a custom solution for customer-specific stackups and fabrication. The primary target application is to support a 3D EM solver analysis modeling versus the time- and frequency-domain measurement methodologies. The solution features include: The CMP-70 platform, assembled and 100% TDR NIST traceable tested, with custom stands Material Identification overview web-based meeting including anisotropic 3D material identification A cross-section PCB report and structures for using as-fabricated geometries Measured S-parameters, pre-tested for quality (passivity/causality and resampled for time domain simulations) A host of novel crosstalk structures suited for 112G HD level project analysis PCB layout design files (NDA required) An EDA starter library including loss models with industry-first accurate surface roughness models Comprehensive training available for 3D EM analysis – correspondence, material ID in X-Y and Z axis for a host of EDA tools Industry-First Hausdorff Technique The WRT application package also includes an industry-first modified Hausdorff (MHD) technique , included as MATLAB code. This algorithmic approach provides an accurate way to compare two sets of measurements in multi-dimensional space to determine how well they match. The technique is used to compare the results simulated by the Clarity solver with those measured on the CMP-70 platform. The methodology and initial results are shown in the figure below, where the figure of merit (FOM) is calculated from 10, 35, and finally to 50GHz. The MHD algorithm requires a MATLAB license, but WRT also accommodates customer data as another option, where WRT provides the comparison between measured and simulated data. Additional Resources If you are attending DesignCon 2025 , be sure to stop by Cadence booth 827 to see WRT’s CMP-70 advanced channel modeling solution in action with the Clarity 3D Solver. Check out our on-demand webinar, " Validating Clarity 3D Solver Accuracy Through Measurement Correlation ." Learn more about the CMP-70 solution and the Clarity 3D Solver . For more information about Cadence’s full suite of integrated multiphysics simulation solutions, download our Multiphysics System Analysis Solutions Portfolio .

As a verification engineer, you’re surely looking for ways to automate the debugging process. Have you developed your own scripts to ease specific debugging steps that tools don’t offer? Working with scripts locally and manually is challenging—so is reusing and organizing them. What if there was a way to create your own app with the required functionality and register it with the tool? The answer to that question is “Yes!” The Verisium Debug Python App Store lets you instantly add additional features and capabilities to your Verisium Debug Application using Python Apps that interact with Verisium Debug via the Python API. Join me, Principal Education Application Engineer Bhairava Prasad, for this Training Webinar and discover the Verisium Debug Python App Store. The app store allows you to search for existing apps, learn about them, install or uninstall them, and even customize existing apps. Date and Time Wednesday, November 20, 2024 07:00 PST San Jose / 10:00 EST New York / 15:00 GMT London / 16:00 CET Munich / 17:00 IST Jerusalem / 20:30 IST Bangalore / 23:00 CST Beijing REGISTER To register for this webinar, sign in with your Cadence Support account (email ID and password) to log in to the Learning and Support System*. Then select Enroll to register for the session. Once registered, you’ll receive a confirmation email containing all login details. A quick reminder: If you haven’t received a registration confirmation within one hour of registering, please check your spam folder and ensure your pop-up blockers are off and cookies are enabled. For issues with registration or other inquiries, reach out to eur_training_webinars@cadence.com . Like this topic? Take this opportunity and register for the free online course related to this webinar topic: Verisium Debug Training To view our complete training offerings, visit the Cadence Training website Want to share this and other great Cadence learning opportunities with someone else? Tell them to subscribe . Hungry for Training? Choose the Cadence Training Menu that’s right for you. Related Courses Xcelium Simulator Training Course | Cadence Related Blogs Unveiling the Capabilities of Verisium Manager for Optimized Operations - Verification - Cadence Blogs - Cadence Community Verisium SimAI: SoC Verification with Unprecedented Coverage Maximization - Corporate News - Cadence Blogs - Cadence Community Verisium SimAI: Maximizing Coverage, Minimizing Bugs, Unlocking Peak Throughput - Verification - Cadence Blogs - Cadence Community Related Training Bytes Introducing Verisium Debug (Video) (cadence.com) Introduction to UVM Debug of Verisium Debug (Video) (cadence.com) Verisium Debug Customized Apps with Python API Please see course learning maps a visual representation of courses and course relationships. Regional course catalogs may be viewed here . *If you don’t have a Cadence Support account, go to Cadence User Registration and complete the requested information. Or visit Registration Help .

In this edition of the Women in CFD series, we feature Vassiliki Moschou, aka Vicky, senior supervisor at BETA CAE, now part of Cadence. Her career journey serves as an inspiration for anyone who believes that studying in one field and working in another is less desirable. Vicky demonstrates how knowledge gained in one discipline can be effectively applied in another, often providing fresh and intriguing insights. Join us in this conversation to learn more about Vicky, her career path, and her advice for those considering a career in a field different from their studies. Tell us something about yourself. I've lived all my 41 years in the vibrant city of Thessaloniki, Greece. I’m married to my high school sweetheart, and together we're raising two incredible daughters who are 11 and almost 8 years old. These girls are absolutely the center of my world, and every day with them feels like a gift. My entire life, including where I have built my career and family, is deeply rooted in Thessaloniki. It's not just where I am from; it's a big part of who I am. Could you share your educational background and how you first became interested in computational fluid dynamics (CFD)? In 2001, I started my academic journey at the Computer Science Department of Aristotle University of Thessaloniki , where I focused on studying signal processing and artificial intelligence. This field fascinated me, and I pursued a master’s degree in the same area to further my expertise. Concurrently, I was involved in European research programs on signal/audio processing and machine learning methodologies. It became evident early on that my career would revolve around software engineering, a path I was fully prepared to pursue. However, everything took a turn when I joined BETA CAE in 2008. It was there that I was introduced to the field of CFD, which was completely unfamiliar to me at the time. This presented a new challenge that I eagerly accepted. I received support from all my colleagues, but I was primarily mentored by two brilliant and dedicated engineers, Michael Giannakidis and Vangelis Skaperdas , who introduced me to the world of CFD. Over time, what was once an unknown territory for me has become my passion. My journey through CFD has been a significant part of my professional growth. In my 30s, I pursued and completed a PhD in systems physiology in collaboration with the Medical and Computer Science Departments of Aristotle University of Thessaloniki. Our research focused on examining the EGF-activated MAPK pathway (often associated with cancer) from the perspective of complex self-organizing systems. Using graph theory, signal processing, and machine learning, we extracted information from the signals observed in this dynamic, distributed biological system to target novel drug development. What are the different positions you have held within the company, and what responsibilities do you currently hold? I started my career as a junior engineer at BETA CAE (now Cadence). It was a role that plunged me deep into the fascinating worlds of software and CFD, a crucial time of my career filled with learning and growth. My hard work and dedication didn't go unnoticed, and after a few years, I was promoted. That promotion was the first step on a career ladder that I've been ascending ever since. Now, I'm in the position of a senior supervisor. Though my job now involves a wide range of managerial tasks, I'm still deeply passionate about the technical side of things. I love writing code and working through the complexities of our projects, merging my leadership responsibilities with my enthusiasm for the technical facets of our work. What would you be doing if not working in CFD? Had my career taken a different trajectory, I envision myself in a role deeply embedded in human connections—perhaps as the owner of a quaint bakery or a cozy hotel, a teacher, or even venturing into human resources. There's a certain allure in careers that foster direct engagement with people, creating experiences and memories. In fact, I have an inherent desire to connect and communicate with people, aspects that are fundamentally different yet equally fulfilling as my current career. What are some of your favorite pastimes and hobbies? Family is at the center of my leisure time. We love taking short trips to the village, hanging out with our friends, and connecting. Our activities range from solving puzzles in escape rooms to passionately cheering at basketball games, especially since my older daughter has taken up the sport. But beyond these activities, being a mother is my most cherished pastime. The moments I share with my daughters, the lessons we learn together, and the joy we find in everyday adventures are what I hold dear. What are your thoughts on women in technical fields? The landscape for women in technical fields is gradually transforming, a change I observe with optimism and hope. In Greece, the increasing presence of women in engineering is a positive sign. In Cadence specifically, the representation of women is high compared to other tech companies. As a mother to two daughters, I am acutely aware of the importance of being a role model to them. It's crucial to demonstrate that aspirations should not be limited by gender and that the technical field is as much a place for women as it is for men. Encouraging this mindset is vital for the progress of our society and for the empowerment of the next generation of women in technology. Advice from Vicky for those considering a career in a field different from their studies: Learning is a lifelong journey. Embrace every challenge as an opportunity to grow and learn something new. Stay curious and adaptable to navigate the ever-evolving landscape of technology. Being labeled an 'expert' is less important than the willingness to learn and adapt. Finding happiness in your work can lead to natural success. In the epoch of artificial intelligence, train the most powerful neural network: your brain. At Cadence, our commitment is towards establishing an inclusive workspace where women feel empowered to achieve their professional best. Anchored by our One Cadence—One Team ethos, we take pride in fostering a community where our driven, devoted, and skilled women employees excel, making exceptional contributions to our customers, communities, and one another. Are you just like Vicky, venturing beyond your academic background, and considering a career in a different domain while being surrounded by an encouraging and uplifting atmosphere? Then, you won't want to miss exploring career opportunities at Cadence—celebrated as 'A Great Place for Women to Work'! Click the button below to discover your next adventure! Learn more about Cadence Fem.AI Alliance, which aims to lead the gender equity revolution in the AI workforce.

Hearing is one of the most essential senses for engaging with the world. It enables us to converse, appreciate music, and remain alert to our surroundings. Hearing loss is a prevalent issue affecting millions of individuals globally and disconnecting them from a world where sound is vital to others and the environment. The World Health Organization (WHO) reports that over 5% of the global population requires hearing rehabilitation, a striking statistic highlighting this issue's pervasive nature. Technology has transformed audiology, evolving from simple ear trumpets to sophisticated modern hearing aids. This advancement began with the invention of the transistor, paving the way for devices that are fully wearable inside or behind the ear. Although hearing aids have been available for many years, historically, access to these critical devices has been insufficient, resulting in numerous individuals lacking the necessary support. However, recent advances in hearing aid technology promise improved acoustic experiences, employing modern techniques like binaural processing and neural networks. These innovations demand sophisticated architecture to balance high memory needs with low power consumption in a user-friendly design. Cadence is at the forefront of this technological evolution, offering tools and IP solutions that enhance the accessibility, efficiency, and impact of hearing aids, paving the way for a more inclusive future. This blog explores how Cadence's advanced DSPs are transforming hearing aid design and making them more accessible, efficient, and impactful. Hearing Aids: A Testament to Human Ingenuity The transition from analo g to digital technology in the late 20th century further transformed hearing aids, offering superior sound quality, customization, and the ability to connect to various electronic devices, thus enhancing the user experience markedly. Today's hearing aids are highly effective, versatile, and nearly invisible, a significant advancement from early attempts to address hearing loss. They also feature advanced noise cancellation and connectivity options, allowing users to integrate seamlessly into the digital world. This progression not only highlights the industry's commitment to improving user experience and accessibility but also offers a glimpse into a future where hearing loss is no longer a barrier. Challenges Despite advancements and sophistication, there are several challenges related to hearing aid design and adoption. Users demand smaller, more discreet devices that don't sacrifice performance. While the shift towards sleeker designs is aesthetically pleasing, it introduces substantial complexities in product design. Designers face the challenges of integrating essential components, such as batteries and peripherals, into increasingly compact spaces. Power consumption remains a critical concern, as these devices must remain operational throughout the day. Leveraging neural networks to enhance the signal-to-noise ratio (SNR) for better quality demands additional memory capacity. Consequently, there is a pressing need for flexible, low-power architectures that incorporate all necessary memory and peripherals without compromising the device’s compact size. Adopting AI for adjusting hearing aid volume to fit an individual's specific auditory requirements is a significant challenge and demands more memory and effort. Besides this, reliability and cost are significant challenges for manufacturers. Cadence's Role in Transforming Hearing Aids In hearing aid development, the capacity to evaluate the energy efficiency of SoCs across different frequencies in real time is crucial. These applications demand cohesive, energy-efficient solutions that can uphold high performance. The Cadence Tensilica HiFi and Fusion F1 DSP family emphasize minimal power usage while providing robust performance, ideally suited for a wide range of audio and voice applications. The Cadence Tensilica HiFi DSP family, a high-performance audio technology with AI acceleration and advanced DSP capability, offers feature-rich audio, speech, and imaging for wearables, automotive, home entertainment, digital assistants, and ASR. The Tensilica HiFi DSP family accelerates innovation with its comprehensive instruction set and supports fixed- and floating-point data types. Simplifying software development, it offers C/C++ programming, an auto-vectorizing compiler, and a rich DSP software library through the Cadence Tensilica Xplorer development environment. With the flexibility to customize and enhance performance through additional instructions and better I/O bandwidth, the Tensilica HiFi and Fusion DSP families offer a robust, low-energy audio solution compatible across an expansive software ecosystem for various applications and devices. Conclusion Technological advancements are driving hearing aid evolution; the future of hearing aids lies in further miniaturization and functionality enhancement. Cadence's ongoing innovations aim to improve signal processing and noise reduction, even in challenging environments. The integration of neural networks promises more apparent sound transmission and greater adaptability. Cadence is working on improving how these devices process signals and reduce noise and has initiated a collaborative venture with distinguished entities like GlobalFoundries (GF), Hoerzentrum Oldenburg gGmbH, and Leibniz University Hannover. This collaboration has borne fruit in the form of the industry's first binaural hearing aid system-on-chip (SoC) prototype, the Smart Hearing Aid Processor ( SmartHeAP ). Learn More Cadence, GlobalFoundries, Hoerzentrum Oldenburg and Leibniz University Hannover Collaborate to Advance Hearing Aid Technology Cadence Extends Battery Life and Improves User Experience for Next-Generation Hearables, Wearables and Always-On Devices Advancing the Future of Hearing Aids with Cadence Bluetooth LE Audio, Hearing Aids, and Mindtree

This post was contributed by Liliko Uchida, application engineer at Cadence. Being a “Woman in STEM” is a phrase that has long been used to describe the holistic experience shared by thousands of women globally, yet it still makes us feel isolated. Partially due to the statistics of gender population in the STEM workforce and the remainder due to our own internal obstacles, being a woman in STEM continues to be a challenge. While many of us know the should-do’s and should-be’s of taking on this unique role objectively, we struggle to implement them. After all, our perseverance as engineers, mathematicians, businesswomen, programmers, and scientists is largely affected by subjectivity. The UMass Lowell Women’s Leadership Conference 2024 aimed to tackle this problem by uniting hundreds of women with shared experiences under one roof. Not only did the conference provide us with the knowledge necessary to persevere, but it also gave us the tools that will allow us to thrive and act upon the facts we already know. It is my hope that through this blog post, I can share some of my main takeaways from this special day. Be Confident This is one of the most palpable pieces of advice we always hear. Yet so many of us struggle to build this confidence because we don’t know how. Featured speaker Nicole Kalil defined confidence as “complete trust in oneself”.”One way to build this self-trust is by getting to know yourself on a deeper level. By creating a true inner connection, we begin to see ourselves as a whole instead of hyper-focusing on our shortcomings frequently illusioned by imposter syndrome. In one of the sessions, we were asked to introduce ourselves to our neighbors, not by what we do for work, but by who we are as a person. Even if this opportunity does not arise every day, this practice can be done simply by listing characteristics of yourself that define who you are. Who do you care for? How do you show them? What are your life goals oriented towards? How do you observe others’ behavior around you, and what does that say about how you make them feel? Getting to know you beneath the surface and allowing yourself to be seen for who you are is critical in building internal confidence. With practice, this self-reassurance will grow independent of external factors. Take Risks “Sometimes, you have to put your foot in the elevator” - Barb Vlacich, Keynote Speaker When opportunities arise, the only thing you can do to have a chance is to try. Without putting your foot in the elevator, the doors will close, becoming a missed opportunity. Similarly, several of the conference’s speakers also emphasized that the answer to every unasked question will always be a no. Even if you are not ready to full-send a negotiation, ask for a raise, or respectfully disagree with a co-worker’s opinion, start by getting comfortable asking uncomfortable questions. Just one discomfort a day will help in building an immunity to the anxiety that comes with taking risks, typically driven by our self-doubt. Another interesting point that stood out from the conference was the statistics of self-assessed qualifications between men and women. During the negotiation panel, it was revealed that men typically feel they only need 60% of the qualifications under a job description to apply, whereas women often feel they need close to 100%. These numbers alone demonstrate how the pure mental habits of men continue to funnel them into STEM and not women. The next time you seek a new opportunity, assess yourself based on the 60% and use it as a checklist threshold. If more women are able to pursue STEM careers using these numbers, the more likely we will begin to populate these roles. Build Your Genuine Network “ The essence of communication lies in the mutual exchange of ideas and emotions. And when the listener isn’t invested, it undermines the entire purpose of the conversation. Why are you having it anyway?” This is a quote from episode 186 of Julie Brown’s podcast This Sh!t Works called “The 5 Steps to Being an Active Listener”. Julie Brown is a Networking Coach, author, and podcast host who guided an energetic and candid conversation about networking and building a personal brand for women. Networking is often misunderstood as putting your name and qualifications out on the table for as many people to pick up your cards. While making these things known is important, they are not what nurtures effective connections. The key to cultivating your genuine network is to activate a sincere interest in the people you meet. Become the proactive receiver of the confidence exercise discussed above. When you meet someone new, what can you take away from them as a person, not an employee? By making people feel heard, even through the little conversations, you can begin to develop more meaningful connections that resonate. And, with practice, the sometimes inherent need to overcompensate by defining yourself with your resume will slowly fade. It was a wonderful opportunity to attend the UML Women’s Leadership Conference with four other inspiring Cadence women. Not only was the conference a motivating learning experience, but it was also a wonderful opportunity for us to bond together as women and feel supported by each other. The most eye-opening part of the day was seeing just how many women alike were sitting under the same roof. The conclusion of the event led me to feel proud to be an engineer, proud to be at Cadence, and most importantly, proud to be a woman. Learn more about life at Cadence .

Each November, we are reminded of the bravery and dedication of those who have served our country. At Cadence, we thank our Veteran employees for their patriotism by reaffirming our commitment to honoring their sacrifices and recognizing their contributions to our business success. Our diverse and inclusive culture is strengthened by the unique perspective of our Veteran employees, and we are proud to support the Veterans Inclusion Group as a space for community members and their allies to connect. In celebration of Veterans Day, we were excited to catch up with Johnathan Edmonds, Veterans Inclusion Group Lead and Design Engineering Director, for a heartfelt chat on his journey through military service to leadership within Cadence. Throughout the conversation, he shared the importance of creating space for Veterans, the skills they offer, and his aspirations for what the Veterans Inclusion Group will achieve in the years ahead. Oh yeah, and he flies planes, too! Join us as we dive into what makes this holiday special for so many across the nation and how we can respectfully commemorate it together. Johnathan, you’re a retired Air Force Reservist, pilot, and now a Design Engineering Director. Can you tell us about your journey from the military to your current role at Cadence? I started my military and electronics journey in the Navy. I enlisted at 18 and served for six years as an aviation electronics technician. During this time, I was able to learn about and repair electronics on planes. This set me up for success, and when I was honorably discharged, I attended Virginia Tech to study computer engineering. Once I graduated, I continued my career as an engineer, but I still wanted to be a military pilot. From my past experience, I knew the reserves were an option where I could learn to fly and still have a civilian career. Not only was I lucky enough to get selected to go to pilot training, but after I returned from flight school, my luck grew, and I was hired at Cadence. Cadence has supported me throughout my military career, which has been a great benefit, as many companies don’t support reservists. The best thing about serving and being employed at Cadence is how I could blend my skill sets to further the Air Force’s mission and achieve great things in engineering. As the first lead of Cadence’s Veterans Inclusion Group, you played an integral part in growing our culture and building community at the company since launching the group four years ago. What inspired you to take on the role of Inclusion Group Lead? I was inspired by three things: camaraderie, service, and outreach. I wanted to see if we could achieve a similar sense of community through the Veterans Inclusion Group as we had during our service life. I also wanted to see how we could better serve our Veterans here at Cadence. I wanted to explore any benefits that could be expanded, roles that could be developed by Vets, and, lastly, I wanted to serve a broader community. COVID-19 put a damper on some of the community support, but we are getting back on track with Veteran employment programs and volunteer efforts like Carry the Load and Gold Star Families. Why is it important to have this space dedicated to Veteran employees? There are many reasons! Networking, for one, creates a stronger, more unified Cadence culture. Two, Vets face a variety of issues not generally understood by those who have not served, such as PTSD, where to get help for disabilities, how to get an old medical record, etc. As I mentioned, I’m also passionate about connecting Veterans with employment and job opportunities. It is so nice to work for a company that actively recruits Vets. We have our own “language,” if you will, so it’s nice to have a space to talk in the language that we are familiar with. What have been some of your favorite moments leading this group over the past few years? Are there any “wins” that you would like to recognize? We have a lot of wins. Events held during COVID-19 and getting past COVID-19, donating to worthwhile causes, and hosting guest speakers are all fantastic milestones and accomplishments. That said, the biggest win is the hiring of new Veteran employees. Mark Murphy, Corporate VP of Sales Operations, and I have both welcomed Vets to our team during this time, and it is such a joy to watch what someone can do when given the opportunity to succeed in the right environment. As you are set to transition out of the lead role next year, what do you hope to see the Veterans Inclusion Group accomplish next? My hope is that the Veterans Inclusion Group partners with other companies, expanding our reach externally and exploring new opportunities to engage Veterans outside of Cadence. Johnathan (left) speaks on an inclusion group panel, along with David Sallard (center), lead of Cadence's Black Inclusion Group and Sr. Principal Application Engineer; Christina Jamerson (on screen), lead of Cadence's Abilities Inclusion Group and Demand Generation Director; and Dianne Rambke (right), lead of Cadence's Latinx Inclusion Group and Marketing Communications Director. What are the important ways that people can signal inclusion and respectfully honor Veterans at work? What are the most meaningful or impactful actions employees everywhere can take to support Veteran coworkers? I think there is one answer to both questions. I recommend that people engage with their companies’ employee resource groups (ERGs) and have conversations with them. Opening up the lines of communication will lead to new paths in their journeys. What are you looking forward to in 2025, both personally and professionally? In 2025, professionally, I am looking forward to taking mixed-signal systems and verification to another level by including emulation, automatic model generation, and seeing which boundaries we can push in our SerDes and Chiplets products. Personally, I am looking forward to making my SXS street legal so I can drive places without getting a ticket, seeing my children participate in sports, church, and school, and taking my wife on vacation to Europe or somewhere else we can unplug. Learn more about Cadence’s Inclusion Groups, diverse culture, and commitment to belonging.

Hello Folks,

Problem statement first: How does one properly setup tensorflow for running on a DSVM using a remote Docker environment? Can this be done in aml_config/*.runconfig?

I receive the following message and I would like to be able to utilize the increased speeds of the extended FMA operations.

tensorflow/core/platform/cpu_feature_guard.cc:140] Your CPU supports instructions that this TensorFlow binary was not compiled to use: AVX2 FMA

Background: I utilize a local docker environment managed through Azure ML Workbench for initial testing and code validation so that I'm not running an expensive DSVM constantly. Once I assess that my code is to my liking, I then run it on a remote docker instance on an Azure DSVM.

I want a consistent conda environment across my compute environments, so this works out extremely well. However, I cannot figure out how to control the tensorflow build to optimize for the hardware at hand (i.e. my local docker on macOS vs. remote docker on Ubuntu DSVM)

hi,

     I save the waveform file of the oscilloscope as CSV file format.

     Now, I need to use this waveform file as the source of the low-pass filter .

     I searched and read the PSPICE help documents, and did not find any  methods. 

     How to realize it?

     Are there any reference documents or examples?

     Thanks!

Hi,

i am compiling firmware under Windows transfer the binaries and the sources to Linux to simulate/debug there. The problem is that the paths in the DWARF debug info of the .elf file are the absolute Windows paths as set by the compiler so they are useless under Linux. Is it possible to configure mappings of these paths to the Linux paths when simulating/debugging like with e.g. GDB (https://sourceware.org/gdb/current/onlinedocs/gdb/Source-Path.html#index-set-substitute_002dpath)?

thx,

Peter

When the Arduino Mega2560 is added to the first serial port, the dynamic memory is 2000 bytes, and when the second serial serial is added, the dynamic memory is 4000 bytes. Now I need to add the third Serial serial port. The dynamic memory is 6000 bytes. Due to the many variables in the program itself, the dynamic memory is not enough. Please help me how to save the dynamic memory?

Cadence_SPB_17.4-2019 + Matlab R2019a

请参考本文档中的步骤进行操作

1，打开BJT_AMP.opj

2，设置Matlab路径

3，打开BJT_AMP_SLPS.slx

4，打开后，设置PSpiceBlock，出现或CEFSimpleUI.exe停止工作

5，添加模块

6，相同

7，打开pspsim.slx

8，相同

9，打开C： Cadence Cadence_SPB_17.4-2019 tools bin

orCEFSimpleUI.exe和orCEFSimple.exe

10，相同

我想问一下如何解决，非常感谢！

Hello,

I'm reading the Design specification for IP6514E.

We will use the DAC mode.

It would seem to be very simple but I don't see any code sequence, i.e.

  1.Write 03(Basic Read) to this register

  2, Write start adress to this register

  3. Write "execute" to this register

  4. Read the data from this register

Thanks,

Stefan

Please give me some ideas. Thank you very much.

While doing the lvs it's showing an error in gnd connection, I am not being able to understand exactly what is the error and what do I need to do to remove this error?

Hello everyone. In recent days, I'm having a weird problem with sound output on my Windows 10 PC. In fact, I can't control the loudness of it. So is there any possibility of PCB of sound card being damaged?

I want to download Xtensa C/C++ Compiler (XCC) . I dont know where to download. Please help me.

Hi, all.

When I use vavlog to compile verilog rtl, it will recognize IO width mismatch problem as a fatal error.

How to turn the error into warning?

VCS can use -error=noIOPCWM to ingore the error.

Is vavlog has similar arguments?

When I try to implement the sweep inside my verilog file, I get the following errors.

/// Function

swp2 sweep param=Ndiscmin values=[0.011 0.5055 1] {     //// Line 63
   tran2 tran start=0 stop=1300n errpreset=conservative
}

Hi,

I need to design EPC8002 eGaN switch in cadence. Can someone provide me step by step guide on hoe to add EPC8002 into my cadence. I am working on BCD180.

Thank you 

Ihsan

This is the 15th installment of The Rationalist, my column for the Times of India.

It’s election season, and promises are raining down on voters like rose petals on naïve newlyweds. Earlier this week, the Congress party announced a minimum income guarantee for the poor. This Friday, the Modi government released a budget full of sops. As the days go by, the promises will get bolder, and you might feel important that so much attention is being given to you. Well, the joke is on you.

Every election, HL Mencken once said, is “an advance auction sale of stolen goods.” A bunch of competing mafias fight to rule over you for the next five years. You decide who wins, on the basis of who can bribe you better with your own money. This is an absurd situation, which I tried to express in a limerick I wrote for this page a couple of years ago:

POLITICS: A neta who loves currency notes/ Told me what his line of work denotes./ ‘It is kind of funny./ We steal people’s money/And use some of it to buy their votes.’

We’re the dupes here, and we pay far more to keep this circus going than this circus costs. It would be okay if the parties, once they came to power, provided good governance. But voters have given up on that, and now only want patronage and handouts. That leads to one of the biggest problems in Indian politics: We are stuck in an equilibrium where all good politics is bad economics, and vice versa.

For example, the minimum guarantee for the poor is good politics, because the optics are great. It’s basically Garibi Hatao: that slogan made Indira Gandhi a political juggernaut in the 1970s, at the same time that she unleashed a series of economic policies that kept millions of people in garibi for decades longer than they should have been.

This time, the Congress has released no details, and keeping it vague makes sense because I find it hard to see how it can make economic sense. Depending on how they define ‘poor’, how much income they offer and what the cost is, the plan will either be ineffective or unworkable.

The Modi government’s interim budget announced a handout for poor farmers that seemed rather pointless. Given our agricultural distress, offering a poor farmer 500 bucks a month seems almost like mockery.

Such condescending handouts solve nothing. The poor want jobs and opportunities. Those come with growth, which requires structural reforms. Structural reforms don’t sound sexy as election promises. Handouts do.

A classic example is farm loan waivers. We have reached a stage in our politics where every party has to promise them to assuage farmers, who are a strong vote bank everywhere. You can’t blame farmers for wanting them – they are a necessary anaesthetic. But no government has yet made a serious attempt at tackling the root causes of our agricultural crisis.

Why is it that Good Politics in India is always Bad Economics? Let me put forth some possible reasons. One, voters tend to think in zero-sum ways, as if the pie is fixed, and the only way to bring people out of poverty is to redistribute. The truth is that trade is a positive-sum game, and nations can only be lifted out of poverty when the whole pie grows. But this is unintuitive.

Two, Indian politics revolves around identity and patronage. The spoils of power are limited – that is indeed a zero-sum game – so you’re likely to vote for whoever can look after the interests of your in-group rather than care about the economy as a whole.

Three, voters tend to stay uninformed for good reasons, because of what Public Choice economists call Rational Ignorance. A single vote is unlikely to make a difference in an election, so why put in the effort to understand the nuances of economics and governance? Just ask, what is in it for me, and go with whatever seems to be the best answer.

Four, Politicians have a short-term horizon, geared towards winning the next election. A good policy that may take years to play out is unattractive. A policy that will win them votes in the short term is preferable.

Sadly, no Indian party has shown a willingness to aim for the long term. The Congress has produced new Gandhis, but not new ideas. And while the BJP did make some solid promises in 2014, they did not walk that talk, and have proved to be, as Arun Shourie once called them, UPA + Cow. Even the Congress is adopting the cow, in fact, so maybe the BJP will add Temple to that mix?

Benjamin Franklin once said, “Democracy is two wolves and a lamb voting on what to have for lunch.” This election season, my friends, the people of India are on the menu. You have been deveined and deboned, marinated with rhetoric, seasoned with narrative – now enter the oven and vote.

The India Uncut Blog © 2010 Amit Varma. All rights reserved.
Follow me on Twitter.

This is the 17th installment of The Rationalist, my column for the Times of India.

One of my favourite English words comes from chess. If it is your turn to move, but any move you make makes your position worse, you are in ‘Zugzwang’. Narendra Modi was in zugzwang after the Pulwama attacks a few days ago—as any Indian prime minister in his place would have been.

An Indian PM, after an attack for which Pakistan is held responsible, has only unsavoury choices in front of him. He is pulled in two opposite directions. One, strategy dictates that he must not escalate. Two, politics dictates that he must.

Let’s unpack that. First, consider the strategic imperatives. Ever since both India and Pakistan became nuclear powers, a conventional war has become next to impossible because of the threat of a nuclear war. If India escalates beyond a point, Pakistan might bring their nuclear weapons into play. Even a limited nuclear war could cause millions of casualties and devastate our economy. Thus, no matter what the provocation, India needs to calibrate its response so that the Pakistan doesn’t take it all the way.

It’s impossible to predict what actions Pakistan might view as sufficient provocation, so India has tended to play it safe. Don’t capture territory, don’t attack military assets, don’t kill civilians. In other words, surgical strikes on alleged terrorist camps is the most we can do.

Given that Pakistan knows that it is irrational for India to react, and our leaders tend to be rational, they can ‘bleed us with a thousand cuts’, as their doctrine states, with impunity. Both in 2001, when our parliament was attacked and the BJP’s Atal Bihari Vajpayee was PM, and in 2008, when Mumbai was attacked and the Congress’s Manmohan Singh was PM, our leaders considered all the options on the table—but were forced to do nothing.

But is doing nothing an option in an election year?

Leave strategy aside and turn to politics. India has been attacked. Forty soldiers have been killed, and the nation is traumatised and baying for blood. It is now politically impossible to not retaliate—especially for a PM who has criticized his predecessor for being weak, and portrayed himself as a 56-inch-chested man of action.

I have no doubt that Modi is a rational man, and knows the possible consequences of escalation. But he also knows the possible consequences of not escalating—he could dilute his brand and lose the elections. Thus, he is forced to act. And after he acts, his Pakistan counterpart will face the same domestic pressure to retaliate, and will have to attack back. And so on till my home in Versova is swallowed up by a nuclear crater, right?

Well, not exactly. There is a way to resolve this paradox. India and Pakistan can both escalate, not via military actions, but via optics.

Modi and Imran Khan, who you’d expect to feel like the loneliest men on earth right now, can find sweet company in each other. Their incentives are aligned. Neither man wants this to turn into a full-fledged war. Both men want to appear macho in front of their domestic constituencies. Both men are masters at building narratives, and have a pliant media that will help them.

Thus, India can carry out a surgical strike and claim it destroyed a camp, killed terrorists, and forced Pakistan to return a braveheart prisoner of war. Pakistan can say India merely destroyed two trees plus a rock, and claim the high moral ground by returning the prisoner after giving him good masala tea. A benign military equilibrium is maintained, and both men come out looking like strong leaders: a win-win game for the PMs that avoids a lose-lose game for their nations. They can give themselves a high-five in private when they meet next, and Imran can whisper to Modi, “You’re a good spinner, bro.”

There is one problem here, though: what if the optics don’t work?

If Modi feels that his public is too sceptical and he needs to do more, he might feel forced to resort to actual military escalation. The fog of politics might obscure the possible consequences. If the resultant Indian military action causes serious damage, Pakistan will have to respond in kind. In the chain of events that then begins, with body bags piling up, neither man may be able to back down. They could end up as prisoners of circumstance—and so could we.

***

Also check out:

Why Modi Must Learn to Play the Game of Chicken With Pakistan—Amit Varma
The Two Pakistans—Episode 79 of The Seen and the Unseen
India in the Nuclear Age—Episode 80 of The Seen and the Unseen

The India Uncut Blog © 2010 Amit Varma. All rights reserved.
Follow me on Twitter.

This is the 18th installment of The Rationalist, my column for the Times of India.

The man who gave us our national anthem, Rabindranath Tagore, once wrote that nationalism was “a great menace.” He went on to say, “It is the particular thing which for years has been at the bottom of India’s troubles.”

Not just India’s, but the world’s: In his book The Open Society and its Enemies, published in 1945 as Adolf Hitler was defeated, Karl Popper ripped into nationalism, with all its “appeals to our tribal instincts, to passion and to prejudice, and to our nostalgic desire to be relieved from the strain of individual responsibility which it attempts to replace by a collective or group responsibility.”

Nationalism is resurgent today, stomping across the globe hand-in-hand with populism. In India, too, it is tearing us apart. But must nationalism always be a bad thing? A provocative new book by the Israeli thinker Yael Tamir argues otherwise.

In her book Why Nationalism, Tamir makes the following arguments. One, nation-states are here to stay. Two, the state needs the nation to be viable. Three, people need nationalism for the sense of community and belonging it gives them. Four, therefore, we need to build a better nationalism, which brings people together instead of driving them apart.

The first point needs no elaboration. We are a globalised world, but we are also trapped by geography and circumstance. “Only 3.3 percent of the world’s population,” Tamir points out, “lives outside their country of birth.” Nutopia, the borderless state dreamed up by John Lennon and Yoko Ono, is not happening anytime soon.

If the only thing that citizens of a state have in common is geographical circumstance, it is not enough. If the state is a necessary construct, a nation is its necessary justification. “Political institutions crave to form long-term political bonding,” writes Tamir, “and for that matter they must create a community that is neither momentary nor meaningless.” Nationalism, she says, “endows the state with intimate feelings linking the past, the present, and the future.”

More pertinently, Tamir argues, people need nationalism. I am a humanist with a belief in individual rights, but Tamir says that this is not enough. “The term ‘human’ is a far too thin mode of delineation,” she writes. “Individuals need to rely on ‘thick identities’ to make their lives meaningful.” This involves a shared past, a common culture and distinctive values.

Tamir also points out that there is a “strong correlation between social class and political preferences.” The privileged elites can afford to be globalists, but those less well off are inevitably drawn to other narratives that enrich their lives. “Rather than seeing nationalism as the last refuge of the scoundrel,” writes Tamir, “we should start thinking of nationalism as the last hope of the needy.”

Tamir’s book bases its arguments on the West, but the argument holds in India as well. In a country with so much poverty, is it any wonder that nationalism is on the rise? The cosmopolitan, globe-trotting elites don’t have daily realities to escape, but how are those less fortunate to find meaning in their lives?

I have one question, though. Why is our nationalism so exclusionary when our nation is so inclusive?

In the nationalism that our ruling party promotes, there are some communities who belong here, and others who don’t. (And even among those who ‘belong’, they exploit divisions.) In their us-vs-them vision of the world, some religions are foreign, some values are foreign, even some culinary traditions are foreign – and therefore frowned upon. But the India I know and love is just the opposite of that.

We embrace influences from all over. Our language, our food, our clothes, our music, our cinema have absorbed so many diverse influences that to pretend they come from a single legit source is absurd. (Even the elegant churidar-kurtas our prime minister wears have an Islamic origin.) As an example, take the recent film Gully Boy: its style of music, the clothes its protagonists wear, even the attitudes in the film would have seemed alien to us a few decades ago. And yet, could there be a truer portrait of young India?

This inclusiveness, this joyous khichdi that we are, is what makes our nation a model for the rest of the world. No nation embraces all other nations as ours does. My India celebrates differences, and I do as well. I wear my kurta with jeans, I listen to ghazals, I eat dhansak and kababs, and I dream in the Indian language called English. This is my nationalism.

Those who try to divide us, therefore, are the true anti-nationals. We must reclaim nationalism from them.

The India Uncut Blog © 2010 Amit Varma. All rights reserved.
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This is the 20th installment of The Rationalist, my column for the Times of India.

Amit Shah’s induction into the union cabinet is such an interesting moment. Even partisans who oppose the BJP, as I do, would admit that Shah is a political genius. Under his leadership, the BJP has become an electoral behemoth in the most complicated political landscape in the world. The big question that now arises is this: can Shah do for India what he did for the BJP?

This raises a perplexing question: in the last five years, as the BJP has flourished, India has languished. And yet, the leadership of both the party and the nation are more or less the same. Then why hasn’t the ability to manage the party translated to governing the country?

I would argue that there are two reasons for this. One, the skills required in those two tasks are different. Two, so are the incentives in play.

Let’s look at the skills first. Managing a party like the BJP is, in some ways, like managing a large multinational company. Shah is a master at top-down planning and micro-management. How he went about winning the 2014 elections, described in detail in Prashant Jha’s book How the BJP Wins, should be a Harvard Business School case study. The book describes how he fixed the BJP’s ground game in Uttar Pradesh, picking teams for 147,000 booths in Uttar Pradesh, monitoring them, and keeping them accountable.

Shah looked at the market segmentation in UP, and hit upon his now famous “60% formula”. He realised he could not deliver the votes of Muslims, Yadavs and Jatavs, who were 40% of the population. So he focussed on wooing the other 60%, including non-Yadav OBCs and non-Jatav Dalits. He carried out versions of these caste reconfigurations across states, and according to Jha, covered “over 5 lakh kilometres” between 2014 and 2017, consolidating market share in every state in this country. He nurtured “a pool of a thousand new OBC and Dalit leaders”, going well beyond the posturing of other parties.

That so many Dalits and OBCs voted for the BJP in 2019 is astonishing. Shah went past Mandal politics, managing to subsume previously antagonistic castes and sub-castes into a broad Hindutva identity. And as the BJP increased its depth, it expanded its breadth as well. What it has done in West Bengal, wiping out the Left and weakening Mamata Banerjee, is jaw-dropping. With hindsight, it may one day seem inevitable, but only a madman could have conceived it, and only a genius could have executed it.

Good man to be Home Minister then, eh? Not quite. A country is not like a large company or even a political party. It is much too complex to be managed from the top down, and a control freak is bound to flounder. The approach needed is very different.

Some tasks of governance, it is true, are tailor-made for efficient managers. Building infrastructure, taking care of roads and power, building toilets (even without an underlying drainage system) and PR campaigns can all be executed by good managers. But the deeper tasks of making an economy flourish require a different approach. They need a light touch, not a heavy hand.

The 20th century is full of cautionary tales that show that economies cannot be centrally planned from the top down. Examples of that ‘fatal conceit’, to use my hero Friedrich Hayek’s term, include the Soviet Union, Mao’s China, and even the lady Modi most reminds me of, Indira Gandhi.

The task of the state, when it comes to the economy, is to administer a strong rule of law, and to make sure it is applied equally. No special favours to cronies or special interest groups. Just unleash the natural creativity of the people, and don’t try to micro-manage.

Sadly, the BJP’s impulse, like that of most governments of the past, is a statist one. India should have a small state that does a few things well. Instead, we have a large state that does many things badly, and acts as a parasite on its people.

As it happens, the few things that we should do well are all right up Shah’s managerial alley. For example, the rule of law is effectively absent in India today, especially for the poor. As Home Minister, Shah could fix this if he applied the same zeal to governing India as he did to growing the BJP. But will he?

And here we come to the question of incentives. What drives Amit Shah: maximising power, or serving the nation? What is good for the country will often coincide with what is good for the party – but not always. When they diverge, which path will Shah choose? So much rests on that.

The India Uncut Blog © 2010 Amit Varma. All rights reserved.
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