An agricultural work vehicle includes a vehicle body having longitudinally extending sides. An enclosed engine compartment is configured within the vehicle body. An air inlet is defined in side of the vehicle body for intake of air into the engine compartment. A grain bin forward of the engine compartment includes a grain bin extension skirt mounted above the grain bin. An intake housing is mounted over the air inlet in the vehicle body side and includes a forwardly extending portion mounted alongside the grain bin extension with an inlet opening oriented so as draw air primarily from an area forward of the engine compartment and above the vehicle body.

A harvesting header includes a cutter bed having a plurality of cutting elements arranged transverse to the header and a crop chopping and conditioning region having a crop chopping device and a crop conditioning device. The crop chopping device is configured to chop crop cut by the cutter bed into smaller lengths and the crop conditioning device is configured to crimp the crop to aid in drying. The first chopping roller has a tubular, cylindrically-shaped body and a plurality of parallel knife-mounting lugs extending radially outward along substantially the full length of the body. A plurality of chopping knives are attached to the knife-mounting lugs and arranged around the body, each chopping knife having a length that is shorter than the length of the knife-mounting lug to which it is attached such that each chopping knife covers only a portion of the lateral length of the first chopping roller.

A grass cutting machine with two cutting units mounted on opposite sides of the chassis has an inclinometer monitoring the left/right inclination of the chassis. If the inclination value exceeds a defined threshold, the higher of the two cutting units is lifted to improve stability.

An agricultural working machine has a one control/regulating unit designed to adjust and monitor working parameters, quality parameters or both of the agricultural working machine that influence a harvesting process. The adjusting and monitoring are carried out in an automatable manner by the control/regulating unit using stored families of characteristics. The agricultural working machine also has at least one display device for depicting setpoint values and actual values of the working parameters, quality parameters or both. The control/regulating unit actuates defined measurement points in the stored families of characteristics and the specifically actuated measurement points are located in the boundary regions of the family of characteristics or outside the active working region of the particular family of characteristics.

A mower carrying a rotary cutting deck has a height of cut system for adjusting the vertical position of the deck relative to the mower frame for changing or adjusting the height of cut. The height of cut system comprises a pair of parallel cross shafts that carry a plurality of pivotal suspension linkages that connect to the deck, the cross shafts and linkages pivoting jointly with one another and with a pivotal control lever. One of the cross shafts carries a torsion spring to counterbalance the weight of the deck. The control lever is maintained in a plurality of adjusted pivotal positions by a height selection bracket fixed to the frame with the height selection bracket being capable of having its position changed or adjusted relative to the frame by a single adjustment bolt. Each suspension linkage has its effective length adjusted by turning a threaded adjuster carried at the upper end of a connecting rod that is part of each linkage to allow the deck to be leveled relative to a reference plane. The adjustment of the height selection bracket is accomplished without affecting the length adjustments previously made to any of the suspension linkages.

A harvesting machine for threshing crop materials includes a platform supported in front of a chassis, an erecting device having a number pairs of guiding bars attached to the platform and having a channel formed between two bar members of each pair of guiding bars, a guiding element disposed between every two adjacent pairs of guiding bars for guiding a stalk of the crop materials into the channel of the guiding bars, a number of pawls extended into the channel for sending the stalk of the crop materials into the channel, and a cutting device having two or more cutting elements for cutting the stalk into a lower base segment that carries no grain and an upper straw segment that carries grains.

The present invention provides a method for measuring reflective intensity of display surface, including: obtaining a luminance value of a first display and a luminance value of a second display when displaying, the first display and the second display having the same observed luminance, the peripheral of the surface of the first display being surrounded by light-shielding object, the first display and the second display being placed side by side; and obtaining the reflective intensity of the display surface in the ambient based on the luminance value of the first display and the luminance values of the second display when displaying. As such, the present invention provides convenient and accurate means to measure the reflective intensity of display surface.

A windguard mechanism comprising a pair of arms attachable to an agricultural machine and a windguard plate extending between the pair of arms and positioned to hold down crop material processed by a pickup mechanism. The windguard plate comprises a first plate fixed between the pair of arms and a second plate positioned movably with respect to the first plate, wherein working surfaces of the first plate and of the second plate form a windguard working surface of an area independent on the position of the second plate.

A semiconductor device has a plurality of semiconductor die. A first prefabricated insulating film is disposed over the semiconductor die. A conductive layer is formed over the first prefabricated insulating film. An interconnect structure is formed over the semiconductor die and first prefabricated insulating film. The first prefabricated insulating film is laminated over the semiconductor die. The first prefabricated insulating film includes glass cloth, glass fiber, or glass fillers. The semiconductor die is embedded within the first prefabricated insulating film with the first prefabricated insulating film covering first and side surfaces of the semiconductor die. The interconnect structure is formed over a second surface of the semiconductor die opposite the first surface. A portion of the first prefabricated insulating film is removed after disposing the first prefabricated insulating film over the semiconductor die. A second prefabricated insulating film is disposed over the first prefabricated insulating film.

An example method includes providing a packaging device includes a substrate having an integrated circuit die mounting region. A plurality of microstructures, each including an outer insulating layer over a conductive material, are disposed proximate a side of the integrated circuit die mounting region. An underfill material is disposed between the substrate and the integrated circuit die, the microstructures preventing spread of the underfill. In another example method, a via can be formed in a substrate and the substrate etched to form a bump or pillar from the via. An insulating material can be formed over the bump or pillar. In another example method, a photoresist deposited over a seed layer and patterned to form openings. A conductive material is plated in the openings, forming a plurality of pillars or bumps. The photoresist and exposed seed layer are removed. The conductive material is oxidized to form an insulating material.

A method of making a semiconductor device can include providing a wafer comprising a plurality of semiconductor die, wherein each semiconductor die comprises an active surface and a backside opposite the active surface. A photosensitive layer can be formed over the wafer and on a backside of each of the plurality of semiconductor die within the wafer with a coating machine. An identifying mark can be formed within the photosensitive layer for each of the plurality of semiconductor die with a digital exposure machine and a developer, wherein a thickness of the identifying mark is less than or equal to 50 percent of a thickness of the photosensitive layer. The photosensitive layer can be cured. The wafer can be singulated into a plurality of semiconductor devices.

A semiconductor package is provided, including: an insulating base body having a first surface with an opening and a second surface opposite to the first surface; an insulating extending body extending outward from an edge of the first surface of the insulating base body, wherein the insulating extending body is less in thickness than the insulating base body; an electronic element having opposite active and inactive surfaces and disposed in the opening with its inactive surface facing the insulating base body; a dielectric layer formed in the opening of the insulating base body and on the first surface of the insulating base body, the insulating extending body and the active surface of the electronic element; and a circuit layer formed on the dielectric layer and electrically connected to the electronic element. The configuration of the insulating layer of the invention facilitates to enhance the overall structural rigidity of the package.

A semiconductor device includes a first moisture-resistant ring disposed in a peripheral region surrounding a circuit region on a semiconductor substrate in such a way as to surround the circuit region and a second moisture-resistant ring disposed in the peripheral region in such a way as to surround the first moisture-resistant ring.

A manufacturing method of a package substrate is provided. The method includes forming a first circuit layer on a carrier. A passive component is disposed on the first circuit layer and the carrier. A dielectric layer is formed on the carrier to embed the passive component and the first circuit layer in the dielectric layer. A second circuit layer is formed on the dielectric layer. The carrier is removed from the dielectric layer. A manufacturing method of a chip package is also provided.

A method for wafer-level packaging includes providing a substrate having a conductive metal pad formed on the surface of the substrate; forming a metal core on the top of the conductive metal pad with the metal core protruding from the surface of the substrate; then, forming an under bump metal layer on the top surface and the side surface of the metal core; and finally, forming a bump structure on the top of the under bump metal layer.

A semiconductor mounting apparatus includes a storing unit that stores a liquid or a gas, a contact unit that comes into contact with a semiconductor chip when the storing unit is filled with the liquid or the gas, and a sucking unit that sucks up the semiconductor chip to bring the semiconductor chip into close contact with the contact unit.

A bump-on-trace (BOT) interconnection in a package and methods of making the BOT interconnection are provided. An embodiment BOT interconnection comprises a landing trace including a distal end, a conductive pillar extending at least to the distal end of the landing trace; and a solder feature electrically coupling the landing trace and the conductive pillar. In an embodiment, the conductive pillar overhangs the end surface of the landing trace. In another embodiment, the landing trace includes one or more recesses for trapping the solder feature after reflow. Therefore, a wetting area available to the solder feature is increased while permitting the bump pitch of the package to remain small.

Package structures and methods are provided to integrate optoelectronic and CMOS devices using SOI semiconductor substrates for photonics applications. For example, a package structure includes an integrated circuit (IC) chip, and an optoelectronics device and interposer mounted to the IC chip. The IC chip includes a SOI substrate having a buried oxide layer, an active silicon layer disposed adjacent to the buried oxide layer, and a BEOL structure formed over the active silicon layer. An optical waveguide structure is patterned from the active silicon layer of the IC chip. The optoelectronics device is mounted on the buried oxide layer in alignment with a portion of the optical waveguide structure to enable direct or adiabatic coupling between the optoelectronics device and the optical waveguide structure. The interposer is bonded to the BEOL structure, and includes at least one substrate having conductive vias and wiring to provide electrical connections to the BEOL structure.

A semiconductor device includes a substrate comprising a trench; a gate dielectric layer formed over a surface of the trench; a gate electrode positioned at a level lower than a top surface of the substrate, and comprising a lower buried portion embedded in a lower portion of the trench over the gate dielectric layer and an upper buried portion positioned over the lower buried portion; and a dielectric work function adjusting liner positioned between the lower buried portion and the gate dielectric layer; and a dipole formed between the dielectric work function adjusting liner and the gate dielectric layer.

Embodiments of the inventive concepts provide a method for manufacturing a semiconductor device. The method includes forming a stack structure including insulating layers and sacrificial layers which are alternately and repeatedly stacked on a substrate. A first photoresist pattern is formed on the stack structure. A first part of the stack structure is etched to form a stepwise structure using the first photoresist pattern as an etch mask. The first photoresist pattern includes a copolymer including a plurality of units represented by at least one of the following chemical formulas 1 to 3, wherein “R1”, “R2”, “R3”, “p”, “q” and “r” are the same as defined in the description.

A performance of a semiconductor device is improved. A film, which is made of silicon, is formed in a resistance element formation region on a semiconductor substrate, and an impurity, which is at least one type of elements selected from a group including a group 14 element and a group 18 element, is ion-implanted into the film, and a film portion which is formed of the film of a portion into which the impurity is ion-implanted is formed. Next, an insulating film with a charge storage portion therein is formed in a memory formation region on the semiconductor substrate, and a conductive film is formed on the insulating film.

A method of manufacturing a semiconductor device according to one embodiment includes forming a first film including a first metal above a processing target member. The method includes forming a second film including two or more types of element out of a second metal, carbon, and boron above the first film. The method includes forming a third film including the first metal above the second film. The method includes forming a mask film by providing an opening part to a stacked film including the first film, the second film and the third film. The method includes processing the processing target member by performing etching using the mask film as a mask.

Embodiments of the inventive concept provide a method for manufacturing a semiconductor device. The method includes forming a stack structure by alternately and repeatedly stacking insulating layers and sacrificial layers on a substrate, sequentially forming a first lower layer and a first photoresist pattern on the stack structure, etching the first lower layer using the first photoresist pattern as an etch mask to form a first lower pattern. A first part of the stack structure is etched to form a stepwise structure using the first lower pattern as an etch mask. The first lower layer includes a novolac-based organic polymer, and the first photoresist pattern includes a polymer including silicon.

The present invention provides a method for manufacturing the N-type TFT, which includes subjecting a light shielding layer to a grating like patternization treatment for controlling different zones of a poly-silicon layer to induce difference of crystallization so as to have different zones of the poly-silicon layer forming crystalline grains having different sizes, whereby through just one operation of ion doping, different zones of the poly-silicon layer have differences in electrical resistivity due to difference of grain size generated under the condition of identical doping concentration to provide an effect equivalent to an LDD structure for providing the TFT with a relatively low leakage current and improved reliability. Further, since only one operation of ion injection is involved, the manufacturing time and manufacturing cost can be saved, damages of the poly-silicon layer can be reduced, the activation time can be shortened, thereby facilitating the manufacture of flexible display devices.

A method of manufacturing a thin film transistor is disclosed. The method of manufacturing the thin film transistor includes: manufacturing a substrate; forming an oxide semiconductor layer on the substrate; forming a pattern including an active layer through a patterning process; forming a source and drain metal layer on the active layer; and forming a pattern including a source electrode and a drain electrode through a patterning process, an opening being formed between the source electrode and the drain electrode at a position corresponding to a region of the active layer used as a channel, wherein the step of forming the pattern including the source electrode and the drain electrode through a patterning process includes: removing a portion of the source and drain metal layer corresponding to the position of the opening through dry etching. The method may also be used to manufacturing a thin film transistor.

A method of forming image sensor packages may include performing a molding process. Mold material may be formed either on a transparent substrate in between image sensor dies, or on a removable panel in between transparent substrates attached to image sensor dies. Redistribution layers may be formed before or after the molding process. Mold material may be formed after forming redistribution layers so that the mold material covers the redistribution layers. In these cases, holes may be formed in the mold material to expose solder pads on the redistribution layers. Alternatively, redistribution layers may be formed after the molding process and the redistribution layers may extend over the mold material. Image sensor dies may be attached to a glass or notched glass substrate with dam structures. The methods of forming image sensor packages may result in hermetic image sensor packages that prevent exterior materials from reaching the image sensor.

A first photoresist pattern and a second photoresist pattern are formed over a substrate. The first photoresist pattern is separated from the second photoresist pattern by a gap. A chemical mixture is coated on the first and second photoresist patterns. The chemical mixture contains a chemical material and surfactant particles mixed into the chemical material. The chemical mixture fills the gap. A baking process is performed on the first and second photoresist patterns, the baking process causing the gap to shrink. At least some surfactant particles are disposed at sidewall boundaries of the gap. A developing process is performed on the first and second photoresist patterns. The developing process removes the chemical mixture in the gap and over the photoresist patterns. The surfactant particles disposed at sidewall boundaries of the gap reduce a capillary effect during the developing process.

A TFT and manufacturing method thereof, an array substrate and manufacturing method thereof, an X-ray detector and a display device are disclosed. The manufacturing method includes: forming a gate-insulating-layer thin film (3'), a semiconductor-layer thin film (4') and a passivation-shielding-layer thin film (5') successively; forming a pattern (5') that includes a passivation shielding layer through one patterning process, so that a portion, sheltered by the passivation shielding layer, of the semiconductor-layer thin film forms a pattern of an active layer (4a'); and performing an ion doping process to a portion, not sheltered by the passivation shielding layer, of the semiconductor-layer thin film to form a pattern comprising a source electrode (4c') and a drain electrode (4b'). The source electrode (4c') and the drain electrode (4b') are disposed on two sides of the active layer (4a') respectively and in a same layer as the active layer (4a'). The manufacturing method can reduce the number of patterning processes and improve the performance of the thin film transistor in the array substrate.

Manufacturing methods of JFET-type compact three-dimensional memory (3D-MC) are disclosed. In a memory level stacked above the substrate, an x-line extends from a memory array to an above-substrate decoding stage. A JFET-type transistor is formed on the x-line as a decoding device for the above-substrate decoding stage, where the overlap portion of the x-line with the control-line (c-line) is semi-conductive.

To provide a semiconductor device having improved reliability. After formation of an n+ type semiconductor region for source/drain, a first insulating film is formed on a semiconductor substrate so as to cover a gate electrode and a sidewall spacer. After heat treatment, a second insulating film is formed on the first insulating film and a resist pattern is formed on the second insulating film. Then, these insulating films are etched with the resist pattern as an etching mask. The resist pattern is removed, followed by wet washing treatment. A metal silicide layer is then formed by the salicide process.

A method for manufacturing an LDMOS device includes: providing a semiconductor substrate (200), forming a drift region (201) in the semiconductor substrate (200), forming a gate material layer on the semiconductor substrate (200), and forming a negative photoresist layer (204) on the gate material layer; patterning the negative photoresist layer (204), and etching the gate material layer by using the patterned negative photoresist layer (204) as a mask so as to form a gate (203); forming a photoresist layer having an opening on the semiconductor substrate (200) and the patterned negative photoresist layer (204), the opening corresponding to a predetermined position for forming a body region (206); and injecting the body region (206) by using the gate (203) and the negative photoresist layer (204) located above the gate (203) as a self-alignment layer, so as to form a channel region.

A magnetoresistive random access memory (MRAM) structure includes a bottom electrode structure. A magnetic tunnel junction (MTJ) element is over the bottom electrode structure. The MTJ element includes an anti-ferromagnetic material layer. A ferromagnetic pinned layer is over the anti-ferromagnetic material layer. A tunneling layer is over the ferromagnetic pinned layer. A ferromagnetic free layer is over the tunneling layer. The ferromagnetic free layer has a first portion and a demagnetized second portion. The MRAM also includes a top electrode structure over the first portion.

An organic layer deposition assembly for depositing a deposition material on a substrate includes a deposition source configured to spray the deposition material, a deposition source nozzle arranged in one side of the deposition source and including deposition source nozzles arranged in a first direction, a patterning slit sheet arranged to face the deposition source nozzle and having patterning slits in a second direction that crosses the first direction, and a correction sheet arranged between the deposition source nozzle and the patterning slit sheet and configured to block at least a part of the deposition material sprayed from the deposition source.

A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.

An array substrate of organic light-emitting diodes and a method for fabricating the same are provided to narrow an edge frame of product device of organic light-emitting diodes, to shorten the package process time, and to improve the substrate utilization and the production efficiency. The array substrate of organic light-emitting diodes includes a plurality of display panels disposed in an array of rows and columns, wherein at least two adjacent display panels are connected through a frame adhesive, and there is no cutting headroom between at least one side of the at least two adjacent display panels.

Substrates such as sheet metal components may be kept spaced apart from each other using a molded polymeric spacing device. The spacing device has a main body with a thickness corresponding to the desired minimum spacing between the substrates and, extending from the main body or a base connected to said main body, an attachment member capable of being inserted into an opening in one of the substrates, but resistant to being easily withdrawn from such opening. Noise and vibration that might otherwise be generated or propagated by closely proximate substrates are reduced through the use of such molded polymeric spacing devices, which may be integrally fashioned from a rubber.

A fastening strap and a manufacturing method thereof are provided. The fastening strap includes a first band and a second band. The first band has a first surface and a second surface. The first surface has a plurality of hooks of special configuration. The second band has a third surface and a fourth surface. The third surface is directly adhered to the second surface of the first band, and the fourth surface has a plurality of loops for being mechanically latched by the hooks on the first surface. The second surface and/or the third surface is printed with at least one pattern. After the first band and the second band are adhered together, the pattern can be seen from the first surface of the first band.

Embodiments of a loop clip used with a golf bag and methods to manufacture a golf bag are generally described herein. Other embodiments of the loop clip may be described and claimed.

A fixing buckle assembly for use as part of a motor vehicle seatbelt restraint system of a type having webbing for positioning on an occupant and a lap pretensioner for pretensioning the seatbelt restraint system. The buckle assembly includes a tongue, preferably affixed to a pyrotechnic lap pretensioner (PLP). The buckle assembly includes a buckle plate featuring an aperture for connection to a loop of the webbing. A cover assembly encases the internal components of the buckle assembly and is formed of two cover halves which are preferably injection molded and snap together in a clam-shell construction. Each of the cover halves have sections which circumscribe a tongue passageway such that after they are assembled and the tongue is inserted in the buckle assembly, the cover halves become interlocked together. At the opposite end of the buckle assembly, the cover halves each include a section extending from the aperture which is retained from separation by being enclosed by the webbing loop. These features prevent separation of the housing halves upon activation of the PLP.

A leash attachable animal excrement bag holder has a carabineer for engaging a leash, body-supported apparel or the like, a flexible, resilient and open-biased support hoop, and a bag suspended from the support hoop. A slide has a body and first and second holes passing entirely through. The first hole encompasses the support hoop at a first distinct location and the second hole encompasses the support hoop at a second distinct location. The slide operatively traverses the support hoop and thereby alters a bias of the support hoop from an open orientation suitable to receive or remove animal excrement bags to a more nearly closed orientation suitable to retain animal excrement bags. A coupling engages the support hoop with the carabineer.

A method is used to prepare a body for burial. The method includes placing the body inside a vessel. The body includes bones and tissue. The method further includes subjecting the body to a flow of steam until the bones are free of tissue. In one implementation, the flow of steam has a temperature of about 212 degrees Fahrenheit and a mass flow rate of at least 1000 pounds per hour. The method may further include removing the bones from the vessel.

A modular casket made of lightweight materials is structurally reinforced using a structural sealant along at least the inner surfaces of the side panels, and optionally along at least side edge portions of a base panel to which the side panels are coupled, to stiffen and rigidize the casket against flexion along longitudinal and lateral axes, as well as torsional flexion. The structurally reinforced casket is sealed or more readily sealed against leakage and provides other benefits of structural stiffness and rigidity with relatively small cost and weight penalties.

A funerary urn includes a receptacle (1) that has an opening (4) that is equipped with a removable sealing partition (11) for introducing ashes. The urn is equipped with side walls (3), a lower wall (2), and an upper wall (5), with one of the walls being removable in order to open and close the urn, the urn also including first and second inside compartments (6, 7) that each has an access element that is independent of the other and separate from the opening (4) for introducing ashes. The first compartment is equipped with a window (8) toward the outside, and the second compartment is completely concealed. The urn is designed for the perpetuation of memory because it makes it possible to preserve an emotional and material trace of the deceased individual thanks to independent compartments of the receptacle receiving the ashes.

A decorative carapace for a burial vault including a carapace having a top surface and a substrate having a decorative graphic, the substrate being attached to the top surface of the carapace.

The sealing acrylic urn vault of the invention includes a generally square sheet of ⅝″ cast acrylic serving as the base and a generally square top portion which will have four adjacent side walls bonded to its edges and protruding downward. Each opposing side wall will be bonded length-wise to each adjoining side, creating a seamless cast acrylic box, open at the bottom, that lowers onto the acrylic base. Attached to the base are four 0.625″ tall ⅝″ thick acrylic guide rails, bonded equidistant from the outside base edge on all four sides of the base. This “railing system” is the fastening guide for the acrylic top portion which lowers onto the base with the inside of the four side walls bonded with the outside edges of the four guide rails.

A hanger for a sash of a window to detachably engage the sash with a rail of the window, and the hanger includes a pulley assembly and a restricting assembly. The pulley assembly has a base and a plurality of pulleys mounted on the base for rotation. The pulleys engage the rail so that the pulley assembly moves in the rail. The base is provided with a slot. The sash is provided with a rod. The rod engages the slot of the pulley assembly to engage the sash with the rail, and the rod leaves the slot via a lateral opening thereof while the covering rotates for a predetermined angle. At this time, the sash is disengaged with the rail to be moved off the window.

Disclosed is a hinge having a rigid portion integral with a flexible portion suitable to be bent with respect to the rigid portion, wherein the rigid portion has a substrate in a rigid composite material and the flexible portion has a first flexible sheet, wherein a first portion of the first flexible sheet is joined at least partially to the substrate by means of at least one first layer of resin for composite materials, wherein the flexible portion also has a second flexible sheet joined at least partially by means of at least one second layer of resin for composite materials both to the first portion of the first flexible sheet and to at least one second portion of the first flexible sheet which is not joined to the substrate.

The invention relates to a device (10) for actuating the closure of a movable part (12) of a motor vehicle, in particular a door, or hatchback, or similar, comprising a support (11) that can be fixed to the inner face of the movable part (12), a bearing unit (20) that can be pivoted about a first axis (13) provided on the support (11) and a handle element (40) with a first (41) and a second end (42), the second end (42) being fixed to the bearing unit (20), whereby the handle element (40) can be pivoted together with the bearing unit (20). According to the invention, the first end (41) is pivotally mounted on the first axis (13) and at least one bearing element (22, 22a, 22b) is provided for the horizontal bearing of the first end (41), said bearing element being located in the region of the first axis (13).

A brake caliper is provided with a timing and retraction controller, a brake pad and a lock-connection comprising an engaging component and a locking component. The timing and retraction controller adjusts brake timing, eliminates parasitic brake losses and dampens out-of-plane vibration between the brake pad and rotor. The brake caliper includes a housing disposed over a brake rotor; first and second opposing brake pads extendably and retractably mounted on opposite sides of the caliper housing, brake pistons that extend and retract the brake pads into and out of frictional engagement with the rotor, and brake pad timing and retraction controllers disposed on opposite sides of the caliper housing. Each controller includes a Belleville spring or other resilient member with a short compression travel limited to between about 1.50 mm and 0.025 mm. The short stroke Belleville spring of each controller applies a hold-off force against the extension force of the brake pistons that slightly delays brake pad extension and slightly reduces brake pad clamping force against the rotor, thereby advantageously providing a front wheel braking bias when applied to the rear wheels of a vehicle. The restorative force applied by the short stroke Belleville forcefully and uniformly retracts the brake pad from the rotor, eliminating parasitic brake losses, and dampening out-of-plane vibration between the brake pad and rotor.