The Cadence AWR Design Environment V22.1 production release is now available for download at Cadence Downloads with design environment, AWR Microwave Office, AWR VSS, AWR Analyst, and other enhancements.(read more)

AWR V22.1 software introduces the Pointer-Hybrid optimization method which uses a combination of optimization methods, switching back and forth between methods to efficiently find the lowest optimization error function cost. The optimization algorithm automatically determines when to switch to a different optimization method, making this a superior method over manual selection of algorithms. This method is particularly robust in regards to finding the global minima without getting stuck in a local minima well.(read more)

When starting a new design, it's important to take the time to consider design recommendations that prevent problems that can arise later in the design cycle. This two-part compilation of guidelines for starting a new design is the result of years of Cadence AWR Design Environment platform Support experience with designs. Pre-design decisions for user interface, simulation, layout, and library configuration lay the groundwork for a successful and efficient AWR design. This blog, part 2, covers the layout and component library considerations designers should note prior to starting a design.(read more)

Microwave Office is Cadence’s tool-of-choice for RF and microwave designers designing everything from III-V 5G chips, to RF systems in board and package technologies. These types of designs require close interaction between the schematic and its layout. A new Training Byte demonstrates how the schematic-layout connections is built into Microwave Office.(read more)

A training webinar on Microwave Office will be given June 27, 2023. The emphasis will be on EM simulation.(read more)

A recording of a training webinar on Microwave Office is available. Topics show the design environment, with special emphasis placed on electromagnetic (EM) simulation. Normal 0 false false false EN-US JA X-NONE ...(read more)

New online training course for AXIEM EM Simulator in AWR Microwave Office is available.(read more)

Hello All:

I am looking for help on the following, as I am new to Cadence tools [I have to use Cadence Innovus for Physical Design after Logic Synthesis using Synopsys Design Compiler, using Nangate 45 nm Open Cell Library]: while using Cadence Innovus, I would need to select a few specific nets to be routed through a specific metal layer. How can I do this on Innovus [are there any command(s)]? Also, would writing and sourcing a .tcl script [containing the command(s)] on the Innovus terminal after the Placement Stage of Physical Design be fine for this?

Secondly, is there a way in Innovus to manipulate layout components, such as changing some pin placements, wire directions (say for example, wire direction changed to facing east from west, etc.) or moving specific closely placed cells around (without violating timing constraints of course) using any command(s)/.tcl script? If so, would pin placement changes and constraining some closely placed cells to be moved apart be done after Floorplanning/Powerplanning (that is, prior to Placement) and the wire direction changes be done after Routing? 

While making the necessary changes, could I use the usual Innovus commands to perform Physical Design of the remaining nets/wires/pins/cells, etc., or would anything need modification for the remaining components as well?

I would finally need to dump the entire design containing all of this in a .def file.

I tried looking up but could only find matter on Virtuoso and SKILL scripting, but I'd be using Innovus GUI/terminal with Nangate 45 nm Open Cell Library. I know this is a lot, but I would greatly appreciate your help. Thanks in advance.

Riya

i want to read from text file two values  on two ports , i wrote  that  code, and i have that error that shown in the image below . and also the data in text file is shown as screenshot

module read_file (a,b);

electrical a,b;
integer in_file_0,data_value, valid, count0,int_value;

analog begin
@(initial_step) begin
in_file_0 = $fopen("/home/hh1667/ee610/my_library/read_file/data2.txt","r");

valid = $fscanf (in_file_0, "%b,%b" ,int_value,count0);
end

V(a) <+ int_value;
V(b) <+ count0;

end

endmodule

Hi Cadence, 

I use simvision 20.09-s007 but my computer screen resolution is very high. As a result, the texts are too small. 

In ~/.simvision/Xdefaults I changed that number to 16, from 12. But the signal names in the waveform traces don't reflect the change. 

Simvision*Font: -adobe-helvetica-medium-r-normal--16-*-*-*-*-*-*-*

Other .font changes seem to reflect on the simvision correctly, except the signal names. 

How do I fix that? I dont mind a single variable to change all the texts fonts to 16. 

Thank you!

PS: I found the answer with another post. I change Preference/Waveform/Display/Signal Height. 

We are looking for suitable tools that could be used for RTL design, IP-XACT based  integration (third party IP) and RTL design verification ( SV / UVM based methodology).

Request to share details on the different Cadence tools that is most suitable for these activities.

This document resolved my first query,

Article (11638952) Title: How to output power and ground nets to GDS
URL: support.cadence.com/.../ArticleAttachmentPortal

but now I have 20 power and 20 ground

below is my code

------------------------------------------------
variable GND "vss1" "vss2" "vss3" ... "vss20"
variable VDD "vdd1" "vdd2" "vdd3" ... "vdd20"

select_net M1 GND -outputlayer GND_M1
select_net M2 GND -outputlayer GND_M2
...
select_net AP GND -outputlayer GND_AP

select_net M1 VDD -outputlayer VDD_M1
select_net M2 VDD -outputlayer VDD_M2
...
select_net AP VDD -outputlayer VDD_AP

rule GND{

copy GND_M1
copy GND_M2
...
copy GND_AP}

rule VDD{

copy VDD_M1
copy VDD_M2
...
copy VDD_AP}
------------------------------------------------

I want 20 GND and 20 VDD are separately to highlight,
like this

Can DRC command use for-loop(skill or Tcl) to split the rule?
or how can I do to split it? 
I don't really want to repeat the rule 40 times..haha😅 (use Pegasus 22.21)

Hi Cadence & forumers, 

I am running a conformal LEC with a flattened netlist against RTL. 

The run hang for 5 days at the "analyze abort" step which is automatically launched by the compare. 

The netlist is flattened at some levels so hierarchical flow which I tried didn't help much. The flattened/highly optimized netlist is from customer and the ultimate goal. How shall I proceed now? 

On the a side note, a test run with a hierarchical netlist from a simple DC "compile -map_effort medium" command finished after 1 day or so. 

Thank you! 

// Command: vpx compare -verbose -ABORT_Print -NONEQ_Print -TIMEstamp
// Starting multithreaded comparison ...
Comparing 241112 points in parallel.

// Multithreading Overhead: 38% Gates: 8501606/6168138
// Multithreaded processing completed.
================================================================================
Compared points PO DFF DLAT BBOX CUT Total
--------------------------------------------------------------------------------
Equivalent 1025 241638 30 75 21 242789
--------------------------------------------------------------------------------
Abort 0 124 0 0 0 124
================================================================================
Compare results of instance/output/pin equivalences and/or sequential merge
================================================================================
Compared points DFF Total
--------------------------------------------------------------------------------
Equivalent 204 204
================================================================================
// Warning: 512 DFFs/DLATs have 1 disabled clock port: skipped data cone comparison
// Resolving aborts by analyze abort...

I am not able to open 64bit version of simvision using the following :

simvision -64 -wav "path to wav"

This throws the error "  /lib64/libc.so.6: version `GLIBC_2.14' not found"

I am only able to open it without the -64 option.

As a result I am not able to use the source browser feature since the simulation was run in 64 bit mode.

Need suggestion on how to resolve this. Thanks.

Good morning,
I dug up an old project from 2005 and I should open the schematic to check some things.
This is the schematic of a XILINX XC95108-pq160 CPLD which the XILINX ISE 6.1 software then translated and compiled, to generate a JEDEC file to burn CPLD.

My problem is that I can't open schematics with the versions of Orcad Schematic Entry that I have.
Can anyone help me understand which version of Orcad Schematic Entry I need to install to see these files?

I shared the files on:
drive.google.com/.../view

Thank you very much

Hi, have two designs and would like to copy paste one area of circuit from the old design to the new design, best way/approach and guidance please..

Below is showing my Master.v

********************************************************************************************************************************************************************************************************************

///////ALU
module ALU (
    input [31:0] A,B,
    input[3:0] alu_control,
    output reg [31:0] alu_result,
    output reg zero_flag
);
    always @(*)
    begin
        // Operating based on control input
        case(alu_control)

        4'b0001: alu_result = A+B;
        4'b0010: alu_result = A-B;
        4'b0011: alu_result = A*B;
        4'b0100: alu_result = A|B;
        4'b0101: alu_result = A&B;
        4'b0110: alu_result = A^B;
        4'b0111: alu_result = ~B;
        4'b1000: alu_result = A<<B;
        4'b1001: alu_result = A>>B;
        4'b1010: begin
            if(A<B)
            alu_result = 1;
            else
            alu_result = 0;
        end
        default: alu_result = A+B;

        endcase

        // Setting Zero_flag if ALU_result is zero
        if (alu_result)
            zero_flag = 1'b1;
        else
            zero_flag = 1'b0;   
    end
endmodule


/////CONTROL UNIT
/*
Control unit controls takes opcode, funct7, funct3 of the instruction code to determine
and control regwrite in IFU, alu control in ALU to execute proper instruction
*/
/*
Control unit controls takes opcode, funct7, funct3 of the instruction code to determine
and control regwrite in IFU, alu control in ALU to execute proper instruction
*/
module CONTROL(
    input [4:0] opcode,
    output reg [3:0] alu_control,
    output reg regwrite_control,memread_control,memwrite_control
);
    always @(opcode)
    begin
       case(opcode)
        5'b00001: begin alu_control=4'b0001;  //add
        regwrite_control=1; memread_control=0; memwrite_control=0;
        end
        5'b00010: begin alu_control=4'b0010;  ///sub
        regwrite_control=1; memread_control=0; memwrite_control=0;
        end
        5'b00011: begin alu_control=4'b0011;  //mul
        regwrite_control=0; memread_control=0; memwrite_control=1;
        end
        5'b00100: begin alu_control=4'b0100;  ///OR
        regwrite_control=0; memread_control=0; memwrite_control=1;
        end
        5'b00101: begin alu_control=4'b0101;  ///AND
        regwrite_control=1; memread_control=0; memwrite_control=0;
        end
        5'b00110: begin alu_control=4'b0110;  ///XOR
        regwrite_control=0; memread_control=0; memwrite_control=1;
        end
        5'b00111: begin alu_control=4'b0111;  ///NOT
        regwrite_control=0; memread_control=0; memwrite_control=1;
        end
        5'b01000: begin alu_control=4'b1000;  //SL
        regwrite_control=1; memread_control=1; memwrite_control=0;
        end
        5'b11001: begin alu_control=4'b1001;  //SR
        regwrite_control=1; memread_control=1; memwrite_control=0;
        end
        5'b01010: begin alu_control=4'b1010;  //COMPARE
        regwrite_control=1; memread_control=1; memwrite_control=0;
        end
        //5'b11010: begin ALU_control=4'b0000;  //SW
        //regwrite_control=1; memread_control=0; memwrite_control=0;
        //end
        //5'b01010: begin ALU_control=4'bxxxx;  //LW
        //regwrite_control=0; memread_control=0; memwrite_control=1;
        //end
        default : begin alu_control = 4'b0001;
        regwrite_control=1; memread_control=0; memwrite_control=0;
        end
        endcase  
    end
endmodule



//////DATA MEMORY
module Data_Mem(
input clock, rd_mem_enable, wr_mem_enable,
input [11:0] address,
input [31:0] datawrite_to_mem,
output reg [31:0] dataread_from_mem );

reg [31:0] Data_Memory[8:0];

initial begin
    Data_Memory[0] = 32'hFFFFFFFF;
    Data_Memory[1] = 32'h00000001;
    Data_Memory[2] = 32'h00000005;
    Data_Memory[3] = 32'h00000003;
    Data_Memory[4] = 32'h00000004;
    Data_Memory[5] = 32'h00000000;
    Data_Memory[6] = 32'hFFFFFFFF;
    Data_Memory[7] = 32'h00000000;
    //Data_Memory[8] = 32'h00000008;
    //Data_Memory[9] = 32'h00000009;
    //Data_Memory[10] = 32'h0000000A;
    //Data_Memory[11] = 32'h0000000B;
    //Data_Memory[12] = 32'h0000000C;
    //Data_Memory[13] = 32'h0000000D;
    //Data_Memory[14] = 32'h0000000E;
    //Data_Memory[15] = 32'h0000000F;
    //Data_Memory[16] = 32'h00000010;
    //Data_Memory[17] = 32'h00000011;
    //Data_Memory[18] = 32'h00000012;
    //Data_Memory[19] = 32'h00000013;
    //Data_Memory[20] = 32'h00000014;
    //Data_Memory[21] = 32'h00000015;
    //Data_Memory[22] = 32'h00000016;
    //Data_Memory[23] = 32'h00000017;
    //Data_Memory[24] = 32'h00000018;
    //Data_Memory[25] = 32'h00000019;
    //Data_Memory[26] = 32'h0000001A;
    //Data_Memory[27] = 32'h0000001B;
    //Data_Memory[28] = 32'h0000001C;
    //Data_Memory[29] = 32'h0000001D;
    //Data_Memory[30] = 32'h0000001E;
    Data_Memory[31] = 32'h0000001F;
       
    end
    always@(posedge clock) begin
       if(wr_mem_enable) begin
            Data_Memory[address] <= datawrite_to_mem;
       end
       else if(rd_mem_enable) begin
               dataread_from_mem <= Data_Memory[address];
       end
       else begin
               dataread_from_mem <= 32'h00000000;
       end
    end
endmodule   



/////INST MEM
/*

*/
module INST_MEM(
    input [31:0] PC,
    input reset,
    output [31:0] Instruction_Code
);
    reg [7:0] Memory [43:0]; // Byte addressable memory with 32 locations

    
    assign Instruction_Code = {Memory[PC+3],Memory[PC+2],Memory[PC+1],Memory[PC]};

    
    
    initial begin
            // Setting 32-bit instruction: add t1, s0,s1 => 0x00940333
            Memory[3] = 8'b0000_0000;
            Memory[2] = 8'b0000_0001;
            Memory[1] = 8'b0111_1100;
            Memory[0] = 8'b0000_0001;
            // Setting 32-bit instruction: sub t2, s2, s3 => 0x413903b3
            Memory[7] = 8'b0000_0000;
            Memory[6] = 8'b0000_0110;
            Memory[5] = 8'b1000_1111;
            Memory[4] = 8'b1110_0010;
            // Setting 32-bit instruction: mul t0, s4, s5 => 0x035a02b3
            Memory[11] = 8'b0000_0000;
            Memory[10] = 8'b0000_0101;
            Memory[9] = 8'b0111_1100;
            Memory[8] = 8'b0000_0011;
            // Setting 32-bit instruction: or t3, s6, s7 => 0x017b4e33
            Memory[15] = 8'b1111_1111;
            Memory[14] = 8'b1111_0100;
            Memory[13] = 8'b1010_0000;
            Memory[12] = 8'b1010_0100;
            // Setting 32-bit instruction: and
            Memory[19] = 8'b0000_0000;
            Memory[18] = 8'b0010_1001;
            Memory[17] = 8'b0001_1101;
            Memory[16] = 8'b0010_0101;
            // Setting 32-bit instruction: xor
            Memory[23] = 8'b0000_0000;
            Memory[22] = 8'b0001_1000;
            Memory[21] = 8'b0000_1101;
            Memory[20] = 8'b0110_0110;
            // Setting 32-bit instruction: not
            Memory[27] = 8'b0000_0000;
            Memory[26] = 8'b0010_1001;
            Memory[25] = 8'b0011_1101;
            Memory[24] = 8'b1100_0111;
            // Setting 32-bit instruction: shift left
            Memory[31] = 8'b0000_0000;
            Memory[30] = 8'b0101_0111;
            Memory[29] = 8'b1100_0110;
            Memory[28] = 8'b0000_1000;
            // Setting 32-bit instruction: shift right
            Memory[35] = 8'b0000_0000;
            Memory[34] = 8'b0110_1010;
            Memory[33] = 8'b1101_0010;
            Memory[32] = 8'b0111_1001;
            /// Setting 32-bit instruction: Campare
            Memory[39] = 8'b0000_0000;
            Memory[38] = 8'b0111_1010;
            Memory[37] = 8'b1101_0010;
            Memory[36] = 8'b0110_1010;
            /// Setting 32-bit instruction:
            Memory[43] = 8'b0000_0000;
            Memory[42] = 8'b0111_0111;
            Memory[41] = 8'b1101_0010;
            Memory[40] = 8'b0111_0010;
        end
   

endmodule

//IFU
/*
The instruction fetch unit has clock and reset pins as input and 32-bit instruction code as output.
Internally the block has Instruction Memory, Program Counter(P.C) and an adder to increment counter by 4,
on every positive clock edge.
*/
module IFU(
    input clock,reset,
    output [31:0] Instruction_Code
);
reg [31:0] PC = 32'b0;  // 32-bit program counter is initialized to zero

    
    always @(posedge clock, posedge reset)
    begin
        if(reset == 1)  //If reset is one, clear the program counter
        PC <= 0;
        else
        PC <= PC+4;   // Increment program counter on positive clock edge
    end
    // Initializing the instruction memory block
    INST_MEM instr_mem(.PC(PC),.reset(reset),.Instruction_Code(Instruction_Code));

endmodule


///MUX

module Mux_2X1 (
    input mem_rd_select, // rd_mem_enable
    input wire [31:0] dataread_from_mem, regdata2,

    output reg [31:0] mux_out
);

always @(mem_rd_select or dataread_from_mem or regdata2) begin
    if (mem_rd_select == 1)
        mux_out <= dataread_from_mem ;
    else
        mux_out <= regdata2;
    end
endmodule

//DFlipFlop
module DFlipFlop(D,clock,Q);
input D; // Data input
input clock; // clock input
output reg Q; // output Q
always @(posedge clock)
begin
 Q <= D;
end
endmodule

///DATA path


module DATAPATH(
    input [4:0]Read_reg_add1,
    input [4:0]Read_reg_add2,
    input [4:0]Reg_write_add,
    input [3:0]Alu_control,
    input [11:0]Address,
    input Wr_reg_enable,Wr_mem_enable,Rd_mem_enable,
    input clock,
    input reset,
    output OUTPUT
    );

    // Declaring internal wires that carry data
    wire zero_flag;
    wire [31:0]Dataread_from_mem;
    wire [31:0]read_data1;
    wire [31:0]read_data2;
    wire [31:0]Mux_out;
    wire [31:0]Alu_result;
    //wire [31:0]datawrite_to_reg;

    // Instantiating the register file
    REG_FILE reg_file_module(.reg_read_add1(Read_reg_add1),.reg_read_add2(Read_reg_add2),.reg_write_add(Reg_write_add),.datawrite_to_reg(Alu_result),.read_data1(read_data1),.read_data2(read_data2),.wr_reg_enable(Wr_reg_enable),.clock(clock),.reset(reset));

    // Instanting ALU
    ALU alu_module(.A(read_data1), .B(Mux_out), .alu_control(Alu_control), .alu_result(Alu_result), .zero_flag(zero_flag));
    
    //Mux
    Mux_2X1 mux(.mem_rd_select(Rd_mem_enable),.dataread_from_mem(Dataread_from_mem),.regdata2(read_data2),.mux_out(Mux_out));

    //Data Memory
    Data_Mem DM(.clock(clock),.rd_mem_enable(Rd_mem_enable),.wr_mem_enable(Wr_mem_enable),.address(Address),.datawrite_to_mem(Alu_result),.dataread_from_mem(Dataread_from_mem));
    
    // Dflipflop
    DFlipFlop DF (.D(zero_flag), .Q(OUTPUT),.clock(clock));
endmodule


/*
A register file can read two registers and write in to one register.
The RISC V register file contains total of 32 registers each of size 32-bit.
Hence 5-bits are used to specify the register numbers that are to be read or written.
*/

/*
Register Read: Register file always outputs the contents of the register corresponding to read register numbers specified.
Reading a register is not dependent on any other signals.

Register Write: Register writes are controlled by a control signal RegWrite.  
Additionally the register file has a clock signal.
The write should happen if RegWrite signal is made 1 and if there is positive edge of clock.
*/
module REG_FILE(
    input [4:0] reg_read_add1,
    input [4:0] reg_read_add2,
    input [4:0] reg_write_add,
    input [31:0] datawrite_to_reg,
    output [31:0] read_data1,
    output [31:0] read_data2,
    input wr_reg_enable,
    input clock,
    input reset
);

    reg [31:0] reg_memory [31:0]; // 32 memory locations each 32 bits wide
    
    initial begin
        reg_memory[0] = 32'h00000000;
        reg_memory[1] = 32'hFFFFFFFF;
        reg_memory[2] = 32'h00000002;
        reg_memory[3] = 32'hFFFFFFFF;
        reg_memory[4] = 32'h00000004;
        reg_memory[5] = 32'h01010101;
        reg_memory[6] = 32'h00000006;
        reg_memory[7] = 32'h00000000;
        reg_memory[8] = 32'h10101010;
        reg_memory[9] = 32'h00000009;
        reg_memory[10] = 32'h0000000A;
        reg_memory[11] = 32'h0000000B;
        reg_memory[12] = 32'h0000000C;
        reg_memory[13] = 32'h0000000D;
        reg_memory[14] = 32'h0000000E;
        reg_memory[15] = 32'h0000000F;
        reg_memory[16] = 32'h00000010;
        reg_memory[17] = 32'h00000011;
        reg_memory[18] = 32'h00000012;
        reg_memory[19] = 32'h00000013;
        reg_memory[20] = 32'h00000014;
        reg_memory[21] = 32'h00000015;
        //reg_memory[22] = 32'h00000016;
        //reg_memory[23] = 32'h00000017;
        //reg_memory[24] = 32'h00000018;
        //reg_memory[25] = 32'h00000019;
        //reg_memory[26] = 32'h0000001A;
        //reg_memory[27] = 32'h0000001B;
        //reg_memory[28] = 32'h0000001C;
        //reg_memory[29] = 32'h0000001D;
        //reg_memory[30] = 32'h0000001E;
        reg_memory[31] = 32'hFFFFFFFF;
    end

    // The register file will always output the vaules corresponding to read register numbers
    // It is independent of any other signal
    assign read_data1 = reg_memory[reg_read_add1];
    assign read_data2 = reg_memory[reg_read_add2];

    // If clock edge is positive and regwrite is 1, we write data to specified register
    always @(posedge clock)
    begin
        if (wr_reg_enable) begin
            reg_memory[reg_write_add] = datawrite_to_reg;
        end     
    else
        reg_memory[reg_write_add] = 32'h00000000;
    end
endmodule


/////PROCESSOR


module PROCESSOR(
    input clock,
    input reset,
    output Output
);

    wire [31:0] instruction_Code;
    wire [3:0] ALu_control;
    wire WR_reg_enable;
    wire WR_mem_enable;
    wire RD_mem_enable;


    IFU IFU_module(.clock(clock), .reset(reset), .Instruction_Code(instruction_Code));
    
    CONTROL control_module(.opcode(instruction_Code[4:0]),.alu_control(ALu_control),.regwrite_control(WR_reg_enable),.memread_control(RD_mem_enable),.memwrite_control(WR_mem_enable));
    
    DATAPATH datapath_module(.Wr_mem_enable(WR_mem_enable),.Rd_mem_enable(RD_mem_enable),.Read_reg_add1(instruction_Code[9:5]),.Read_reg_add2(instruction_Code[14:10]),.Reg_write_add(instruction_Code[19:15]),.Address(instruction_Code[31:20]),.Alu_control(ALu_control),.Wr_reg_enable(WR_reg_enable), .clock(clock), .reset(reset), .OUTPUT(Output));

endmodule

**********************************************************************************************************************************************************

Below is my Synthesis.tcl file for genus synthesis

********************

set_attribute lib_search_path "/home/sameer23185/Desktop/VDF_PROJECT/lib"
set_attribute hdl_search_path "/home/sameer23185/Desktop/VDF_PROJECT"
set_attribute library "/home/sameer23185/Desktop/VDF_PROJECT/lib/90/fast.lib"
read_hdl Master.v
elaborate
read_sdc Min_area.sdc
set_attribute hdl_preserve_unused_register true
set_attribute delete_unloaded_seqs false
set_attribute optimize_constant_0_flops false
set_attribute optimize_constant_1_flops false
set_attribute optimize_constant_latches false
set_attribute optimize_constant_feedback_seqs false
#set_attribute prune_unsued_logic false
synthesize -to_mapped -effort medium
write_hdl > report/HDL_min_Netlist.v
write_sdc > report/constraints.sdc
write_script > report/synthesis.g
report_timing > report/synthesis_timing_report.rep
report_power > report/synthesis_power_report.rep
report_gates > report/synthesis_cell_report.rep
report_area > report/synthesis_area_report.rep
gui_show

**********************************************

WHEN I COMPARING MY GOLDEN.V WITH HDL_min_Netlist.v  during   conformal , I got  these  non-equivalent   point   for   every reg memory and for every data memory. I don't know what to do with these non-equivalent point. I've been stuck here for the past four days. Please help me in this and how can I remove this non- equivalent point , since I am new to this I really don't know what to do.

hi

How can I tell the LEC tool to ignore a combination of Primary input bus in both Golden and revised.

For example in both Golden and revised there is 

input [3:0] data_in

I want LEC not to check the case that data_in[3:0] == 4'b1000

I want to use a transmission gate in my design, but it is not available as a standard cell for Genus RTL synthesis. How can I perform an analysis of area, power, and critical path delay that includes the transmission gate alongside standard cells?

Could you provide guidance or a methodology for integrating custom cells, like the transmission gate, into the synthesis flow for accurate analysis?

We have a big circuit having 12K gates totally and trying to show it in one page slide visually. But it is so hard for us to shrink it down from gate-level to module-level. Do you have any function like these:

• Toggle wires on and off
• “Right click” elements and group them into black boxes
• Quickly left or right align elements to clean up pictures

Hi. I'm a very new learner on Cadence. I want to synthesis my logic design for the maximum, minimum and an average results of delay, power dissipation and area under varying multiple inputs of different data. The different data will be exported from other software results. I'm lost on the steps/processes I should do.

Could anyone suggest me on which software and/or function or scripts I should use to achieve these results?

Optimize Regression Suite, Accelerate Coverage Closure, and Increase hit count of rare bins using Xcelium Machine Learning. It is easy to use and has no learning curve for existing Xcelium customers. Xcelium Machine Learning Technology helps you discover hidden bugs when used early in your design verification cycle.(read more)

Artificial intelligence (AI) is everywhere. Machine learning (ML) and its associated inference abilities promise to revolutionize everything from driving your car to making your breakfast. Verification is never truly complete; it is over when you run...(read more)

The automotive industry revolutionized the definition of a vehicle in terms of safety, comfort, enhanced autonomy, and internet connectivity. With this trend, the automotive industry rapidly adopted automotive Ethernet such as 10Base-T1, 100Base-T1, and in some cases, 1000Base-T1. 

Faster Speed (than CAN-FD), Scalability, embedded security protocols (like MacSec), cost and energy efficiency, and simple yet redundant network made Ethernet an obvious choice over CAN(FD) and FlexRay.  

Ethernet 10Base-T1 

10BASE-T1S is defined under IEEE with 802.3cg. The S in 10BASE-T1S stands for a short distance. 10BASE-T1S uses a multidrop topology, where each node connects to a single cable. Multidrop topology eliminates the need for switches and, as a result, fewer cables/less cost. The primary goal of 10BASE-T1S is a deterministic transmission on a collision-free multidrop network. 10BASE-T1S cables use a pair of twisted wires. As per IEEE, at least eight nodes can connect to each, but more connections are feasible.    

The Physical Layer Collision Avoidance [PLCA] protocol ensures that it uses the entire 10 Mbps bandwidth. In 10BaseTs, Reconciliation Sublayer provides optional Physical Layer Collision Avoidance (PLCA) capabilities among participating stations. Using PLCA-enabled Physical Layers in CSMA/CD half-duplex shared-medium networks can provide enhanced bandwidth and improved access latency under heavily loaded traffic conditions. The working principle of PLCA is that transmit opportunities on a mixing segment are granted in sequence based on a node ID unique to the local collision domain (set by the management entity). 10BASE-T1S also supports an arbitration scheme that guarantees consistent node access to the media within a predefined time.  

The 10BASE-T1S PHY is intended to cover the low-speed/low-cost applications in the industrial and automotive environment. A large number of pins (16) required by the MII interface is one of the significant cost factors that must be addressed to fulfill this objective. The 10BASE-T1S "Transceiver" solution is suited for embedded systems where the digital portion of the PHY is fully integrated, e.g., into an MCU or an Ethernet switch core, leaving only the analog portion (the transceiver) into a separate IC. 

Ethernet 100Base-T1/1000Base-T1 

100Base-T1 and 1000Base-T1 can be used for audio/video information. With Higher bandwidth capacity, 100Base-T1/ 1000Base-T1 paired with AVB (Audio video bridging) can be used for car infotainment systems. 100Base-T1/1000Base-T1 paired with time-sensitive networking [TSN] protocol can be used to fulfill the automotive industry's mission-critical, time-sensitive, and deterministic latency needs. 

 PTP Over MacSec  

With today's automotive network, all the Electronic Control Units connected require timing accuracy and network synchronization, Precision Time Protocol (PTP), defined in IEEE 1588, provides synchronized clocks throughout a network.  While maintaining the timing accuracy for mission-critical applications, protecting the vehicle network from vulnerable threats is mandatory, and PTP over MacSec provides the consolidated solution.  

With the availability of the Cadence Verification IP for 10/100/1000BaseT1 and TSN, adopters can start working with these specifications immediately, ensuring compliance with the standard and achieving the fastest path to IP and SoC verification closure. The 10/100/1000GBaseT1 and TSN provide a full-stack solution, including support to the PHY, MAC, and TSN layers with a comprehensive coverage model and protocol checkers. Ethernet BaseT1 and TSN VIP covers all features required for complete coverage verification closure. More details are available in the Ethernet Verification IP portfolio. 

Krunal 

The increase in compute and data-intensive applications and the need for lower power consumption have resulted in a rapidly growing number of Arm-based devices in various market segments; this requires fast time to market (TTM) and support for off-t...(read more)

Ensuring that the RTL designs correctly implement the C++ algorithmic intent in every circumstance is difficult to achieve with conventional verification. Learn more how Jasper C2RTL App helps to perform equivalence checking with 100x performance improvement(read more)

To stay ahead in competition in chip design real-time collaborations ensure traceability, speedy innovations at reduced the cost.(read more)

It has become challenging to ensure that the designs are complete, correct, and adhere to necessary coding rules before handing them off for RTL verification and implementation. RTL Designer Signoff Solution from Cadence helps the user identify RTL bugs at a very early development stage, saving a lot of effort and cost for the design and verification team. Our reputed customers have confirmed that using RTL signoff for their design IP helped save up to 4 weeks and reduce the late-stage RTL changes by up to 80%.(read more)

In a network containing multiple nodes, the need for synchronization between the various nodes is not just instrumental but also a complicated and highly complex process. This process becomes even more tricky if we synchronize the clocks between the Manager and the Peripheral. As we know, in a real-time network, some of the nodes would behave like Managers while some would be a Peripheral. If we must make the communication process smooth, then the local clocks of these nodes must be synchronized. 

The problem with this synchronization is that we have the clock running in the Manager as well. If we send the value of the Manager clock to the Peripheral, the synchronization doesn’t happen as we have a propagation delay of the messages, along with the propagation delay of the electronic circuits of Manager and the Peripheral.  

The cherry on the cake is that these electronic circuit propagation delays are not random and remain constant, so we can add a time offset to it to match the clock. To tackle this challenge, IEEE has come up with a protocol named “Precision Timing Protocol.” 

Operation of PTP: 

To synchronize the clocks, a Sync message is sent by the Manager to the Peripheral, which then timestamps the receiving time of the same. Following this, a ‘Follow up’ message is issued by the Manager stating the timestamp at which the Sync message was sent. 

The Peripheral then finds the difference between the two values and adds this to its current time. After this, the time difference between the Manager and the Peripheral narrows down to only the propagation delay of the messages.  

To overcome this, the Peripheral issues a ‘Delay Request’ to the Manager, and the Manager, in turn, issues a ‘Delay Response.’ Both these messages have the timestamp of when they were issued. The time at which they are received is then noted. Since two messages are sent, one from the Peripheral and the other from the Manager, there are two propagation delays. Then half of this value is our propagation delay. 

The Peripheral then adds this propagation delay to its clock, and hence the clock gets synchronized. 

Advantages of PTP: 

1. It provides accurate time stamping. 
2. It is a well-known clock synchronization protocol. 
3. It provides intensified security inside the premises. 
4. It provides the possibility of setting coordinated actions and synchronized communication. 

There are various versions of PTP that have been developed over time, namely PTPv1, PTPv2, PTPv2_1, and the latest PTP-AS. 

Cadence Verification IP for Ethernet is available to support the newer version of PTP, allowing simulation of the device for efficient IP, SoC, and system-level design verification. Semiconductor companies can start using it to fully verify their controller design and achieve functional verification closure on it within no time. 

The rising customer expectations, intermingling fields and high performance needs can be satisfied with the system based design. An intelligent Systems Design strategy can offer a quicker route to an optimum design and helps to increase designers' productivity and analyzes efficiency by providing the ability to explore the entire design space. Cadence Intelligent System Strategy enables a system design revolution and reduces project schedules with optimized continuous integration.(read more)

At what stage in the design cycle do you start to think about the PCB material costs? What about the costs to assemble the PCB? Once a design becomes successful, should you then redesign it to achieve a scalable product? Placing components and routi...(read more)

Introduction

Multiphysics is an integral part of the concepts around digital twins. In this post, I want to discuss the mechanical aspects of multiphysics in system simulations, which are critical for 3D-IC, multi-die, and chiplet design.

The physical world in which we live is growing ever more electrified. Think of the transformation that the cell phone has brought into our lives, as has the present-day migration to electronic vehicles (EVs). These products are not only feats of electronic engineering but of mechanical as well, as the electronics find themselves in new and novel forms such as foldable phones and flying cars (eVOTLs). Here, engineering domains must co-exist and collaborate to bring about the best end products possible.

Start with the electronics—chips, chiplets, IC packaging, PCB, and modules. But now put these into a new form factor that can be dropped or submerged in water or accelerated along a highway. What about drop testing, aerodynamics, and aeroacoustics? These largely computational fluid dynamics (CFD) and/or mechanical multiphysics phenomena must also be accounted for. And then how does the drop testing impact the electrical performance? The world of electronics and its vast array of end products is pushing us beyond pure electrical engineering to be more broadly minded and develop not only heterogeneous products but heterogeneous engineering teams as well.

Cadence's Unique Expertise

It's at this crossroad of complexity and electronic proliferation that Cadence shines. Let's take, for example, the latest push for higher-performing high-bandwidth memory (HBM) devices and AI data center expansion. These technologies are growing from several layers to 12, and I can't emphasize enough the importance of teamwork and integrated solutions in tackling the challenges of advanced packaging technologies and how collaboration is shaping the future of semiconductor innovation and paving the way for cutting-edge developments in the industry.

These layered electronics are powered, and power creates heat. Heat needs to be understood, and thus, the thermal integrity issues uncovered along the way must be addressed. However, electronic thermal issues are just the first domino in a chain of interdependencies. What about the thermal stress and warpage that can be caused by the powering of these stacked devices? How does that then lend to mechanical stress and even material fatigue as the temperature cycles from high to low and back through the use of the electronic device? This is just one example in a long list of many...

Cadence Multiphysics Analysis Offerings

The confluence of electrical, mechanical, and CFD is exactly why Cadence expanded into multiphysics at a significant rate starting in 2019 with the announcement of the Clarity 3D Solver and Celsius Thermal Solver products for electromagnetic (EM) and thermal multiphysics system simulations. Recent acquisitions of Numeca, Pointwise, and Cascade (now branded within Cadence as the Fidelity CFD Platform) as well as Future Facilities (now the Cadence Reality Digital Twin product line) are all adding CFD expertise. The recent addition of Beta CAE brings mechanical multiphysics to the suite of solutions available from Cadence. The full breadth of these multiphysics system analyses, spanning EM, thermal, signal integrity/power integrity (SI/PI), CFD, and now mechanical, creates a platform for digital twinning across a wide array of applications. You can learn more by viewing Cadence's Reality Digital Twin platform launch on the keynote stage at NVIDIA's GTC in March, as well as this Designed with Cadence video: NV5, NVIDIA, and Cadence Collaboration Optimizes Data Centers.

Conclusion

Ever more sophisticated electronic designs are in demand to fulfill the needs of tomorrow's technologies, driving a convergence of electrical and mechanical aspects of multiphysics in system simulations. To successfully produce the exciting new products of the future, both domains must be able to collaborate effectively and efficiently. Cadence is fully committed to developing and providing our customers with the software products they need to enable this electrical/mechanical evolution. From EM, to thermal, to SI/PI, CFD, and mechanical, Cadence is enabling digital twinning across a wide array of applications that are forging pathways to the future.

For more information on Cadence's multiphysics system analysis offerings, visit our webpage and download our brochure.

Explore Impacts of Finite Interconnect Impedance on PDN Characterization

Over the past few decades, many details have been worked out in the power distribution network (PDN) in the frequency and time domains. We have simulation tools that can analyze the physical structure from DC to very high frequencies, including spatial variations of the behavior. We also have frequency- and time-domain test methods to measure the steady-state and transient behavior of the built-up systems.

All of these pieces in our current toolbox have their own assumptions, limitations, and artifacts, and they constantly raise the challenging question that designers need to answer: How to select the design process, simulation, measurement tools, and processes so that we get reasonable answers within a reasonable time frame with a reasonable budget.

Read this award-winning DesignCon 2024 paper titled “Impact of Finite Interconnect Impedance Including Spatial and Domain Comparison of PDN Characterization.” Led by Samtec’s Istvan Novak and written with a team of nine authors from Cadence, Amazon, and Samtec, the paper discusses a series of continually evolving challenges with PDN requirements for cutting-edge designs.

Read the full paper now: “Impact of Finite Interconnect Impedance Including Spatial and Domain Comparison of PDN Characterization.”

Live Doc is an advanced automated PCB documentation generation tool integrated with OrCAD X Presto designed to streamline the creation of PCB documentation. By automating the generation of PCB fabrication and assembly drawings, Live Doc significantly...(read more)

Does anyone know whether it is possible to have multiple contact points for a bond wire on a large die pad? Note: This is different from adding multiple wires which I will also be doing. I need to add multiple bond connections to the same large die pad for redundancy connections to each pad for each wire. I have a large die pad which I need to have 5 wires with each wire having 3 bond connections to the same die pad.

Starting SPB 23.1, in Allegro X PCB Editor and Allegro X Advanced Package Designer, you can align components by using offset mode. Earlier only spacing mode was available.

Follow these steps to Align Components using Offset Mode:

1. Set Application Mode to Placement Edit.
2. Drag the components that need to be aligned and right-click and choose Align Components.
3. Now, in the Options tab, you will notice Spacing Section with Equal Offset. You can equally and individually offset the components by using the +/- buttons for increment or decrement.

Have you ever encountered ERROR(SPMHNI-67) while importing logic? If yes, you might already know that you had to export libraries of the design and make sure that paths (devpath, padpath, and psmpath) include the location of exported files.  

Starting in SPB23.1, if you go to File > Import > Logic/Netlist and click on the Other tab, you will see an option, Reuse device files for existing components. 

After selecting this option, ERROR(SPMHNI-67) will no longer be there in the log file, because the tool will automatically extract device files and seamlessly use them for newly imported data. In other words, SPB_23.1 lets you reuse the device / component definitions already in the design without first having to dump libraries manually. An excellent improvement, don’t you think?  

Starting from SPB23.1, a new option, Allow DRCs to surrounding metal, has been added in the Etch-Back form to allow DRCs to the surrounding objects. form to allow DRCs to the surrounding objects.

The Allow DRCs to surrounding metal option lets you see and adjust objects instead of the current behavior, which sacrifices the width of the mask for the trace.

• When this option is turned off, it maintains the EB mask to another object clearance.
• When this option is enabled, it keeps the EB mask to the EM trace edge clearance and shows a DRC if the EB mask to another object spacing is out of rule.

Starting SPB 23.1, a new pin property, WIREBOND_PROFILE_NAME is introduced. This property can be used to define a wirebond profile to a die pin. When adding a wirebond, the pin will use the profile defined in the WIREBOND_PROFILE_NAME property associated to the die pin.

Assign the WIREBOND_PROFILE_NAME property to the die pin using Edit > Properties and set the desired wirebond profile name in the Value field.

The following image displays the WIREBOND_PROFILE_NAME property assigned to the pin and wire profile of the Wire Bond for that pin.

Have you ever thought of a handy utility to specify all necessary transmission line parameters to decide upon the stackup?   

Starting SPB 23.1, a handy feature Transmission Line Calculator, is built into Allegro X Advanced Package Designer (Allegro X APD). This feature will require either an SiP Layout license or can be accessed through SiP Layout Bundle. 

From the Analyze dropdown menu in the 23.1 Allegro X APD toolbar, you can choose Transmission Line Calculator. 

You can use this calculator to help decide constraints and stackup for laminate-based PCB or Packages. You can calculate the correct stackup material and width/spacing to meet any requirements that may be later entered in a constraint. This is truly a calculated number and not a true field solver. 

The different types of calculations that the Transmission Line Calculator can provide are Microstrip, Embedded microstrip, Stripline, CPW (Coplanar), FGCPW (frequency-dependent Coplanar), Asymmetric stripline, Coupled microstrip (Differential Pair), Coupled stripline (Differential Pair), and Dual striplines. 

This feature is important for customers relying on fabricators/spreadsheets to provide this information or need to test a quick spacing/width as per the impedance value. 

Let us know your comments on this new feature in 23.1 Allegro X APD. 

Starting SPB 23.1, Allegro X APD lets you import/export the symbol and component properties by using Die Text-In/Out wizards. 

Exporting the symbol 

You can export the symbol by using File > Export > Die Text-Out Wizard. 

In the Die Text-Out Wizard window, you can see the newly added options, that is, Component Properties and Symbol Properties. 

This entire information including the properties will be saved in a text file. 

Importing the symbol 

You can import the same text file in Allegro X APD by using Die Text-In Wizard. 

Choose the text file you want to import. 

Symbol properties added in the text file will be visible in the Die Text-In Wizard window. 

At times, there might arise a condition in the design where you need to push the net of selected pins to all its physically connected objects. For example, a few pins are updated with a new net, and it is required to push the new net to all its connected objects. At times, you might update the die or copy routing to other components, when a portion of routing gets the wrong net.

To propagate the net of the pin to all its physically connected objects, Allegro X APD uses the standalone command, Push Connectivity.

You can call the command through Logic > Push Connectivity.

Alternately, you can use the push connectivity command at the command line. Once the command is active, it lets you select pins or symbols that will be used to push net connectivity to all connected objects.

Presently, dynamic shapes and filled rectangles are not considered as part of connectivity. Static shapes are supported.

The vision manager is good tool for routing check. but no quickly or effective  tool to fix or optimize this  problems to be optimized.

For example, parallel Gap less than preferred, min seg/Arc length,uncoupled diff-pair segs，and so on.

I only know use spread between voids to fix the non-optimized segs. in fact it is inefficient.

the parallel gap less than preferred is only to slice evry trace, its inefficient.

If i set the paraller gap less than 50um, Is there any tool to quickly fix these problems（gap less than 50um）?

For other problems，i can use tool to quickly fix the min seg/Arc length，uncoupled diff pair segs，accoding to select by polygon or select  by windows.

Hi，

There are mang components in BGA ball side of flipchip package.

Are there DFA check space of compont body or pin soldermask to BGA ball or BGA PAD or bga  soldermask in allegro APD?

I only find space of compont to compont in APD DFA. 

By default, a dielectric must separate each pair of conductor layers in the cross-section of a design. In rare cases, this does not represent the real, manufactured substrate.

If your design requires you to have conductor layers that are not separated by a dielectric (such as, for half-etch designs), there is a variable that needs to be set in Allegro X APD. You must set this by enabling the variable icp_allow_adjacent_conductors. This entry, and its location in the User Preferences Editor, are shown in the following image.

The Objects on adjacent conductor layers do not electrically connect together, automatically. A via must be used to establish the inter-layer connections.

When enabling this option, it is recommended to exercise caution because excluding dielectric layers from your cross-section can lead to inaccurate calculations, including the calculations for signal integrity and via heights. It is important that your cross-section accurately reflect the finished product to ensure the most accurate results possible. Any dielectric layers present in the manufactured part need to be in the cross-section for accurate extraction, 3D viewing, and so on.

Let us know your comments on the various designs that would require adjacent conductor layers.

Hi，

Can you tell me which setting is causing this?

In the general edit. I try slide via to other position. but the slide is wrong.

in the cm，i set pad-pad connect is all allowed，and i turn off via to pad spacing in the same net spacing. only turn on via to via spacing in the same net spacing，set to via to via spacing =0.

default the via is closer to the pad edge, I think the correct location is show in the pic2.

Hello, SKILL experts. 

I'm studying SKILL language to build some useful function in APD+.

Now, I want to execute 'Import Sub-drawing' function in new form.

But I cannot find how to do execute APD+ embedded function in a field of new form. 

Has anyone experienced this or idea to solve this problem? 

Display Stream Compression (DSC) is a lossless or near-lossless image compression standard developed by the Video Electronics Standards Association (VESA) for reducing the bandwidth required to transmit high-resolution video and images. DSC compresses video streams in real-time, allowing for higher resolutions, refresh rates, and color depths while minimizing the data load on transmission interfaces such as DisplayPort, HDMI, and embedded display interfaces.

Why Is DSC Needed?

In the ever-evolving landscape of display technology, the pursuit of higher resolutions and better visual quality is relentless. As display capabilities advance, so do the challenges of managing the immense amounts of data required to drive these high-performance screens. This is where DSC steps in. DSC is designed to address the challenges of transmitting ultra-high-definition content without sacrificing quality or performance. As displays grow in resolution and capability, the amount of data they need to transmit increases exponentially. DSC addresses these issues by compressing video streams in real-time, significantly reducing the bandwidth needed while preserving image quality.
 

DSC Use in End-to-end System

DSC Key Features

• Encoding tools:
  • Modified Median-Adaptive Prediction (MMAP)
  • Block Prediction (BP)
  • Midpoint Prediction (MPP)
  • Indexed color history (ICH)
  • Entropy coding using delta size unit-variable length coding (DSU-VLC)

• The DSC bitstream and decoding process are designed to facilitate the decoding of 3 pixels/clock in practical hardware decoder implementations. Hardware encoder implementations are possible at 1 pixel/clock.
• DSC uses an intra-frame, line-based coding algorithm, which results in very low latency for encoding and decoding.

DSC encoding algorithm
 

• Compression can be done to a fractional bpp. The compressed bits per pixel ranges from 6 to 63.9375.
• For validation/compliance certification of DSC compression and decompression engines, cyclic redundancy checks (CRCs) are used to verify the correctness of the bitstream and the reconstructed image.
• DSC supports more color bit depths, including 8, 10, 12, 14, and 16 bpc.
• DSC supports RGB and YCbCr input format, supporting 4:4:4, 4:2:2, and 4:2:0 sampling.
• Maximum decompressor-supported bits/pixel values are as listed in the Maximum Allowed Bit Rate column in the table below

• DP DSC Source device shall program the bit rate within the range of Minimum Allowed Bit Rate column in the table:

Summary

Display Stream Compression (DSC) is a technology used in DisplayPort to enable higher resolutions and refresh rates while maintaining high image quality. It works by compressing the video data transmitted from the source to the display, effectively reducing the bandwidth required. DSC uses a visually lossless algorithm, meaning that the compression is designed to be imperceptible to the human eye, preserving the fidelity of the image. This technology allows for smoother, more detailed visuals at higher resolutions, such as 4K or 8K, without requiring a significant increase in data bandwidth.

More Information

• Cadence has a very mature Verification IP solution. Verification over many different configurations can be used with DisplayPort 2.1 and DisplayPort 1.4 designs, so you can choose the best version for your specific needs.
• The DisplayPort VIP provides a full-stack solution for Sink and Source devices with a comprehensive coverage model, protocol checkers, and an extensive test suite.
• More details are available on the DisplayPort Verification IP product page, Simulation VIP pages.
• If you have any queries, feel free to contact us at talk_to_vip_expert@cadence.com

Verisium SimAI App harnesses the power of machine learning technology with the Cadence Xcelium Logic Simulator - the ultimate breakthrough in accelerating verification closure. It builds models from regressions run in the Xcelium simulator, enabling the generation of new regressions with specific targets. The Verisium SimAI app also features cousin bug hunting, a unique capability that uses information from difficult-to-hit failures to expose cousin bugs. With these advanced machine learning techniques, Verisium SimAI offers the potential for a significant boost in productivity, promising an exciting future for our users.

Figure 1: Regression compression and coverage maximization with Verisium SimAI 

What can I do with Verisium SimAI?

You can exercise different use cases with Verisium SimAI as per your requirements. For some users, the goal might be regression compression and improving coverage regain. Coverage maximization and hitting new bins could be another goal. Other users may be interested in exposing hard-to-hit failures, bug hunting for difficult to find issues. Verisium SimAI allows users to take on any of these challenges to achieve the desired results.

Let's go into some more details of these use cases and scenarios where using SimAI can have a big positive impact.

1. Using SimAI for Regression Compression and Coverage Regain

Unlock up to 10X compute savings with SimAI!

Verisium SimAI can be used to compress regressions and regain coverage. This flow involves setting up your regression environment for SimAI, running your random regressions with coverage and randomization data followed by training, and finally, synthesizing and running the SimAI-generated compressed regressions. The synthesized regression may prune tests that do not help meet the goal and add more runs for the most relevant tests, as well as add run-specific constraints. This flow can also be used to target specific areas like areas involving a high code churn or high complexity.

You can check out the details of this flow with illustrative examples in the following Rapid Adoption Kits (RAK) available on the Cadence Learning and Support Portal (Cadence customer credentials needed):

• Using SimAI with vManager (For Regression Compression and Coverage Regain) (RAK) 
• Using SimAI with a Generic Runner (For Regression Compression and Coverage Regain) (RAK)

2. Using SimAI for Coverage Maximization and Targeting coverage holes

Reduce your Functional Coverage Holes by up to 40% using SimAI!

Verisium SimAI can be used for iterative coverage maximization. This is most effective when regressions are largely saturated, and SimAI will explicitly try to hit uncovered bins, which may be hard-to-hit (but not impossible) coverage holes. This is achieved using iterative learning technology where with each iteration, SimAI does some exploration and determines how well it performed. This technique can also be used for bug hunting by using holes as targets of interest.

See more details on the Cadence Learning and Support Portal:

• Using SimAI for Coverage Maximization - vManager flow (RAK) 
• Using SimAI for Coverage Maximization - Generic Runner Flow (RAK)

3. Using SimAI for Bug Hunting

Discover and fix bugs faster using SimAI!

Verisium SimAI has a new bug hunting flow which can be used to target the goal of exposing hard-to-hit failure conditions. This is achieved using an iterative framework and by targeting failures or rare bins. The goal to target failures is best exercised when the overall failure rate is typically low (below 5%). Iterative learning can be used to improve the ability to target specific areas. Use the SimAI bug hunting use case to target rare events, low hit coverage bins, and low hit failure signatures.

See more details on the Cadence Learning and Support Portal:

• Using SimAI for Bug Hunting with vManager (RAK) 
• Using SimAI for Bug Hunting – Generic runner flow (RAK) 

Unlock compute savings, reduce your functional coverage holes, and discover and fix bugs faster with the power of machine learning technology now enabled by Verisium SimAI!

Please keep visiting  https://support.cadence.com/raks to download new RAKs as they become available.

Please note that you will need the Cadence customer credentials to log on to the Cadence Online  Support  https://support.cadence.com/, your 24/7 partner for getting help in resolving issues related to Cadence software or learning Cadence tools and technologies.

Happy Learning!