Here's a nightmare. You sign off your design with the usual margins. It is a 7nm chip that is meant to run at 3GHz. But it only runs at 2.7GHz. You get Cadence to help you work out what is going...

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I recently attended a webinar presented by Wally Rhines about his new book, Predicting Semiconductor Business Trends After Moore's Law . Wally was the CEO of Mentor, as you probably know. Now he...

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Cadence has a new white paper out on Computational Software . I've written on these topics in Breakfast Bytes, most recently in the posts: Computational Software System Analysis: Computational...

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We have talked about aspects of the in-design symbol edit application mode in the past. This is the environment specific to the Allegro® Package Designer Plus layout tools allowing you to work...

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In last week's post, 1G Mobile: AMPS, TOPS, C-450, Radiocom 2000, and All Those Japanese Ones . I covered 1G mobile, the first analog standards. Then we went digital. 2G The Nordic countries...

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Do you have a set of Bluetooth earbuds yet? If not, you will. The iPhone was the first to kill the ubiquitous 3.5mm headphone jack, but many other manufacturers have quietly followed. Of course,...

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If I talk about my life, it was much simpler when I used to live with my parents. They took good care of whatever I wanted - in fact, they still do. But now, I am living alone, and sometimes I buy...

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Complexity is driving the urgency for advanced artificial intelligence systems more than ever—and that means someone has to supply the tools to create those systems. Cadence is up to the task: we’ve been expanding our AI offerings. If you haven’t already seen what Cadence can do for your AI needs, or if you’re not quite up-to-date on this whole AI boom, let this presentation given by K.T. Moore at the Cadence Theater at DAC bring you up to speed.

The technology behind AI isn’t as new as you’d think—the principles that govern how AI learns have been in development since 1959, when Arthur Samuel defined the concept of “machine learning.” At the time, there was nothing even resembling the necessary compute power to put Samuel’s concepts into practice—but now we can. AI designs are huge, and they’re massively parallel—simulating them on older computers and simulators would have taken ages; never mind how long it would take to do some by-hand measure like they had to do in the '60s.

But with advancements in server technology and the parallelization technology in products like Xcelium Parallel Logic Simulator and JasperGold smart technology, plus hardware-based engines like the Palladium and Protium platforms, verifying AI designs is not only possible—it’s easy.  But, read on, its not just about simulation technology.

AI tech is flooding the industry. It’s applicable to almost every vertical—cloud computing can use AI to intelligently manage a user’s required resources, consumer electronics are using it to tailor a user experience based on a whole host of collected data, automotive companies want to use AI to drive cars, healthcare to assist in diagnoses given a set of symptoms and a database of other, similar patients—and that’s saying nothing of the multitude of industrial applications. AI is also useful in the creation of developers’ tools themselves. Part of what’s causing the semiconductor industry boom is just this—an exploding interest in AI chips. And with 5G technology imminent, and with the looming billion-gate plus sizes of the SoCs that implement 5G, AI-assisted developers' tools might need to become the norm, not an outlier.

So: in all of this, where is Cadence?

Cadence is focusing its efforts on two areas, dubbed “machine learning inside” and “machine learning outside.” ML inside in the digital design flow refers to improving PPA, faster engines, and better testing and diagnostics. None of this physically affects how you use a tool, but it makes using that tool a much better experience. ML outside talks about the design flow in general, working toward an automated design flow, as well as productivity improvements across the flow. These things do change how you use a tool, but don’t worry, it’s all for the better.

Additionally, Cadence is working to improve design enablement; that is, hardware and software co-design. Smart Genus and Innovus solutions make designing your SoC easier than ever—using the full flow can result in up to a 21% PPA gain.

If you’re looking specifically for IP to enable AI on your SoC, the Tensilica DNA 100 processor has you covered, too. It’s great for companies designing edge or AI chips, offers great compression rates and efficient power usage, and has 4.7X the performance of other AI SoC IP on similar array sizes.

Cadence has you covered no matter where you’re going in this new world of AI systems—with our AI-enabled tools, IP,  and our strong partner ecosystem, you can be at ease knowing you’ll be supported no matter how complex your needs are.

Everyone keeps talking about “the cloud” this and “the cloud” that these days—but you’re a semiconductor designer. Everyone keeps saying “the cloud” is revolutionizing all aspects of electronics design—but what does it mean for you? Cadence's own Tom Hackett discussed this in a presentation at the Cadence Theater during DAC 2019.

What people refer to as “the cloud” is commonly divided into three categories: Infrastructure as a Service (IaaS), Platform as a Service (PaaS), and software as a Service (SaaS). With IaaS, you bring your own software—i.e. loading your owned or appropriately licensed tools onto cloud hardware that you rent by the minute. This service is available from providers like Google Cloud Platform, Amazon Web Service, and Microsoft Azure. In PaaS (also available from the major cloud providers), you create your own offering using capabilities and a software design environment provided by the cloud vendor that makes subsequent scaling and distribution really easy because the service was “born in the cloud”.  Lastly, there’s SaaS, where the cloud is used to access and manage functionality and data without requiring users to set up or manage any of the underlying infrastructure used to provide it.  SaaS companies like Workday and Salesforce deliver their value in this manner.  The Cadence Cloud portfolio makes use of both IaaS and SaaS, depending on the customers’ interest.  Cadence doesn’t have PaaS offerings because our customers don’t create their own EDA software from building blocks that Cadence provides.

All of these designations are great, but you’re a semiconductor designer. Presumably you use Workday or some similar software, or have in the past when you were an intern, but what about all of your tools? Those aren’t on the cloud.

Wait—actually, they are.

Using EDA tools in the cloud allows you to address complexity and data explosion issues you would have to simply struggle through before. Since you don’t have to worry about having the compute-power on-site, you can use way more power than you could before. You may be wary about this new generation of cloud-based tools, but don’t worry: the old rules of cloud computing no longer apply. Cloud capacity is far larger than it used to be, and it’s more secure. Updates to scheduling software means that resource competition isn’t as big of a deal anymore. Clouds today have nearly unlimited capacity—they’re so large that you don’t ever need to worry about running out of space.

The vast increase in raw compute available to designers through the cloud makes something like automotive functional safety verification, previously an extremely long verification task, doable in a reasonable time frame. With the cloud, it’s easy to scale the amount of compute you’re using to fit your task—whether it’s an automotive functional safety-related design or a small one.

Nowadays, the Cadence Cloud Portfolio brings you the best and brightest in cloud technology. No matter what your use case is, the Cadence Cloud Portfolio has a solution that works for you. You can even access the Palladium Cloud, allowing you to try out the benefits of an accelerator without having to buy one.

Cloud computing is the future of EDA. See the future here.

Emulators are great. They vastly speed up verification to the point where it’s hard to imagine life without them; as designs grow in complexity, simple simulation can’t keep up for the biggest designs. The extra oomph from emulation is almost a necessity for the top percentages of design sizes. However, many users of Palladium aren’t efficiently using their unit’s processing power, and as a result they’re missing out on the full speed-up potential that Palladium can provide.

Altair’s HERO is here for you. With its help, your Palladium unit can be even more amazing for your productivity than before.

HERO (that’s Hardware Emulator Resource Optimizer) adds emulator support to Altair’s Accelerator. You already know and love Altair’s scheduling tools; so why not make them do more for you, so you can be one of those people who are making the most out of their Palladium system?

Emulators are kind of like big computers, but it’s a lot harder to manage leftover resources on an emulator than it is on, say, a CPU. A scheduler like HERO neatly sidesteps this problem by more intelligently using the resources available to ensure that there’s a minimal patchwork of leftover resources to begin with.

HERO supports past generations of Palladium as well, so if you’re still using an older version, you can still take advantage of the upgrades HERO provides. There’s a wide variety of features HERO has that make your emulator easier to use. HERO separates a job into a “select” section and a “run” section: the “select” part makes a last-minute decision on which domains or boards to use, while the “run” part is the actual job. This makes it easier to ensure that your Palladium emulator is being used as efficiently as possible. Jobs are placed using “shapes”, which are a set of job types; these can be selected from a list of pre-defined ones by the user. Shapes can have special constraints if those are needed.

A new reservation system also helps HERO organize Palladium’s processing power better. HERO offers both “hard” reservations and “soft” reservations. A hard reservation locks other users out of reserving any part of the emulator at all, while a soft reservation allows a user to reserve a part of the emulator for a later use. Think of it like this: a soft reservation is like grabbing a ticket from the deli counter, while a hard reservation stops you from ever entering the market.

When using HERO, you can manage your entire verification workload. You’ll find that your utilization of your emulator vastly increases—it’s been reported that some users using only 30% of the capabilities of their Palladium unit(s) saw a massive increase to over 90% once they made the switch to HERO.

If you’re ready to take your Palladium productivity to the next level, Altair has a HERO for you.

To see the full presentation given by Andrea Casotto in the Cadence Theater at DAC 2019, check here.

Autonomous vehicles are coming. In a statistic from the U.S. Department of Transportation, about 37,000 people died in car accidents in the United States in 2018. Having safe, fully automatic vehicles could drastically reduce that number—but the trick is figuring out how to make an autonomous vehicle safe. Internet-enabled systems in cars are more common than ever, and it’s unlikely that the use of them will slow or stop—and while they provide many conveniences to a driver, they also represent another attack surface that a potential criminal could use to disable a vehicle while driving.

So—what’s being done to combat this? Green Hills Software is on the case, and they explained the landscape of security in automotive systems in a presentation given by Max Hinson in the Cadence Theater at DAC 2019. They have software embedded [FS1] in most parts of a car, and all the major OEMs use their tech. The challenge they’ve taken on is far from a simple one—between the sheer complexity of modern automotive computer systems, safety requirements like the ISO 26262 standard, and the cost to develop and deploy software, they’ve got their work cut out for them. It’s the complexity of the systems that represents the biggest challenge, though. The autonomous cars of the future have dynamic behaviors, cognitive networks, require security certification to at least ASIL-D, require cyber security like you’d have on an important regular computer system to cover for the internet-enabled systems—and all of this comes with a caveat: under current verification abilities, it’s not possible to test every test case for the autonomous system. You’d be looking at trillions of test cases to reach full coverage—not even the strongest emulation units can cover that today.

With regular cars, you could do testing with crash-test dummies, and ramming the car into walls at high speeds in a lab and studying the results. Today, though, that won’t cut it. Testing like that doesn’t see if a car has side-channel vulnerabilities in its infotainment system, or if it can tell the difference between a stop sign and a yield sign. While driving might seem simple enough to those of us that have been doing it for a long time, to a computer, the sheer number of variables is astounding. A regular person can easily filter what’s important and what’s not, but a machine learning system would have to learn all of that from scratch. Green Hills Software posits that it would take nine billion miles of driving for a machine learning system of today’s caliber to reach an average driver’s level—and for an autonomous car, “average” isn’t good enough. It has to be perfect.

A certifier for autonomous vehicles has a herculean task, then. And if that doesn’t sound hard enough, consider this: in modern machine-vision systems, something called the “single pixel hack” can be exploited to mess them up. Let’s say you have a stop sign, and a system designed to recognize that object as a stop sign. Randomly, you change one pixel of the image to a different color, and then check to see if the system still recognizes the stop sign. To a human, who knows that a stop sign is octagonal, red, and has “STOP” written in white block letters, a stop sign that’s half blue and maybe bent a bit out of shape is still, obviously, a stop sign—plus, we can use context clues to ascertain that sign at an intersection where there’s a white line on the pavement in front of our vehicle probably means we should stop. We can do this because we can process the factors that identify a stop sign “softly”—it’s okay if it’s not quite right; we know what it’s supposed to be. Having a computer do the same is much more difficult. What if the stop sign has graffiti on it? Will the system still recognize it as a stop sign? How big of an aberration needs to be present before the system no longer acknowledges the mostly-red, mostly-octagonal object that might at one point have had “stop” written on it as a stop sign? To us, a stop sign is a stop sign, even with one pixel changed—but change it in the right spot, and the computer might disagree.

The National Institute of Security and Technology tracks vulnerabilities along those lines in all sorts of systems; by their database, a major vulnerability is found in Linux every three days. And despite all our efforts to promote security, this isn’t a battle we’re winning right now—the number of vulnerabilities is increasing all the time.

Check back next time to see the other side: what does Green Hills Software propose we do about these problems? Read part 2 now.

If you missed the first part of this series, you can find it here.

So: what does Green Hills Software propose we do?

The issue of “solving security” is, at its core, impossible—security can never be 100% assured. What we can do is make it as difficult as possible for security holes to develop. This can be done in a couple ways; one is to make small code in small packs executed by a “safing plan”—having each individual component be easier to verify goes a long way toward ensuring the security of the system. Don’t have sensors connect directly to objects—instead have them output to the safing plan first, which can establish control and ensure that nothing can be used incorrectly or in unintended ways. Make sure individual software components are sufficiently isolated to minimize the chances of a side-channel attack being viable.

What all of these practices mean, however, is that a system needs to be architected with security in mind from the very beginning. Managers need to emphasize and reward secure development right from the planning stages, or the comprehensive approach required to ensure that a system is as secure as it can be won’t come together. When something in someone else’s software breaks, pay attention—mistakes are costly, but only one person has to make it before others can learn from it and ensure it doesn’t happen again. Experts are experts for a reason—when an independent expert tells you something in your design is not secure, don’t brush them off because the fix is expensive. This is what Green Hills Software does, and it’s how they ensure that their software is secure.

Now, where does Cadence fit into all of this? Cadence has a number of certified secure offerings a user can take advantage of when planning their new designs. The Tensilica portfolio of IP is a great way to ensure basic components of your design are foolproof. As always, the Cadence Verification Suite is great for security verification in both simulation and emulation, and JasperGold platform’s formal apps are a part of that suite as well.

We are entering a new age of autonomous technology, and with that new age we have to update our security measures to match. It’s not good enough to “patch up” security at the end—security needs to beat the forefront of a verification engineer or hardware designer’s mind at all stages of development. For a lot of applications, quite literally, lives are at stake. It’s uncharted territory out there, but with Green Hills Software and Cadence’s tools and secure IP, we can ensure the safety of tomorrow.

Looking to learn? There's a bunch of new RAKs (Rapid Adoption Kits) available online now!

1) Indago 19.09 Better Driver Tracing and More

Are you new to Indago and not sure where to start? Luckily, there’s a new Rapid Adoption Kit for you: the Indago 19.09 Overview RAK! This neat package contains everything you need to get your debugging started through Indago. In four short labs, plus a brief introductory lab, you’ll have all the basics of Indago 19.09 down—the Indago working environment, the SmartLog, how Indago interacts with the rest of the Cadence Verification Suite, and how Indago uses HDL driver tracing.

Lab 1 discusses the various debugging tools included in Indago and teaches you how to customize your Indago windows and environment settings. Lab 2 covers the SmartLog feature and talks about analyzing and filtering its messages to suit your needs, as well as how to interact with the waveform marker. Lab 3 is an interactive Indago debugging experience—it’ll walk you through how to use Indago and its features in an actual working environment: setting breakpoints, using simulator commands in the Indago console, toolbars, switches, and more. Lab 4 is all things HDL tracing—recording debug data, an introduction to debug assertions, waveform visualizations, driving expression analysis, and single-step driver tracing, among other things.

Interested? Check out the RAK here.

2) IXCOM MSIE: Faster Palladium Build Time

Got several testbenches you want to compile with the same DUT and tests and you want to do it fast? With IXCOM, all you have to do to compile those different testbenches is use the xrun command for each after compiling your DUT. But what exactly is IXCOM, and how does one start using it? This quick RAK can help—here, you’ll learn the basics of using MSIE features with IXCOM, complete with an example to get you started. Using MSIE can vastly improve your build times with Palladium and using IXCOM is the best way to shrink that tedious rebuild time as small as it can get. Check out this RAK here.

3)  JasperGold Control and Status Register Verification App Automates UVM Register Map Verification

New to the JasperGold Control and Status Register (CSR) Verification App for your UVM testbenches? Don’t worry; there’s a RAK for that! This eponymous RAK can get you up and running with this in no time, helping you automate your checks from UVM register map specs. With this RAK, you’ll learn the basics of the JasperGold CSR, how to use JasperGold CSR’s Proof Accelerator, and more. CSR features a model-based approach to predicting a register’s expected value, supports pipeline interfaces, all IP-XACT access policies, and it can fully model any expected register value. It also supports register aliases, read and write semantics, and separate read/write data latencies in any given field.

If this functionality sounds up your alley, you can take a look at this RAK here.

When you design a rigid-flex board, the focus is, of course, on the bend. Your design might be bend to install (stable flexion) - it will be bent only a few times while installing. Or it might be dynamic - it will be bent regularly. It's important to...(read more)

You must deal with many reports in your daily life – for your health, financial accounts, credit, your child’s academic records, and the count goes on. Ever noticed that these reports contain many details, most of which you don’t wa...(read more)

With ECAD-MCAD Library Creator, you can easily create footprints for your parts using thousands of ready-to-use templates that are provided with the tool.(read more)

Longfellow's metaphorical footprints on the sands of time is more profound and eternal no doubt but a footprint for silicon (a form of sand isn't it?) is as important for PCB designers. So, here we will list the steps to create a fo...(read more)

All PCB designers know the importance of proper power delivery for successful board design. Integrated circuits need the power to turn on, and ICs with marginal power delivery will not operate reliably. Since power planes can...(read more)

Imagine you are on a vacation with your family, and suddenly, your phone starts buzzing. You pick it up and what are you looking at is a bunch of pending, unanswered e-mails. You start recollecting the checklist you had made before taking off only to realize that you haven’t put on the automatic replies! (read more)

In my previous blog, I talked about creating a footprint using an existing template in Allegro ECAD-MCAD Library Creator and explained how easily you can access an existing template and create a package from it by just clicking a button. In this blog...(read more)

What is a Power Distribution Network (PDN) after all but resistance, inductance, and capacitance in the PCB and components? And, of course, it is there to deliver the right current and voltage to each component on your PCB. But is that all? Are there oth...(read more)

Have you ever manufactured a printed circuit board (PCB) without analyzing all the routed signal traces? Most designers will say “yes, all the time.” Trace widths and spacing are set by constraints, and many designers simply don’t h...(read more)

So, what if you can figure out all that can go wrong when your product is being assembled early on? Not guess but know and correct at an early stage – not wait for the fabricator or manufacturer to send you a long report of what needs to change. That’s why Design for Assembly (DFA) rules(read more)

All engineers can enhance their mixed-signal low-power structural verification productivity by learning while doing with a PIEA RAK (Power Intent Export Assistant Rapid Adoption Kit). They can verify the mixed-signal chip by a generating macromodel for their analog block automatically, and run it through Conformal Low Power (CLP) to perform a low power structural check.  

The power structure integrity of a mixed-signal, low-power block is verified via Conformal Low Power integrated into the Virtuoso Schematic Editor Power Intent Export Assistant (VSE-PIEA). Here is the flow.

Applying the flow iteratively from lower to higher levels can verify the power structure.

Cadence customers can learn more in a Rapid Adoption Kit (RAK) titled IC 6.1.5 Virtuoso Schematic Editor XL PIEA, Conformal Low Power: Mixed-Signal Low Power Structural Verification.

• To read the overview presentation, click on following link: PIEA Overview
• To download this PIEA RAK click on following link: PIEA RAK Download

The RAK includes Rapid Adoption Kit with demo design (instructions are provided on how to setup the user environment). It Introduces the Power Intent Export Assistant (PIEA) feature that has been implemented in the Virtuoso IC615 release.  The power intent extracted is then verified by calling Conformal Low Power (CLP) inside the Virtuoso environment.

• Last Update: 11/15/2012.
• Validated with IC 6.1.5 and CLP 11.1

The RAK uses a sample test case to go through PIEA + CLP flow as follows:

• Setup for PIEA
• Perform power intent extraction
• CPF Import: It is recommended to Import macro CPF, as oppose to designing CPF for sub-blocks. If you choose to import design CPF files please make sure the design CPF file has power domain information for all the top level boundary ports
• Generate macro CPF and design CPF
• Perform low power verification by running CLP

It is also recommended to go through older RAKs as prerequisites.

• Conformal Low Power, RTL Compiler and Incisive: Low Power Verification for Beginners
• Conformal Low Power: CPF Macro Models
• Conformal Low Power and RTL Compiler: Low Power Verification for Advanced Users

To access all these RAKs, visit our RAK Home Page to access Synthesis, Test and Verification flow

Note: To access above docs, use your Cadence credentials to logon to the Cadence Online Support (COS) web site. Cadence Online Support website https://support.cadence.com/ is your 24/7 partner for getting help and resolving issues related to Cadence software. If you are signed up for e-mail notifications, you can receive new solutions, Application Notes (Technical Papers), Videos, Manuals, and more.

You can send us your feedback by adding a comment below or using the feedback box on Cadence Online Support.

Sumeet Aggarwal

On May 7, 2013 Cadence announced a 30% productivity gain in the June 2013 Incisive Enterprise Simulator 13.1 release.  Advanced debug visualization, faster turn-around time, and the extension of eight years of low-power verification innovation to IEEE 1801/UPF are the key capabilities in the release.

When we talk about low-power verification its easy to equate it with simulation.  For certain, simulation is the heart of a low-power verification solution. Simulation enables engineers to run their design in the context of power intent.  The challenge is that a simulation-only approach is inadequate. For example, if engineers could achieve SoC quality by verifying the individual function of each power control module (PCM), then simulation could be enough.  For a single power domain, simulation can be enough. 

However, when the SoC has multiple power domains -- and we have seen SoCs with hundreds of them -- engineers have to check the PCMs and all of the arcs between the power modes.  These SoCs often synchronize some of the domain switching to reduce overall complexity, creating the potential for signal skew errors on the control signals for the connected domains.  Managing these complexities requires verification methodologies including advanced debug, verification planning, assertion-based verification, Universal Verification Methodology - Low Power (UVM-LP), and more (see Figure 1).

Figure 1:  Comprehensive Low-Power Verification 

But even advanced verification methodologies on top of simulation aren't enough.  For example, the state machine that defines the legal and illegal power mode transitions is often written in software. The speed and capacity of the Palladium emulation platform is ideal to verify in this context, and it is integrated with simulation sharing debug, UVM acceleration, and static checks for low-power. And, it reports verification progress into a holistic plan for the SoC.  Another example is the ability to compare the design in the implementation flow with the design running in simulation to make sure that what we verify is what we intend to build.

Taken together, verification across multiple engines provides the comprehensive low-power verification needed for today's advanced node SoCs.  That's the heart of this low-power verification announcement. 

Another point you may have noticed is the extension of the Common Power Format (CPF) based power-aware support in the Incisive Enterprise Simulator to IEEE 1801.  We chose to bring IEEE 1801 to simulation first because users like you sometimes need to mix vendors for regression flows.  Over time, Cadence will extend the low-power capabilities throughout its product suite to IEEE 1801.

If you are using CPF today, you already have the best low-power solution. The evidence is clear:  the upcoming IEEE 1801-2013 update includes many of the CPF features contributed to 1801/UPF to enable methodology convergence.  Since you already have those features in the CPF flow, any migration before you have a mature IEEE 1801-2013 tool flow would reduce the functionality you have today.

If you are using Unified Power Format (UPF) 1.0 today, you want to start planning your move toward the IEEE 1801-2013 standard.  A good first step would be to move to the IEEE 1801-2009 standard.  It fills holes in the earlier UPF 1.0 definition.  While it does lack key features in -2013, it is an improvement that will make the migration to -2013 easier. The Incisive 13.1 release will run both UPF 1.0 and IEEE 1801-2009 power intent today.

Over the next few weeks you'll see more technical blogs about the low-power capabilities coming in the Incisive 13.1 release.  You can also join us on June 19 for a webinar that will introduce those capabilities using the reference design supplied with the Incisive Enterprise Simulator release.

=Adam "The Jouler" Sherer

(Yes, "Sherilog" is still here.  :-) )

The IEEE has announced the publication of the new 1801-2013 standard, also known as UPF 2.1, and immediate availability for free download through the IEEE 1801-2013 Get Program. Even though the standard is new to the whole world, for the people of the IEEE working group this standard is finally done and is in the past now.

There is a Chinese saying "好事多磨" which means "good things take time to happen." I forgot the exact time when I first joined the working group for the new standard -- about two and half years ago -- but I do remember long hours of meetings and many "lively" debates and discussions. Since the "hard time" has passed us, I would like to share some fun facts about the working group and the standard.

• The 1801 working group is the largest entity based ballot group in IEEE-SA history.
• The new standard was initially planned for 2012, but was delayed purely due to the large amount of work required.
• At one point, the group was debating on whether the new standard should be called UPF 2.1 or 3.0. It may sound weird now but we spent quite some time discussing this. Eventually we settled on 2.1 as it was the original plan.
• The 1801-2013 document has 358 pages which is 53% thicker than previous version (the sheer amount of changes in the new standard indicate that this is more than just a normal incremental update of the previous version as suggested by naming it 2.1)
• Around 300 real issues were reported over the previous version and a majority of them were fixed in the new release.
• This is the first release with constructs and semantics coming from Common Power Format (CPF), a sign of convergence of the two industry leading power formats.
• There are about 100 working group meetings in my Outlook calendar since 2011, with meeting times ranging from 2 hours to 8 hours.
• We extensively used Google Drive (which was called Google Docs when the working group started), a great tool for productivity. I cannot imagine how any standard could have been done before Google existed!

Personally, I had an enjoyable journey, especially from having the privilege to work with many industry experts who are all passionate about low power. I do have one more thing to share though. My older daughter went from middle school to high school during the period of the development of the new standard. Since most of the meetings took place in the early morning California time, she had to endure the pain of listening to all these discussions on power domain, power switches, etc. on her way to school.

I asked her if she learned anything. She told me that other than being able to recognize the voices of Erich, John and Joe on the line, she also learned that she would never want to become an electrical or computer engineer! She was so happy that the meetings stopped a couple of months ago. But what I did not tell her is that the meetings will resume after DAC! Well, I am sure this will be a big motivation for her to get her own driving license in the summer.

If you want to get some quick technical insights into the new standard, check out my recent EE Times article IEEE 1801-2013: A bold step towards power format convergence.

Qi Wang

DAC is right around the corner! On the demo floor at Cadence® Booth #2214, we will demonstrate how to use the Cadence mixed-signal and low-power solution to design, verify, and implement a microcontroller-based mixed-signal design. The demo design architecture is very similar to practical designs of many applications like power management ICs, automotive controllers, and the Internet of Things (IoT). Cadene tools demonstrated in this design include Virtuoso® Schematic Editor, Virtuoso Analog Design Environment, Virtuoso AMS Designer, Virtuoso Schematic Model Generator, Virtuoso Power Intent Assistant, Incisive® Enterprise Simulator with DMS option, Virtuoso Digital Implementation, Virtuoso Layout Suite, Encounter® RTL Compiler, Encounter Test, and Conformal Low Power. An extended version of this demo will also be shown at the ARM® Connected Community Pavilion Booth #921.

For additional highlights on Cadence mixed-signal and low-power solutions, stop by our booth for:

• The popular book, Mixed-signal Methodology Guide, which will be on sale during DAC week!
• A sneak preview of the eBook version of the Mixed-signal Methodology Guide
• Customer presentations at the Cadence DAC Theater
  • 9am, Tuesday, June 4  ARM  Low-Power Verification of A15 Hard Macro Using CLP 
  • 10:30am, Tuesday, June 4  Silicon Labs  Power Mode Verification in Mixed-Signal Chip
  • 12:00pm, Tuesday, June 4  IBM  An Interoperable Flow with Unified OA and QRC Technology Files
  • 9am, Wednesday, June 5  Marvell  Low-Power Verification Using CLP
  • 4pm, Wednesday, June 5  Texas Instruments  An Inter-Operable Flow with Unified OA and QRC Technology Files
• Partner presentations at the Cadence DAC Theater
  • 10am, Monday, June 3  X-Fab  Rapid Adoption of Advanced Cadence Design Flows Using X-FAB's AMS Reference Kit
  • 3:30pm, Monday, June 3  TSMC TSMC Custom Reference Flow for 20nm -  Cadence Track
  • 9:30am,Tuesday, June 4  TowerJazz   Substrate Noise Isolation Extraction/Model Using Cadence Analog Flow
  • 12:30pm, Wednesday, June 5  GLOBALFOUNDRIES  20nm/14nm Analog/Mixed-signal Flow
  • 2:30pm, Wednesday, June 5  ARM  Cortex®-M0 and Cortex-M0+: Tiny, Easy, and Energy-efficient Processors for Mixed-signal Applications
• Technology sessions at suites
  • 10am, Monday, June 3    Low-power Verification of Mixed-signal Designs
  • 2pm, Monday, June 3      Advanced Implementation Techniques for Mixed-signal Designs
  • 2pm, Monday, June 3      LP Simulation: Are You Really Done?
  • 4pm, Monday, June 3      Power Format Update: Latest on CPF and IEEE 1801  
  • 11am, Wednesday, June 5   Mixed-signal Verification
  • 11am, Wednesday, June 5   LP Simulation: Are You Really Done?
  • 4pm, Wednesday, June 5   Successful RTL-to-GDSII Low-Power Design (FULL)
  • 5pm, Wednesday, June 5   Custom/AMS Design at Advanced Nodes

We will also have three presentations at the Si2 booth (#1427):

• 10:30am, Monday, June 3   An Interoperable Implementation Solution for Mixed-signal Design
• 11:30am, Tuesday, June 4   Low-power Verification for Mixed-signal Designs Using CPF
• 10:30am, Wednesday, June 5   System-level Low-power Verification Using Palladium

We have a great program at DAC. Click the link for complete Cadence DAC Theater and Technology Sessions. Look forward to seeing you at DAC!     

There is no better way other than a self-help training kit -- (rapid adoption kit, or RAK) -- to demonstrate the Incisive Enterprise Simulator's IEEE 1801 / UPF low-power features and its usage. The features include:

• Unique SimVision debugging 
• Patent-pending power supply network visualization and debugging
• Tcl extensions for LP debugging
• Support for Liberty file power description
• Standby mode support
• Support for Verilog, VHDL, and mixed language
• Automatic understanding of complex feedthroughs
• Replay of initial blocks
• ‘x' corruption for integers and enumerated types
• Automatic understanding of loop variables
• Automatic support for analog interconnections

Mickey Rodriguez, AVS Staff Solutions Engineer has developed a low power UPF-based RAK, which is now available on Cadence Online Support for you to download.

• This rapid adoption kit illustrates Incisive Enterprise Simulator (IES) support for the IEEE 1801 power intent standard. 

Patent-Pending Power Supply Network Browser. (Only available with the LP option to IES)

• In addition to an overview of IES features, SimVision and Tcl debug features, a lab is provided to give the user an opportunity to try these out.

The complete RAK and associated overview presentation can be downloaded from our SoC and Functional Verification RAK page:

We are covering the following technologies through our RAKs at this moment:

Synthesis, Test and Verification flow
Encounter Digital Implementation (EDI) System and Sign-off Flow
Virtuoso Custom IC and Sign-off Flow
Silicon-Package-Board Design
Verification IP
SOC and IP level Functional Verification
System level verification and validation with Palladium XP

Please visit https://support.cadence.com/raks to download your copy of RAK.

We will continue to provide self-help content on Cadence Online Support, your 24/7 partner for learning more about Cadence tools, technologies, and methodologies as well as getting help in resolving issues related to Cadence software. If you are signed up for e-mail notifications, you're likely to notice new solutions, application notes (technical papers), videos, manuals, etc.

Note: To access the above documents, click a link and use your Cadence credentials to log on to the Cadence Online Support https://support.cadence.com/ website.

Happy Learning!

Sumeet Aggarwal and Adam Sherer

If you weren't able to attend the 2013 DVCon, you missed out on a great IEEE 1801/UPF tutorial delivered by members of the IEEE committee. Accellera had the event recorded and that recording is now posted on the Accellera.org website. Regardless of your work so far with low power design and verification, you need to watch this video.

Power management is becoming ubiquitous in our world. The popular aspect is that reduced power is good for the evironment and that is true. But for those teams that have been building chips around the 40nm node and below, there is another truth. Power management is required simply to get working silicon in many cases. As the industry expands the number of designs with power management and forges deeper into advanced nodes, we steadily identify improvements to the power format descriptions. The most recent set of imporvements to the IEEE 1801 standard are now available in the 2013 version of that standard.

To help bring the standard to life, five representatives from the IEEE joined to deliver a tutorial at DVCon in 2013. Qi Wang (Cadence), Erich Marschner (Mentor), Jeffrey Lee (Synopsys), John Biggs (ARM), and Sushma Honnavarra-Prasad (Broadcom) each contributed to the tutorial. It started with a review of the UPF basics that led to the IEEE 1801 standard delivered by the EDA companies. The IEEE 1801 users then presented tutorial content on how to apply the standard. The session then concluded with a look forward to the IEEE 1801-2013 (UPF 2.1) standard. The standard was released two months after the DVCon tutorial and is available through the Accellera Get program.

So after the bowl games are over and you'vre returned through the woods and back over the river from Grandma's, grab a cup of hot cocoa and learn more about the power standards you may well be using in 2014.

Regards,

Adam "The Jouler" Sherer

ST Microelectronics reported their success with IEEE 1801 / UPF low-power simulation using Incisive Enterprise Simulator at CDNLive India in November 2013. We were able to meet with Mohit Jain just after his presentation and recorded this video that explains the key points in his paper.

With eight years of experience and pioneering technology in native low-power simulation, Mohit was able to apply Incisive Enterprise Simulator to a low-power demonstrator in preparation for use with a production set-top box chip.  Mohit was impressed with the ease in which he was able to reuse his existing IEEE 1801 / UPF code successfully, including the power format files and the macro models coded in his Liberty files. Mohit also discusses how he used the power-aware Cadence SimVision debugger.

The Cadence low-power verification solution for IEEE 1801 / UPF also incorporates the patent-pending Power Supply Network visualization in the SimVision debugger.  You can learn more about that in the Incisive low-power verification Rapid Adoption Kit for IEEE 1801 / UPF here in Cadence Online Support.

Just another happy Cadence low-power verification user!

Regards,

 Adam "The Jouler" Sherer 

Freescale was a successful Incisive® simulation CPF low-power user when they decided to step up their game. In November 2013, at CDNLive India, they presented a paper explaining how they improved their ability to find power-related bugs using a more sophisticated verification flow.  We were able to catch up with Abhinav Nawal just after his presentation to capture this video explaining the key points in his paper.

Abhinav had already established a low-power simulation process using directed tests for a design with power intent captured in CPF. While that is a sound approach, it tends to focus on the states associated with each power control module and at least some of the critical power mode changes.  Since the full system can potentially exercise unforeseen combinations of power states, the directed test approach may be insufficient. Abhinav built a more complete low-power verification approach rooted in a low-power verification plan captured in Cadence® Incisive Enterprise Manager.  He still used Incisive Enterprise Simulator and the SimVision debugger to execute and debug his design, but he also added Incisive Metric Center to analyze coverage from his low-power tests and connect that data back to the low-power verification plan.  As a result, he was able to find many critical system-level corner case issues, which, left undetected, would have been catastrophic for his SoC.  In the paper, Abhinav presents some of the key problems this approach was able to find.

You can achieve results similar to Abhinav. Incisive Enterprise Simulator can generate a low-power verification plan from the power format, power-aware assertions, and it can collect power-aware knowledge.  To get started, you can use the Incisive Low-Power Simulation Rapid Adoption Kit (RAK) for CPF available on Cadence Online Support.

Just another happy Cadence low-power verification user!

Regards,

Adam "The Jouler" Sherer  

Hello, i saw that MAESTRO is a plotting addon is it a part of ADE EXPLORER?

i cant see the relation between the two.i started to read manual and regarding MAESTRO i only see code.

is there some simple examples?
Thanks.

Hello, i have a realy mistick thing going with copying libraries in cadence virtuoso,

When i copy straight forwart the whole library it gives me a warning that accsess was denied,but when i go into the library and copy it as a single file, then it goes fine.

another problem is it doesnt show in the massage console  ALL the files which could not be copied.(which is the much bigger problem,becuase i would have to pass threw all the subdirectories to verify if all files are there)

Is there a way to see which files wasnt able to be copied?

Thanks. 

Hi,
I am new to the circuit design and troubleshooting. My project is to design a trans-impedance amplifier using Cadence that can amplify a signal coming from a photodiode. I started out with the regulated cascode configuration as shown in the circuit below. I look at the frequency response using AC simulation and it looks like a high pass (/net 5). The results doesn ot show any gain (transient response), or expected low-pass roll-off in the AC response.

First thing, I looked into the operating regions of the MOSFETs and adjusted the input dc voltage of the Vsin to 0.5 to make sure that the T0, T1 mosfets are in saturation(checked this with the print->dc operating points). Beyond this point, I am not sure on how to proceed and interpret the results to make changes. Any help would be greatly appreciated.

Thanks,

-Rakesh.

Hello , i am trying to extract netlist from a circuit  in assembler

I have found the manual shown bellow , however there is no such option in tools in assembler.

how do i view the NETLIST of this circuit?

Thanks.

ASSEMBLER VIEW menu

Virtuoso Version -- IC6.1.7-64b.500.23

Cadence Spectre Version -- 17.10.515

I have a very simple circuit. Please find attached. It is basically a resistor across a port. I run a S-param simulation and can plot the S-params, but unfortunately not the Z-param or Y-param. 

/resized-image/__size/320x240/__key/communityserver-discussions-components-files/33/Capture_5F00_Sch.JPG

/resized-image/__size/320x240/__key/communityserver-discussions-components-files/33/Capture_5F00_Error.JPG

Can anyone point me in the correct direction to sort out this problem? The zpm does work in another design environment, but not in the new design environment (a new project). The virtuoso and the cadence-spectre versions match in both the project environments. I am at a loss at what to look for. 

Hello,

Would anyone know how to setup a PSS or QPSS simulation with 25% dutycycle clock sources or if such a thing is possible with QPSS.

Fig1 (below) is a snapshot of the circuit I am trying to characterize. This has 4 clock ports each with 25%duty cycle in the ON state. Fig2 below shows two of these clocks.

Each path in the circuit consists of two switches with a low pass RC sandwiched in between. The Input is a 50Ohm port sine wave and the output is a 1K resistor. The output nets of all paths are connected together.

I am trying to determine the swept frequency response from input to output (voltage) when the input is from 500Mhz to  510MHz. The Period (T=1/Fp) of each of the pulses is such that Fp=500MHz. The first pulse source has a delay=0, second has delay=T/4, third delay=2T/4, etc...

I am currently getting it working and seeing the correct result (bandpass response) with Transient but the problem is doing a dft at 500MHz with 10KHz spacings needs at least 100us and takes up a lot of time and disk space.

Many Thanks,
Chris.

Fig1

Fig2

Hello, I have a problem with a certain type of transistor,my hyrarchy has a lot components an sub components and visually inspecting them is very hard.

is there a way like in other cadence layout viewer tools , to enter the name of the component or a NET somewhere and it will focus on it visualy or give the hyrarchy path to it?

Thanks.

Hello,

I am using virtuoso version IC 6.1.7-64b.500.1, and I am trying to follow the Spectre RF Workshop-Noise-Aware PLL Design Flow(MMSIM 7.1.1) pdf.

I could find the workshop library "pllMMLib", but I cannot find PLL Macro Model Wizard, and I attached my screen.

Could you please help me install the module "PLL Macro Model Wizard"?

Thanks a lot!

Hello

The document I referenced is https://filebox.ece.vt.edu/~symort/rfworkshop/Mixer_workshop_instruction.pdf. (This is cadence workshop document)

While following the pxf simulation in the above article, the results are different and I have a question.

My result picture is shown below.

<my result error>

<document result>

<my direct plot>

<document direct plot>

The difference with the documentation is that in the direct plot screen after the pxf simulation,

1.output harmonics-> input sideband

2.Frequency axis: out-> frequency axis: absin

3.The results for port0 (RF port) are also different (see photo below).

4.The frequency values in the box are different.

My screen shows 5G, 10G, 1K ~ 10M, but the document is the same as 1K ~ 10M.

Ask for a solution. Thank you.

Hi, all

Recently, I meet the simulation error as the picture shows when I simulate my circuit with transient.  how can I solve this problem?

thank you~

Hello, i am trying to produce a gain circles on a simple transistor as shown bellow.

i have defined the range from 1 til 30 dB and i dont get any circle just dots in infinity?

Where did i go wrong?
Thanks.

Hello, i have built a matching network of 13dB gain and  NF as shown bellow step by step.(including all the plots and matlab )

its just not working at all,i am doing it exacly by the thoery

taking a point inside the circle-> converting its gamma to Z_source->converting gamma_s into gamma_L with the formulla bellow as shown in the matlab->converting the gamma_L into Z_L-> building the matching network for conjugate of Z_L and Z_c.Its just not working.

where did i got  wrong?

Thanks.

gamma_s=75.8966*exp(deg2rad(280.88)*i);
z_s=gamma2z(gamma_s,50);
s11=0.99875-0.03202*i
s12=721.33*10^(-6)+8.622*10^(-3)*i
s21=-188.37*10^(-3)+30.611*10^(-3)*i
s22=875.51*10^(-3)-100.72*10^(-3)*i
gamma_L=conj((s22+(s12*s21*gamma_s)/(1-s11*gamma_s)))
z_L=gamma2z(gamma_L,50)

Hello, i need to test the  parameter Kf under some conditions in subthreshold.i cannot just plot the OP param,becasue i need to derive it under certain conditions.

Spectre(of Cadence) like BSIM(of Berkley) has developed a method for deriving each parameter in their model.

Is there a way to help me with such manual where i can test in cadence virtuoso the Kf parameter shown in the formula bellow?

Thanks.

Hi,

i am designing a broadband (100 MHz -6 GHz BW) receiver chain for  radar/rcs measurement tester. i will put Low noise amplifier after antenna input followed by mixed(10 MHz IF BW and digitizer.

I am facing problem regarding LAN. bandwidth of LAN is  approx 6 GHz(100 MHz-6GHz), gain 25-35 dB, with NF less than 2. I am uncertain about noise floor at the output of LNA.  I dont know exact SNR at the input of LNA but it shall be good.System operation will be on stepped CW waveform so receiver input signal will sweep over the BW and some step size.

so LNA output r noise floor will be? i assume, we can neglect thr role of input noise because it will be lesser than internal noise of LNA.

will it be LNA internal noise (Thermal noise due to BW) only ?

will it be LNA internal noise (Thermal noise due to BW)  + LAN Gain ? -78+25 =-53 dB? internal noise shall be lesser because NF is less than 3 . 

i have practically observed that that output noise floor is much lesser then even thermal noise( over LNA BW). i have gone through some tutorial where  formula says( internal noise+input noise)+gain. in  my case input noise shall be much less than theoretical internal noise. 

Thanks

Hello, There is a manual in matlab of matching LNA  shown in the link bellow.

In it as shown in the plot bellow they mention input and output circle plots.

Is there such option of input and output circle in cadence virtuoso?

https://www.mathworks.com/help/rf/examples/designing-matching-networks-part-1-networks-with-an-lna-and-lumped-elements.html

Hi Guys,

Anyone know equivalent skill for create detail.

Eugene

hello there, i'm a student studying allegro PCB designer.

There are some commands that i can do with GUI, but i want to know what kind of commands i used so that i can route with commands only(ex) skill).

Is there any file that i can see what kind of commands i used something like log files or command history?

thank you for reading this long boring question.

I am trying to understand why axlDBTextBlockCompact(nil) on my test case says it can compact the text blocks down to 38, whereas I find only a total of 26 unique text block references in axlDBGetDesign()->text, axlDBGetDesign()->symbols and axlDBGetDesign()->symdefs. Where else are text blocks used besides these three?

We have many legacy board designs which have non-standard films. I'm writing SKILL code to automatically align a board's film records with our internal standard.

While I'm sure there will be multiple questions, here are the first two I've run into:

1. It seems the polyCutLayer parameter of axlFilmCreate() doesn't work. You can easily see this for yourself. Try typing "axlFilmCreate("test" ?polyCutLayer nil)" on the command window in Allegro. I'm returned "nil", indicating the film could not be created, and I see "*WARNING* (axlFilmCreate): Invalid option type: ?polyCutLayer" in the command window. Just to try a different parameter and see that it works, try "axlFilmCreate("test" ?negative t)". I'm returned a "t" and the film is created. Page 139 of 17.4-2019 algroskill.pdf shows this parameter and I can see it listed if I inspect an existing from from the DB, so what gives? Is the polyCutLayer parameter broken when creating films?

2. In conjunction with the above, if I loop through all current films and use axlDeleteObject() to remove them all, and then try to create new films but give an argument to the polyCutLayer parameter, films containing copper layers seem to be automatically created. There are four films (my test board has four layers) with the ETCH/, PIN/, and VIA CLASS/ subclasses. I am able to manually delete all films and see absolutely no films at all. Is there something weird going on here or is this to be expected for some reason?

I'm running Allegro 17.4s002.