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How To Excel At Great UX Design

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How To Port Your Airtel Mobile Connection To A Jio Number: Follow These Simple 4 Steps

You can now port from Airtel to Jio and vice versa through these easy 4 steps.




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The correlogram: Visualize correlations by fitting angles

A common way to visualize the sample correlations between many numeric variables is to display a heat map that shows the Pearson correlation for each pair of variables, as shown in the image to the right. The correlation is a number in the range [-1, 1], where -1 indicated perfect [...]

The post The correlogram: Visualize correlations by fitting angles appeared first on The DO Loop.





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Congress To Begin 'Delhi Nyay Yatra' Today Against AAP Government's Policies

The Congress will begin a month-long 'Delhi Nyay Yatra' from Rajghat on Friday to corner the Aam Aadmi Party government on various issues affecting the city.




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1 Killed, 2 Injured, 13 Rounds Fired: 3 Minors Arrested In Delhi Shootout

One person was killed and two others were injured when three men on a motorcycle opened fire on three friends returning home on a scooter last night in the Kabir Nagar area of North East Delhi.




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Explosion At Hyderabad Hotel Damages Six Huts, Injures 2

The explosion occurred in Telangana Spice Kitchen on Road Number One Jubilee Hills. According to police, the explosion damaged the boundary wall of the hotel.




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24% Deaths In Delhi Caused Due To Infectious, Parasitic Diseases: Report

A Delhi government report has attributed nearly 24 per cent of the total about 89,000 deaths registered in the national capital in 2023 to infectious and parasitic diseases like cholera, diarrhoea, tuberculosis and hepatitis B, among others.




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Video: Man Climbs Electric Tower In Noida, Dances On Top Of It

A man climbed an electric tower in Uttar Pradesh's Noida Sector 76 on Sunday afternoon. After nearly two hours, he was brought down by the police and fire department officials.




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UP Girl's Hair Gets Entangled In Ferris Wheel's Rod; Scalp Ripped Off

In a horrifying incident at a fair in Kannauj, Uttar Pradesh, a teenage girl's hair became entangled in the roller of a swing, resulting in her entire scalp being ripped out.




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Jailed Gangster's Wife Tries To Extort Rs 2 Crore From Hotelier, Arrested

Police on Monday arrested Manisha, wife of jailed gangster Kaushal Chaudhary, for allegedly trying to extort Rs 2 crores from a hotel owner, officials said.




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BJP MP Inaugurates 12-Lane Highway In South Delhi To Ease Traffic

BJP MP from South Delhi Ramvir Singh Bidhuri on Tuesday inaugurated a newly constructed stretch of a 12-lane national highway connecting Mithapur Chowk to the Mumbai-Baroda highway in the Badarpur area.




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6,791 Power Connections Provided In Delhi On Lt Governor's Intervention

Power discoms have provided electricity connections to 6,791 of the 10,802 applicants living in Delhi's unauthorised colonies following Lieutenant Governor V K Saxena's intervention, the Raj Niwas said on Tuesday.




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DUSU Election Results To Be Announced On November 21

The results for the Delhi University Students' Union elections will be declared on November 21, almost two months after the polls were held, according to university officials.




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Imane Khelif: Boxer In Gender Row And Now Olympic Champion

Born in a poor village, Algerian boxer Imane Khelif has overcome numerous obstacles throughout her life to win a controversial Paris Olympics gold on Friday.




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Ratan Tata's Journey From Mumbai Boy To Global Icon - A Timeline

Ratan Naval Tata, the business titan and global icon who led the Tata behemoth from thirty countries to over a hundred since becoming chairman in 1991, died today at Mumbai's Breach Candy Hospital. He was 86.




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Noel Tata Takes Over From Ratan Tata. Know The Tata Ancestry And History

Founded in 1868, Tatas have become one of largest and most diverse global conglomerates. It is a name heard in almost every home in India and tens of millions overseas.










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Telangana train accident: Goods train derails near Peddapalli. Check full list of cancelled, diverted trains today | Today News - Mint

  1. Telangana train accident: Goods train derails near Peddapalli. Check full list of cancelled, diverted trains today | Today News  Mint
  2. Goods train derails in Telangana's Peddapalli; 20 trains cancelled, 10 diverted  The Economic Times
  3. 11 coaches of goods train derail in Telangana  The Times of India
  4. Goods train derailment in Telangana affects rail traffic between Delhi and Chennai  Telangana Today
  5. Goods train derails in Telangana's Peddapalli; 30 trains cancelled, several diverted  The Hindu







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UK University Tells Rich Students To Not Be A 'Snob' To Poorer Classmates

A guidance has been issued to the wealthier students with a list of actions they need to follow to create an inclusive environment.




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Here's Why India Celebrates Jawaharlal Nehru's Birthday As Children's Day

Children's Day, also known as 'Bal Diwas', is celebrated annually on November 14 in India. The day is celebrated to appreciate and acknowledge children as they are the future of the county.




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Man Seeks Online Help To Decode Devanagari Text He Found At German Market

A man recently took to Reddit, seeking help identifying an unknown Devanagari text he found at a flea market in Germany.




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Krispy Kreme To Celebrate World Kindness Day With Free Doughnuts

The offer is valid across the US. Some of its international locations - the chain operates in 40 countries - also have World Kindness Day promotions planned.




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Mumbai, Delhi, Bengaluru, Hyderabad Airports Won’t Be Sold To Private Investors: Privatization Plan Put On Hold

The government is temporarily freezing the proposed sale of AAI’s stakes in the private joint ventures operating the airports at Delhi, Mumbai, Hyderabad and Bangalore. Reason The finance ministry has decided to defer for now the sale of the AAI’s residual stakes in these four joint ventures, the reason being that the valuations could be […]




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Apple Wants To Shift iPhone Production To India, Vietnam & Completely Ignore China For This Reason

Recently, Apple is accelerating its plans to shift some of its production outside China. The Cupertino headquartered company is asking its suppliers to plan more for assembling the product elsewhere in Asia, particularly India and Vietnam. Apple Shifting Assembly Line Outside Of China Sources involved in this discussion also said that Apple is also looking […]




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India Beats China In Air Travel Safety: Ranking Jumps From 102 To 48 In Global Aviation Safety

India’s air safety protocols and executions have improved drastically over the years, as validated by the findings of a specialized agency of the United Nations, the International Civil Aviation Organization or ICAO. The UN watchdog has upgraded India’s ranking in terms of aviation safety to the 48th position, jumping past the rankings of countries like […]




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Intel to spin-off and sell Wind River Software to TPG

Wind River, an IoT and industrial operating system owned by Intel will be acquired by TPG, global alternative asset firm. Terms of the deal were not disclosed. Intel had bought Wind River Systems for $884 million in 2009

Wind River operates in several markets, including aerospace and defense, automotive, industrial, medical and networking technologies. Its core products in these markets are operating systems, software infrastructure platforms, device management, and simulation software. The IoT practice of Wind River provides consulting services for customers building IoT applications.

In a statement for Wind River, Nehal Raj, Partner and Head of Technology investing at TPG said “We see a tremendous market opportunity in industrial software driven by the convergence of the Internet of Things (IoT), intelligent devices and edge computing. As a market leader with a strong product portfolio, Wind River is well positioned to benefit from these trends. We are excited about the prospects for Wind River as an independent company, and plan to build on its strong foundation with investments in both organic and inorganic growth.”

Wind River’s main IoT product is Helix Device Cloud, a cloud-offering capable of managing deployed IoT devices and industrial equipment across a machine’s lifecycle. Helix can connect and manage devices remotely.

Helix platform’s key uses cases are gateway management, proactive maintenance, security updates, and device provisioning.




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Salesforce and other tech giants invest $24M in IFTTT to help it expand in enterprise IoT

IFTTT (If This Than That), a web-based software that automates and connects over 600 online services/software raised a $24M Series C led by Salesforce. Other investors include IBM and the Chamberlain Group and Fenox Venture Capital.

New apps and devices that made their way to IFTTT

The latest round brings IFTTT’s funding to $63M and it will use the funding proceeds to provide integration for enterprise and IoT services and hiring. In IFTTT’s platform, applets are code/script users need to deploy to integrate two or more services (such Google Drive’s integration with Twitter/Facebook).

“IFTTT is at the forefront of establishing a more connected ecosystem for devices and services. They see IFTTT as an important business, ecosystem, and partner in the industry,” said CEO Linden Tibbets.

Investment in IFTTT reveals that Salesforce is consolidating its presence in enterprise IoT space. It also acquired Mulesoft, an integration platform that rivals Microsoft’s BizTalk.

IBM’s investment in IFTTT is also noteworthy as the former is pushing its IBM Watson IoT platform. The following statement also shows its keen interest in IFTTT.

“IBM and IFTTT are working together to realize the potential of today’s connected world. By bringing together IBM’s Watson IoT Platform and Watson Assistant Solutions with consumer- facing services, we can help clients to create powerful and open solutions for their users that work with everything in the Internet of Things,” said Bret Greenstein, VP, Watson Internet of Things, IBM.

Other recent investments in IoT companies include $30M Series B of Armis and Myriota's $15M for its IoT satellite-based connectivity platform.

For latest IoT funding and product news, please visit our IoT news section.




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Amber Solutions raises $3.3M Series A to fast track sales of its smart electrical products

Amber Solutions, an IoT product company that sells smart outlets, switches and circuit breakers closed Series A Preferred Stock round of financing that equals $3.3M in gross proceeds. Amber will use the funds to support the commercial development of Amber's core technologies.

One of Amber’s product is solid-state circuit interrupter (GFCI) that basically stops harmful levels of electricity from passing through a person. It operates as a safety device alerting the homeowner of electrocution incidents in real time.

"We are pleased that our investors are embracing Amber's vision of bringing superior IoT intelligence and connectivity to a highly strategic area--the single gang box locations within the standard electrical infrastructure in homes and buildings," said Amber Solutions CEO Thar Casey.
"Amber's smart outlets and switches strategically aggregate IoT sensors and functions within a structure's single gang box locations. This means a more discreet and yet wider array of IoT sensing and control in every room than is typical today,"Casey further added.

Amber Solutions’ core markets are builders that prepare smart home/smart building ready infrastructure, certified electrical contractors or remodelers, and electrical manufacturers.

Amber products

Other latest funding news include Owlet’s $24M Series B, Axonize’s $6M Series A round and addition of Deutsche Telekom as its strategic investor, and $30M Series B raised by Palo Alto-based Armis.




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EV Ultimo launches platform in the Electric Vehicles ecosystem

EV Ultimo launches platform to assist brands, buyers, stakeholders in the Electric Vehicles ecosystem




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Operation Shanela Yielded Good Results in the Joe Gqabi District

[SAPS] SAPS members' continued efforts to prevent and detect crime yielded the following successes within the Joe Gqabi District as part of Operation Shanela during the week and start of the weekend .




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COP29 Expected Finalise Financing Model for Developing Economies

[SAnews.gov.za] With the United Nations Framework Convention on Climate Change (COP29) taking place this week, South Africa expects the COP29 Presidency to enhance efforts to finalise the New Collective Quantified Goal on Finance (NCQG), which is a matter of great importance for developing economies.





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Cosatu Welcomes the Drop in the Unemployment Rate

[COSATU] The Congress of South African Trade Unions (COSATU) welcomes the slight drop in the expanded unemployment rate from 42.6% in the second quarter to 41.9% in the third quarter of this year.




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Media Reminder - Na and NCOP to Hold Plenary Sittings to Discuss 16 Days of Activism and Infrastructure Development

[Parliament of South Africa] Parliament, Tuesday, 12 November 2024 - The National Assembly (NA) will hold a plenary session scheduled to start at 10:00. Among the items on the agenda from 10:00 to 13:00 is the statement by the Minister of Water and Sanitation on water security in the country and a debate on 16 Days of Activism for no violence against women and children. The debate will be held under the theme, "Marking 30 years of democratic rights for women and fostering national unity to end gender-based violence".




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A South African Politician Ends Up Homeless in Nthikeng Mohlele's Spicy New Novel - but Is It Any Good?

[The Conversation Africa] Despite the flaws in the latest novel by South African writer Nthikeng Mohlele, there is something alluring about Revolutionaries' House. It is Mohlele's most political novel, and the parallels drawn between love and politics - and their pitfalls - are intriguing.




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Navigating Chiplet-Based Automotive Electronics Design with Advanced Tools and Flows

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which are themselves parts of a whole silicon system, offer unparalleled potential for improving system performance, reducing manufacturing costs, and accelerating time-to-market in the automotive sector. However, the transition to working with chiplets in automotive electronics is not without its challenges.

Designers must now grapple with a new set of considerations, such as die-to-die interconnect standards, complex processes, and the integration of diverse IPs. Advanced toolsets and standardized design approaches are required to meet these challenges head-on and elevate the potential of chiplets in automotive innovation. In the following discourse, we will explore in detail the significance of chiplets in the context of automotive electronics, the obstacles designers face when working with this paradigm, and how Cadence comprehensive suite of IPs, tools, and flows is pioneering solutions to streamline the chiplet design process.

Unveiling Chiplets in Automotive Electronics

For automotive electronics, chiplets offer a methodology to modularize complex functionalities, integrate different chiplets into a package, and significantly enhance scalability and manufacturability. By breaking down semiconductor designs into a collection of chiplets, each fulfilling specific functions, automotive manufacturers can mix and match chiplets to rapidly prototype new designs, update existing ones, and specialize for the myriad of use cases found in vehicles today.

The increasing significance of chiplets in automotive electronics comes as a response to several industry-impacting phenomena. The most obvious among these is the physical restriction of Moore's Law, as large die sizes lead to poor yields and escalating production costs. Chiplets with localized process specialization can offer superior functionality at a more digestible cost, maintaining a growth trajectory where monolithic designs cannot. Furthermore, chiplets support the assembly of disparate technologies onto a single subsystem, providing a comprehensive yet adaptive solution to the diverse demands present in modern vehicles, such as central computing units, advanced driver-assistance systems (ADAS), infotainment units, and in-vehicle networks. This chiplet-based approach to functional integration in automotive electronics necessitates intricate design, optimization, and validation strategies across multiple domains.

The Complexity Within Chiplets

Yet, with the promise of chiplets comes a series of intricate design challenges. Chiplets necessitate working across multiple substrates and technologies, rendering the once-familiar 2-dimensional design space into the complex reality of multi-layered, sometimes even three-dimensional domains. The intricacies embedded within this design modality mandate devoting considerable attention to partitioning trade-offs, signal integrity across multiple substrates, thermal behavior of stacked dies, and the emergence of new assembly design kits to complement process design kits (PDKs).

To effectively address these complexities, designers must wield sophisticated tools that facilitate co-design, co-analysis, and the creation of a robust virtual platform for architectural exploration. Standardizations like the Universal Chip Interconnect Express (UCIe) have been influential, providing a die-to-die interconnect foundation for chiplets that is both standardized and automotive-ready. The availability of UCIe PHY and controller IP from Cadence and other leading developers further eases the integration of chiplets in automotive designs.

The Role of Foundries and Packaging in Chiplets

Foundries have also pivoted their services to become a vital part of the chiplet process, providing specialized design kits that cater to the unique requirements of chiplets. In tandem, packaging has morphed from being a mere logistical afterthought to a value-added aspect of chiplets. Organizations now look to packaging to deliver enhanced performance, reduced power consumption, and the integrity required by the diverse range of technologies encompassed in a single chip or package. This shift requires advanced multiscale design and analysis strategies that resonate across a spectrum of design domains.

Tooling Up for Chiplets with Cadence

Cadence exemplifies the rise of comprehensive tooling and workflows to facilitate chiplet-based automotive electronics design. Their integrations address the challenges that chiplet-based SoCs present, ensuring a seamless design process from the initial concept to production. The Cadence suite of tools is tailored to work across design domains, ensuring coherence and efficiency at every step of the chiplet integration process.

For instance, Cadence Virtuoso RF subflows have become critical in navigating radio frequency (RF) challenges within the chiplets, while tools such as the Integrity 3D-IC Platform and the Allegro Advanced Multi-Die Package Design Solution have surfaced to enable comprehensive multi-die package designs. The Integrity Signal Planner extends its capabilities into the chiplet ecosystem, providing a centralized platform where system-wide signal integrity can be proactively managed. Sigrity and Celsius, on the other hand, offer universally applicable solutions that take on the challenges of chiplets in signal integrity and thermal considerations, irrespective of the design domain. Each of these integrated analysis solutions underscores the intricate symphony between technology, design, and packaging essential in unlocking the potential of chiplets for automotive electronics.

Cadence portfolio includes solutions for system analysis, optimization, and signoff to complement these domain-specific tools, ensuring that the challenges of chiplet designs don't halt progress toward innovative automotive electronics. Cadence enables designers to engage in power- and thermal-aware design practices through their toolset, a necessity as automotive systems become increasingly sophisticated and power-efficient.

A Standardized Approach to Success with Chiplets

Cadence’s support for UCIe underscores the criticality of standardized approaches for heterogeneous integration by conforming to UCIe standards, which numerous industry stakeholders back. By co-chairing the UCIe Automotive working group, Cadence ensures that automotive designs have a universal and standardized Die-to-Die (D2D) high-speed interface through which chiplets can intercommunicate, unleashing the true potential of modular design.

Furthermore, Cadence champions the utilization of virtual platforms by providing transaction-level models (TLMs) for their UCIe D2D IP to simulate the interaction between chiplets at a higher level of abstraction. Moreover, individual chiplets can be simulated within a chiplet-based SoC context leveraging virtual platforms. Utilizing UVM or SCE-MI methodologies, TLMs, and virtual platforms serve as first lines of defense in identifying and addressing issues early in the design process before physical silicon even enters the picture.

Navigating With the Right Tools

The road to chiplet-driven automotive electronics is one paved with complexity, but with a commitment to standards, it is a path that promises significant rewards. By leveraging Cadence UCIe Design and Verification IP, tools, and methodologies, automotive designers are empowered to chart a course toward chiplets and help to establish a chiplet ecosystem. With challenges ranging from die-to-die interconnect to standardization, heterogeneous integration, and advanced packaging, the need for a seamless integrated flow and highly automated design approaches has never been more apparent. Companies like Cadence are tackling these challenges, providing the key technology for automotive designers seeking to utilize chiplets for the next-generation E/E architecture of vehicular technology.

In summary, chiplets have the potential to revolutionize the automotive electronics industry, breathing new life into the way vehicles are designed, manufactured, and operated. By understanding the significance of chiplets and addressing the challenges they present, automotive electronics is poised for a paradigm shift—one that combines the art of human ingenuity with the power of modular and scalable microchips to shape a future that is not only efficient but truly intelligent.

Learn more about how Cadence can help to enable automakers and OEMs with various aspects of automotive design.




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How to see placement reasons of cells? How to highlight timing start/end points?

I am working with innovus on a huge design. I found some cells are placed far away from both timing start points and timing end points. I suspect some other timing paths may be near-critical that results in this sub-optimal cell placement; or innovus has to place the cell far away due to congestion of placement or routing.

Is there a way to see why innovus places/moves the cell during place_opt_design or ccopt_design?

Also, is there a way to highlight all timing start points or timing end points that go through a cell? There may be thousands of timing paths through this cell. I tried using report_timing and timing debugger but it is very painful to click the highlight box and highlight the timing paths one by one.

Thank you for your help!




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what is "cell with Zero maximum clock transition time" ?

anyone know what is "cell with Zero maximum clock transition time"  ?

not zero transition, not maximum transtion, it is zero maximum clock transition time.

it means X0 cell? (drive-strength)

can you explain? 

thanks :-)




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Clock doubler SDC modelling

Hi all,

I'm trying to model the clock of a clock doubler. The doubler consists of a delay cell and an XOR gate, which generates a pulse on both the rising and falling edge of the input clock. I've created a simple module to evaluate this. In this case, DEL1 and XOR2 are standard library cells. There is a don_touch constraint on both library cells as well as on clk_d.

module top (
input wire clk,
output reg Q);

//Doubler
wire clk_d;
wire clk_2x;
DEL1 u_delay (.I(clk),.Z(clk_d));
XOR2 u_xor (.A1(clk),.A2(clk_d),.Z(clk_2x));

//FF for connecting the clock to some leaf:
always @(posedge clk_2x) Q<=~Q;

endmodule

My SDC looks like this:

create_clock [get_ports {clk}] -name clk_i -period 100
set_clock_latency -rise 0.1 [get_pins u_xor/Z]
set_clock_latency -fall 0.4 [get_pins u_xor/Z]
create_generated_clock -name clk_2x -edges {1 1 2 2 3} -source clk [get_pins u_xor/Z]

The generated clock is correctly generated but the pulse width is zero. I would be expecting that the pulse width is the difference between fall and rise latency but is not applied:

report_clocks:

report_clocks -generated:

clk_2x is disconnected from the FF after syn_generic. What can I do to model some minimum pulse width? Will innovus later on model this correctly with the delay of DEL1?




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How to import different input combination to the same circuit to get max, min, and average delay, power dissipation and area

Hi everyone. 

I'm very a new cadence user. I'm not good at using it and quite lost in finding a way to get the results. With the topic, I would like to ask you for some suggestions to improve my cadence skills.

I have some digital decision logic. Some are combinational logic, some are sequential logic that I would like to import or generate random input combination to the inputs of my decision logic to get the maximum, minimum, and average delay power dissipation and area when feeding the different input combination.

My logic has 8-bit, 16-bit, and 32-bit input. The imported data tends to be decimal numbers.

I would like to ask you:

- which tool(s) are the most appropriate to import and feed the different combination to my decision logic?

- which tool is the most appropriate to synthesis with different number of input? - I have used Genus Synthesis Solution so far. However with my skill right now I can only let Genus synthesize my Verilog code one setup at a time. I'm not sure if I there is anyway I can feed a lot of input at a time and get those results (min, max, average of delay, power dissipation and area)

- which language or scripts I should pick up to use and achieve these results?

-where can I find information to solve my problem? which information shall I look for?

Thank you so much for your time!!

Best Regards




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IC 23.1 installation configuration failure on RHEL 9

I am trying to install IC231 on RHEL 8 using installscape, however configuring keeps failing.

I tried to run the configuration file manually as suggested in one of the previous posts and it gives me following errors:

sh batch_configure.sh
/home/rs/cadence/installs/IC231/install/tmp/slconfig.sh: line 165: xterm: command not found
cat: ncvhdl23.03-d103lnx86_101124125631.stat: No such file or directory
rm: cannot remove 'ncvhdl23.03-d103lnx86_101124125631.stat': No such file or directory
/home/rs/cadence/installs/IC231/install/tmp/slconfig.sh: line 165: xterm: command not found
cat: ncvhdl64b23.03-d103lnx86_101124125631.stat: No such file or directory
rm: cannot remove 'ncvhdl64b23.03-d103lnx86_101124125631.stat': No such file or directory
/home/rs/cadence/installs/IC231/install/tmp/slconfig.sh: line 165: xterm: command not found
cat: oaRedist22.61-p003lnx86_101124125631.stat: No such file or directory
rm: cannot remove 'oaRedist22.61-p003lnx86_101124125631.stat': No such file or directory
/home/rs/cadence/installs/IC231/install/tmp/slconfig.sh: line 165: xterm: command not found
cat: amsEnv64b23.10-p043lnx86_101124125631.stat: No such file or directory
rm: cannot remove 'amsEnv64b23.10-p043lnx86_101124125631.stat': No such file or directory
/home/rs/cadence/installs/IC231/install/tmp/slconfig.sh: line 165: xterm: command not found
cat: ihdl64b23.10-p043lnx86_101124125631.stat: No such file or directory
rm: cannot remove 'ihdl64b23.10-p043lnx86_101124125631.stat': No such file or directory

I am not very well versed with Linux at the moment but trying. Could any one suggest something or point to what is missing?