Hello,

I would like to create a button for my form that prompts the user to click on a cellview and draw a rectangle bounding box, exactly like the one used in the Area and Density Calculator. Can someone please help me with this?

Thanks!

Beto

Hi guys,

I see that inside VNC I can’t resize window boxes by mouse. While pressing the arrow at the box edge and dragging it nothing happens:

is it a bug, or setup change require?

Noted, it only happens when trying to resize window box from left and right side..

Thx

Hi,

I want to define a procedure that with @key, and I also want to restrict the variable's datatype, I tried with folloing but I received error in CIW

procedure(tt(handler @key str1 str2 "ssS")
  printf("handler: %L " handler)
)

tt('test)

The error is like: *Error* tt: argument for keyword ?str1 should be a symbol (type template = "ssS") at line 11 of file

Thanks,

James

Thermal analysis with the Cadence Celsius Thermal Solver integrated within the AWR Microwave Office circuit simulator gives designers an understanding of device operating temperatures related to power dissipation. That temperature information can be introduced into an electrothermal model to predict the impact on RF performance.(read more)

Cadence AWR Design Environment Software Featured in Multiple Training Course Options: Live and Virtual Starting in October(read more)

Microwave Office is Cadence’s tool-of-choice for RF and microwave designers designing everything from III-V 5G chips, to RF systems in board and package technologies. These types of designs require close interaction between the schematic and its layout. A new Training Byte demonstrates how the schematic-layout connections is built into Microwave Office.(read more)

Data sets are a powerful and easy-to-use feature in Microwave Office. Data can be effortlessly be swapped in graphs, and circuit schematics.(read more)

A training webinar on Microwave Office will be given June 27, 2023. The emphasis will be on EM simulation.(read more)

A recording of a training webinar on Microwave Office is available. Topics show the design environment, with special emphasis placed on electromagnetic (EM) simulation. Normal 0 false false false EN-US JA X-NONE ...(read more)

By David Vye, Senior Product Marketing Manager, AWR, Cadence When designing multi-octave high-power amplifiers, it is a challenge to achieve both broadband gain and power matching using a combination of lumped and distributed techniques. One approach...(read more)

New online training course for AXIEM EM Simulator in AWR Microwave Office is available.(read more)

Hi Cadence, 

I use simvision 20.09-s007 but my computer screen resolution is very high. As a result, the texts are too small. 

In ~/.simvision/Xdefaults I changed that number to 16, from 12. But the signal names in the waveform traces don't reflect the change. 

Simvision*Font: -adobe-helvetica-medium-r-normal--16-*-*-*-*-*-*-*

Other .font changes seem to reflect on the simvision correctly, except the signal names. 

How do I fix that? I dont mind a single variable to change all the texts fonts to 16. 

Thank you!

PS: I found the answer with another post. I change Preference/Waveform/Display/Signal Height. 

Hi Cadence & forumers, 

I am running a conformal LEC with a flattened netlist against RTL. 

The run hang for 5 days at the "analyze abort" step which is automatically launched by the compare. 

The netlist is flattened at some levels so hierarchical flow which I tried didn't help much. The flattened/highly optimized netlist is from customer and the ultimate goal. How shall I proceed now? 

On the a side note, a test run with a hierarchical netlist from a simple DC "compile -map_effort medium" command finished after 1 day or so. 

Thank you! 

// Command: vpx compare -verbose -ABORT_Print -NONEQ_Print -TIMEstamp
// Starting multithreaded comparison ...
Comparing 241112 points in parallel.

// Multithreading Overhead: 38% Gates: 8501606/6168138
// Multithreaded processing completed.
================================================================================
Compared points PO DFF DLAT BBOX CUT Total
--------------------------------------------------------------------------------
Equivalent 1025 241638 30 75 21 242789
--------------------------------------------------------------------------------
Abort 0 124 0 0 0 124
================================================================================
Compare results of instance/output/pin equivalences and/or sequential merge
================================================================================
Compared points DFF Total
--------------------------------------------------------------------------------
Equivalent 204 204
================================================================================
// Warning: 512 DFFs/DLATs have 1 disabled clock port: skipped data cone comparison
// Resolving aborts by analyze abort...

Hi everyone, 

Is there any method to generate "Sheet" column for a pin report like table below? The column "Name.Pin" & "Signal" can be generated easily, but I have no idea to generate the column of "Sheet Name".

The software using here are Allegro Design Entry HDL, OrCAD Capture and Allegro PCB Editor. Can these 3 software generate "Sheet Name" data?

Thank you. 

Good morning,
I dug up an old project from 2005 and I should open the schematic to check some things.
This is the schematic of a XILINX XC95108-pq160 CPLD which the XILINX ISE 6.1 software then translated and compiled, to generate a JEDEC file to burn CPLD.

My problem is that I can't open schematics with the versions of Orcad Schematic Entry that I have.
Can anyone help me understand which version of Orcad Schematic Entry I need to install to see these files?

I shared the files on:
drive.google.com/.../view

Thank you very much

Hello,

I am trying to load some of the signals of the design saved in the signals.svwf to the waveform windown via the tcl file, I am using the following commands but nothing works, Can you please help 

 -submit waveform loadsignals -using "Waveform 2" FB1.svwf but it gives me the below error

-submit waveform new -reuse -name Waveforms

hi

How can I tell the LEC tool to ignore a combination of Primary input bus in both Golden and revised.

For example in both Golden and revised there is 

input [3:0] data_in

I want LEC not to check the case that data_in[3:0] == 4'b1000

We have a big circuit having 12K gates totally and trying to show it in one page slide visually. But it is so hard for us to shrink it down from gate-level to module-level. Do you have any function like these:

• Toggle wires on and off
• “Right click” elements and group them into black boxes
• Quickly left or right align elements to clean up pictures

I am trying to understand the Linting process. I know that mainly JasperGold is the tool for this purpose. Though I think JasperGold is more suited for later stages of the design. As a RTL Design Engineer, I want to make sure that if another tool has the capability of doing Linting earlier in the flow. for example, does Xcelium, Genus or Confomal support linting. I have seen some contradicting information online regarding this topic, though I can't find anything related to Linting on any of these tools.

Thanks

Learn how Xcelium PowerPlayback App enables the massively parallel Xcelium replay of waveforms for glitch-accurate power estimation of multi-billion gate SoC designs.(read more)

New IC packaging workflows in Cadence Allegro X layout tools allow you to follow a guided path from starting a design through final manufacturing. The path is there to ensure that you don’t miss steps and perform actions in the optimal order. W...(read more)

Power network design and analysis of 3D-ICs is a major challenge due to the complex nature and large size of the power network. In addition, designers must deal with the complexity of routing power through the interposer, multiple dies, through-silicon vias (TSVs), and through-dielectric vias (TDVs).
Cadence’s Integrity 3D-IC Platform and Voltus IC Power Integrity Solution provide a fully integrated solution for early planning and analysis of 3D-IC power networks, 3D-IC chip-centric power integrity signoff, and hierarchical methods that significantly improve capacity and performance of power integrity (PI) signoff while maintaining a very high level of accuracy at signoff. This blog summarizes the typical design challenges faced by today’s 3D-IC designers, as discussed in our recent webinar, “Addressing 3D-IC Power Integrity Design Challenges.” Please click here to view the full webinar.

Major Trends in Advanced Chip Design

From chips to chiplets, stacked die, 3D-ICs, and more, three major trends are impacting advanced semiconductor packaging design. The first is heterogenous integration, which we define as a disaggregated approach to designing systems on chip (SoCs) from multiple chiplets. This approach is similar to system-in-package (SiP) design, except that instead of integrating multiple bare die – including 3D stacking – on a single substrate, multiple IPs are integrated in the form of chiplets on a single substrate.

The second major trend is around new silicon manufacturing techniques that leverage silicon vias (TSVs) and high-density fanout RDL. These advancements mean that silicon is becoming a more attractive material for packaging, especially when high bandwidth and form factor become key attributes in the end design. This brings new design and verification challenges to most packaging engineers who typically work with organic and ceramic substrate materials.

Finally, on the ecosystem side, all the large semiconductor foundries now offer their own versions of advanced packaging. This brings new ways of supporting design teams with technologies like reference flows and PDKs, concepts that have typically been lacking in the packaging community. Cadence has worked with many of the leading foundries and outsourced semiconductor assembly and test facilities (OSATs) to develop multi-chip(let) packaging reference flows and package assembly design kits. The downside is that, with the time restrictions designers are under today, there isn’t enough time to simulate the details of these flows and PDKs further.

For those who must make the best electro/thermal/physical decisions to achieve the best power/performance/area/cost (PPAC), factors can include accurate die size estimations, thermal feasibility, die-to-die interconnect planning, interposer planning (silicon/organic), front-to-front and front-to-back (F2F/F2B) planning, layer stack and electromigration/ IR drop (EMIR)/TSV planning, IO bandwidth feasibility, and system-level architecture selection.

3D-IC Power Network Design and Analysis

The key to success in 3D-IC design is early power integrity planning and analysis. Cadence’s Integrity 3D-IC platform is a high-capacity 3D-IC platform that enables 3D design planning, implementation, and system analysis in a single, unified cockpit. Cadence’s Voltus IC Power Integrity Solution is a comprehensive full chip electromigration, IR drop, and power analysis solution. With its fully distributed architecture and hierarchical analysis capabilities, Voltus provides very fast analysis and has the capacity to handle the largest designs in the industry. Typically, 3D-IC PDN design and analysis is performed in four phases, as shown in Figure 1.

Phase 1 - Perform early power delivery network (PDN) exploration with each fabric’s PDN cascaded in system PI with early circuit models.

Phase 2 – Plan 3D-IC PDNs in Cadence’s Integrity 3D-IC platform, including micro bumps, TSVs, and through dielectric vias (TDVs), power grid synthesis for dies, and early rail analysis and optimization.

Phase 3 – Perform full chip-centric signoff in Voltus with detailed die, interposer, and package models, including chip die models, while keeping some dies flat.

Phase 4 – Perform full system-level signoff with Cadence’s Sigrity SystemPI using detailed extracted package models from Sigrity XtractIM, board models from Sigrity PowerSI or Clarity 3D Solver, interposer models from XtractIM or Voltus, and chip power models from Voltus.

Figure 1. 3D-IC PDN design and analysis phases

3D-IC Chip-Centric Signoff

The integration of Integrity 3D-IC and Voltus enables chip-centric early analysis and signoff. Figure 2 and Figure 3 highlight the chip centric early PI optimization and signoff flows. In early analysis, the on-chip power networks are synthesized, and the micro bumps and TSVs can be placed and optimized. In the signoff stage, all the detailed design data is used for power analysis, and detailed models are extracted and used for package, interposer, and on-die power networks.

Figure 2. Early chip-centric PI analysis and optimization flow

Figure 3. Chip-centric 3D-IC PI signoff

Hierarchical 3D-IC PI Analysis

To improve the capacity and performance of 3D-IC PI analysis, Voltus enables hierarchical analysis using chiplet models. Chiplet models can be reduced chip models in spice format or more accurate xPGV models which are highly accurate proprietary models generated by Voltus. With xPGV models, the hierarchical PI analysis has almost the same accuracy as flat analysis but offers 10X or higher benefit in runtime and memory requirements.

Conclusion

This blog has highlighted the major design trends enabled by advanced 3D packaging and the design challenges arising from these advancements. The design of power delivery networks is one of these major challenges. We have discussed Cadence solutions to overcome this PI challenge. To learn more, view our recent webinar, "Addressing 3D-IC Power Integrity Design Challenges" and visit the Voltus web page.

When it comes to system integration, PCB designers need to collaborate with the signal analysis or integrity team to run pre-route or post-route analysis and modify constraints, floorplan, or topology based on the results. Allegro PCB Edito...(read more)

The OrCAD X and Allegro X 24.1 release is now available at Cadence Downloads. This blog post provides links to access the release and describes some major changes and new features.   OrCAD X /Allegro X 24.1 (SPB241) Here is a representative li...(read more)

Have you ever encountered ERROR(SPMHNI-67) while importing logic? If yes, you might already know that you had to export libraries of the design and make sure that paths (devpath, padpath, and psmpath) include the location of exported files.  

Starting in SPB23.1, if you go to File > Import > Logic/Netlist and click on the Other tab, you will see an option, Reuse device files for existing components. 

After selecting this option, ERROR(SPMHNI-67) will no longer be there in the log file, because the tool will automatically extract device files and seamlessly use them for newly imported data. In other words, SPB_23.1 lets you reuse the device / component definitions already in the design without first having to dump libraries manually. An excellent improvement, don’t you think?  

Starting from SPB23.1, a new option, Allow DRCs to surrounding metal, has been added in the Etch-Back form to allow DRCs to the surrounding objects. form to allow DRCs to the surrounding objects.

The Allow DRCs to surrounding metal option lets you see and adjust objects instead of the current behavior, which sacrifices the width of the mask for the trace.

• When this option is turned off, it maintains the EB mask to another object clearance.
• When this option is enabled, it keeps the EB mask to the EM trace edge clearance and shows a DRC if the EB mask to another object spacing is out of rule.

Starting SPB 23.1, a new pin property, WIREBOND_PROFILE_NAME is introduced. This property can be used to define a wirebond profile to a die pin. When adding a wirebond, the pin will use the profile defined in the WIREBOND_PROFILE_NAME property associated to the die pin.

Assign the WIREBOND_PROFILE_NAME property to the die pin using Edit > Properties and set the desired wirebond profile name in the Value field.

The following image displays the WIREBOND_PROFILE_NAME property assigned to the pin and wire profile of the Wire Bond for that pin.

Have you ever thought of a handy utility to specify all necessary transmission line parameters to decide upon the stackup?   

Starting SPB 23.1, a handy feature Transmission Line Calculator, is built into Allegro X Advanced Package Designer (Allegro X APD). This feature will require either an SiP Layout license or can be accessed through SiP Layout Bundle. 

From the Analyze dropdown menu in the 23.1 Allegro X APD toolbar, you can choose Transmission Line Calculator. 

You can use this calculator to help decide constraints and stackup for laminate-based PCB or Packages. You can calculate the correct stackup material and width/spacing to meet any requirements that may be later entered in a constraint. This is truly a calculated number and not a true field solver. 

The different types of calculations that the Transmission Line Calculator can provide are Microstrip, Embedded microstrip, Stripline, CPW (Coplanar), FGCPW (frequency-dependent Coplanar), Asymmetric stripline, Coupled microstrip (Differential Pair), Coupled stripline (Differential Pair), and Dual striplines. 

This feature is important for customers relying on fabricators/spreadsheets to provide this information or need to test a quick spacing/width as per the impedance value. 

Let us know your comments on this new feature in 23.1 Allegro X APD. 

Starting SPB 23.1, Allegro X APD lets you import/export the symbol and component properties by using Die Text-In/Out wizards. 

Exporting the symbol 

You can export the symbol by using File > Export > Die Text-Out Wizard. 

In the Die Text-Out Wizard window, you can see the newly added options, that is, Component Properties and Symbol Properties. 

This entire information including the properties will be saved in a text file. 

Importing the symbol 

You can import the same text file in Allegro X APD by using Die Text-In Wizard. 

Choose the text file you want to import. 

Symbol properties added in the text file will be visible in the Die Text-In Wizard window. 

In a package design, designers often need to perform degassing. This is typically done at the end of the design process before sending the design to the manufacturer.

Degassing is a process where you perforate power planes, voltage planes, and filled shapes in your design. Degassing holes let the gas escape from beneath the metal during manufacturing of the substrate. The perforations or holes for degassing are generally small, having a specified size and shape, and are spaced regularly across the surface of the plane. If the degassing process is not done, it may result in the formation of gas bubbles under the metal, which may cause the surface of the metal to become uneven. After you degas the design, it is recommended to perform electrical verification.

Allegro X APD has degassing features that allow users to automate the process and place holes in the entire shape.

In today’s topic, we will talk about how to avoid adding  degassing holes on a particular shape.

Sometimes, a designer may need to avoid adding degassing holes to a particular shape on a layer. All other shapes on the layer can have degassing holes but not this shape. Using the Layer Based Degassing Parameters option, the designer can set the degassing parameters for all shapes on the layer. Now, the designer would like to defer adding degassing holes for this particular shape.

You may wonder if there is an easy way to achieve this. We will now see how this can be done with the tool.

Once the degassing parameters are set, performing Display > Element on any of the shapes on that layer will show the degassing parameters set.

You can apply the Degas_Not_Allowed property to a shape to specify that degassing should not be performed on this shape, even if the degassing requirements are met. Select the shape and add the property as shown below.

Switch to Shape Edit application mode (Setup > Application mode > Shape Edit) and window-select all shapes on the layer. Then, right-click and select Deferred Degassing > All Off.

Now, all shapes on the layer will have degassing holes except for the shape which has the Degas_Not_Allowed property attached to it.

By default, a dielectric must separate each pair of conductor layers in the cross-section of a design. In rare cases, this does not represent the real, manufactured substrate.

If your design requires you to have conductor layers that are not separated by a dielectric (such as, for half-etch designs), there is a variable that needs to be set in Allegro X APD. You must set this by enabling the variable icp_allow_adjacent_conductors. This entry, and its location in the User Preferences Editor, are shown in the following image.

The Objects on adjacent conductor layers do not electrically connect together, automatically. A via must be used to establish the inter-layer connections.

When enabling this option, it is recommended to exercise caution because excluding dielectric layers from your cross-section can lead to inaccurate calculations, including the calculations for signal integrity and via heights. It is important that your cross-section accurately reflect the finished product to ensure the most accurate results possible. Any dielectric layers present in the manufactured part need to be in the cross-section for accurate extraction, 3D viewing, and so on.

Let us know your comments on the various designs that would require adjacent conductor layers.

Power and Ground rings are exposed rings of metal surrounding a die that supply power/ground to the die and create a low-impedance path for the current flow. These rings ensure stable power distribution and reduce noise. Allegro X Package Designer Plus has a utility called Power/Ground Ring Generator which lets you define and place one or more shapes in the form of a ring around a die.

 To run the PWR/GND Generator Wizard, go to Route > Power/Ground Ring Generator or type "pring wizard" in the APD command window to invoke the Wizard.

This Wizard lets you define and place one or more shapes in the form of a ring around a die. The Power/Ground Ring Wizard creates up to 12 rings (shapes) at a time. If you require more rings, you can run the Power/Ground Ring Wizard as many times as needed. This command displays a wizard in which you can specify:

• The number of rings to be generated
• The creation of the first ring as a die flag (Die flag is the boundary of the die like the power ring.)
  • If you create a die flag and the first ring is the same net as the flag, you can enter a negative distance to overlap the ring and the die flag.
• Multiple options for placement of the rings with respect to:
  • Origination point
  • Distance from the edge of the die
  • Distance from the nearest die pin on each die side
• The reference designator of the die with which the rings will be used
• The distance between rings
• The width of each ring
• The corner types on each ring (arc, chamfer, and right-angle)
• An assigned net name for each ring
• A label for each ring

The rings are basic in nature. For other shape geometries or split rings, choose Shape > Polygon or Shape > Compose/Decompose Shape from the menu in the design window.

Depending on the options selected, the Power/Ground Ring Wizard UI changes, representing how the rings will be created. Verify the Wizard settings to ensure that the rings are created as intended.

1. When the Power/Ground Ring Wizard appears, set the number of rings to 2, accept the other defaults, and click Next. You can set Create first ring as die flag to create a basic die flag.

         2. Define Ring 1 and the net associated with it.

              a) Browse and choose Vss in the Net Names dialog box.

            b) Click OK.

            c) Specify the label as VSS.

            d) Click Next.

             The first ring should appear in your design. It is associated with the proper net; in this case, VSS.

2. For the second ring, choose the net as Vdd and specify the label as VDD.
3. Click Next.
4. Click Finish in the Result Verification screen to complete the process.

The completed rings appear as shown below.

Now, when you click on Power and Ground Die Pin and add wirebonds, you will see that the wirebonds are placed directly on the Power and Ground rings.

Hello, SKILL experts. 

I'm studying SKILL language to build some useful function in APD+.

Now, I want to execute 'Import Sub-drawing' function in new form.

But I cannot find how to do execute APD+ embedded function in a field of new form. 

Has anyone experienced this or idea to solve this problem? 

As technology continues to evolve at a rapid pace, the importance of robust and efficient interconnect standards cannot be overstated. Peripheral Component Interconnect Express (PCIe) has been a cornerstone in high-speed data transfer, enabling seamless communication between various hardware components.   

With the advent of PCIe 6.1 ECN, a significant advancement in speed and efficiency, ensuring the accuracy and reliability of its operations is paramount. One critical aspect of this is the verification of shared credit updates. For detailed understanding on Shared Credit, please refer Understanding PCIe 6.0 Shared Flow Control. 

In this blog, we will discuss why this verification is essential and what it entails.  

Introduction 

PCIe 6.1 ECN brings numerous advancements over earlier versions, such as increased bandwidth and faster data transfer speeds.   

A crucial mechanism for efficient data transmission in PCIe 6.0 is the credit-based flow control system. In this system, devices monitor credits, representing the buffer capacity available for incoming data.   

When a device transmits data, it uses credits, which are replenished or adjusted once the data is received and processed. This system ensures that the sender does not overload the receiver.  

Given the critical role of shared credit updates in maintaining the integrity and efficiency of data transfers, verification of these updates is crucial.  Proper management of credit updates is essential to ensure data integrity, as any discrepancies can lead to data loss, corruption, or system crashes.   

Verification also guarantees efficient resource allocation, preventing scenarios where some components are starved of credit while others have an excess, thus avoiding inefficiencies.  Credit inefficiencies pose issues in low power negotiations by preventing devices from entering low power states. Additionally, verification involves checking for proper error handling mechanisms, ensuring that the system can recover gracefully from errors in credit updates and maintain overall stability.   

PCIe 6.1 ECN Flow Control Optimizations Over PCIe 6.0

PCIe 6.1 ECN builds on the FLIT-based architecture introduced in PCIe 6.0, further optimizing flow control mechanisms to handle increased data rates and improved efficiency.  PCIe 6.1 ECN introduced refinements in credit management, making the allocation and advertisement of credits more precise, which helps in reducing bottlenecks and improving data flow efficiency.  Enhancements in flow control protocols ensure better management of buffer spaces and more efficient credit allocation. These enhancements are designed to handle the increased data rates and throughput demands of next-generation applications, ensuring robust and efficient data flow across PCIe devices.  

Below are some major updates: 

1. There have been improvements in error detection and correction mechanisms in PCIe 6.1 ECN to enhance flow control reliability by ensuring that corrupted data packets are detected and handled appropriately without disrupting the flow of valid packets.  
2. The merged credit system, which was a key feature introduced int PCIe 6.0 to simplify and optimize credit management, was further enhanced in PCIe 6.1 ECN to improve performance and efficiency.  
3. PCIe 6.1 ECN introduced better algorithms for allocating and reclaiming merged credits to handle high data rates, introduced more robust error detection and correction mechanism reducing the degradation or system instability. 
4. PCIe 6.1 ECN provided clear guidelines on how to implement the merged credit system correctly, helping developers to implement more reliable systems. For more details, please refer to Specifications section 2.6.1 Flow Control (FC) Rules.

Summary 

In summary, PCIe 6.0 is a complex protocol with many verification challenges. You must understand many new Spec changes and think about the robust verification plan for the new features and backward compatible tests impacted by new features. Cadence’s PCIe 6.0 Verification IP is fully compliant with the latest PCIe Express 6.0 specifications and provides an effective and efficient way to verify the components interfacing with the PCIe 6.0 interface. Cadence VIP for PCIe 6.0 provides exhaustive verification of PCIe-based IP and SoCs, and we are working with early adopter customers to speed up every verification stage.   

More Information

For more info on how Cadence PCIe Verification IP and Triple Check VIP enable users to confidently verify PCIe 6.0, see VIP for PCI Express, VIP for Compute Express Link  and TripleCheck for PCI Express    

See the PCI-SIG website for more details on PCIe in general and the different PCI standards.  

For more information on PCIe 6.0 new features, please visit PCIeLaneMargin, PCIe6.0LaneMargin, and Demonstrating PCIe 6.0 Equalization Procedure.

The Sigrity and Systems Analysis (SIGRITY/SYSANLS) 2024.1 release is now available for download at Cadence Downloads . For the list of CCRs fixed in this release, see the README.txt file in the installation hierarchy. SIGRITY/SYSANLS 2024.1 Here is a list of some of the key updates in the SIGRITY/SYSANLS 2024.1 release: For more details about these and all the other new and enhanced features introduced in this release , refer to the following document: Sigrity Release Overview and Common Tools What's New . Supported Platforms and Operating Systems Platform and Architecture X86_64 (lnx86) Windows (64 bit) Development OS RHEL 8.4 Windows Server 2022 Supported OS RHEL 8.4 and above RHEL 9 SLES 15 (SP3 and above) Windows 10 Windows 11 Windows Server 2019 Windows Server 2022 Systems Analysis 2024.1 Clarity 3D Solver Clarity 3D Layout Structure Optimization Workflow : A new workflow, Clarity 3D Layout Structure Optimization Workflow, has been added to Clarity 3D Layout. This workflow integrates Allegro PCB Designer with Clarity 3D Layout for high-speed structure optimization. Component Geometry Model Editor : The new Clarity 3D Layout editor lets you set up ports, solder bumps/balls/extrusions, and two-terminal and multi-terminal circuits using a single GUI. Coaxial Open Port Option Added to Port Setup Wizard : The Coaxial Open Port option lets you create ports for each target net pin and reference net pin in Clarity 3D Layout. The nearby reference net pins are then used as a reference for each target net pin, reducing the number of ports needed. In addition, the ports of unused reference net pins are shorted to the ground. Parametric Import Option Added : Two new options, Parametric Import and Default Import , have been added to the Tools – Launch Clarity3DWorkbench menu. The Parametric Import option lets you import the design along with its parameters into Clarity 3D Workbench. The Default Import option lets you ignore the parameters when importing the design into Clarity 3D Workbench. Component Library Added to Generate 3D Components : Clarity 3D Workbench now includes a new component library that lets you use predefined 3D component templates or add existing 3D components to create 3D designs and simulation models. AI-Powered Content Search Capability : Clarity 3D Workbench and Clarity 3D Transient Solver now support an AI-powered capability for searching the content and displaying relevant information. Expression Parser to Handle Undefined Parameters : Clarity 3D Workbench and Clarity 3D Transient Solver support writing expressions or equations containing undefined parameters in the Property window to describe a simulation variable. The improved expression parser automatically detects any undefined parameter in an expression and prompts users to specify their values. This capability lets you define a model or a simulation variable as a function instead of specifying static values. For detailed information, refer to Clarity 3D Layout User Guide and Clarity 3D Workbench User Guide on the Cadence Support portal. Clarity 3D Transient Solver Mesh Processing Improved to Simulate Large Use Cases : Clarity 3D Transient Solver leverages a new meshing algorithm that enhances overall mesh processing, specifically for large designs and use cases. The new algorithm dramatically improves the mesh quality, minimum mesh size, number of mesh key points, total mesh number, and memory usage. Advanced Material Processing Engine : The material processing capability has been enhanced to handle thin outer metal, which previously resulted in open and short issues in some designs. In addition, the material processing engine offers improved mode extraction for particular use cases, including waveguide and coaxial designs. Characteristic Impedance Calculation Improved : The solver engine now uses a new analytical calculation method to calculate the characteristic impedance of coaxial designs with improved accuracy. For detailed information, refer to Clarity 3D Transient Solver User Guide on the Cadence Support portal. Celsius Studio Celsius Interchange Model Introduced : Celsius Studio now supports Celsius Interchange Model generation, which is a 3D model derived from detailed physical designs for multi-physics and multi-scale analysis. This Celsius Interchange Model file ( .cim ) serves as a design information carrier across Celsius Studio tools, enabling a variety of simulation and analysis tasks . Celsius 3DIC Thermal Workflow Improvements : The Thermal Simulation workflows in Celsius 3DIC have been significantly enhanced. Key improvements include: Advanced Power Setup with Transient Power Function and Multi Mode options Enhanced GUI for the Mesh Control and Simulation Control tabs Improved meshing capabilities Celsius Interchange Model ( .cim ) generation Material library support for block and connections Import of Heat Transfer Coefficients (HTCs) from a CFD file Bump creation through the Bump Array Wizard Layer Stackup CSV file generation Celsius 3DIC Warpage and Stress Workflow Enhancements : The Warpage and Stress workflow in Celsius 3DIC has undergone significant improvements, such as: Improved multi-stage warpage simulation flow for 3DIC packaging process Enhanced GUI for the Mesh Control , Simulation Control , and Stress Boundary Conditions tabs Support for large deformations and temperature profiles Bump creation through the Bump Array Wizard New constraint types Enhanced meshing capabilities Geometric Nonlinearity Support in Warpage and Stress Analysis : Large deformation analysis is now supported in warpage and stress studies. This study uses the Total Lagrangian approach to model geometric nonlinearities in simulation, which allows accurate prediction of final deformations. Thermal Network Extraction and Simulation : In the solid extraction flow in Celsius 3D Workbench, you can now import area-based power map files to create terminals. For designs with multiple blocks, this capability allows automatic terminal creation, eliminating the need to manually create and set up 2D sheets individually. Additionally, thermal throttling feature is now supported in Celsius Thermal Network. This makes it ideal for preliminary analyses or when a quick estimation is required. It runs significantly faster than 3D models, allowing for quicker iterations and more efficient decision-making. For detailed information, refer to the Celsius 3DIC User Guide , Celsius Layout User Guide and Celsius 3D Workbench User Guide on the Cadence Support portal. Sigrity 2024.1 Layout Workbench Improved Graphical User Interface : A new option, Use Improved User Interface , has been added in the Themes page of the Options dialog box in the Layout Workbench GUI. In the new GUI, the toolbar icons and menu options have been enhanced and rearranged. For detailed information, refer to Layout Workbench User Guide on the Cadence Support portal. Broadband SPICE Python Script Integration with Command Line for Simulation Tasks : Broadband SPICE lets you run Python scripts directly from the command line for performing simulation and analysis. The new -py and *.py options make it easier to integrate Python scripts with the command-line operations. This update streamlines the process of automating and customizing simulations from the command line, which makes your simulation tasks faster and easier. For detailed information, refer to Broadband SPICE User Guide on the Cadence Support portal. Celsius PowerDC Block Power Assignment (BPA) File Format Support : PowerDC now supports the BPA file format. Similar to the Pin Location (PLOC) file, the BPA file is a current assignment file that defines the total current of a power grid cell, which is then equally distributed across the power pins within the cell. This provides better control over the power distribution. Ability to Run Multiple IR Drop Cases Sequentially : You can now select multiple result sinks from the Current-Limited IR Drop flow and run IR Drop analysis for them sequentially. PowerDC automatically runs the simulations in sequence after you select multiple result sinks. This saves time by automating the process. Enhanced Support for Mixed Conversion Devices : PowerDC now supports mixing different conversion devices, such as switching regulators and linear regulators within a single DC-DC/LDO instance. This enhancement offers added flexibility by letting you configure each instance in your design according to your specific needs. For detailed information, refer to PowerDC User Guide on the Cadence Support portal. PowerSI Monte Carlo Method Added : A new option, Monte Carlo Method, has been added in the Optimality dialog box. This option lets you create multiple random samples to depict variations in the input parameters and assess the output. Channel Check Optimization Added : The S-Parameter Assessment workflow in PowerSI now supports Channel Check Optimization . It uses the AI-driven Multidisciplinary Analysis and Optimization (MDAO) technology that lets you optimize your design quickly and efficiently with no accuracy loss. For detailed information, refer to PowerSI User Guide on the Cadence Support portal. SPEEDEM Multi-threaded Matrix Solver Support Added : The Enable Multi-threaded Matrix Solver check box has been added that lets you accelerate the simulation speed for high-performance computing. This check box provides two options, Automatic and Always, to include the -lhpc4 or -lhpc5 parameter, respectively, in the SPEEDEM Simulator (SPDSIM) before running the simulation. For detailed information, refer to the SPEEDEM User Guide on the Cadence Support portal. XtractIM Options to Skip or Calculate Special DC-R Simulation Results : The Skip DC_R of Each Path and Only DC_R of Each Path options have been added to the Setup menu. Skip DC_R of Each Path : This option lets you skip the calculation of the DC-R result during the simulation. Other results, such as SPICE T-model , RL_C of Each Path , Coupling of Each Path , etc., are still calculated. Only DC_R of Each Path : This option lets you calculate the DC-R result only during the simulation. Other results, such as SPICE T-model , RL_C of Each Path , Coupling of Each Path , etc., are not calculated. Color Assignment for Pin Matching : The MCP Auto Connection window includes the Display Color Editor , which lets you assign a color for pin matching. It helps you easily identify the matching pins in the left and right sections of the MCP Auto Connection window . Ability to Save Simulations Individually : The Save each simulation individually check box has been added to the Tools - Options - Edit Options - Simulation (Basic) - General form. Select this check box and run the simulation to generate a simulation results folder containing files and logs with a timestamp for each simulation. Reuse of SPD File Settings : The XtractIM setup check box lets you import an existing package setup to reuse the configurations and settings from one .spd file to another. For detailed information, refer to XtractIM User Guide on the Cadence Support portal. Documentation Enhancements Cloud-Based Help System Upgraded The cloud-based help system, Doc Assistant, has been upgraded to version 24.10, which contains several new features and enhancements over the previous 2.03 version. Sigrity Release Team Please send your questions and feedback to sigrity_rmt@cadence.com .

This November, the engineering and simulation community is set to converge in China for an event that promises to be nothing short of revolutionary. The 2024 BETA CAE Systems China Open Meeting, taking place in the vibrant cities of Beijing and Shanghai on November 5 and 7 , respectively, is a must-attend for anyone looking to stay at the forefront of technological innovation in simulation solutions. Prepare to be inspired by Ben Gu , the visionary Corporate VP of Research and Development at Cadence. He will lead both meetings in Beijing and Shanghai with his keynote on " A New Millennium in Multiphysics System Analysis ." This thought-provoking keynote is expected to provide attendees with a glimpse into the future of engineering simulation and analysis. What sets the BETA CAE Systems Open Meetings apart is not just the high caliber of speakers but also the hands-on training sessions designed to enhance your technical expertise with the BETA CAE software suite. Whether you are an inexperienced individual seeking to acquire fundamental knowledge or an accomplished professional endeavoring to hone your expertise, these training sessions following the open meetings are meticulously tailored to meet your needs. Join Us at the BETA CAE Systems Open Meeting in Beijing The BETA CAE Systems Open Meeting in Beijing will feature a keynote speech by Peng Qiao , Senior Engineer at Great Wall Motors Co., Ltd, on Multidisciplinary Optimization Techniques for Automotive Control Arms . ( View detailed agenda for Beijing. ) When: November 5, 2024 Where: Grand Metropark Hotel Beijing If this sounds interesting, register today for the BETA CAE Systems Beijing Open Meeting by clicking the button below. Don't Miss Out on the BETA CAE Systems Open Meeting in Shanghai After the BETA CAE Systems Open Meeting in Beijing, the next meeting in China will be in Shanghai. During this event, Liu Deping, CAE Engineer from Zhejiang Geely Automobile Research Institute Co., Ltd, will deliver a keynote speech on the Application of ANSA in the Simulation Development Cycle . ( View detailed agenda for Shanghai. ) When: November 7, 2024 Where: InterContinental Shanghai Jing'an Following the open meeting on November 7 will be an exclusive training day on November 8. This session will provide attendees with practical experience using the BETA CAE software to improve their technical skills and provide hands-on knowledge of the software. If you find this intriguing, register now for the BETA CAE Systems Shanghai Open Meeting by clicking the button below. Why Attend? Gain firsthand insights into the latest developments in simulation technology Learn from real-world applications and success stories from various industries Connect and exchange ideas with experts in a collaborative environment Mark your calendars for this unparalleled opportunity to explore the forefront of simulation technology. Whether you're aiming to broaden your knowledge, enhance your technical skills, or connect with industry leaders, the BETA CAE Systems Open Meetings are your gateway to the future of engineering. Join us and be part of shaping the next wave of innovation in the simulation world.

This post was contributed by Liliko Uchida, application engineer at Cadence. Being a “Woman in STEM” is a phrase that has long been used to describe the holistic experience shared by thousands of women globally, yet it still makes us feel isolated. Partially due to the statistics of gender population in the STEM workforce and the remainder due to our own internal obstacles, being a woman in STEM continues to be a challenge. While many of us know the should-do’s and should-be’s of taking on this unique role objectively, we struggle to implement them. After all, our perseverance as engineers, mathematicians, businesswomen, programmers, and scientists is largely affected by subjectivity. The UMass Lowell Women’s Leadership Conference 2024 aimed to tackle this problem by uniting hundreds of women with shared experiences under one roof. Not only did the conference provide us with the knowledge necessary to persevere, but it also gave us the tools that will allow us to thrive and act upon the facts we already know. It is my hope that through this blog post, I can share some of my main takeaways from this special day. Be Confident This is one of the most palpable pieces of advice we always hear. Yet so many of us struggle to build this confidence because we don’t know how. Featured speaker Nicole Kalil defined confidence as “complete trust in oneself”.”One way to build this self-trust is by getting to know yourself on a deeper level. By creating a true inner connection, we begin to see ourselves as a whole instead of hyper-focusing on our shortcomings frequently illusioned by imposter syndrome. In one of the sessions, we were asked to introduce ourselves to our neighbors, not by what we do for work, but by who we are as a person. Even if this opportunity does not arise every day, this practice can be done simply by listing characteristics of yourself that define who you are. Who do you care for? How do you show them? What are your life goals oriented towards? How do you observe others’ behavior around you, and what does that say about how you make them feel? Getting to know you beneath the surface and allowing yourself to be seen for who you are is critical in building internal confidence. With practice, this self-reassurance will grow independent of external factors. Take Risks “Sometimes, you have to put your foot in the elevator” - Barb Vlacich, Keynote Speaker When opportunities arise, the only thing you can do to have a chance is to try. Without putting your foot in the elevator, the doors will close, becoming a missed opportunity. Similarly, several of the conference’s speakers also emphasized that the answer to every unasked question will always be a no. Even if you are not ready to full-send a negotiation, ask for a raise, or respectfully disagree with a co-worker’s opinion, start by getting comfortable asking uncomfortable questions. Just one discomfort a day will help in building an immunity to the anxiety that comes with taking risks, typically driven by our self-doubt. Another interesting point that stood out from the conference was the statistics of self-assessed qualifications between men and women. During the negotiation panel, it was revealed that men typically feel they only need 60% of the qualifications under a job description to apply, whereas women often feel they need close to 100%. These numbers alone demonstrate how the pure mental habits of men continue to funnel them into STEM and not women. The next time you seek a new opportunity, assess yourself based on the 60% and use it as a checklist threshold. If more women are able to pursue STEM careers using these numbers, the more likely we will begin to populate these roles. Build Your Genuine Network “ The essence of communication lies in the mutual exchange of ideas and emotions. And when the listener isn’t invested, it undermines the entire purpose of the conversation. Why are you having it anyway?” This is a quote from episode 186 of Julie Brown’s podcast This Sh!t Works called “The 5 Steps to Being an Active Listener”. Julie Brown is a Networking Coach, author, and podcast host who guided an energetic and candid conversation about networking and building a personal brand for women. Networking is often misunderstood as putting your name and qualifications out on the table for as many people to pick up your cards. While making these things known is important, they are not what nurtures effective connections. The key to cultivating your genuine network is to activate a sincere interest in the people you meet. Become the proactive receiver of the confidence exercise discussed above. When you meet someone new, what can you take away from them as a person, not an employee? By making people feel heard, even through the little conversations, you can begin to develop more meaningful connections that resonate. And, with practice, the sometimes inherent need to overcompensate by defining yourself with your resume will slowly fade. It was a wonderful opportunity to attend the UML Women’s Leadership Conference with four other inspiring Cadence women. Not only was the conference a motivating learning experience, but it was also a wonderful opportunity for us to bond together as women and feel supported by each other. The most eye-opening part of the day was seeing just how many women alike were sitting under the same roof. The conclusion of the event led me to feel proud to be an engineer, proud to be at Cadence, and most importantly, proud to be a woman. Learn more about life at Cadence .

Hello Folks,

Problem statement first: How does one properly setup tensorflow for running on a DSVM using a remote Docker environment? Can this be done in aml_config/*.runconfig?

I receive the following message and I would like to be able to utilize the increased speeds of the extended FMA operations.

tensorflow/core/platform/cpu_feature_guard.cc:140] Your CPU supports instructions that this TensorFlow binary was not compiled to use: AVX2 FMA

Background: I utilize a local docker environment managed through Azure ML Workbench for initial testing and code validation so that I'm not running an expensive DSVM constantly. Once I assess that my code is to my liking, I then run it on a remote docker instance on an Azure DSVM.

I want a consistent conda environment across my compute environments, so this works out extremely well. However, I cannot figure out how to control the tensorflow build to optimize for the hardware at hand (i.e. my local docker on macOS vs. remote docker on Ubuntu DSVM)

When the Arduino Mega2560 is added to the first serial port, the dynamic memory is 2000 bytes, and when the second serial serial is added, the dynamic memory is 4000 bytes. Now I need to add the third Serial serial port. The dynamic memory is 6000 bytes. Due to the many variables in the program itself, the dynamic memory is not enough. Please help me how to save the dynamic memory?

Please give me some ideas. Thank you very much.

While doing the lvs it's showing an error in gnd connection, I am not being able to understand exactly what is the error and what do I need to do to remove this error?

I want to download Xtensa C/C++ Compiler (XCC) . I dont know where to download. Please help me.

Hi, all.

When I use vavlog to compile verilog rtl, it will recognize IO width mismatch problem as a fatal error.

How to turn the error into warning?

VCS can use -error=noIOPCWM to ingore the error.

Is vavlog has similar arguments?

Hi,

I need to design EPC8002 eGaN switch in cadence. Can someone provide me step by step guide on hoe to add EPC8002 into my cadence. I am working on BCD180.

Thank you 

Ihsan

Designers have long recognized the need to analyze the reliability of ICs. Two commonly used approaches for performing reliability analysis include calculating the change in device degradation and relying on safe operating checks in circuit simulators. 

With the advent of the ever-increasing use of ICs in mission-critical applications, the need for reliable reliability analysis has become of paramount importance. Over the years, you have been using reliability analysis in Virtuoso ADE Assembler and Virtuoso ADE Explorer to measure and review aging effects, such as device characteristic degradations, model parameter changes, self-heating effects, and so on.

Reliability analysis can be performed using two modes: Spectre native and RelXpert. The reliability analysis analyzes the effect of time on circuit performance drift and predicts the reliability of designs in terms of performance. In ADE Assembler, you can run the reliability simulation for fresh test (when time is zero), stress test (to generate degradation data), and aged test (at specific intervals, such as one year, three years, or 10 years). In the stress test, extreme environmental conditions are used to stress devices before aging analysis.

The following figure shows the reliability simulation flow.

The Reliability Options form has the following four tabs: 

• Basic: Enables you to specify analysis type, aging options, start and stop time of reliability simulation, and options related to device masking, degradation ratio, and lifetime calculation. 

• Modeling: Enables you to choose the modeling type you want to use during reliability simulation. 

• Degradation: Enables you to specify the options to print device and subcircuit degradation information into a .bt0 file. 

• Output: Enables you to specify the degradation reports to be generated and methods to filter degradation results in the reports.

While the Basic and the Output tabs are used by design engineers, the Modeling and the Degradation tabs are primarily used by model developers.

Reviewing degradation reports in text or XML formats can be a tiresome exercise because degradation data can be large and can contain a large number of instances due to advanced technology nodes and post-layout simulations. For you to work effectively and interactively with these reports, the new reliability report is based on the SQLite database, which adds the benefit of improved performance and capabilities of sorting and filtering reliability data using SQLite operators.

As they say, watching this in action might help you more than reading about it, so please take a look at our Training Bytes video channel, which offers many helpful videos on how to run Reliability Analysis in Virtuoso Studio.

All the related videos are linked together in a channel so that you can easily access and watch as many as you like.

Reliability Analysis in Virtuoso Studio

Want to Learn More?

For lab instructions and a downloadable design, enroll for the online training courses of your interest on

Reliability Analysis in Virtuoso Studio vIC23.1 (Online)

 Training is also available as "Blended" or "live" class.

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About Knowledge Booster Training Bytes

Knowledge Booster Training Bytes is an online journal that relays information about Cadence Training videos, online courses, and upcoming webinars that are available in the Learning section of the Cadence Learning and Support portal. This blog category brings you direct links to these videos, courses, and other related material on a regular basis.

Niyati Singh

On behalf of the Cadence Training team

Virtuoso Studio IC23.1 ISR7 production release is now available for download.(read more)

This blog describes an efficient way to name the histories saved by the simulation runs in Virtuoso ADE Assembler.(read more)

Have you ever wanted to write a DRC rule deck to check for space or width constraints on polygons? Or have you wondered how the multiple lines of an LVS rule deck extract and conduct a comparison between the schematic and layout? Maybe you've been curious about the role of rule deck writers in creating high-quality designs ready for tape-out.

If any of these questions interest you, there is good news: the latest version (v23.1) of the Physical Verification Rules Writer (PVLRW) course is designed to teach you rule deck writing. This free 16-hour online course includes audio and labs designed to make your learning experience comfortable and flexible. Whether you are new to the concept or an experienced CAD/PDK engineer, the course is structured to enhance your rule deck writing skills.

The PVLRW course covers six core modules: Layer Processing, DRC Rules, Layout Extraction, ERC and LVS Rules, Schematic Netlisting, and Coloring Rules. There are also three optional appendix sections. Each module explains relevant rules with syntax, concepts, graphics, examples, and case studies.

This course is based on tool versions PEGASUS231 and Virtuoso Studio IC231.

Pegasus Input and Output

Pegasus is a cloud-ready physical verification signoff solution that enables engineers to support faster delivery of advanced-node integrated circuits (ICs) to market.

Pegasus requires input data in the form of layout geometry, schematic netlists, and rules that direct the tool operation. The rules fall into two categories: those that describe the fabrication process and those that control the job-specific operation.

Pegasus provides log and report files, netlists, databases, and error databases as output.

Overview of Pegasus Rule File

The rule decks written in Physical Verification Language (PVL) work for the Cadence PV signoff tools Pegasus and PVS (Physical Verification System).   

The PVL rules are placed in a file that gets selected in a run from the GUI or the command line, as the user directs. PVL rules may be on separate lines within the file and can also be contained in named rule blocks.

Each line of code starts with a PVL rule that uses prefix type notation. It consists of a keyword followed by options, input layer or variable names, and output layer or variable names.

A rule block has the format of the keyword rule, followed by a rule name you wish to give it, followed by an opening curly brace. You enter the rules you wish to perform, followed by a closing curly brace on the last separate line.

  Sample Rule deck with individual lines of code and rule blocks.

DRC Rules

The first step in a typical Pegasus flow is a Design Rule Check (DRC), which verifies that layout geometries conform to the minimum width, spacing, and other fabrication process rules required by an IC foundry. Each foundry specifies its own process-dependent rules that must be met by the layout design.

There are three types of DRC rules: layer definition rules, layer derivation rules, and DRC design check rules. Layer definition rules identify the layers contained in the input layout database, and layer derivation rules derive additional layers from the original input layers, allowing the tool to test the design against specific foundry requirements using the design check rules.

A sample DRC Rule deck

A layout view displaying the DRC violations

LVS Rules

The Pegasus Layout Versus Schematic (LVS) tool compares the layout netlist with the schematic netlist to check for discrepancies.

There are two essential LVS rule sets: LVS extraction rules and comparison rules. LVS extraction rules help extract drawn devices and connectivity information from the input layout geometry data and outputs into a layout netlist. The LVS extraction rule set also includes the layer definition, derivation, extraction, connectivity, and net listing rules.

LVS comparison rules are associated with comparing the extracted layout netlist to a schematic netlist.

A sample LVS Rule deck. 

TCL, Macros, and Conditional commands

Tcl is supported and used in various Pegasus functionalities, such as Pegasus rule files and Pegasus configurator. Macros are functional templates that are defined once and can be used multiple times in a rule file. Conditional Commands are used to process or skip specific commands in the rule file.

Do You Have Access to the Cadence Support Portal?

If not, follow the steps below to create your account.

• On the Cadence Support portal, select Register Now and provide the requested information on the Registration page.
• You will need an email address and host ID to sign up.
• If you need help with registration, contact support@cadence.com.

To stay up to date with the latest news and information about Cadence training and webinars, subscribe to the Cadence Training emails.

If you have questions about courses, schedules, online, public, or live onsite training, reach out to us at Cadence Training.

For any questions, general feedback, or future blog topic suggestions, please leave a comment.

Related Resources

About Knowledge Booster Training Bytes

Knowledge Booster Training Bytes is an online journal that relays information about Cadence Training videos, online courses, and upcoming webinars in the Learning section of the Cadence Learning and Support portal. This blog category brings you direct links to these videos, courses, and other related material on a regular basis. Subscribe to receive email notifications about our latest Custom IC Design blog posts.

Virtuoso Studio IC23.1 ISR8 production release is now available for download.(read more)