A method for producing synthetic gas from biomass by: a) grinding the biomass, feeding the biomass into a pyrolysis furnace while spraying a first superheated water vapor into the pyrolysis furnace, controlling the temperature of the pyrolysis furnace at 500-800° C., contacting the biomass with the first superheated water vapor for a pyrolysis reaction to yield crude synthetic gas and ash including coke; b) cooling the ash, and separating the coke from the ash; c) transporting the crude synthetic gas and the coke into a gasifier, spraying a second superheated water vapor into the gasifier, controlling the gasifier at an operating temperature of 1200-1600° C., contacting the biomass with the second superheated water vapor for a gasification reaction to yield primary synthetic gas; and d) cooling, removing dust, deacidifying, and desiccating the primary synthetic gas to obtain clean synthetic gas.

The invention relates to a gasifier comprising a syngas generation section, a coal methanation section and a syngas methanation section in the order from bottom to top. The invention also relates to a process for preparing methane by catalytically gasifying coal using such a gasifier. Optionally, the gasifier is additionally provided with a coal pyrolysis section above the syngas methanation section.

The disclosed embodiments provide systems for the removal and use of tar from a biomass gasification system. For example, in one embodiment, a biomass gasification system includes a reactor configured to gasify a biomass fuel in the presence of air to generate a producer gas. The system also includes an absorber configured to receive a mixture of the producer gas and tar and to absorb the tar into an organic solvent to produce treated producer gas and a rich solvent mixture containing at least a portion of the tar. The system further includes a recycle line configured to direct the rich solvent mixture to a biomass gasifier.

An image displaying device includes: a display section cyclically switching a plurality of image streams, thereby time-divisionally displaying the plurality of image streams, each of the plurality of image streams being provided for corresponding one of a plurality of shutter mechanisms performing opening-closing operations at timings different from each other; and a dithering processing section performing a dithering process on a plurality of input images by using a plurality of masks, each of the plurality of masks having a pattern of two-dimensionally-arranged grayscale values, the pattern differing from a pattern of another mask, and then supplying a plurality of resultant images produced through the dithering process to the display section. The dithering processing section controls the dithering process in such a manner that the plurality of masks are sequentially and cyclically switched in synchronization with shutter open timings for each of the shutter mechanisms.

Various processes and apparatus are discussed for an ultra-high heat flux chemical reactor. A thermal receiver and the reactor tubes are aligned to 1) absorb and re-emit radiant energy, 2) highly reflect radiant energy, and 3) any combination of these, to maintain an operational temperature of the enclosed ultra-high heat flux chemical reactor. Particles of biomass are gasified in the presence of a steam carrier gas and methane in a simultaneous steam reformation and steam biomass gasification reaction to produce reaction products that include hydrogen and carbon monoxide gas using the ultra-high heat flux thermal energy radiated from the inner wall and then into the multiple reactor tubes. The multiple reactor tubes and cavity walls of the receiver transfer energy primarily by radiation absorption and re-radiation, rather than by convection or conduction, to the reactants in the chemical reaction to drive the endothermic chemical reaction flowing in the reactor tubes.

A method for production of hydrogen from organic matter, includes: pyrolysis of a feed of organic matter by passing a gaseous treatment stream essentially having carbon dioxide through the organic matter, the pyrolysis producing, on the one hand, a pyrolysis gas stream having the gaseous treatment stream, steam and volatile organic compounds originating from the organic matter, and on the other hand pyrolysis chars having carbon components; oxycombustion of at least a proportion of the volatile organic compounds present in the pyrolysis gas stream, by injection of oxygen, upstream of a layer of redox filtering matter comprising high-temperature carbon components; and after the oxycombustion, passing the oxidized pyrolysis gas stream through the redox layer, the passage producing a synthesis gas stream comprising hydrogen obtained by deoxidation of steam by the high-temperature carbon components.

A solid feed system may comprise a supersonic nozzle, an isolated injection section having a port for injection of solid feedstock positioned downstream from the supersonic nozzle, and a supersonic diffuser positioned downstream from the isolated injection section. Additionally, a gasification system may comprise such a solid feed system and a reaction chamber downstream thereof. Furthermore, a method of reacting a solid feedstock under pressure may include directing a fluid flow through a supersonic nozzle to provide a supersonic flow stream, and directing the supersonic flow stream through an isolated injection section at a static pressure at least fifty percent (50%) lower than an operating pressure within a reaction chamber (e.g., at a static pressure near ambient pressure).

A gasification quench chamber is disclosed. The gasification quench chamber includes a reservoir that contains liquid coolant in its lower portion and an exit for the cooled syngas in its upper portion; a dip tube that is configured to introduce a syngas mixture to contact the liquid coolant which produces the cooled syngas; a cooling device configured to further cool the cooled syngas in its upper portion; and a stability device in the lower portion that is configured to mitigate coolant level fluctuation and sloshing. In an embodiment of the quench chamber, the cooling device includes a heat exchanger pipe. A quench chamber and scrubber assembly is also disclosed.

An odorant addition device for adding odorant to fuel gas in a gas system that consumes the fuel gas, the device including: an addition unit for adding the odorant to fuel gas to be consumed by the gas system; an environmental condition detection unit for detecting in the gas system an environmental condition regarding diffusion of odorant in fuel gas; and an addition adjustment unit for adjusting mode of odorant addition by the addition unit based on the environmental condition detected by the environmental condition detection unit. In this way, it is possible to detect leakage of fuel gas more reliably and improve safety dramatically, in a gas system that consumes the fuel gas as fuel.

The present invention provides a reformer tube apparatus, including: an axially aligned tubular structure including a flange section, a top section, a middle section, and a bottom section; wherein the top section of the axially aligned tubular structure includes a first portion having a first wall thickness; wherein the top section of the axially aligned tubular structure includes a second portion having a second wall thickness; and wherein the top section of the axially aligned tubular structure includes a third portion having a transitioning wall thickness that joins the first portion to the second portion. The flange section includes a concentric flange disposed about a top portion thereof. The bottom section of the tubular structure includes a plurality of concentric wedge structures disposed about the interior thereof. The bottom section of the tubular structure also includes a recess disposed about the exterior thereof. The axially aligned tubular structure further includes a secondary flange section coupled to the flange section, wherein the secondary flange section includes a concentric flange disposed about a top portion thereof. Optionally, the reformer tube apparatus is disposed within a reformer used in a direct reduction process.

An electrical connector has two portions, a first portion connectable to a device and a second portion having a contact point which is movable in relation to the first portion. The second portion having the contact point comprises a magnet configured to attract the corresponding connector. The contact point does not require a counteracting force, whereby the side magnets may be smaller or the connector may lack the side magnets entirely.

Disclosed are electronic devices and connectors, including: a first main body, a second main body; the first magnet being arranged at a first end of the first main body and the second magnet being arranged at a second end of the second main body; the first magnet having a magnetic property opposite that of the second magnet; the first main body being pluggably connected to the second main body through the interaction between the first magnet and the second magnet; the first number of spacers is arranged at a preset position of the first magnet, and the first number of spacers is arranged at a preset positions of the second magnet; and the spacers are non-magnetic. Other embodiments, including manufacturing methods, are described and claimed.

The invention provides a M.2 interface memory device and a M.2 interface connection seat insertedly provided thereof. The M.2 interface memory device comprises a M.2 interface card and a housing provided with at least one guide groove. The M.2 interface connection seat is disposed on a circuit board, and comprises two arms and a base comprising a M.2 interface slot. At least one arm is provided with a guide rail. An opening direction of the M.2 interface slot is horizontal to a surface of the circuit board. When the M.2 interface card is inserted into the M.2 interface slot in a horizontal direction, the M.2 interface memory device will be fixed within the M.2 interface connection seat by embedding between the guide groove and the guide rail. Thus, M.2 interface memory devices of a variety of specification lengths are able to be inserted into the M.2 interface connection seat.

In one example an electronic device comprises at least one electronic component, a chassis comprising a first section, a connector to connect the first section of the chassis to a second section, the connector comprising a housing defining a first shaft, a retention structure disposed in the shaft, and a plurality of electrical contacts positioned within a corresponding plurality of channels in the retention structure. Other examples may be described.

An electrical connector includes first and second connector parts and an electrical connection detector. The electrical connection detector includes a contact spring with a spring contact on the first connector part and a contact strip on the second connector part. The electric connection detector establishes an electrical connection between the contact spring and the contact strip when the connector parts are joined together. The second connector part includes an electrically insulating protrusion which forms a guide bevel that rises in a joining direction of the first connector part toward the second connector part. The spring contact is guided over the guide bevel, rests behind the protrusion, and physically contacts the contact strip when the connector parts are joined together to thereby establish an electrical connection between the contact spring and the contact strip.

An electrical assembly has a lead frame with a plurality of elongated conductor sets and an insulative housing. Each conductor set has two differential signal pair conductors between a first ground conductor and a second ground conductor. A slot extends through the insulative housing and at least partially exposes the first ground conductor of a first conductor set and the second ground conductor of a second conductor set. A first ground shield has a first tab bent inward that extends into the slot from a first side of the lead frame. A second ground shield has second tab bent inward that extends into the slot from a second side of the lead frame. A conductive medium is provided in the slot to electrically connect the first tab, the second tab, the first ground conductor and the second ground conductor.

The invention relates to a busbar having a profiled body which forms an elongate receiving channel, a first and a second groove being formed in the channel floor, and the electrical conductors being arranged in the first and second groove. Furthermore, the invention relates to a consumer unit for securing to such a busbar and for drawing current or data from such a busbar, and the use of the consumer unit in conjunction with such a busbar. Further aspects of the invention form a power transmission device having such a busbar and such a consumer unit, as well as a building element in which such a busbar is installed.

A composite electronic connector comprising an insulating housing, a USB Type-C connector and a USB Type-A connector which are arranged in the insulating housing is disclosed. The USB Type-C connector comprises a circuit board, a connecting line and a plurality of transferring terminals. One side of the circuit board is arranged with twenty-four golden fingers, other side of the circuit board is connected with the plurality of transferring terminals. The connecting line is used to integrate signal transmitted through the twenty-four golden fingers of the USB Type-C connector into USB Type-A standard adopted outputting signal, and outputs the outputting signal through the plurality of transferring terminals.

There is provided an adapter for adapting an electronic device to a modular electronic device system. The adapter generally has a housing having two lateral edges, a cavity between the lateral edges and being adapted to receive the electronic device, each of the two lateral edges of the housing having at least one magnetic coupler electrically connectable with at least one magnetic coupler of the modular electronic device system by magnetically engaging the at least one magnetic coupler of the adapter with the at least one magnetic coupler of the modular electronic device system, and an internal electric conductor network electrically connected to the magnetic couplers of the adapter and electrically connected to an internal connector which is electrically connectable to the electronic device when received in the cavity of the housing.

A terminal attaching/detaching device includes a housing, an engaging member, and a movable member. The engaging member is configured to move in a first direction toward a terminal inserted in the housing to engage with the terminal, and is configured to move from the terminal inserted in the housing in a second direction to disengage from the terminal. The movable member is configured to move in concert with the engaging member in the moving process thereof in the first direction, and is configured to move the engaging member from the terminal inserted in the housing in the second direction, so that the engaging member is disengaged from the terminal.

The present invention relates to a connection element for connection of an electrical connector (17) with a cable (15) connected on the connection element (10), wherein the connection element (10) has a mechanism (21) which is configured to secure the connection element (10) in a predetermined position on the electrical connector (17), and wherein the connection element (10) has on a contact region between the connection element (10) the electrical connector (17) that is generated after the connection of the electrical connector (17) with the cable (15) at least one layer made of a sealing material, which is configured to seal a region of the connecting element (10) on the electrical connector (17) in a liquid tight manner.

An arrangement for an electronic device is disclosed. A plurality of electrically conductive pins is positioned in respective vias of the circuit carrier, the pins extend from a first face of the circuit carrier to a contact end in order to electrically contact one or more components. The arrangement is equipped with an electrically insulating layer on a circuit carrier face, which is the first or a second face, in the region of the pin, the insulating layer having a prefabricated element which is positioned on the face of the circuit carrier. A portion of each pin, the portion being arranged adjacently to the respective via on the face, is surrounded by the material of the insulating layer in a continuously lateral manner.

Techniques and mechanisms for providing socket connection to a substrate. In an embodiment, a socket device includes a first socket body portion that is to provide for signal exchanges as part of a socket connector including the first socket body portion and a second socket body portion. The first socket body portion and the second socket body portion comprise respective zones, wherein, of the two zones, only one such zone has a first electro-mechanical characteristic. The first electro-mechanical characteristic is selected from the group consisting of an interconnect dimension, an interconnect material, an interconnect structure, a socket body material, and a shielding structure. In another embodiment, modular socket sub-assemblies each comprise a respective one of the first zone and the second zone.

An electrical connector includes a housing having pockets formed in a receiving end of the housing. A terminal module is inserted into the pockets wherein the terminal modules are constructed from a stitch plate including a plurality of terminals retained therein, A cover having a plurality of spaced apart walls form thereon is arranged on the stitch plate and is moved into engagement with the stitch plate with the walls disposed in the intervening space between adjacent terminals. The connector assembly is pressed onto a circuit board in which a force is applied to the connector housing and is directly transferred to the terminal tails of the terminal modules causing electrical contact between conductive holes of the circuit board and the terminals.

An electrical receptacle connector includes a metallic shell, an insulated housing, first receptacle terminals, second receptacle terminals, first glue recess, and a first texture region. The metallic shell circularly encloses the insulated housing. The first and second receptacle terminals are held in the insulated housing. The first texture region is annularly formed on an inner wall of the metallic shell and corresponds to a periphery of the outer wall of the insulated housing. Therefore, the sealing member can attach onto the first texture region efficiently. Therefore, the sealing member does not overflow to the front portion of the receptacle cavity, and the inner gap can be sealed by the sealing member properly. Hence, the first texture region allows the sealing member to attach onto the inner wall of the shell body, and the sealing member can cover the inner gap completely to provide a reliable waterproof performance.

The present invention provides a system and method for providing a seal for an electrical penetrator in a subsea environment. More specifically, the present invention provides for a system for creating a seal about an electrical penetrator without using o-rings or independent seals. The present invention provides for a set of supporting apparatuses to be placed in compression about a central ceramic penetrator element. The geometry of the central ceramic penetrator element and the interior of the supporting apparatuses forms a hermetic seal when under a constant radial and axial, or axial compressive force.

Provided is an electronic device that is highly resistant to a water-soluble grinding oil and a method for manufacturing the same. An electronic device includes a main body and a cable including a lead wire, an insulating portion, and an outer coat, a first sealing portion that covers the insulating portion, and a second sealing portion that seals the first sealing portion, the insulating portion is made of a material that is more resistant to a water-soluble grinding oil than the outer coat is, and the first sealing portion is made of a material that has higher adherence to the insulating portion than that of the second sealing portion does.

An electrical cord covering system includes a first housing portion and a second housing portion. The housing portions each include compression portions around their respective rims. The compression portions each have two recessed areas. When the housing portions are in a closed position a hollow region is formed to cover mated electrical cord plugs. A rim seal is formed with the compression portions. Two apertures are formed in the rim seal from the recessed apertures. The cable apertures form seals against electrical cords running to the electrical cord plugs.

A magnetic connector has a receptacle and a plug. The receptacle has an electromagnet comprising an inner core, an outer core, a coil disposed around the inner core and an air gap defined by the edges of the inner and outer cores. The plug has a plug core and an anchor defined by the plug core edge. The anchor is configured to insert into the air gap as a receptacle socket electrically connects with plug pins. The coil is energized and de-energized so as to assist in the insertion or removal of the anchor from within the air gap and the corresponding connection and disconnection of the socket and pins.

The invention relates to a shielded connector for a motor vehicle. The connector comprises at least one casing shielding element. The shielding element includes a cable outlet portion provided with a plurality of resilient tabs that are integral with the shielding element. The tabs include a contact zone in electrical contact with a ferrule crimped to a shielding braid of a cable. The contact zone is maintained pressed against the shielding braid by means of a removable clamping ring.

An electronic device system can include an electronic device. The electronic device can include a receptacle, and a device logic driving status unit configured to generate a status signal indicating activity of the electronic device, and a communications cable. The communications cable can include a first plug configured to connect to the receptacle and receive the status signal, wherein the first plug includes a status indicator configured to indicate activity of the electronic device based on the status signal.

A terminal block for an electronic device, which block can be attached to an electronics housing of the electronic device, includes at least one base strip comprising a plurality of connector sockets; and a plurality of connector modules that can be attached to the connector sockets of the at least one base strip in at least one insertion direction, are held on the connector sockets in an inserted position, and can be released from the connector sockets to be removed from the at least one base strip; and a locking device. The locking device includes: an actuating part that can be moved relative to the at least one base strip in an actuation direction; and a plurality of locking elements that are engaged in a locking manner in mating elements of the connector modules in a locked position.

The present invention describes a microfabricated or nanofabricated structured diamond abrasive with a high surface density array of geometrical protrusions of pyramidal, truncated pyramidal or other shape, of designed shapes, sizes and placements, which provides for improved conditioning of CMP polishing pads, or other abrasive roles. Three methods of fabricating the structured diamond abrasive are described: molding of diamond into an array of grooves of various shapes and sizes etched into Si or another substrate material, with subsequent transferal onto another substrate and removal of the Si; etching of an array of geometrical protrusions into a thick diamond layer, and depositing a thick diamond layer over a substrate pre-patterned (or pre-structured) with an array of geometrical protrusions of designed sizes, shapes and placements on the surface.

An abrasive article includes a polymer matrix and abrasive grains dispersed in the polymer matrix, wherein the abrasive article has a void volume of at least 50%. The polymer matrix is polymerized from a monomer including at least one double bond.

Embodiments of the invention relate to polycrystalline diamond (“PCD”) fabricated by sintering a mixture including diamond particles and a selected amount of graphite particles, polycrystalline diamond compacts (“PDCs”) having a PCD table comprising such PCD, and methods of fabricating such PCD and PDCs. In an embodiment, a method includes providing a mixture including graphite particles present in an amount of about 0.1 weight percent (“wt %”) to about 20 wt % and diamond particles. The method further includes subjecting the mixture to a high-pressure/high-temperature process sufficient to form PCD.

An abrasive article includes a body having abrasive particles contained within a bond material. The abrasive particles can include a majority content of silicon nitride and a minority content of sintering material including at least two rare-earth oxide materials. In an embodiment, the rare-earth oxide materials can include Nd2O3 and Y2O3. In a particular embodiment, the abrasive particles comprise a content (wt %) of Nd2O3 that is greater than a content of Y2O3 (wt %).

A method of forming an abrasive article includes providing a green body having abrasive particles including microcrystalline alumina, and heating the green body via microwave radiation to form a bonded abrasive body including the abrasive particles and a bond material comprising a vitreous phase.

Polycrystalline ultra-hard materials and compacts comprise an ultra-hard material body having a polycrystalline matrix of bonded together ultra-hard particles, e.g., diamond crystals, and a catalyst material disposed in interstitial regions within the polycrystalline matrix. The material microstructure is substantially free of localized concentrations, regions or volumes of the catalyst material or other substrate constituent. The body can include a region extending a depth from a body working surface and that is substantially free of the catalyst material. The compact is produced using a multi-stage HPHT process, e.g., comprising two HPHT process conditions, wherein during a first stage HPHT process the catalyst material is melted and only partially infiltrates the precursor ultra-hard material, and during a second stage further catalyst material infiltrates the precursor ultra-hard material to produce a fully sintered compact.

A method for fabricating a semiconductor device includes (a) depositing an insulating film on a semiconductor substrate; (b) forming a recess in the insulating film; (c) depositing a conductive film on the insulating film while filling the recess with the conductive film; and (d) polishing the conductive film. Step (d) includes a first polishing substep of using a first polisher pad conditioned with a first dresser and a second polishing substep of using a second polisher pad conditioned with a second dresser different from the first dresser.

An abrasive article includes a fibrous substrate, a binder disposed on the fibrous substrate, and abrasive grains in contact with the binder. The binder includes an imide cross-linked urethane derived from a blocked isocyanate component and an anhydride component.

A plastic soft composition is formed of soft base material constantly provided with plasticity, porous fine particles for polishing contained in the base material, and the like, and a polishing process and a coating process are performed to a painted surface and the like using the plastic soft composition. The fine particles for polishing are impregnated with a coating agent (a surface protective agent) added with an activator which is emulsified by contact with water, and the coating agent is held in concave portions formed in the fine particles. Both polishing work and coating work are achieved by sliding the plastic soft composition on a painted surface by a palm pressure of a user.

An abrasive article including a bonded abrasive having a body formed of abrasive grains contained within a bond material, wherein the body grinds a superabrasive workpiece having an average Vickers hardness of at least about 5 GPa at an average specific grinding energy (SGE) of not greater than about 350 J/mm3, at a material removal rate of at least about 8 mm3/sec, and wherein grinding is a centerless grinding operation.

A cubic boron nitride sintered body tool has, at least at a cutting edge, a cubic boron nitride sintered body composed of a cubic boron nitride particle and a binder phase. The binder phase contains at least Al2O3 and a Zr compound. On any straight line in the sintered body, the mean value of a continuous distance occupied by Al2O3 is 0.1-1.0 μm, and the standard deviation of the continuous distance occupied by Al2O3 is not more than 0.8. On the straight line, X/Y is 0.1-1 where X represents the number of points of contact between Al2O3 and the Zr compound, and Y represents the sum of the number of points of contact between Al2O3 and cBN and the number of points of contact between Al2O3 and binder phase component(s) other than Al2O3 and the Zr compound.

A layer of matrix powder is deposited within a mold opening. A layer of super-abrasive particles is then deposited over the matrix powder layer. The super-abrasive particles have a non-random distribution, such as being positioned at locations set by a regular and repeating distribution pattern. A layer of matrix powder is then deposited over the super-abrasive particles. The particle and matrix powder layer deposition process steps are repeated to produce a cell having alternating layers of matrix powder and non-randomly distributed super-abrasive particles. The cell is then fused, for example using an infiltration, hot isostatic pressing or sintering process, to produce an impregnated structure. A working surface of the impregnated structure that is oriented non-parallel (and, in particular, perpendicular) to the super-abrasive particle layers is used as an abrading surface for a tool.

An abrasive element comprises a body of crystalline abrasive material. The body has an array of cutting elements formed of crystalline abrasive material which projects from a surface of the body. The shape, size and form of the projections is controlled in the production process. The body may be a natural or synthetic crystal. The body may be a film formed by deposition. The body may be diamond or cubic boron nitride. The body may be monocrystalline or polycrystalline. The projections may be aligned along a crystallographic plane or planes.

Embodiments of the invention relate to methods of fabricating a polycrystalline diamond compacts and applications for such polycrystalline diamond compacts. In an embodiment, a method of fabricating a polycrystalline diamond body includes mechanically milling non-diamond carbon and a sintering aid material for a time and aggressiveness sufficient to form a plurality of carbon-saturated sintering aid particles and sintering a plurality of diamond particles in the presence of the plurality of carbon-saturated sintering aid particles to form the polycrystalline diamond body.

An abrasive article having an abrasive body including abrasive grains contained within a bond material, wherein the abrasive grains comprise microcrystalline alumina, and wherein the bond material includes less than about 1.0 mol % phosphorous oxide (P2O5), and a ratio measured in mol % between a total content of sodium oxide (Na2O) and a total content of potassium oxide (K2O) defined by [K2O/Na2O] having a value greater than about 0.5.

A cBN sintered body tool has the following feature. In at least one cross sectional surface of the cBN sintered body tool taken along a plane perpendicular to a joining surface having the largest area in joining surfaces between the cBN sintered body and the joining layer, a point C and a point D are assumed to represent points away by ¼ of the length of a line segment connecting a point A and a point B shown in a figure. A value obtained when an area of a region surrounded by a line segment connecting the point C and the point D, the first cBN particle, the second cBN particle, and the binder phase is divided by the length of the line segment connecting the point A and point B to each other is 0.14-0.6 μm.

Methods of making a superabrasive tool precursor are disclosed, along with such precursors and associated tools. Particularly, methods are disclosed for orienting superabrasive particles in a viscous binding material in order to provide tools based thereupon and having desired performance characteristics.

A low defect chemical mechanical polishing composition for polishing silicon oxide containing substrates is provided comprising, as initial components: water, a colloidal silica abrasive; and, an additive according to formula I.