Hi! 

I am attempting to create a very simple test pcell that contains a single Nmos 4 terminal device (Gate, Source, Drain, Backgate). However, unlike other devices I have used in the past, the backgate terminal of the device I wish to include within the pcell is an inherited connection, and the other 3 are physical terminals. Note that for the pcell master, I do not want any inherited connections, just physical pins. Hence I need to drive this inherited connection with a pin within my pcell. I started implementing the symbol and schematic first, ensuring I could obtain the correct connectivity, extract netlist, etc. I thought I had it hooked up correctly, but alas I am failing to export the CDL. Let me explain my current approach.

Schematic:

Create the 4 physical pins using a combination of dbCreateInst (for the pin isnt), dbMakeNet, dbCreateTerm and dbCreatePin.

Create the device instance using dbCreateInstByMasterName and setting the desired cdf parameters + callbacks.

For the physical terminals of the device, I'm using dbCreateConnByName to make the connection to the appropriate net that was created above.

For the inherited connection, I am creating a netSet property like so: dbCreateProp(newinst deviceTermName "netSet" netName)

Symbol:

Create the 4 physical pins using a combination of dbCreateRect, dbMakeNet, dbCreateTerm, dbCreatePin.

And then create whatever symbol design I wish using the likes of dbCreateRect, dbCreateLine, etc. 

Everything works fine when using a device without an inherited connection, so I'm guessing I'm missing something along this line... Also, if I copy the contents of the pcell schematic to a regular schematic view, do a check and save, the view extracts just fine. So I wonder if the check and save it fixing the connectivity that I may not have. 

Thanks for any possibly engagement or suggestions 🙂

Keelan

A new Python library has been written to facilitate an interface between Python and AWR software using a command structure that adheres more closely to Python coding conventions. This library is labeled "pyawr-utils" and it is installed using the standard Python pip command. Comprehensive documentation for installing and using pyawr-utils is available.(read more)

The Cadence AWR Design Environment V22.1 production release is now available for download at Cadence Downloads with design environment, AWR Microwave Office, AWR VSS, AWR Analyst, and other enhancements.(read more)

Hello All:

I am looking for help on the following, as I am new to Cadence tools [I have to use Cadence Innovus for Physical Design after Logic Synthesis using Synopsys Design Compiler, using Nangate 45 nm Open Cell Library]: while using Cadence Innovus, I would need to select a few specific nets to be routed through a specific metal layer. How can I do this on Innovus [are there any command(s)]? Also, would writing and sourcing a .tcl script [containing the command(s)] on the Innovus terminal after the Placement Stage of Physical Design be fine for this?

Secondly, is there a way in Innovus to manipulate layout components, such as changing some pin placements, wire directions (say for example, wire direction changed to facing east from west, etc.) or moving specific closely placed cells around (without violating timing constraints of course) using any command(s)/.tcl script? If so, would pin placement changes and constraining some closely placed cells to be moved apart be done after Floorplanning/Powerplanning (that is, prior to Placement) and the wire direction changes be done after Routing? 

While making the necessary changes, could I use the usual Innovus commands to perform Physical Design of the remaining nets/wires/pins/cells, etc., or would anything need modification for the remaining components as well?

I would finally need to dump the entire design containing all of this in a .def file.

I tried looking up but could only find matter on Virtuoso and SKILL scripting, but I'd be using Innovus GUI/terminal with Nangate 45 nm Open Cell Library. I know this is a lot, but I would greatly appreciate your help. Thanks in advance.

Riya

Hi,

I have synthesized a verilog code. When performing the pnr in innovus it is showing the error "Instance g5891__718 (similar for other) of the cell AND2_X6 has no physical library or has wrong dimension  values (<=0). Check your design setup to make sure the physical library is loaded in and attribute specified in library are correct.

When importing synthesized netlist in virtuoso then it says " Module AND2_X6, instantiated in the top module decoder, is not defined. Therefore the top module decoder will be imported as functional."

Please help what's going on here? 

This document resolved my first query,

Article (11638952) Title: How to output power and ground nets to GDS
URL: support.cadence.com/.../ArticleAttachmentPortal

but now I have 20 power and 20 ground

below is my code

------------------------------------------------
variable GND "vss1" "vss2" "vss3" ... "vss20"
variable VDD "vdd1" "vdd2" "vdd3" ... "vdd20"

select_net M1 GND -outputlayer GND_M1
select_net M2 GND -outputlayer GND_M2
...
select_net AP GND -outputlayer GND_AP

select_net M1 VDD -outputlayer VDD_M1
select_net M2 VDD -outputlayer VDD_M2
...
select_net AP VDD -outputlayer VDD_AP

rule GND{

copy GND_M1
copy GND_M2
...
copy GND_AP}

rule VDD{

copy VDD_M1
copy VDD_M2
...
copy VDD_AP}
------------------------------------------------

I want 20 GND and 20 VDD are separately to highlight,
like this

Can DRC command use for-loop(skill or Tcl) to split the rule?
or how can I do to split it? 
I don't really want to repeat the rule 40 times..haha😅 (use Pegasus 22.21)

I'm currently trying to explore the verilog simulation option in cadence.

One thing that comes to my mind that if there exists a way in cadence workflow to dump selected register/wire's waveform during the simulation. 

Are there any additional tools needed apart from xcelium, is there a tutorial or specific training course for this aspect. I glance through Xcelium Simulator Course Version 22.09, but it seems not having related context. 

I know in Synopsys's workflow, it can be realized using verdi & fsdb in the command line as follows:

if (inst.CTRL_STATE==STATE_START_TO_DUMP)

$fsdbDumpvars(0, inst_1.reg_0);

end

Thanks in advance!

hi

How can I tell the LEC tool to ignore a combination of Primary input bus in both Golden and revised.

For example in both Golden and revised there is 

input [3:0] data_in

I want LEC not to check the case that data_in[3:0] == 4'b1000

Artificial intelligence (AI) is everywhere. Machine learning (ML) and its associated inference abilities promise to revolutionize everything from driving your car to making your breakfast. Verification is never truly complete; it is over when you run...(read more)

Learn how Xcelium PowerPlayback App enables the massively parallel Xcelium replay of waveforms for glitch-accurate power estimation of multi-billion gate SoC designs.(read more)

Xcelium Simulator has been in the industry for years and is the leading high-performance simulation platform. As designs are getting more and more complex and verification is taking longer than ever, the need of the hour is plug-and-play apps that ar...(read more)

NAND Flash memory is now a widely accepted non-volatile memory in many application areas for data storage such as digital cameras, USB drive, SSD and smartphones. One form of NAND flash memory, Toggle NAND, was introduced to transmit high-speed data asynchronously thus consuming less power and increasing the density of the NAND flash device. 

The initial Toggle NAND versions had memory arranged in terms of SLC (Single Level Cell) or MLC (Multi Level Cell) mode that was considered as a 2D scalar stack and their frequency of operation was also less. The ever-growing demand of high memory capacity and high throughput required further research in the areas like the shrinking size of cell, performance to fill-in these gaps.

Some of these new requirements were incorporated, leading to newer versions of Toggle NAND, namely 3.0 and 4.0, with a re-arrangement of the internal memory developing a 3D layer of memory. With such structures, higher capacity of the memory was possible, but performance was the primary challenge as the latency of the write/read of memory quadrupled with the same frequency.

The key to improving the performance and run the device at very high speed in low power mode was to enhance the frequency of operation for faster read/writes to the memory and reduce the voltage levels.

But with every technology advancement comes some other problems, the next being the data sampling at that high frequency that can cause setup/hold time issues. To overcome these concerns, different types of trainings on the signal interface were made mandatory that shall assist in proper sampling of the data. Few other features for improving the integrity of the signals were added.

The current set of commands were applicable to access the SLC and MLC memory modes but with the 3D layering, these commands were lacking access to the entire set of TLC (Triple Level Cell) and QLC (Quad Level Cell) memory modes. Thus, more commands were required to make sure that the 3D layering was fully written/read.

Main features of Toggle NAND 4.0 :

• High Density of Memory
• High Frequency of operation, greater than 800 MHz
• Data Trainings

Cadence Verification IP for Flash Toggle NAND 4.0 is available to support the newer version of Flash Toggle NAND 4.0, allowing to simulate the memory device for efficient IP, SoC, and system-level design verification. Semiconductor companies can start using it to fully verify their controller design and achieve functional verification closure on it within no time. 
 
Gaurav 

The rising customer expectations, intermingling fields and high performance needs can be satisfied with the system based design. An intelligent Systems Design strategy can offer a quicker route to an optimum design and helps to increase designers' productivity and analyzes efficiency by providing the ability to explore the entire design space. Cadence Intelligent System Strategy enables a system design revolution and reduces project schedules with optimized continuous integration.(read more)

Live Doc is an advanced automated PCB documentation generation tool integrated with OrCAD X Presto designed to streamline the creation of PCB documentation. By automating the generation of PCB fabrication and assembly drawings, Live Doc significantly...(read more)

Cadence is super excited to announce SPB 23.1 release —Your freedom to design boldly!  

These tools help engineers build better PCBs faster with the new 3D engine and optimized interface.  

We have been hard at work to bring you this release and believe that it will help you take control of the PCB design process with the powerful new features in Allegro X APD like: 

• Packaging Support in 3DX Canvas 

• 3DX Wire DRCs 

• Aligning Components by Offset 

• Text Wizard Enhancements 

• Device File Reuse for Existing Components for Netlist and Logic Import 

Watch this space to know all about What’s New in SPB 23.1.  

Regards 

Team PCBTech 

Cadence Design System 

For individuals, small businesses, or teams, START YOUR FREE TRIAL. 

Does anyone know how to not include a pbar in a constraint manager analysis? I have some relative delay constraints applied on a group of differential nets. When I analyze the design these all show an error. If I delete the plating bar from the design they are all passing. The plating bar gets generated on the Substrate Geometry / Plating_Bar class. I understand that I could just delete the plating bar to verify the constraint but the issue is when I archive this design I would like it to be clean meaning it is in the final state for manufacturing AND passing all constraints according to design reviews.

Anyone have an idea? 

Thank you!

Hi，

I want to delete via use skill，but i dont write this skill. can you help me.

This skill has Interactive interface，the interface can imput  Select Net and select padstack；

I can  use temp group to select the via；

example，i want to delete via，the padstack is L1:L3，the net is vss. i can imput padstack  L1:L3 and select net: VSS；

Note: The green is VSS，the padstack L1:L3 and L3:L5 ；

thanks

By default, a dielectric must separate each pair of conductor layers in the cross-section of a design. In rare cases, this does not represent the real, manufactured substrate.

If your design requires you to have conductor layers that are not separated by a dielectric (such as, for half-etch designs), there is a variable that needs to be set in Allegro X APD. You must set this by enabling the variable icp_allow_adjacent_conductors. This entry, and its location in the User Preferences Editor, are shown in the following image.

The Objects on adjacent conductor layers do not electrically connect together, automatically. A via must be used to establish the inter-layer connections.

When enabling this option, it is recommended to exercise caution because excluding dielectric layers from your cross-section can lead to inaccurate calculations, including the calculations for signal integrity and via heights. It is important that your cross-section accurately reflect the finished product to ensure the most accurate results possible. Any dielectric layers present in the manufactured part need to be in the cross-section for accurate extraction, 3D viewing, and so on.

Let us know your comments on the various designs that would require adjacent conductor layers.

Verisium SimAI App harnesses the power of machine learning technology with the Cadence Xcelium Logic Simulator - the ultimate breakthrough in accelerating verification closure. It builds models from regressions run in the Xcelium simulator, enabling the generation of new regressions with specific targets. The Verisium SimAI app also features cousin bug hunting, a unique capability that uses information from difficult-to-hit failures to expose cousin bugs. With these advanced machine learning techniques, Verisium SimAI offers the potential for a significant boost in productivity, promising an exciting future for our users.

Figure 1: Regression compression and coverage maximization with Verisium SimAI 

What can I do with Verisium SimAI?

You can exercise different use cases with Verisium SimAI as per your requirements. For some users, the goal might be regression compression and improving coverage regain. Coverage maximization and hitting new bins could be another goal. Other users may be interested in exposing hard-to-hit failures, bug hunting for difficult to find issues. Verisium SimAI allows users to take on any of these challenges to achieve the desired results.

Let's go into some more details of these use cases and scenarios where using SimAI can have a big positive impact.

1. Using SimAI for Regression Compression and Coverage Regain

Unlock up to 10X compute savings with SimAI!

Verisium SimAI can be used to compress regressions and regain coverage. This flow involves setting up your regression environment for SimAI, running your random regressions with coverage and randomization data followed by training, and finally, synthesizing and running the SimAI-generated compressed regressions. The synthesized regression may prune tests that do not help meet the goal and add more runs for the most relevant tests, as well as add run-specific constraints. This flow can also be used to target specific areas like areas involving a high code churn or high complexity.

You can check out the details of this flow with illustrative examples in the following Rapid Adoption Kits (RAK) available on the Cadence Learning and Support Portal (Cadence customer credentials needed):

• Using SimAI with vManager (For Regression Compression and Coverage Regain) (RAK) 
• Using SimAI with a Generic Runner (For Regression Compression and Coverage Regain) (RAK)

2. Using SimAI for Coverage Maximization and Targeting coverage holes

Reduce your Functional Coverage Holes by up to 40% using SimAI!

Verisium SimAI can be used for iterative coverage maximization. This is most effective when regressions are largely saturated, and SimAI will explicitly try to hit uncovered bins, which may be hard-to-hit (but not impossible) coverage holes. This is achieved using iterative learning technology where with each iteration, SimAI does some exploration and determines how well it performed. This technique can also be used for bug hunting by using holes as targets of interest.

See more details on the Cadence Learning and Support Portal:

• Using SimAI for Coverage Maximization - vManager flow (RAK) 
• Using SimAI for Coverage Maximization - Generic Runner Flow (RAK)

3. Using SimAI for Bug Hunting

Discover and fix bugs faster using SimAI!

Verisium SimAI has a new bug hunting flow which can be used to target the goal of exposing hard-to-hit failure conditions. This is achieved using an iterative framework and by targeting failures or rare bins. The goal to target failures is best exercised when the overall failure rate is typically low (below 5%). Iterative learning can be used to improve the ability to target specific areas. Use the SimAI bug hunting use case to target rare events, low hit coverage bins, and low hit failure signatures.

See more details on the Cadence Learning and Support Portal:

• Using SimAI for Bug Hunting with vManager (RAK) 
• Using SimAI for Bug Hunting – Generic runner flow (RAK) 

Unlock compute savings, reduce your functional coverage holes, and discover and fix bugs faster with the power of machine learning technology now enabled by Verisium SimAI!

Please keep visiting  https://support.cadence.com/raks to download new RAKs as they become available.

Please note that you will need the Cadence customer credentials to log on to the Cadence Online  Support  https://support.cadence.com/, your 24/7 partner for getting help in resolving issues related to Cadence software or learning Cadence tools and technologies.

Happy Learning!

The Sigrity and Systems Analysis (SIGRITY/SYSANLS) 2024.1 release is now available for download at Cadence Downloads . For the list of CCRs fixed in this release, see the README.txt file in the installation hierarchy. SIGRITY/SYSANLS 2024.1 Here is a list of some of the key updates in the SIGRITY/SYSANLS 2024.1 release: For more details about these and all the other new and enhanced features introduced in this release , refer to the following document: Sigrity Release Overview and Common Tools What's New . Supported Platforms and Operating Systems Platform and Architecture X86_64 (lnx86) Windows (64 bit) Development OS RHEL 8.4 Windows Server 2022 Supported OS RHEL 8.4 and above RHEL 9 SLES 15 (SP3 and above) Windows 10 Windows 11 Windows Server 2019 Windows Server 2022 Systems Analysis 2024.1 Clarity 3D Solver Clarity 3D Layout Structure Optimization Workflow : A new workflow, Clarity 3D Layout Structure Optimization Workflow, has been added to Clarity 3D Layout. This workflow integrates Allegro PCB Designer with Clarity 3D Layout for high-speed structure optimization. Component Geometry Model Editor : The new Clarity 3D Layout editor lets you set up ports, solder bumps/balls/extrusions, and two-terminal and multi-terminal circuits using a single GUI. Coaxial Open Port Option Added to Port Setup Wizard : The Coaxial Open Port option lets you create ports for each target net pin and reference net pin in Clarity 3D Layout. The nearby reference net pins are then used as a reference for each target net pin, reducing the number of ports needed. In addition, the ports of unused reference net pins are shorted to the ground. Parametric Import Option Added : Two new options, Parametric Import and Default Import , have been added to the Tools – Launch Clarity3DWorkbench menu. The Parametric Import option lets you import the design along with its parameters into Clarity 3D Workbench. The Default Import option lets you ignore the parameters when importing the design into Clarity 3D Workbench. Component Library Added to Generate 3D Components : Clarity 3D Workbench now includes a new component library that lets you use predefined 3D component templates or add existing 3D components to create 3D designs and simulation models. AI-Powered Content Search Capability : Clarity 3D Workbench and Clarity 3D Transient Solver now support an AI-powered capability for searching the content and displaying relevant information. Expression Parser to Handle Undefined Parameters : Clarity 3D Workbench and Clarity 3D Transient Solver support writing expressions or equations containing undefined parameters in the Property window to describe a simulation variable. The improved expression parser automatically detects any undefined parameter in an expression and prompts users to specify their values. This capability lets you define a model or a simulation variable as a function instead of specifying static values. For detailed information, refer to Clarity 3D Layout User Guide and Clarity 3D Workbench User Guide on the Cadence Support portal. Clarity 3D Transient Solver Mesh Processing Improved to Simulate Large Use Cases : Clarity 3D Transient Solver leverages a new meshing algorithm that enhances overall mesh processing, specifically for large designs and use cases. The new algorithm dramatically improves the mesh quality, minimum mesh size, number of mesh key points, total mesh number, and memory usage. Advanced Material Processing Engine : The material processing capability has been enhanced to handle thin outer metal, which previously resulted in open and short issues in some designs. In addition, the material processing engine offers improved mode extraction for particular use cases, including waveguide and coaxial designs. Characteristic Impedance Calculation Improved : The solver engine now uses a new analytical calculation method to calculate the characteristic impedance of coaxial designs with improved accuracy. For detailed information, refer to Clarity 3D Transient Solver User Guide on the Cadence Support portal. Celsius Studio Celsius Interchange Model Introduced : Celsius Studio now supports Celsius Interchange Model generation, which is a 3D model derived from detailed physical designs for multi-physics and multi-scale analysis. This Celsius Interchange Model file ( .cim ) serves as a design information carrier across Celsius Studio tools, enabling a variety of simulation and analysis tasks . Celsius 3DIC Thermal Workflow Improvements : The Thermal Simulation workflows in Celsius 3DIC have been significantly enhanced. Key improvements include: Advanced Power Setup with Transient Power Function and Multi Mode options Enhanced GUI for the Mesh Control and Simulation Control tabs Improved meshing capabilities Celsius Interchange Model ( .cim ) generation Material library support for block and connections Import of Heat Transfer Coefficients (HTCs) from a CFD file Bump creation through the Bump Array Wizard Layer Stackup CSV file generation Celsius 3DIC Warpage and Stress Workflow Enhancements : The Warpage and Stress workflow in Celsius 3DIC has undergone significant improvements, such as: Improved multi-stage warpage simulation flow for 3DIC packaging process Enhanced GUI for the Mesh Control , Simulation Control , and Stress Boundary Conditions tabs Support for large deformations and temperature profiles Bump creation through the Bump Array Wizard New constraint types Enhanced meshing capabilities Geometric Nonlinearity Support in Warpage and Stress Analysis : Large deformation analysis is now supported in warpage and stress studies. This study uses the Total Lagrangian approach to model geometric nonlinearities in simulation, which allows accurate prediction of final deformations. Thermal Network Extraction and Simulation : In the solid extraction flow in Celsius 3D Workbench, you can now import area-based power map files to create terminals. For designs with multiple blocks, this capability allows automatic terminal creation, eliminating the need to manually create and set up 2D sheets individually. Additionally, thermal throttling feature is now supported in Celsius Thermal Network. This makes it ideal for preliminary analyses or when a quick estimation is required. It runs significantly faster than 3D models, allowing for quicker iterations and more efficient decision-making. For detailed information, refer to the Celsius 3DIC User Guide , Celsius Layout User Guide and Celsius 3D Workbench User Guide on the Cadence Support portal. Sigrity 2024.1 Layout Workbench Improved Graphical User Interface : A new option, Use Improved User Interface , has been added in the Themes page of the Options dialog box in the Layout Workbench GUI. In the new GUI, the toolbar icons and menu options have been enhanced and rearranged. For detailed information, refer to Layout Workbench User Guide on the Cadence Support portal. Broadband SPICE Python Script Integration with Command Line for Simulation Tasks : Broadband SPICE lets you run Python scripts directly from the command line for performing simulation and analysis. The new -py and *.py options make it easier to integrate Python scripts with the command-line operations. This update streamlines the process of automating and customizing simulations from the command line, which makes your simulation tasks faster and easier. For detailed information, refer to Broadband SPICE User Guide on the Cadence Support portal. Celsius PowerDC Block Power Assignment (BPA) File Format Support : PowerDC now supports the BPA file format. Similar to the Pin Location (PLOC) file, the BPA file is a current assignment file that defines the total current of a power grid cell, which is then equally distributed across the power pins within the cell. This provides better control over the power distribution. Ability to Run Multiple IR Drop Cases Sequentially : You can now select multiple result sinks from the Current-Limited IR Drop flow and run IR Drop analysis for them sequentially. PowerDC automatically runs the simulations in sequence after you select multiple result sinks. This saves time by automating the process. Enhanced Support for Mixed Conversion Devices : PowerDC now supports mixing different conversion devices, such as switching regulators and linear regulators within a single DC-DC/LDO instance. This enhancement offers added flexibility by letting you configure each instance in your design according to your specific needs. For detailed information, refer to PowerDC User Guide on the Cadence Support portal. PowerSI Monte Carlo Method Added : A new option, Monte Carlo Method, has been added in the Optimality dialog box. This option lets you create multiple random samples to depict variations in the input parameters and assess the output. Channel Check Optimization Added : The S-Parameter Assessment workflow in PowerSI now supports Channel Check Optimization . It uses the AI-driven Multidisciplinary Analysis and Optimization (MDAO) technology that lets you optimize your design quickly and efficiently with no accuracy loss. For detailed information, refer to PowerSI User Guide on the Cadence Support portal. SPEEDEM Multi-threaded Matrix Solver Support Added : The Enable Multi-threaded Matrix Solver check box has been added that lets you accelerate the simulation speed for high-performance computing. This check box provides two options, Automatic and Always, to include the -lhpc4 or -lhpc5 parameter, respectively, in the SPEEDEM Simulator (SPDSIM) before running the simulation. For detailed information, refer to the SPEEDEM User Guide on the Cadence Support portal. XtractIM Options to Skip or Calculate Special DC-R Simulation Results : The Skip DC_R of Each Path and Only DC_R of Each Path options have been added to the Setup menu. Skip DC_R of Each Path : This option lets you skip the calculation of the DC-R result during the simulation. Other results, such as SPICE T-model , RL_C of Each Path , Coupling of Each Path , etc., are still calculated. Only DC_R of Each Path : This option lets you calculate the DC-R result only during the simulation. Other results, such as SPICE T-model , RL_C of Each Path , Coupling of Each Path , etc., are not calculated. Color Assignment for Pin Matching : The MCP Auto Connection window includes the Display Color Editor , which lets you assign a color for pin matching. It helps you easily identify the matching pins in the left and right sections of the MCP Auto Connection window . Ability to Save Simulations Individually : The Save each simulation individually check box has been added to the Tools - Options - Edit Options - Simulation (Basic) - General form. Select this check box and run the simulation to generate a simulation results folder containing files and logs with a timestamp for each simulation. Reuse of SPD File Settings : The XtractIM setup check box lets you import an existing package setup to reuse the configurations and settings from one .spd file to another. For detailed information, refer to XtractIM User Guide on the Cadence Support portal. Documentation Enhancements Cloud-Based Help System Upgraded The cloud-based help system, Doc Assistant, has been upgraded to version 24.10, which contains several new features and enhancements over the previous 2.03 version. Sigrity Release Team Please send your questions and feedback to sigrity_rmt@cadence.com .

Wild River Technology (WRT), the leading supplier of signal integrity measurement and optimization test fixtures for high-speed channels at data rates of up to 224G, has announced the availability of a new advanced channel modeling solution that helps achieve extreme signal integrity design to 70GHz. Read the press release. The CMP-70 program continues the industry-first simulation-to-measurement collaboration with Cadence that was initially established with the CMP-50. Significant resources were dedicated to the development of the CMP-70 by Cadence and WRT over almost three years. The CMP-70 will be on display at DesignCon 2025 , January 28-30, in Cadence booth 827 to benchmark the Cadence Clarity 3D Solver . “I am not a fan of hype-based programs that simply get attention,” remarked Alfred P. Neves, WRT’s co-founder and chief technical officer. “Both Cadence and Wild River brought substantial skills to the table in this project as we continued our industry-first simulation-to-measurement collaboration. The result is a proven, robust and accurate platform that brings extreme signal integrity to 70GHz designs. This application package has also been instrumental in demonstrating the robust 3D EM simulation capability of the Cadence Clarity solver.” “We’re delighted to continue the joint development and validation program with WRT that started with the CMP-50,” said Gary Lytle, product management director at Cadence. “The skilled and experienced signal integrity technologists that both companies bring to the program results in a superior signal integrity solution for our mutual customers.” CMP-70 Solution Features The solution is available both in a standard configuration and as a custom solution for customer-specific stackups and fabrication. The primary target application is to support a 3D EM solver analysis modeling versus the time- and frequency-domain measurement methodologies. The solution features include: The CMP-70 platform, assembled and 100% TDR NIST traceable tested, with custom stands Material Identification overview web-based meeting including anisotropic 3D material identification A cross-section PCB report and structures for using as-fabricated geometries Measured S-parameters, pre-tested for quality (passivity/causality and resampled for time domain simulations) A host of novel crosstalk structures suited for 112G HD level project analysis PCB layout design files (NDA required) An EDA starter library including loss models with industry-first accurate surface roughness models Comprehensive training available for 3D EM analysis – correspondence, material ID in X-Y and Z axis for a host of EDA tools Industry-First Hausdorff Technique The WRT application package also includes an industry-first modified Hausdorff (MHD) technique , included as MATLAB code. This algorithmic approach provides an accurate way to compare two sets of measurements in multi-dimensional space to determine how well they match. The technique is used to compare the results simulated by the Clarity solver with those measured on the CMP-70 platform. The methodology and initial results are shown in the figure below, where the figure of merit (FOM) is calculated from 10, 35, and finally to 50GHz. The MHD algorithm requires a MATLAB license, but WRT also accommodates customer data as another option, where WRT provides the comparison between measured and simulated data. Additional Resources If you are attending DesignCon 2025 , be sure to stop by Cadence booth 827 to see WRT’s CMP-70 advanced channel modeling solution in action with the Clarity 3D Solver. Check out our on-demand webinar, " Validating Clarity 3D Solver Accuracy Through Measurement Correlation ." Learn more about the CMP-70 solution and the Clarity 3D Solver . For more information about Cadence’s full suite of integrated multiphysics simulation solutions, download our Multiphysics System Analysis Solutions Portfolio .

DDR5 DIMM Architectures The DDR5 generation of Double Data Rate DRAM memories has experienced rapid adoption in recent years. In particular, the JEDEC-defined DDR5 Dual Inline Memory Module (DIMM) cards have become a mainstay for systems looking for high-density, high-bandwidth, off-chip random access memory[1]. Within a short time, the DIMM architecture evolved from an interconnected hierarchy of only SDRAM memory devices (UDIMM[2]) to complex subsystems of interconnected components (RDIMM/LRDIMM/MRDIMM[3]). DIMM Designs and Popular Verification Use Cases The growing complexity of the DIMMs presented a challenge for pre-silicon verification engineers who could no longer simply validate against single DDR5 SDRAM memory models. They needed to consider how their designs would perform against DIMMs connected to each channel and operating at gigahertz clock speeds. To address this verification gap, Cadence developed DDR5 DIMM Memory Models that encapsulated all of the architectural complexities presented by real-world DIMMs based on a robust, easy-to-use, easy-to-debug, and easy-to-reconfigure methodology. This memory-subsystem-in-a-single-instance model has seen explosive adoption among the traditional IP Developer and SOC Integrator customers of Cadence Memory Models. The Cadence DIMM models act as a single unit with all of the relevant DIMM components instantiated and interconnected within, and with all AC/Timing parameters among the various components fully matched out-of-the-box, based on JEDEC specifications as well as datasheets of actual devices in the market. The typical use-case for the DIMM models has been where the DUT is a DDR5 Memory Controller + PHY IP stack, and the validation plan mandated compliance with the JEDEC standards and Memory Device vendor datasheets. Unique Use Case for the DIMM Discrete Component Models Although the Cadence DIMM models have enjoyed tremendous proliferation because of their cohesive implementation and unified user API, the actual DIMM Models are built on top of powerful, flexible discrete component models, each of which was designed to stand on its own as a complete SystemVerilog UVM-based VIP. All of these discrete component models exist in the Cadence VIP Catalog as standalone VIPs, complete with their own protocol compliance checking capabilities and their own configuration mappings comprehensively modeling individual AC/Timing parameters. Because of this deliberate design decision, the Cadence DIMM Discrete Component Models can support a unique use-case scenario. Some users seek to develop IC Designs for the various DIMM components. Such users need verification environments that can model the individual components of a DIMM and allow them the option to replace one or another component with their Component Design IP. They can then validate that their component design is fully compatible with the rest of the components on the DIMM and meets the integrity of the overall DIMM compliance with JEDEC standards or Memory Vendor datasheets. The Cadence Memory VIP portfolio today includes various examples that demonstrate how customers can create DIMM “wrappers” by selecting from among the available DIMM discrete component models and “stitching” them together to build their own custom testbench around their specific Component Design IP. A Solution for Unique Component Scenarios The Cadence DDR5 DIMM Memory Models and DIMM Discrete Component Models can provide users with a flexible approach to validating their specific component designs with a fully populated pre-silicon environment. Augmented Verification Capabilities When the DIMM “wrapper” model is augmented with the Cadence DFI VIP[4] that can simulate an MC+PHY stack and offers a SystemVerilog UVM test API to the verification engineer, the overall testbench transforms into a formidable pre-silicon validation vehicle. The DFI VIP is designed as a combination of an independent DFI MC VIP and a DFI PHY VIP connected to each other via the DFI Standard Interface and capable of operating seamlessly as a single unit. It presents a UVM Sequence API to the user into the DFI MC VIP with the Memory Interface of the PHY VIP connected to the DIMM “wrapper” model. With this testbench in hand, the user can then fully take advantage of the UVM Sequence Library that comes with the DFI VIP to enable deep validation of their Component Design inside the DIMM “wrapper” model. Verification Capabilities Further Enhanced A possible further enhancement comes with the potential addition of an instance of the Cadence DIMM Memory Model in a Passive Monitor mode at the DRAM Memory Interface. The DIMM Passive Monitor consumes the same configuration describing the DIMM “wrapper” in the testbench, and thus can act as a reference model for the DIMM wrapper. If the DIMM Passive Monitor responds successfully to accesses from the DFI VIP, but the DIMM wrapper does not, then it exposes potential bugs in the DUT Components or in the settings of their AC/Timing parameters inside the DIMM wrapper. Debuggability, Interface Visibility, and Protocol Compliance One of the key benefits of the DIMM Discrete Component Models that become manifest, whether in terms of the unique use-case scenario described here, or when working with the wholly unified DDR5 DIMM Memory Models, is the increased debuggability of the protocol functionality. The intentional separation of the discrete components of a DIMM allows the user to have full visibility of the memory traffic at every datapath landmark within a DIMM structure. For example, in modeling an LRDIMM or MRDIMM, the interface between the RCD component and the SDRAM components, the interface between the RCD component and the DB components, and the interface between the SDRAM components and the DB components—all are visible and accessible to the user. The user has full access to dump the values and states of the wire interconnects at these interfaces to the waveform viewer and thus can observe and correlate the activity against any protocol violations flagged in the trace logs by any one or more of the DIMM Discrete Component Models. Access to these interfaces is freely available when using the DIMM Discrete Component Models. On the unified DDR5 DIMM Memory Models, a feature called Debug Ports enables the same level of visibility into the individual interconnects amidst the SDRAM components, RCD components, and DB components. When combined with the Waveform Debugger[5] capability that comes built-in with the VIPs and Memory Models offered by Cadence and used with the Cadence Verisium Debug[6] tool, the enhanced debuggability becomes a powerful platform. With these debug accesses enabled, the user can pull out transaction streams, chip state and bank state streams, mode register streams, and error message streams all right next to their RTL signals in the same Verisium Debug waveform viewer window to debug failures all in one place. The Verisium Debug tool also parses all of the log files to probe and extract messages into a fully integrated Smart Log in a tabbed window fully hyperlinked to the waveform viewer, all at your fingertips. A Solution for Every Scenario Cadence's DDR5 DIMM Memory Models and DIMM Discrete Component Models , partnered with the Cadence DFI VIP, can provide users with a robust and flexible approach to validating their designs thoroughly and effectively in pre-silicon verification environments ahead of tapeout commitments. The solution offers unparalleled latitude in debuggability when the Debug Ports and Waveform Debugger functions of the Memory Models are switched on and boosted with the use of the Cadence Verisium Debug tool. [1] Shyam Sharma, DDR5 DIMM Design and Verification Considerations , 13 Jan 2023. [2] Shyam Sharma, DDR5 UDIMM Evolution to Clock Buffered DIMMs (CUDIMM) , 23 Sep 2024. [3] Kos Gitchev, DDR5 12.8Gbps MRDIMM IP: Powering the Future of AI, HPC, and Data Centers , 26 Aug 2024. [4] Chetan Shingala and Salehabibi Shaikh, How to Verify JEDEC DRAM Memory Controller, PHY, or Memory Device? , 29 Mar 2022. [5] Rahul Jha, Cadence Memory Models - The Gold Standard , 15 Apr 2024. [6] Manisha Pradhan, Accelerate Design Debugging Using Verisium Debug , 11 Jul 2023.

This post was contributed by Liliko Uchida, application engineer at Cadence. Being a “Woman in STEM” is a phrase that has long been used to describe the holistic experience shared by thousands of women globally, yet it still makes us feel isolated. Partially due to the statistics of gender population in the STEM workforce and the remainder due to our own internal obstacles, being a woman in STEM continues to be a challenge. While many of us know the should-do’s and should-be’s of taking on this unique role objectively, we struggle to implement them. After all, our perseverance as engineers, mathematicians, businesswomen, programmers, and scientists is largely affected by subjectivity. The UMass Lowell Women’s Leadership Conference 2024 aimed to tackle this problem by uniting hundreds of women with shared experiences under one roof. Not only did the conference provide us with the knowledge necessary to persevere, but it also gave us the tools that will allow us to thrive and act upon the facts we already know. It is my hope that through this blog post, I can share some of my main takeaways from this special day. Be Confident This is one of the most palpable pieces of advice we always hear. Yet so many of us struggle to build this confidence because we don’t know how. Featured speaker Nicole Kalil defined confidence as “complete trust in oneself”.”One way to build this self-trust is by getting to know yourself on a deeper level. By creating a true inner connection, we begin to see ourselves as a whole instead of hyper-focusing on our shortcomings frequently illusioned by imposter syndrome. In one of the sessions, we were asked to introduce ourselves to our neighbors, not by what we do for work, but by who we are as a person. Even if this opportunity does not arise every day, this practice can be done simply by listing characteristics of yourself that define who you are. Who do you care for? How do you show them? What are your life goals oriented towards? How do you observe others’ behavior around you, and what does that say about how you make them feel? Getting to know you beneath the surface and allowing yourself to be seen for who you are is critical in building internal confidence. With practice, this self-reassurance will grow independent of external factors. Take Risks “Sometimes, you have to put your foot in the elevator” - Barb Vlacich, Keynote Speaker When opportunities arise, the only thing you can do to have a chance is to try. Without putting your foot in the elevator, the doors will close, becoming a missed opportunity. Similarly, several of the conference’s speakers also emphasized that the answer to every unasked question will always be a no. Even if you are not ready to full-send a negotiation, ask for a raise, or respectfully disagree with a co-worker’s opinion, start by getting comfortable asking uncomfortable questions. Just one discomfort a day will help in building an immunity to the anxiety that comes with taking risks, typically driven by our self-doubt. Another interesting point that stood out from the conference was the statistics of self-assessed qualifications between men and women. During the negotiation panel, it was revealed that men typically feel they only need 60% of the qualifications under a job description to apply, whereas women often feel they need close to 100%. These numbers alone demonstrate how the pure mental habits of men continue to funnel them into STEM and not women. The next time you seek a new opportunity, assess yourself based on the 60% and use it as a checklist threshold. If more women are able to pursue STEM careers using these numbers, the more likely we will begin to populate these roles. Build Your Genuine Network “ The essence of communication lies in the mutual exchange of ideas and emotions. And when the listener isn’t invested, it undermines the entire purpose of the conversation. Why are you having it anyway?” This is a quote from episode 186 of Julie Brown’s podcast This Sh!t Works called “The 5 Steps to Being an Active Listener”. Julie Brown is a Networking Coach, author, and podcast host who guided an energetic and candid conversation about networking and building a personal brand for women. Networking is often misunderstood as putting your name and qualifications out on the table for as many people to pick up your cards. While making these things known is important, they are not what nurtures effective connections. The key to cultivating your genuine network is to activate a sincere interest in the people you meet. Become the proactive receiver of the confidence exercise discussed above. When you meet someone new, what can you take away from them as a person, not an employee? By making people feel heard, even through the little conversations, you can begin to develop more meaningful connections that resonate. And, with practice, the sometimes inherent need to overcompensate by defining yourself with your resume will slowly fade. It was a wonderful opportunity to attend the UML Women’s Leadership Conference with four other inspiring Cadence women. Not only was the conference a motivating learning experience, but it was also a wonderful opportunity for us to bond together as women and feel supported by each other. The most eye-opening part of the day was seeing just how many women alike were sitting under the same roof. The conclusion of the event led me to feel proud to be an engineer, proud to be at Cadence, and most importantly, proud to be a woman. Learn more about life at Cadence .

On November 5, 2024, the Cadence Bangalore Toastmasters Club celebrated a significant milestone by hosting its 50th meeting. Established in December 2020, the club was created to provide a supportive environment for individuals looking to improve their communication and leadership skills. Over the years, the club has evolved into a vibrant community filled with success stories of personal development and newfound confidence. A testament to the club's dedication is its achievement of the "Select Distinguished Club" status during the 2023-2024 program year. By fulfilling 7 out of 10 distinguished goals, the club highlighted its commitment to excellence—a success driven by its vibrant members' relentless focus and perseverance. The strategic insight gained from regular Toastmasters committee meetings and the influential "Moments of Truth" sessions held in 2023 and 2024 are key to this success. Our club members have consistently demonstrated strong performance in various speech contests, with notable achievements across multiple levels. In 2023, members excelled in Evaluation and Table Topics contests, reaching the district level while advancing to the Division Level in the International Speech Contest. Continuing their success into 2024, members again qualified for area-level contests, securing third-place positions in the Evaluation and Table Topics categories, highlighting the club's dedication and competitive spirit. The 50th meeting was based on the theme of serendipity. It was not only a milestone celebration but also a vibrant festival of achievements and growth. The day buzzed with energy as activities like a spirited Treasure Hunt injected enthusiasm and camaraderie among attendees. Distinguished guests, including Kripa Venkitachalam and Madhavi Rao, enriched the occasion with inspiring speeches. Madhavi reignited the club's spirit, while Kripa's discourse on the Growth Mindset and the "Power of Yet" encouraged members to pursue continuous self-improvement. The Cadence Bangalore Toastmasters Club is enthusiastic about its promising future and is committed to creating an environment that promotes personal and professional growth. Many members are close to completing their Toastmasters levels and pathways, and this term, a new group of approximately 30 individuals has joined, bringing the total membership to 52. This vibrant community is just beginning its journey and is eager to reach new milestones together through mutual support and a shared commitment to excellence. The transformations experienced by many club members are truly compelling. They often share how the club has significantly improved their communication skills and boosted their confidence. One member recalls, "Before joining, I found public speaking intimidating. Now, I embrace every opportunity to share my ideas." Another member highlights how the club's supportive environment helped him overcome his fear of public speaking, propelling his career to new heights. This culture of constructive feedback and continuous improvement has inspired countless members to pursue their dreams with renewed determination and optimism. The Cadence Bangalore Toastmasters Club's journey is a living testament to the power of community and the potential within each of us to grow and achieve greatness. As the club continues to evolve and inspire, it serves as a beacon for those aspiring to transform their skills and seize their moment in the spotlight. Learn more about life at Cadence.

I'm trying to simulate a practice code . Verilog verification of my code do not give any error.But when I try to elaborate, this error is being showed:

ncelab: *E,CUVHNF (./FSM_test.v,17|20): Hierarchical name component lookup failed at 'l'

What does this mean? How can I debug this error ? Is there any archive or list of possible error list so that I don't have to ask in forum to understand the errors. 

I am looking for LM117 Pspice model. Can someone send me the file. Thank you

Designers have long recognized the need to analyze the reliability of ICs. Two commonly used approaches for performing reliability analysis include calculating the change in device degradation and relying on safe operating checks in circuit simulators. 

With the advent of the ever-increasing use of ICs in mission-critical applications, the need for reliable reliability analysis has become of paramount importance. Over the years, you have been using reliability analysis in Virtuoso ADE Assembler and Virtuoso ADE Explorer to measure and review aging effects, such as device characteristic degradations, model parameter changes, self-heating effects, and so on.

Reliability analysis can be performed using two modes: Spectre native and RelXpert. The reliability analysis analyzes the effect of time on circuit performance drift and predicts the reliability of designs in terms of performance. In ADE Assembler, you can run the reliability simulation for fresh test (when time is zero), stress test (to generate degradation data), and aged test (at specific intervals, such as one year, three years, or 10 years). In the stress test, extreme environmental conditions are used to stress devices before aging analysis.

The following figure shows the reliability simulation flow.

The Reliability Options form has the following four tabs: 

• Basic: Enables you to specify analysis type, aging options, start and stop time of reliability simulation, and options related to device masking, degradation ratio, and lifetime calculation. 

• Modeling: Enables you to choose the modeling type you want to use during reliability simulation. 

• Degradation: Enables you to specify the options to print device and subcircuit degradation information into a .bt0 file. 

• Output: Enables you to specify the degradation reports to be generated and methods to filter degradation results in the reports.

While the Basic and the Output tabs are used by design engineers, the Modeling and the Degradation tabs are primarily used by model developers.

Reviewing degradation reports in text or XML formats can be a tiresome exercise because degradation data can be large and can contain a large number of instances due to advanced technology nodes and post-layout simulations. For you to work effectively and interactively with these reports, the new reliability report is based on the SQLite database, which adds the benefit of improved performance and capabilities of sorting and filtering reliability data using SQLite operators.

As they say, watching this in action might help you more than reading about it, so please take a look at our Training Bytes video channel, which offers many helpful videos on how to run Reliability Analysis in Virtuoso Studio.

All the related videos are linked together in a channel so that you can easily access and watch as many as you like.

Reliability Analysis in Virtuoso Studio

Want to Learn More?

For lab instructions and a downloadable design, enroll for the online training courses of your interest on

Reliability Analysis in Virtuoso Studio vIC23.1 (Online)

 Training is also available as "Blended" or "live" class.

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You can become Cadence Certified once you complete the course (s) and share your knowledge and certifications on social media channels. Go straight to the course exam at the Learning and Support Portal.

Note: Some of the above links are accessible only to Cadence customers who have a valid login ID for the Cadence Learning and Support Portal.

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If not, follow the steps below to create your account.

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• If you need help with registration, contact support@cadence.com.

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If you have questions about courses, schedules, online, public, or live onsite training, reach out to us at Cadence Training.

Related Resources

About Knowledge Booster Training Bytes

Knowledge Booster Training Bytes is an online journal that relays information about Cadence Training videos, online courses, and upcoming webinars that are available in the Learning section of the Cadence Learning and Support portal. This blog category brings you direct links to these videos, courses, and other related material on a regular basis.

Niyati Singh

On behalf of the Cadence Training team

At a bustling Cadence event, we met Adrian, an intern at a startup who immerses himself in Cadence tools for his research and work.

Adrian was enthusiastic about the innovative technologies at his disposal but faced a significant challenge: internet access was limited to a single machine for new joiners, forcing interns to wait in line for their turn to use online resources.

Adrian's excitement soared when he discovered a game-changing solution: Doc Assistant. The cloud-based help viewer, Doc Assistant, ships with all Cadence tools, enabling Adrian to access help resources offline from any machine equipped with the software. This meant Adrian could continue his research and work seamlessly, irrespective of internet availability!

Meeting Cadence users and customers at such events has given us the opportunity to showcase how they can benefit from the diverse features that Doc Assistant offers.

With that note, welcome back to our Doc Assistant A-Z blog series! In Part 1, we explored key features and benefits that our innovative viewer brings to the table. Today, in Part 2, we'll dive deeper into the advanced functionalities and customization options that make Doc Assistant indispensable for its users.

Whether you're looking to streamline your workflow or enhance your user experience, this blog will provide the insights you need to fully leverage the capabilities of our documentation viewer. Let’s get started!

What Makes Doc Assistant Stand Out?

Here are a few (more) cool features of Doc Assistant!

That's not all. We have more coming your way. Until next time, take care and stay tuned for our next edition!

Want to Know More?

For any questions or general feedback, write to docassistant.support@cadence.com.

Subscribe to receive email notifications about our latest Custom IC Design blog posts.

Happy reading!

-Priya Sriram, on behalf of the Doc Assistant Team

The SPECTRE 24.1 release is now available for download at Cadence Downloads. For information on supported platforms and other release compatibility information, see the README.txt file in the installation hierarchy.(read more)

Welcome back to the Doc Assistant A-Z blog series!

Since the launch of Doc Assistant, we've been gathering feedback and input from our customers regarding their experiences with our latest documentation viewer. My interaction with Ralf was particularly useful and interesting.

Ralf is a design engineer who works on complex schematics and intricate layouts. For each release, he is challenged with the task of verifying the tool and feature changes across multiple releases. He shared with me that he has been using Doc Assistant’s capabilities to help him achieve this.

Ralf explained that he utilizes Doc Assistant to open and compare documents from different releases side-by-side, seamlessly tracking updates across multiple releases and verifying those updates in his Cadence tools. Additionally, in Doc Assistant’s online mode, he compares documents across previous tool versions, ensuring a thorough review of any changes. Finally, he was happy to share with me that Doc Assistant features have helped him significantly reduce the time he spends on identifying such changes.

You, of course, can also achieve such productivity gains using several Doc Assistant features designed to help simplify such tasks!

In previous editions of this blog series, we looked at some key features and benefits of Doc Assistant. If you've missed these editions, I would highly recommend that you read them:

• Doc Assistant A-Z: Making the Most of the Cadence Cloud-Based Help Viewer: Part 1
• Doc Assistant A-Z: Making the Most of the Cadence Cloud-Based Help Viewer: Part 2
  

In this third installment, we're diving into some more of Doc Assistant's key capabilities.

To learn more about how to use the above features, check out the Doc Assistant User Guide.

These are just a few of the productivity gain features in Doc Assistant. We’ll cover more in the next blog in the series.

Want to Know More?

If you have any feedback on Doc Assistant or would like to request more information or a demo, please contact docassistant.support@cadence.com.

Subscribe to receive email notifications about our latest Custom IC Design blog posts.

Happy reading!

- Priya Sriram, on behalf of the Doc Assistant Team

Hello Fellow PCB Designers,

We have a 10 layer PCB design that originated in Pads and was converted over to Allegro 17.4, this is an old design but is manufacturable and works perfectly fine.  When I try to generate a Gerber for the Top or Bottom layers

the Gerber comes out fine.  But Most of the middle layers are Etch's and via's for power and grounds, but the Gerber's come mostly blank, there might be some details, but in the Gerber view everything is displayed correctly.

The design does have many close spacings, I have not changed anything in the constrains manager yet, turned off a lot of the DRC's, but thinking there might be something wrong with the constrains.

  I find that the CSet is set to 2_18, not sure yet what this means, also there are many of these definitions, PCS 3,4,5,ect, are the same as CSet 2_18 any suggestions would be great, we are currently looking into this, have seen

that even small change in constraint manager can cause long processing and even Allegro crashing, this is a large project.

Thanks Much, Thanks, Mike Pollock.

I'm not able to export a CIS Standard BOM to a Microsoft 365 Excel (business subscription, version 2111).
Selecting the "Export BOM report to Excel" option opens a new Excel window, but OrCAD (17.4-2019 S023) won't fill it with any data...

I tried it on a different PC with Microsoft Office Professional Plus 2019 Excel (strangely the version number is the same: 2111) and with OrCAD 17.4-2019 S016 and it worked flawlessly.

Does anybody experiencing the same issue?
Does the Excel variant, the OrCAD version or the PC itself causing this?
Thanks for any help!

Hello,


I would like to use the simulation software xrun/simvision that comes with XCELIUM. We are currently using classroom licenses and want to disable all ip addresses on the student pcs except the license server ip. We want to make sure that students cannot copy confidential data from the Cadence tools.


Problem:

When I launch the xrun simulation while all ip addresses are blocked, it starts but the performance is very slow. The GUI starts after 5 minutes and the simulation is ready after 10 minutes. The interesting thing is that when I enable all blocked ip addresses, everything works at a reasonable speed.

Terminal Output (execution without internet connection):

xrun -gui design.vhd

waiting for SimVision/Verisium Debug to connect...


Is there a way to run the simulation tools without an Internet connection? Or can you give me the ip addresses that are used by the simulation tools so that I can enable only those specific ips?


Regards,

Max

Hi,

I'm searching for a way to get a quick overview of too low cpk-values after a montecarlo sim. The non-MC results have the spec and thus the easy/understandable red/green/(yellow) colorcoding, but for MC sims I don't get a highlight for high variations inside the limits.

Is this possible (besides copying each expression into avg()+3*std()) and ..-..)?

It would be really handy to scan through finished sims...

(My final application is then to export the table for my reports and documentation...)

Regards,

leo

I'm trying to use Jasper for checking parameter propagation in a large design. I have a list of top-level parameters, each with a HDL path of a module parameter somewhere lower in the hierarchy that's supposed to receive its value from the top-level module. The FPV app seems like an excellent tool for this, but elaborating the entire design in it is extremely time-consuming and memory-intensive. So, I'm trying to black-box everything but the interesting HDL paths. I thought using `elaborate -top dut_module_name -bbox_i * -no_bbox_i inst_foo -no_bbox_i inst_bar (...)` would work, but it doesn't. Jasper just starts flooding the log with warnings from modules that are definitely not on the whitebox list, and eventually dies due to insufficient memory. When I use -bbox_m * it correctly elaborates the top-level module with all of its sub-modules black-boxed. But then the -no_bbox_i switches have no effect. Could anyone suggest a working solution for this use case?

Hello,

I have been running this `uvm_reg_hw_reset_seq` sequence for the AHB protocol. My UVM Adapter looks like:

Issue: When I use basic reg.write, my write access are working well, as that is managed by the driver i.e. once adapter gives the packet to the driver, the driver supplies the address and the control signals to the DUT on the first clock cycle and then the write data on the next clock cycle. But when I am performing the read operation, somehow the UVM adapter is reading the data at the same clock cycle where read address + Controls are supplied and this is triggering read failure messages from the `uvm_reg_hw_reset_seq` sequence. What should I modify in the driver/sequencer/adapter so that the UVM adapter can read the data on the next cycle instead of the same clock cycle.

Just FYI: The waveforms of the read operation are correct, it is just the Adapter and the `uvm_reg_hw_reset_seq`. The AHB Driver + AHB Monitor is fully proven and verified to be working correctly.

I'm completely new to Cadence. I've been able to run a very simple simulation with the -gui option. Simvision opens, I add the variables to the waveform viewer, and press run. All is good.

I don't understand the flow when using the -nogui option. It appears that the simulation runs and returns control to the OS. When I launch Simvision, is there a database or file that I can open to display the already-simulated data?

My command is of the form:

xrun -gui -64bit -sv -access +rwc -top tb_top.sv <src files>

I want to do a 2-step build->simulate as follow:

1. Make multiple builds using xrun -elaborate [other options]. The purpose is to create multiple builds with different compile-time macros (+define+MACROA +define+MACROB=ABC). Each build is located in a different directory.

2. Run simulation with xrun -r. This is where I need help. How do I specify which build to simulate? Also, I need the simulation directory (with log files, …) to be different than the build directory.

Has anyone been able to achieve this or similar solutions?

I just completed the setup of xcelium and I am trying to test a very simple vhdl file - I got " CSI: *F,INTERR: INTERNAL EXCEPTION" without any further explanation. Could someone point me to how to investigate this error further?

csi-xmelab - CSI: Command line: 
xmelab
-f /home/cadadmin/test/xcelium.d/run.lnx86.23.03.d/xmelab.args
-ACCESS +r
-no_analogsolver
-MESSAGES
andgate
-XLMODE ./xcelium.d/run.lnx86.23.03.d
-RUNMODE
-CDSLIB ./xcelium.d/run.lnx86.23.03.d/cds.lib
-HDLVAR ./xcelium.d/run.lnx86.23.03.d/hdl.var
-WORK worklib
-IRUNHASTOP
-CHECK_VERSION TOOL: xrun 23.03-s001
-LOG_FD 4

csi-xmelab - CSI: *F,INTERR: INTERNAL EXCEPTION
-----------------------------------------------------------------
The tool has encountered an unexpected condition and must exit.
Contact Cadence Design Systems customer support about this
problem and provide enough information to help us reproduce it,
including the logfile that contains this error message.
TOOL: xmelab 23.03-s001
OPERATING SYSTEM: Linux 4.18.0-513.9.1.el8_9.x86_64 #1 
Elaboration of package STD.STANDARD
-----------------------------------------------------------------

csi-xmelab - CSI: Cadence Support Investigation, recording details
csi-xmelab - CSI: investigation complete took 0.000 secs, send this file to Cadence Support

We are trying to run compilation, elab and sim with command xrun -r -u alu, where alu is one of the units to execute. we are getting the following errors.

1) xmsim: *E,DLMKDF: Unable to add default DEFINE std       /home/xxxx/Cad/xcelium/tools/inca/files/STD.
    xmsim: *E,DLMKDF: Unable to add default DEFINE synopsys  /home/xxxx/Cad/xcelium/tools/inca/files/SYNOPSYS

2) xmsim: *W,DLNOHV: Unable to find an 'hdl.var' file to load in.

What is the purpose of hdl.var

3) xmsim: *F,NOSNAP: Snapshot 'alu' does not exist in the libraries.

I cannot see in log files, which libraries is it referring to??

Any one request you to help on how to debug these.

Hi, I'm using the xcelium simulator to simulate a testbench, in which I first stimulate my design to do something (part "A") and then do a direct follow-up test on the design (part "B").

I need two things from this testbench: the results of the test (part "B", passed/failed) and coverage information, but the coverage information should only include part A and explicitly not part B.

I could do the following: run the testbench with part A and B, get the "passed/failed" result of the test and then follow up another simulator run with another testbench, that only includes part A and get the coverage information from that simulation run.

Is there a way to force xcelium to give me the coverage information of only a part of the simulation? Ideally, I would like to write the verilog code of my testbench to look something like this:

• do A
• dump coverage information
• do B

But maybe there is another way to tell xcelium to consider only part of the testbench for the coverage information. I did have a look at the manual, but was not able to find something useful for this problem. Any ideas?

Hi,

Current and valid TCAs for Functional Safety are readily available at the FuSa "one-stop shop".

But I have not been able to find any archive repository for access to the obsoleted versions.

I would need to have also v1.4 of Xcelum TCA to investigate exact changes wrt previous projects.

Anyone knows how to find it?

Best regards,  Lars

Please include a brief summary of how to use it.

As noted in white papers, posts on the Team Specman Blog, and the Specman documentation, IntelliGen is a totally new stimulus generator than the original "Pgen" and, as a result, there is some amount of effort needed to migrate an existing verification environment to fully leverage the power of IntelliGen.  One of the main steps in migrating code is running the linters on your code and adressing the issues highlighted. 

Included below is a simple utility you can include in your environment that allows you to collect some valuable statistics about your code base to allow you to better gauge the amount of work that might be required to migrate from Pgen to IntelliGen.  The ICFS statistics reported are of particular benefit as the utility not only identifies the approximate number of ICFSs in the environment, it also breaks the total number down according to generation contexts (structs/units and gen-on-the-fly statements) allowing you to better focus your migration efforts. 

IMPORTANT: Sometimes a given environment can trigger a large number of IntelliGen linting messages right off the bat.  Don't let this freak you out!  This does not mean that migration will be a long effort as quite often some slight changes to an environment remove a large number of identified issues.  I recently encountered a situation where a simple change to three locations in the environment, removed 500+ ICFSs!

The methods included in the utility can be used to report information on the following:
- Number of e modules
- Number of lines in the environment (including blanks and comments)
- Number and type of IntelliGen Guidelines linting messages
- Number of Inconsistently Connected Field Sets (ICFSs)
- Number of ICFS contexts and how many ICFSs per context
- Number of soft..select overlays found in the envioronment
- Number of Laces identified in the environment

To use the code below, simply load it before/after loading e-code and then
you can execute any of the following methods:

- sys.print_file_stats()             : prints # of lines and files
- sys.print_constraint_stats()   : prints # of constraints in the environment
- sys.print_guideline_stats()    : prints # of each type of linting message
- sys.print_icfs_stats()            : prints # of ICFSs, contexts and #ICFS/context
- sys.print_soft_select_stats() : prints # of soft select overlay issues
- sys.print_lace_stats()           : *Only works for SPMNv6.2s4 and later* prints # of laces identified in the environment

Each of the above calls to methods produces it's own log files (stored in the current working directory) containing relevant information for more detailed analysis.
- file_stats_log.elog : Output of "show modules" command
- constraint_log.elog : Output of the "show constraint" command
- guidelines_log.elog : Output of "gen lint -g" (with notification set to MAX_INT in order to get all warnings)
- icfs_log.elog       : Output of "gen lint -i" command
- soft_select_log.elog: Output of the "gen lint -s" command
- lace_log.elog       : Output of the "show lace" command

Happy generating!

Corey Goss

Can anyone tell me how i can supress few strings or integers while reading with $sscanf.

I read a line from a file into a string. there are few strings and integers seperated by white spaces in the line. I am interested in one string which comes at postion 5 in the line. how can i suppress all other strings and integers with $scanf.

i tried the following syntax but it dint work.

 $sscanf(line,"* * * * %s",string_arg);

i am tring to supress first 4 integers/strings in the line.

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