Oakland-based food-and-drinks company Purity Organic announced today that it is launching a limited new line of Sweet Leaf beverages that consumers can buy directly online.

"We can't wait to get Sweet Leaf back into the hands of our customers online," said Purity Organic vice president of marketing Bill Porter.…

The owners of Oakland's Homestead Restaurant have debuted a new concept meant to outlast the COVID-19 crisis.

Stories you shouldn’t miss:

1. Alameda County Public Health Director Muntu Davis contends that gentrification should be examined in terms of health impacts because of the displacement and stress it causes for low-income residents, the Bay Area News Group$ reports.…

A ceramic electronic component includes an interior part and an exterior part. The interior part includes an interior part dielectric layer and an internal electrode layer. The exterior part includes an exterior part dielectric layer. The exterior part is positioned outside the interior part along a laminating direction thereof. The interior part dielectric layer and the exterior part dielectric layer respectively contain barium titanate as a main component. β−α≧0.20 and α/β≦0.88 are satisfied, where α mol part and β mol part are respectively an amount of a rare earth element contained in the interior and exterior part dielectric layers, provided that an amount of barium titanate contained in the interior and exterior part dielectric layers is respectively 100 mol parts in terms of BaTiO3.

A ceramic electronic component includes a dielectric layer and an electrode layer. The dielectric layer contains a plurality of ceramic particles and grain boundary phases present therebetween. A main component of the ceramic particles is barium titanate. An average thickness of the grain boundary phases is 1.0 nm or more. A thickness variation σ of the grain boundary phases is 0.1 nm or less.

An electric circuit device connecting first and second external elements, the electric circuit device including: a first electronic component; a first bus bar electrically connected to the first electronic component; a second bus bar electrically connected to the electronic component and overlapped with the first bus bar in a direction perpendicular to main surfaces of the first and second bus bars; a first external terminal electrically connecting the first bus bar to the first external element; a second external terminal electrically connecting the second bus bar to the second external element; a first region in the first external terminal electrically coupled to the first external element; and a second region in the second external terminal electrically coupled to the second external element, and at least partially overlapped with the first region in the direction.

A multilayer ceramic electronic component includes a laminated body including dielectric layers and internal electrode layers, and first and second external electrodes. The laminated body further includes a first conductor layer, a first insulating coating layer, a second conductor layer, and a second insulating coating layer. The surface of the first conductor layer closer to a first end surface is partially connected to the first external electrode. The surface of the second conductor layer closer to a second end surface is partially connected to the second external electrode.

An apparatus is disclosed which includes an electrolytic capacitive element with multiple capacitor sections.

The invention relates to a device for thermally disconnecting or tripping an overvoltage protection device, comprising: a locking element (A1), on which a first force (F1) acts, and which is fixed in such a way that same is released when a limit temperature is exceeded; and a slider (S1) which is blocked in a first state (Z1) by the fixed locking element (A1), and on which a second force (F2) acts in order to transfer same into a second state (Z2) when the locking element (A1) is released.

A method and system for cooling a device (preferably a micro-device), comprising cooling the device by using a lower critical solution temperature (LCST) mixture. Enhancement of heat transfer rates is achieved during phase separation of a two-component system (two-component mixture) with a LCST. Convective heat transfer rates in small diameter pipes and over a vertical (hot) plate are demonstrated.

Embodiments are generally directed to cooling of electronics using folded foil microchannels. An embodiment of an apparatus includes a semiconductor die; a substrate, the semiconductor die being coupled with the substrate; and a cooling apparatus for the semiconductor die, wherein the cooling apparatus includes a folded foil preform, the folded foil forming a plurality of microchannels, and a fluid coolant system to direct a fluid coolant through the microchannels of the folded foil.

A wiring device includes a housing that encloses a line voltage port and a low-voltage port for providing power to at least one removable load. The removable load can couple to a connector PCB. The connector PCB may include a tongue portion with retention surface features and a body portion with supporting circuitry. The tongue portion may be disposed within a low-voltage port of the wiring device. A plurality of conductive traces may extend from the body to the tongue of the connector PCB. The low voltage port may include sidewalls disposed around the tongue portion to guide the plug of a removable load into engagement with the conductive traces of the tongue portion so that one or more of the plurality of conductive traces electrically contact the removable load to deliver power to the removable load.

The present disclosure provides a method and a system for protecting an electrical device. The method includes: acquiring coordinate data of the electronic device; determining whether the coordinate data exceeds a data range corresponding to a preset state of the electronic device; and disabling the electronic device when the coordinate data exceeds the data range corresponding to the preset state.

A surge suppression device includes a micro electromechanical system (MEMS) switch electrically connected to a current path. Additionally, the surge suppression device includes a transient voltage suppression (TVS) device electrically connected in series to the MEMS switch. The surge suppression device is configured to protect electronic components from voltage surges or current surges.

An overvoltage protection device includes a resistor that is connected in series between an internal signal line connected to a communication terminal of a processor and a communication line, a diode of which a cathode is connected to the internal signal line and an anode is connected to a ground, and a PNP transistor of which a base is connected to a power supply terminal, an emitter is connected to the internal signal line, and a collector is connected to the ground. When a base-emitter voltage (a junction saturation voltage) of the transistor in operation is defined as VBE and a power source is turned on (a voltage V1) by the operation of the transistor, a voltage of the internal signal line is limited to the source voltage V1+VBE. When the power source is turned off (a voltage 0 V), the voltage of the internal signal line is limited to the source voltage 0 V+VBE.

The present invention provides a chip and an electronic device. The chip comprises at least one pin, and the chip comprises at least one ESD (Electrostatic Discharge) protection circuit inside, and the ESD protection circuit is employed to reduce or eliminate a damage of electrostatic to other elements or circuit inside the chip, and the ESD protection circuit is located corresponding to a pin, and the ESD protection circuit is electrically coupled to the pin. The electronic device comprises the aforesaid chip.

An electrical energy receiving end capable of overvoltage protection and a wireless electrical energy transmission device are provided. An electrical energy receiving coil is divided into a first receiving coil and a second receiving coil, so that under normal operation the first receiving coil and the second receiving coil jointly resonate with an impedance matching network to receive energy. When the electrical energy receiving end has an overvoltage, the first receiving coil and the impedance matching network (or the second receiving coil and the impedance matching network) form a loop, and due to the impedance mismatch, the energy received by the electrical energy receiving end is greatly reduced to solve the problem of overvoltage at the electrical energy receiving end.

Electronic device heat transfer technology is disclosed. In an example, an electronic device package can include a substrate. The electronic device package can also include a heat transfer component. The electronic device package can further include a heat-generating electronic component coupled to the substrate between the substrate and the heat transfer component. The electronic device package can also include a viscous thermal interface material (TIM) providing a heat transfer pathway between the electronic component and the heat transfer component. In addition, the electronic device package can include a barrier about at least a portion of a periphery of the viscous TIM to maintain the viscous TIM within a confined location in proximity to the electronic component. The TIM is uninterrupted by the barrier within the periphery.

In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.

A package includes a conductive pad, with a plurality of openings penetrating through the conductive pad. A dielectric layer encircles the conductive pad. The dielectric layer has portions filling the plurality of openings. An Under-Bump Metallurgy (UBM) includes a via portion extending into the dielectric layer to contact the conductive pad. A solder region is overlying and contacting the UBM. An integrated passive device is bonded to the UBM through the solder region.

A flexible substrate and a flexible display device including the same are disclosed. In one aspect, the flexible substrate includes a first substrate that is flexible and a metal wiring layer over the first substrate and having a first surface facing the first substrate, a second surface opposite to the first surface, and a plurality of holes penetrating the first and second surfaces. The holes are arranged in a plurality of rows. The holes comprise a first hole in an n-th row and a first hole in a (n-1)th row. The first hole of the n-th row is spaced apart from the first hole in the (n-1)th row by a first distance, and an edge of each of the holes is curved.

A stretchable electronic assembly comprising a stretchable body, a plurality of electronic components encapsulated in the stretchable body, at least one meandering conductor connected to at least one electronic component of the plurality of electronic components, at least one hollow pocket formed in the stretchable body, the at least one meandering conductor encapsulated in the stretchable body and the at least one meandering conductor located within the at least one hollow pocket formed in the stretchable body.

A display device is disclosed. A back cover supports a back surface of a display panel. A bending member is bent at a predetermined curvature and attached to the back surface of the back cover. A curvature-changing unit is coupled to the back surface of the back cover to rotate the bending member and change the curvature of either the display panel or the back cover.

One embodiment provides a deformable housing, including a recess for holding a deformable device; a deformable portion comprising at least two surfaces having a plurality of concave/convex structures; and at least two support parts embedded in the deformable portion. Other aspects are described and claimed.

An automation field device having a housing and a modular field device electronics unit located inside the housing. The electronics unit has a first circuit board having at least one first and one second plug-in connector element, wherein the first plug-in connector element is used to electrically connect a peripheral unit, wherein both the first and the second plug-in connector elements can be contacted essentially from the same preferred plug-in direction, and a second circuit board having at least one third plug-in connector element, wherein the circuit boards are arranged such that the second plug-in connector element is connected to the third plug-in connector element in a detachable manner to electrically connect the peripheral unit to the second circuit board, and the second circuit board has at least one opening, via which the first plug-in connector element of the first circuit board is accessible for connecting the peripheral unit.

According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board, a second circuit board opposed to the first circuit board, a third circuit board opposed to the second circuit board, a first connector connecting the first and second circuit boards to each other, a second connector connecting the second and third circuit boards to each other, and is offset to the first connector in a plane direction, a first spacer between the first and second circuit boards, and a second spacer between the second and third circuit boards. The first spacer includes a support body at a position opposed to the second connector and in contact with the first and second circuit boards.

An apparatus to support a flexible screen of an electronic device includes a plurality of shafts, a plurality of rows of first connecting members, and a plurality of rows of second connecting members. Each first and second connecting member has a top side, a bottom side, a left aperture and a right aperture extending from the top side to the bottom side, with each aperture coupled to a shaft. The width of the apertures for each second connecting member is greater than the width of the apertures for each first connecting member. The plurality of shafts are connected to each other by alternate rows of first connecting members and second connecting members along the length of the shafts. Each connecting member in a row of connecting members overlaps with two connecting members in an adjacent row of connecting members.

An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.

According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board on which a heat-producing component is mounted, a second circuit board, a third circuit board, a first connector connecting the first and second circuit boards, a second connector connecting the second and third circuit boards, a first spacer sandwiched between the first and second circuit boards, and a second spacer sandwiched between the second and third circuit boards. The first spacer includes a spacer frame, a partition member opposed to the heat-producing component with a gap between, and a thermal transfer member attached to the partition member and in contact with the first circuit board.

A fan assembly includes a first guide, a second guide disposed in a direction vertical to the first guide such that the height of the first guide is adjustable, a slider disposed to move in a horizontal direction along the second guide, and a plurality of fan modules fastened to the slider, wherein each of the plurality of fan modules is fastened to the slider such that the height of the fan module is adjustable. Accordingly, the heights of the plurality of fan modules can be simultaneously adjusted, and the heights of some of the plurality of fan modules can be adjusted different from those of the other fan modules, so that the plurality of fan modules can be optimally installed.

An electronic apparatus includes a housing including a sealable housing section, heat generating components accommodated in the housing section, an internal-side heat exchanger contacting one inner surface of one wall of the housing, an external-side heat exchanger contacting one outer surface of the wall and opposed to the internal-side heat exchanger, an external-side heat exchanger for heat generating components for heat exchange between the heat generating components and air outside the housing section, and an internal fan. A high-heat generating component generating the most heat contacts the inner surface and opposed to the external-side heat exchanger for heat generating components. Heat exchange between the high-heat generating component and air outside the housing section is effected via the external-side heat exchanger for heat generating components. Heat exchange between air inside the housing section and air outside the housing section is effected via the internal-side heat exchanger and the external-side heat exchanger.

Disclosed is a display device that includes a display panel and a multi-layered panel provided adjacent the display panel. The multi-layered panel may include a front plate located toward the display panel, a rear plate provided parallel to the front plate, and a honeycomb mesh interposed between the front plate and the rear plate. The honeycomb mesh may have a plurality of hexagonal cells. A metal plate may be coupled to a rear surface of the multi-layered panel and a drive board may be seated on the metal plate. At least one of the front plate or the rear plate may include at least one opening that extends parallel to a shorter side of the display device.

News, arts, and dining coverage for Oakland, Berkeley, and the greater East Bay.

I was wondering why the iconic Civic Centre clock in Southampton is not lit up blue on Thursday at 8pm to clap for the NHS.

The UK-based mixer-maker and audiophile favorite MasterSounds has a small piece of joy to brighten up DJs’ days. They’ve released the third generation of their Radius 2 and Radius 4 mixers, and have adjusted their price points to cater to artists with a lower spending budget (especially now). These mixers are homegrown, too—MasterSounds mixers are […]

The post A third generation of Radius 2 + 4 rotary mixers: New tech upgrades, lower price appeared first on DJ TechTools.

The Children at Aurora Theatre Company makes us think deeply. Noble on its face for messages involving climate change and generational responsibility, excellent craft rises foremost as the walk-away reward of Aurora Theatre's new production. Written by Lucy Kirkwood and directed with signature, uncanny brilliance by Barbara Damashek, The Children employs a familiar theatrical construct to reveal the play's layered, complex story in 95 uninterrupted minutes.…

Coming on the heels of the AB5 trauma, the coronavirus lockdown poses an extra economic threat. The COVID-19 pandemic has affected all facets of life in California and the world.…

Embodiments are directed to an electromagnetic memory device having a memory cell and an encapsulation layer formed over the memory cell. The memory cell may include a magnetic tunnel junction (MTJ), and the encapsulation layer may be formed from a layer of hydrogenated amorphous silicon. Amorphous silicon improves the coercivity of the MTJ but by itself is conductive. Adding hydrogen to amorphous silicon passivates dangling bonds of the amorphous silicon, thereby reducing the ability of the resulting hydrogenated amorphous silicon layer to provide a parasitic current path to the MTJ. The hydrogenated amorphous silicon layer may be formed using a plasma-enhanced chemical vapor deposition, which can be tuned to enable a hydrogen level of approximately 10 to approximately 20 percent. By keeping subsequent processing operations at or below about 400 Celsius, the resulting layer of hydrogenated amorphous silicon can maintain its hydrogen level of approximately 10 to 20 percent.

A method of making a MRAM device includes forming a magnetic tunnel junction on an electrode, the magnetic tunnel junction comprising a reference layer positioned in contact with the electrode, a tunnel barrier layer arranged on the reference layer, and a free layer arranged on the tunnel barrier layer; and depositing an encapsulating layer on and along sidewalls of the magnetic tunnel junction; wherein the exposing of the magnetic tunnel junction to hydrogen plasma is performed at a temperature from about 150 to about 250° C. An MRAM device including an encapsulating layer comprising either silicon nitride or aluminum oxide is also provided.

A magnetic element is provided. The magnetic element includes a free magnetization layer having a surface area that is approximately 1,600 nm2 or less, the free magnetization layer including a magnetization state that is configured to be changed; an insulation layer coupled to the free magnetization layer, the insulation layer including a non-magnetic material; and a magnetization fixing layer coupled to the insulation layer opposite the free magnetization layer, the magnetization fixing layer including a fixed magnetization so as to be capable of serving as a reference of the free magnetization layer.

The semiconductor device according to the present invention has an upper electrode, a first lower layer wiring that also functions as a lower electrode, an electrical resistance-changing film interposed between the upper electrode and the first lower layer wiring, a second lower layer wiring, and a contact plug, the contact plug connecting to the upper electrode and to the second lower layer wiring. The present invention yields a semiconductor device with which it is possible to dispose elements in high density while maintaining the reliability and manufacturing yield of the electrical resistance-changing element.

A polymer comprising a first repeating unit represented by Formula 1: wherein, in Formula 1, groups and variables are the same as described in the specification.

A compound represented by Formula 1 and an organic light-emitting device including the same are provided:

Disclosed is a display device having a display panel that includes a plurality of pixels in a display area, each pixel including a first thin film transistor (TFT); a plurality of pads in a non-display area outside the display area that provide operating signals to the plurality of pixels in the display area, each pad including a first signal line running toward the display area and a second signal line running toward an outer edge of the display panel, with each pad disposed between the first and second signal lines; and an extension line crossing one or more of second signal lines of the plurality of pads, two ends of the extension line running toward the outer edge of the display panel, wherein each of the one or more of second signal lines of the plurality of pads includes an active layer of a second TFT.

A polymer compound comprising a structural unit represented by the formula (1): wherein R1, R2, R3 and R4 each independently represent an alkyl group, an aryl group or a monovalent heterocyclic group, and these groups optionally have a substituent, two rings A may be the same or different, and represent a thiophene ring, a benzothiophene ring or a thienothiophene ring, n represents 1 or 2, and X represents a halogen atom, an alkyl group, an alkoxy group, an alkylthio group, an amino group, an aryl group, a monovalent heterocyclic group, an alkenyl group or an alkynyl group, and these groups optionally have a substituent, and when n is 2, two groups X may be the same or different.

The present disclosure provides a nitrogen-containing heterocyclic compound having a general formula (I) and an organic photoelectric apparatus thereof. The general formula (I) is wherein A1, A2, A3, A4, A5, A6, A7, A8, A9, and A10 are independently selected from a hydrogen atom, at least one compound having the general formula (II) and at least one compound having a general formula (III), wherein Y1, Y2, and Y3 are independently selected from C and N; and R3 and R4 are independently selected from C6-30 aromatic group and C2-30 heterocyclic aromatic group, wherein X is selected from oxyl group, sulfenyl group, substituted or non-substituted imino group, substituted or non-substituted methylene group, and substituted or non-substituted silicylene group, and R5, R6, R7, R8, R9, R10, R11, and R12 are independently selected from hydrogen, deuterium, C1-30 alkyl group, C6-30 aromatic group, and C2-30 heterocyclic aromatic group.

The present disclosure provides a nitrogen-containing heterocyclic compound having general formula (I) and an organic photoelectric apparatus thereof. where A1, A2, A3, A4, A5, A6, A7, and A8 are independently selected from a hydrogen atom, at least one compound having the general formula (II) and at least one compound having the general formula (III), where Y1, Y2, and Y3 are independently selected from C and N; R3 and R4 are independently selected from C6-30 aromatic group and C2-30 heterocyclic aromatic group, wherein X is selected from any one of oxyl group (—O—), sulfhydryl group (—S—), substituted or non-substituted imino group, substituted or non-substituted methylene group, and substituted or non-substituted silicylene group; R5, R6, R7, R8, R9, R10, R11, and R12 are independently selected from hydrogen, deuterium, C1-30 alkyl group, C6-30 aromatic group, or C2-30 heterocyclic aromatic group.

According to one or more embodiments, an organic light-emitting device includes: a first electrode; a second electrode facing the first electrode; and an organic layer between the first electrode and the second electrode, the organic layer including an emission layer, wherein the organic layer may include a first compound represented by one selected from Formulae 1-1 and 1-2, and a second compound represented by Formula 2:

The present specification provides a hetero-cyclic compound and an organic light emitting device including the hetero-cyclic compound.

According to the present invention, there are provided a pyrimidine derivative represented by a general formula (1) indicated below, and an organic electroluminescent device comprising a pair of electrodes, and at least one organic layer sandwiched therebetween, wherein the pyrimidine derivative is used as a constituent material for the at least one organic layer. The pyrimidine derivative of the present invention is a material for a high efficiency, high durability organic electroluminescent device, is excellent in electron injection/transport performance, has hole blocking capability, and excels in characteristics.